BR0313125A - Instalação para o tratamento sob vácuo notadamente de substratos - Google Patents
Instalação para o tratamento sob vácuo notadamente de substratosInfo
- Publication number
- BR0313125A BR0313125A BR0313125-4A BR0313125A BR0313125A BR 0313125 A BR0313125 A BR 0313125A BR 0313125 A BR0313125 A BR 0313125A BR 0313125 A BR0313125 A BR 0313125A
- Authority
- BR
- Brazil
- Prior art keywords
- chamber
- installation
- treatment
- substrate
- substrates
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Treatment Of Fiber Materials (AREA)
Abstract
"INSTALAçãO PARA O TRATAMENTO SOB VáCUO NOTADAMENTE DE SUBSTRATOS". Essa instalação é notável pelo fato de que ela é composta por módulos independentes e alinhados (M) que compreendem cada um deles uma câmara de tratamento sob vácuo (C) e uma câmara de transferência (B) com meios de transferência de um substrato, para uma das diferentes câmaras ou de uma câmara para a outra situada a jusante ou a montante, diretamente ao lado ou separada de pelo menos um módulo, de modo que enquanto um substrato está em uma câmara para um tratamento específico, um outro substrato pode ser transferido para uma outra câmara para ser submetido a um outro tratamento.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0209955A FR2843129B1 (fr) | 2002-08-01 | 2002-08-01 | Installation pour le traitement sous vide notamment de substrats |
PCT/FR2003/002320 WO2004013375A1 (fr) | 2002-08-01 | 2003-07-23 | Installation pour le traitement sous vide de substrats |
Publications (2)
Publication Number | Publication Date |
---|---|
BR0313125A true BR0313125A (pt) | 2005-07-05 |
BRPI0313125B1 BRPI0313125B1 (pt) | 2017-02-21 |
Family
ID=30129697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0313125A BRPI0313125B1 (pt) | 2002-08-01 | 2003-07-23 | instalação para o tratamento, a vácuo, de substratos |
Country Status (12)
Country | Link |
---|---|
US (1) | US7886686B2 (pt) |
EP (1) | EP1525335B1 (pt) |
JP (1) | JP4652051B2 (pt) |
CN (1) | CN100439560C (pt) |
AU (1) | AU2003269048A1 (pt) |
BR (1) | BRPI0313125B1 (pt) |
CA (1) | CA2493988C (pt) |
ES (1) | ES2601388T3 (pt) |
FR (1) | FR2843129B1 (pt) |
MX (1) | MXPA05001279A (pt) |
PL (1) | PL374645A1 (pt) |
WO (1) | WO2004013375A1 (pt) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070111367A1 (en) * | 2005-10-19 | 2007-05-17 | Basol Bulent M | Method and apparatus for converting precursor layers into photovoltaic absorbers |
DE602007006147D1 (de) | 2007-02-02 | 2010-06-10 | Applied Materials Inc | Prozesskammer, Inline-Beschichtungsanlage und Verfahren zur Behandlung eines Substrats |
EP1956111B1 (de) * | 2007-02-09 | 2010-09-08 | Applied Materials, Inc. | Anlage mit einer Transportvorrichtung zur Behandlung von Substraten |
CN101139699A (zh) * | 2007-08-07 | 2008-03-12 | 北京实力源科技开发有限责任公司 | 一种量产真空镀膜系统结构及其工件传输系统 |
DE102007058052B4 (de) * | 2007-11-30 | 2013-12-05 | Von Ardenne Anlagentechnik Gmbh | Vakuumbeschichtungsanlage |
FR2940321B1 (fr) * | 2008-12-19 | 2011-12-23 | Carewave Shielding Technologies | Machine de depot sous vide,sur un substrat,de materiaux en couches minces,par pulverisation cathodique. |
WO2012012394A1 (en) * | 2010-07-23 | 2012-01-26 | First Solar, Inc | In-line deposition system |
DE102010056123B3 (de) * | 2010-12-21 | 2012-04-26 | Ekra Automatisierungssysteme Gmbh | Drucktischanordnung, Verfahren zum Betreiben einer Drucktischanordnung |
CN102185024B (zh) * | 2011-04-01 | 2013-05-15 | 湘潭大学 | 一种处理制备cigs太阳能电池吸收层的硒化炉及制备方法 |
US9915475B2 (en) * | 2011-04-12 | 2018-03-13 | Jiaxiong Wang | Assembled reactor for fabrications of thin film solar cell absorbers through roll-to-roll processes |
DE102011114593B4 (de) * | 2011-09-30 | 2016-11-03 | Manz Ag | Transporteinrichtung zum Transportieren mehrerer Substrate in den Bereich einer Substrat-Behandlungseinrichtung sowie eine derart ausgestaltete Vakuumbehandlungseinrichtung |
CN102605343A (zh) * | 2011-12-20 | 2012-07-25 | 汉能科技有限公司 | 一种lpcvd工艺中的冷却腔传输系统 |
CN103205720B (zh) * | 2012-01-17 | 2015-12-16 | 上海北玻镀膜技术工业有限公司 | 传动缝隙模块及应用其的连续溅射镀膜设备 |
EP2809822A1 (en) * | 2012-01-31 | 2014-12-10 | First Solar, Inc | Integrated vapor transport deposition method and system |
