BR112022005090A2 - Dispositivo emissor de luz e pacote emissor de luz - Google Patents

Dispositivo emissor de luz e pacote emissor de luz

Info

Publication number
BR112022005090A2
BR112022005090A2 BR112022005090A BR112022005090A BR112022005090A2 BR 112022005090 A2 BR112022005090 A2 BR 112022005090A2 BR 112022005090 A BR112022005090 A BR 112022005090A BR 112022005090 A BR112022005090 A BR 112022005090A BR 112022005090 A2 BR112022005090 A2 BR 112022005090A2
Authority
BR
Brazil
Prior art keywords
light emitting
unit
led sub
package
emitting device
Prior art date
Application number
BR112022005090A
Other languages
English (en)
Inventor
Min Jang Jong
Yeon Kim Chang
Original Assignee
Seoul Viosys Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seoul Viosys Co Ltd filed Critical Seoul Viosys Co Ltd
Publication of BR112022005090A2 publication Critical patent/BR112022005090A2/pt

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    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
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    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
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    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

DISPOSITIVO EMISSOR DE LUZ E PACOTE EMISSOR DE LUZ. A presente invenção trata de um elemento emissor de luz para exibição que, de acordo com uma modalidade, compreende uma primeira subunidade de LED, uma segunda subunidade de LED na primeira subunidade de LED e uma terceira subunidade de LED na segunda subunidade de LED, em que a terceira subunidade de LED emite luz com comprimento de onda mais curto que a primeira subunidade de LED e mais longo que a segunda subunidade de LED.
BR112022005090A 2019-09-18 2020-09-16 Dispositivo emissor de luz e pacote emissor de luz BR112022005090A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962902069P 2019-09-18 2019-09-18
US17/020,834 US11398462B2 (en) 2019-09-18 2020-09-15 Light emitting device for display and light emitting package having the same
PCT/KR2020/012452 WO2021054702A1 (ko) 2019-09-18 2020-09-16 디스플레이용 발광 소자 및 그것을 가지는 발광 패키지

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EP (1) EP4033530A4 (pt)
JP (1) JP2022549605A (pt)
KR (1) KR20220065757A (pt)
CN (2) CN114424342A (pt)
BR (1) BR112022005090A2 (pt)
MX (1) MX2022002988A (pt)
WO (1) WO2021054702A1 (pt)

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Publication number Priority date Publication date Assignee Title
US11508876B2 (en) * 2018-12-31 2022-11-22 Seoul Viosys Co., Ltd. Light emitting device package and display device having the same
US11489002B2 (en) * 2019-10-29 2022-11-01 Seoul Viosys Co., Ltd. LED display apparatus
US11664355B2 (en) * 2019-12-02 2023-05-30 Seoul Semiconductor Co., Ltd. Display apparatus
KR20230061031A (ko) * 2021-10-28 2023-05-08 삼성전자주식회사 마이크로 발광 소자 및 이를 포함하는 디스플레이 장치

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KR101100579B1 (ko) 2005-01-06 2012-01-13 엘지이노텍 주식회사 반도체 발광 다이오드 및 그의 제조 방법과 반도체 발광다이오드를 이용한 디스플레이의 제조 방법
TWI244228B (en) 2005-02-03 2005-11-21 United Epitaxy Co Ltd Light emitting device and manufacture method thereof
KR100765236B1 (ko) 2006-06-30 2007-10-09 서울옵토디바이스주식회사 패터닝된 발광다이오드용 기판 제조방법 및 그것을채택하는 발광 다이오드 제조방법
US20130285010A1 (en) * 2012-04-27 2013-10-31 Phostek, Inc. Stacked led device with posts in adhesive layer
WO2016047950A1 (en) 2014-09-26 2016-03-31 Seoul Viosys Co., Ltd. Light emitting device and method of fabricating the same
KR102263065B1 (ko) 2014-09-26 2021-06-10 서울바이오시스 주식회사 발광 소자 및 그 제조 방법
US11282981B2 (en) 2017-11-27 2022-03-22 Seoul Viosys Co., Ltd. Passivation covered light emitting unit stack
US20190164945A1 (en) * 2017-11-27 2019-05-30 Seoul Viosys Co., Ltd. Light emitting diode for display and display apparatus having the same
US11527519B2 (en) * 2017-11-27 2022-12-13 Seoul Viosys Co., Ltd. LED unit for display and display apparatus having the same
US11552057B2 (en) * 2017-12-20 2023-01-10 Seoul Viosys Co., Ltd. LED unit for display and display apparatus having the same
US11522006B2 (en) * 2017-12-21 2022-12-06 Seoul Viosys Co., Ltd. Light emitting stacked structure and display device having the same

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US20210082887A1 (en) 2021-03-18
CN213071131U (zh) 2021-04-27
JP2022549605A (ja) 2022-11-28
MX2022002988A (es) 2022-04-01
EP4033530A4 (en) 2023-10-25
US20230387087A1 (en) 2023-11-30
US11398462B2 (en) 2022-07-26
CN114424342A (zh) 2022-04-29
US20220359474A1 (en) 2022-11-10
US11769761B2 (en) 2023-09-26
WO2021054702A1 (ko) 2021-03-25
KR20220065757A (ko) 2022-05-20
EP4033530A1 (en) 2022-07-27

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