BR112016019464A2 - projeto de indutor em esferas de ubm flutuantes para encapsulamento no nível de pastilha (wlp). - Google Patents

projeto de indutor em esferas de ubm flutuantes para encapsulamento no nível de pastilha (wlp).

Info

Publication number
BR112016019464A2
BR112016019464A2 BR112016019464A BR112016019464A BR112016019464A2 BR 112016019464 A2 BR112016019464 A2 BR 112016019464A2 BR 112016019464 A BR112016019464 A BR 112016019464A BR 112016019464 A BR112016019464 A BR 112016019464A BR 112016019464 A2 BR112016019464 A2 BR 112016019464A2
Authority
BR
Brazil
Prior art keywords
wlp
ubm
encapsulation
floating
inductor design
Prior art date
Application number
BR112016019464A
Other languages
English (en)
Portuguese (pt)
Inventor
Hadjichristos Aristotele
David Lane Ryan
Zhang Xiaonan
Kyu Song Young
Park Yunseo
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of BR112016019464A2 publication Critical patent/BR112016019464A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/497—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/922—Bond pads being integral with underlying chip-level interconnections
    • H10W72/9223—Bond pads being integral with underlying chip-level interconnections with redistribution layers [RDL]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/942—Dispositions of bond pads relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/147—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being multilayered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
BR112016019464A 2014-02-12 2015-02-11 projeto de indutor em esferas de ubm flutuantes para encapsulamento no nível de pastilha (wlp). BR112016019464A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/179,202 US9245940B2 (en) 2014-02-12 2014-02-12 Inductor design on floating UBM balls for wafer level package (WLP)
PCT/US2015/015450 WO2015123321A1 (en) 2014-02-12 2015-02-11 Inductor design on floating ubm balls for wafer level package (wlp)

Publications (1)

Publication Number Publication Date
BR112016019464A2 true BR112016019464A2 (pt) 2018-05-08

Family

ID=52596604

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112016019464A BR112016019464A2 (pt) 2014-02-12 2015-02-11 projeto de indutor em esferas de ubm flutuantes para encapsulamento no nível de pastilha (wlp).

Country Status (7)

Country Link
US (1) US9245940B2 (https=)
EP (1) EP3105788A1 (https=)
JP (1) JP6440723B2 (https=)
KR (1) KR102389227B1 (https=)
CN (1) CN106030790B (https=)
BR (1) BR112016019464A2 (https=)
WO (1) WO2015123321A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12113038B2 (en) * 2020-01-03 2024-10-08 Qualcomm Incorporated Thermal compression flip chip bump for high performance and fine pitch
CN112366154A (zh) * 2020-11-06 2021-02-12 深圳市Tcl高新技术开发有限公司 芯片转移方法
US12381156B2 (en) 2021-11-10 2025-08-05 Samsung Electronics Co., Ltd. Redistribution substrate and semiconductor package including the same

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6710433B2 (en) * 2000-11-15 2004-03-23 Skyworks Solutions, Inc. Leadless chip carrier with embedded inductor
JP3558595B2 (ja) * 2000-12-22 2004-08-25 松下電器産業株式会社 半導体チップ，半導体チップ群及びマルチチップモジュール
JP3871609B2 (ja) * 2002-05-27 2007-01-24 松下電器産業株式会社 半導体装置及びその製造方法
US6762495B1 (en) * 2003-01-30 2004-07-13 Qualcomm Incorporated Area array package with non-electrically connected solder balls
JP3983199B2 (ja) * 2003-05-26 2007-09-26 沖電気工業株式会社 半導体装置及びその製造方法
US7619296B2 (en) * 2005-02-03 2009-11-17 Nec Electronics Corporation Circuit board and semiconductor device
US8717137B2 (en) 2006-05-31 2014-05-06 Broadcom Corporation On-chip inductor using redistribution layer and dual-layer passivation
JP2008205422A (ja) * 2006-07-03 2008-09-04 Nec Electronics Corp 半導体装置
JP2008124363A (ja) * 2006-11-15 2008-05-29 Nec Electronics Corp 半導体装置
JP2008210828A (ja) * 2007-02-23 2008-09-11 Casio Comput Co Ltd 半導体装置およびその製造方法
JP4492621B2 (ja) * 2007-02-13 2010-06-30 カシオ計算機株式会社 半導体装置およびその製造方法
TWI397158B (zh) * 2007-02-13 2013-05-21 兆裝微股份有限公司 混有磁性體粉末之半導體裝置及其製造方法
JP5103032B2 (ja) * 2007-03-01 2012-12-19 ルネサスエレクトロニクス株式会社 半導体装置
JP5536388B2 (ja) 2009-08-06 2014-07-02 株式会社テラプローブ 半導体装置およびその製造方法
US8471358B2 (en) 2010-06-01 2013-06-25 Taiwan Semiconductor Manufacturing Company, Ltd. 3D inductor and transformer
US8710658B2 (en) 2011-11-18 2014-04-29 Cambridge Silicon Radio Limited Under bump passive components in wafer level packaging
US9000876B2 (en) 2012-03-13 2015-04-07 Taiwan Semiconductor Manufacturing Company, Ltd. Inductor for post passivation interconnect

Also Published As

Publication number Publication date
WO2015123321A1 (en) 2015-08-20
CN106030790A (zh) 2016-10-12
EP3105788A1 (en) 2016-12-21
JP2017510063A (ja) 2017-04-06
KR20160120303A (ko) 2016-10-17
JP6440723B2 (ja) 2018-12-19
US9245940B2 (en) 2016-01-26
KR102389227B1 (ko) 2022-04-20
CN106030790B (zh) 2019-08-20
US20150228707A1 (en) 2015-08-13

Similar Documents

Publication Publication Date Title
DK3204417T3 (da) Cd73-blokering
CL2015000326S1 (es) Cargador.
LT3157916T (lt) Heteroarilo junginiai, skirti kinazės inhibavimui
CL2015000278S1 (es) Tapa.
DE102015102730B8 (de) Verbinder
DK3204639T3 (da) Hovedakselfastgørelsesanordning
GB2526211B (en) Ball valve
EP3297102A4 (en) Connector
CL2014002537S1 (es) Tapa.
DK3177800T3 (da) Brøndventilsystem
DK3209890T3 (da) Vippedyvel
FR3023988B3 (fr) .
BR112017013156A2 (pt) combinações de composto ativo.
BR112017012801A2 (pt) combinações de composto ativo.
CL2014003030S1 (es) Equipo para bebidas.
ZA201704705B (en) Csp tracking
GB201417006D0 (en) Improved drainage mechanism
AU357948S (en) Sport shoe
BR112016019464A2 (pt) projeto de indutor em esferas de ubm flutuantes para encapsulamento no nível de pastilha (wlp).
FI20155929A7 (fi) Syöttöveden jälkilämmitin
FR3040045B1 (fr) Satellite artificiel
GB201401166D0 (en) Paddle for water sports
ES1100207Y (es) Válvula de alimentación
ES1129405Y (es) Pista de padel
FR3021958B1 (fr) Tire-bouchon integre.

Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B350 Update of information on the portal [chapter 15.35 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]

Free format text: MANTIDO O INDEFERIMENTO UMA VEZ QUE NAO FOI APRESENTADO RECURSO DENTRO DO PRAZO LEGAL