DE102012100927A1 (de) * | 2012-02-06 | 2013-08-08 | Roth & Rau Ag | Prozessmodul |
JP2015061049A (ja) * | 2013-09-20 | 2015-03-30 | 日本電産リード株式会社 | 処理対象物搬送システム、及び基板検査システム |
CN103531508B (zh) * | 2013-10-17 | 2016-05-18 | 深圳市华星光电技术有限公司 | 基板运输设备及运输方法 |
JP6285305B2 (ja) * | 2014-07-22 | 2018-02-28 | 住友化学株式会社 | 半導体製造装置及び半導体の製造方法 |
CN108231651B (zh) * | 2017-12-26 | 2020-02-21 | 厦门市三安光电科技有限公司 | 微元件转移装置和转移方法 |
CN109609923B (zh) * | 2019-01-11 | 2023-08-25 | 广东谛思纳为新材料科技有限公司 | 一种便于拉链扣电离子镀铂加工的自动化装置 |
US10923374B1 (en) * | 2019-07-23 | 2021-02-16 | Applied Materials, Inc. | Walking beam chamber |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3973665A (en) * | 1975-03-07 | 1976-08-10 | Gca Corporation | Article delivery and transport apparatus for evacuated processing equipment |
JPS58197262A (ja) * | 1982-05-13 | 1983-11-16 | Canon Inc | 量産型真空成膜装置及び真空成膜法 |
JPH06105742B2 (ja) * | 1983-11-28 | 1994-12-21 | 株式会社日立製作所 | 真空処理方法及び装置 |
FR2583774B1 (fr) * | 1985-06-25 | 1992-08-14 | Stein Heurtey | Installation de traitements thermochimiques a temperatures et atmospheres differentes, notamment pour l'industrie automobile |
JPS6328863A (ja) * | 1986-07-22 | 1988-02-06 | Ulvac Corp | 真空処理装置 |
US6491802B2 (en) * | 1992-10-28 | 2002-12-10 | Hitachi, Ltd. | Magnetic film forming system |
US6290824B1 (en) * | 1992-10-28 | 2001-09-18 | Hitachi, Ltd. | Magnetic film forming system |
JP2759028B2 (ja) * | 1992-10-28 | 1998-05-28 | 株式会社日立製作所 | 磁性膜形成装置およびインライン成膜装置 |
DE4341635C2 (de) * | 1993-12-07 | 2002-07-18 | Unaxis Deutschland Holding | Vakuumbeschichtungsanlage |
US5730801A (en) * | 1994-08-23 | 1998-03-24 | Applied Materials, Inc. | Compartnetalized substrate processing chamber |
US5705044A (en) * | 1995-08-07 | 1998-01-06 | Akashic Memories Corporation | Modular sputtering machine having batch processing and serial thin film sputtering |
US6053687A (en) * | 1997-09-05 | 2000-04-25 | Applied Materials, Inc. | Cost effective modular-linear wafer processing |
JP2002203883A (ja) * | 2000-12-27 | 2002-07-19 | Shibaura Mechatronics Corp | 多層膜の形成装置 |
-
2002
- 2002-08-01 FR FR0209955A patent/FR2843129B1/fr not_active Expired - Lifetime
-
2003
- 2003-07-23 JP JP2004525465A patent/JP4652051B2/ja not_active Expired - Lifetime
- 2003-07-23 EP EP03750835.5A patent/EP1525335B1/fr not_active Expired - Lifetime
- 2003-07-23 CN CNB038219824A patent/CN100439560C/zh not_active Expired - Lifetime
- 2003-07-23 PL PL03374645A patent/PL374645A1/xx not_active Application Discontinuation
- 2003-07-23 CA CA2493988A patent/CA2493988C/fr not_active Expired - Lifetime
- 2003-07-23 MX MXPA05001279A patent/MXPA05001279A/es active IP Right Grant
- 2003-07-23 BR BRPI0313125A patent/BRPI0313125B1/pt active IP Right Grant
- 2003-07-23 ES ES03750835.5T patent/ES2601388T3/es not_active Expired - Lifetime
- 2003-07-23 AU AU2003269048A patent/AU2003269048A1/en not_active Abandoned
- 2003-07-23 WO PCT/FR2003/002320 patent/WO2004013375A1/fr active Application Filing
-
2005
- 2005-01-27 US US11/044,253 patent/US7886686B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1681962A (zh) | 2005-10-12 |
JP4652051B2 (ja) | 2011-03-16 |
FR2843129A1 (fr) | 2004-02-06 |
EP1525335B1 (fr) | 2016-10-12 |
CA2493988C (fr) | 2011-01-11 |
CN100439560C (zh) | 2008-12-03 |
ES2601388T3 (es) | 2017-02-15 |
CA2493988A1 (fr) | 2004-02-12 |
JP2006509905A (ja) | 2006-03-23 |
AU2003269048A1 (en) | 2004-02-23 |
BRPI0313125B1 (pt) | 2017-02-21 |
US20050145335A1 (en) | 2005-07-07 |
MXPA05001279A (es) | 2005-09-08 |
US7886686B2 (en) | 2011-02-15 |
WO2004013375A1 (fr) | 2004-02-12 |
EP1525335A1 (fr) | 2005-04-27 |
PL374645A1 (en) | 2005-10-31 |
FR2843129B1 (fr) | 2006-01-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B07A | Application suspended after technical examination (opinion) [chapter 7.1 patent gazette] | ||
B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
B09B | Patent application refused [chapter 9.2 patent gazette] |
Free format text: INDEFIRO O PEDIDO DE ACORDO COM O(S) ARTIGO(S) DA LPI |
|
B12B | Appeal against refusal [chapter 12.2 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |