BR0209331B1 - processo para a metalização eletrolìtica direta de superfìcies de substratos eletricamente não condutores. - Google Patents
processo para a metalização eletrolìtica direta de superfìcies de substratos eletricamente não condutores.Info
- Publication number
- BR0209331B1 BR0209331B1 BRPI0209331-6A BR0209331A BR0209331B1 BR 0209331 B1 BR0209331 B1 BR 0209331B1 BR 0209331 A BR0209331 A BR 0209331A BR 0209331 B1 BR0209331 B1 BR 0209331B1
- Authority
- BR
- Brazil
- Prior art keywords
- substrate surfaces
- sulfonic acid
- electrolytic metallization
- direct electrolytic
- electrically nonconductive
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10124631A DE10124631C1 (de) | 2001-05-18 | 2001-05-18 | Verfahren zum direkten elektrolytischen Metallisieren von elektrisch nichtleiteitenden Substratoberflächen |
PCT/EP2002/005250 WO2002095091A2 (en) | 2001-05-18 | 2002-05-13 | Direct electrolytic metallization of non-conducting substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
BR0209331A BR0209331A (pt) | 2004-10-13 |
BR0209331B1 true BR0209331B1 (pt) | 2011-11-29 |
Family
ID=7685522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0209331-6A BR0209331B1 (pt) | 2001-05-18 | 2002-05-13 | processo para a metalização eletrolìtica direta de superfìcies de substratos eletricamente não condutores. |
Country Status (15)
Country | Link |
---|---|
US (1) | US7025867B2 (pt) |
EP (1) | EP1390568B1 (pt) |
JP (1) | JP4686113B2 (pt) |
KR (1) | KR100863161B1 (pt) |
CN (1) | CN1329557C (pt) |
AT (1) | ATE272730T1 (pt) |
BR (1) | BR0209331B1 (pt) |
CA (1) | CA2437105A1 (pt) |
DE (2) | DE10124631C1 (pt) |
ES (1) | ES2225785T3 (pt) |
HK (1) | HK1060753A1 (pt) |
MX (1) | MXPA03010344A (pt) |
MY (1) | MY126221A (pt) |
TW (1) | TW555893B (pt) |
WO (1) | WO2002095091A2 (pt) |
Families Citing this family (57)
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US20050199587A1 (en) * | 2004-03-12 | 2005-09-15 | Jon Bengston | Non-chrome plating on plastic |
US7365007B2 (en) * | 2004-06-30 | 2008-04-29 | Intel Corporation | Interconnects with direct metalization and conductive polymer |
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US20060105453A1 (en) * | 2004-09-09 | 2006-05-18 | Brenan Colin J | Coating process for microfluidic sample arrays |
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US20090277798A1 (en) * | 2005-09-02 | 2009-11-12 | Ebara-Udylite Co. Ltd. | Catalyst attachment-enhancing agent |
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JP5236648B2 (ja) | 2006-09-07 | 2013-07-17 | エンソン インコーポレイテッド | 電解めっき銅金属配線で絶縁性基板の表面を金属配線するための方法 |
EP1918426A1 (de) * | 2006-10-09 | 2008-05-07 | Enthone, Inc. | Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten |
US8840967B2 (en) * | 2006-10-11 | 2014-09-23 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing printed circuit board including flame retardant insulation layer |
US20080142478A1 (en) * | 2006-11-01 | 2008-06-19 | Microchem Corp. | Epoxy removal process for microformed electroplated devices |
CN101029409B (zh) * | 2006-11-24 | 2011-03-16 | 江苏工业学院 | 印制线路板直接孔金属化的前处理溶液及方法 |
EP1978582A1 (en) * | 2007-04-05 | 2008-10-08 | Atotech Deutschland Gmbh | Process for the preparation of electrodes for use in a fuel cell |
US20110064954A1 (en) * | 2008-05-22 | 2011-03-17 | Ebara-Udylite Co., Ltd. | Method for conditioning insulating resin and its use |
US8318265B2 (en) * | 2008-06-12 | 2012-11-27 | General Electric Company | Plasma mediated processing of non-conductive substrates |
EP2180770A1 (en) | 2008-10-21 | 2010-04-28 | Atotech Deutschland Gmbh | Method to form solder deposits on substrates |
EP2244285A1 (en) | 2009-04-24 | 2010-10-27 | ATOTECH Deutschland GmbH | Method to form solder deposits on substrates |
CN101696323B (zh) * | 2009-10-30 | 2012-03-21 | 华南师范大学 | 一种用于超级电容器的聚苯胺/二氧化锰复合材料的制备方法 |
