JP7673061B2 - Ｌｅｄディスプレイ装置 - Google Patents

Ｌｅｄディスプレイ装置 Download PDF

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Publication number
JP7673061B2
JP7673061B2 JP2022524027A JP2022524027A JP7673061B2 JP 7673061 B2 JP7673061 B2 JP 7673061B2 JP 2022524027 A JP2022524027 A JP 2022524027A JP 2022524027 A JP2022524027 A JP 2022524027A JP 7673061 B2 JP7673061 B2 JP 7673061B2
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light
light emitting
layer
emitting
led subunit
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JP2023501923A5 (https=
JP2023501923A (ja
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フン イ，チョン
スン チョ，デ
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Seoul Viosys Co Ltd
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Seoul Viosys Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H10H20/8314—Electrodes characterised by their shape extending at least partially onto an outer side surface of the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H10H20/8316—Multi-layer electrodes comprising at least one discontinuous layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/032—Manufacture or treatment of electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/034—Manufacture or treatment of coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections

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  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2022524027A 2019-10-29 2020-10-29 Ｌｅｄディスプレイ装置 Active JP7673061B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201962927196P 2019-10-29 2019-10-29
US62/927,196 2019-10-29
US17/082,018 2020-10-28
US17/082,018 US11489002B2 (en) 2019-10-29 2020-10-28 LED display apparatus
PCT/KR2020/014851 WO2021086026A1 (ko) 2019-10-29 2020-10-29 Led 디스플레이 장치

Publications (3)

Publication Number Publication Date
JP2023501923A JP2023501923A (ja) 2023-01-20
JP2023501923A5 JP2023501923A5 (https=) 2023-11-01
JP7673061B2 true JP7673061B2 (ja) 2025-05-08

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JP2022524027A Active JP7673061B2 (ja) 2019-10-29 2020-10-29 Ｌｅｄディスプレイ装置

Country Status (8)

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US (4) US11489002B2 (https=)
EP (1) EP4024453A4 (https=)
JP (1) JP7673061B2 (https=)
KR (1) KR102899779B1 (https=)
CN (2) CN114616674A (https=)
BR (1) BR112022008047A2 (https=)
MX (1) MX2022004907A (https=)
WO (1) WO2021086026A1 (https=)

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US11489002B2 (en) * 2019-10-29 2022-11-01 Seoul Viosys Co., Ltd. LED display apparatus
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CN114078897A (zh) * 2020-08-19 2022-02-22 京东方科技集团股份有限公司 发光器件及其制备方法、显示面板、背光模组和显示装置
US11417703B2 (en) * 2020-08-31 2022-08-16 Hong Kong Beida Jade Bird Display Limited Double color micro LED display panel
US11476299B2 (en) * 2020-08-31 2022-10-18 Hong Kong Beida Jade Bird Display Limited Double color micro LED display panel
US11646300B2 (en) * 2020-09-01 2023-05-09 Jade Bird Display (shanghai) Limited Double color micro LED display panel
CN115117211B (zh) * 2021-03-18 2025-07-01 隆达电子股份有限公司 半导体晶片与发光装置
CN114664983B (zh) * 2022-03-22 2023-03-21 西湖大学 一种基于Micro LED的显示装置的制作方法以及显示装置
CN115394762B (zh) * 2022-05-17 2024-07-09 诺视科技(苏州)有限公司 一种具有透明衬底的像素级分立器件及其制作方法
JP2024092521A (ja) * 2022-12-26 2024-07-08 沖電気工業株式会社 発光装置
US20240322093A1 (en) * 2023-03-23 2024-09-26 Yenrich Technology Corporation Light-emitting module
US20240363820A1 (en) * 2023-04-28 2024-10-31 Seoul Viosys Co., Ltd. Light emitting module and display device having the same
JP7741522B2 (ja) * 2023-06-16 2025-09-18 シャープ株式会社 表示パネル
JP7741521B2 (ja) * 2023-06-16 2025-09-18 シャープ株式会社 表示パネル

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US20140312368A1 (en) 2013-04-19 2014-10-23 Lextar Electronics Corporation Led display and manufacturing method thereof
JP2015135986A (ja) 2015-03-23 2015-07-27 株式会社東芝 光半導体装置
US20190165207A1 (en) 2017-11-27 2019-05-30 Seoul Viosys Co., Ltd. Led unit for display and display apparatus having the same
US20190229097A1 (en) 2017-12-05 2019-07-25 Seoul Semiconductor Co., Ltd. Displaying apparatus having light emitting device, method of manufacturing the same and method of transferring light emitting device

Also Published As

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US20210126043A1 (en) 2021-04-29
KR102899779B1 (ko) 2025-12-18
BR112022008047A2 (pt) 2022-07-12
US20230053740A1 (en) 2023-02-23
JP2023501923A (ja) 2023-01-20
EP4024453A1 (en) 2022-07-06
EP4024453A4 (en) 2023-10-25
KR20220091457A (ko) 2022-06-30
CN213782016U (zh) 2021-07-23
WO2021086026A1 (ko) 2021-05-06
US20250056953A1 (en) 2025-02-13
US11837625B2 (en) 2023-12-05
MX2022004907A (es) 2022-06-29
CN114616674A (zh) 2022-06-10
US20240120365A1 (en) 2024-04-11
US11489002B2 (en) 2022-11-01
US12199133B2 (en) 2025-01-14

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