EP2405468A1 (en) | 2010-07-05 | 2012-01-11 | ATOTECH Deutschland GmbH | Method to form solder deposits on substrates |
EP2405469B1 (en) | 2010-07-05 | 2016-09-21 | ATOTECH Deutschland GmbH | Method to form solder alloy deposits on substrates |
KR102055459B1 (ko) | 2010-08-02 | 2019-12-12 | 아토테크더치랜드게엠베하 | 기판 상에 솔더 성막 및 비용융 범프 구조들을 형성하는 방법 |
EP2506690A1 (en) | 2011-03-28 | 2012-10-03 | Atotech Deutschland GmbH | Method to form solder deposits and non-melting bump structures on substrates |
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EP2602357A1 (en) * | 2011-12-05 | 2013-06-12 | Atotech Deutschland GmbH | Novel adhesion promoting agents for metallization of substrate surfaces |
CN104145537A (zh) * | 2012-03-29 | 2014-11-12 | 德国艾托特克公司 | 细线电路的制造方法 |
CN104204294B (zh) * | 2012-03-29 | 2018-12-07 | 德国艾托特克公司 | 促进介电衬底与金属层之间粘着度的方法 |
EP2645830B1 (en) * | 2012-03-29 | 2014-10-08 | Atotech Deutschland GmbH | Method for manufacture of fine line circuitry |
EP2644744A1 (en) | 2012-03-29 | 2013-10-02 | Atotech Deutschland GmbH | Method for promoting adhesion between dielectric substrates and metal layers |
EP2657367B1 (en) | 2012-04-24 | 2015-11-25 | Enthone Inc. | Pre-etching composition and etching process for plastic substrates |
EP2709160B1 (en) | 2012-09-14 | 2016-03-30 | ATOTECH Deutschland GmbH | Method for metallization of solar cell substrates |
KR101294229B1 (ko) * | 2012-12-10 | 2013-08-07 | 와이엠티 주식회사 | 인쇄회로기판의 쓰루 홀 또는 비아 홀 내벽에 전도성폴리머층을 형성하는 방법 |
CN104284527A (zh) * | 2013-07-01 | 2015-01-14 | 深圳市环基实业有限公司 | 印刷电路板及其制作方法 |
CN104427744A (zh) * | 2013-08-30 | 2015-03-18 | 富葵精密组件(深圳)有限公司 | 电路板及其制作方法 |
CN105593410A (zh) | 2013-09-26 | 2016-05-18 | 德国艾托特克公司 | 用于衬底表面金属化的新颖粘着促进方法 |
EP2937446B1 (en) * | 2013-10-22 | 2018-06-13 | Okuno Chemical Industries Co., Ltd. | Composition for etching treatment of resin material |
JP6406841B2 (ja) * | 2014-03-24 | 2018-10-17 | アトテック・ドイチュラント・ゲーエムベーハーAtotech Deutschland Gmbh | 金属層形成方法およびプリント回路基板製造方法 |
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CN105132977B (zh) * | 2015-08-31 | 2017-12-29 | 广东东硕科技有限公司 | 一种用于线路板制造的调整液及其制备方法 |
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US10151035B2 (en) | 2016-05-26 | 2018-12-11 | Rohm And Haas Electronic Materials Llc | Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts |
ES2708341T3 (es) | 2016-11-22 | 2019-04-09 | Macdermid Enthone Gmbh | Grabado exento de cromo para un galvanizado sobre plástico |
CN107723764A (zh) * | 2017-10-31 | 2018-02-23 | 电子科技大学 | 一种在绝缘基材上直接电镀的方法 |
CN108601235A (zh) * | 2017-12-28 | 2018-09-28 | 广东光华科技股份有限公司 | 绝缘基材表面电镀金属的方法 |
CN108645822A (zh) * | 2018-06-19 | 2018-10-12 | 华电电力科学研究院有限公司 | 一种自动测定油品破乳化度的装置及测定方法 |
CN108977862B (zh) * | 2018-08-30 | 2022-08-05 | 广东东硕科技有限公司 | 绝缘基材表面电镀金属的方法 |
CN111171356B (zh) | 2018-10-24 | 2021-06-22 | 电子科技大学 | 一种制备复合型导电聚合物的方法 |
US11818849B1 (en) | 2023-04-21 | 2023-11-14 | Yield Engineering Systems, Inc. | Increasing adhesion of metal-organic interfaces by silane vapor treatment |
US11919036B1 (en) | 2023-04-21 | 2024-03-05 | Yield Engineering Systems, Inc. | Method of improving the adhesion strength of metal-organic interfaces in electronic devices |
Family Cites Families (15)
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---|---|---|---|---|
JP2657423B2 (ja) * | 1988-03-03 | 1997-09-24 | ブラスベルク・オーベルフレヒェンテヒニーク・ゲー・エム・ベー・ハー | 新規なスルーホールめっき印刷回路基板およびその製造方法 |
KR100216328B1 (ko) * | 1989-09-14 | 1999-08-16 | 그레고루 후렝크, 디터 베크베르트 | 회로판의 직접 금속화 방법 |
DE3939676C2 (de) * | 1989-11-28 | 1994-01-27 | Schering Ag | Metallisierung von Nichtleitern |
GB2243838A (en) * | 1990-05-09 | 1991-11-13 | Learonal | Process for metallising a through-hole printed circuit board by electroplating |
WO1992020204A1 (de) * | 1991-04-26 | 1992-11-12 | Blasberg Oberflächentechnik GmbH | Mittel zur selektiven ausbildung einer dünnen oxidierenden schicht |
DE4202337A1 (de) * | 1992-01-29 | 1993-08-05 | Bayer Ag | Verfahren zur durchkontaktierung von zweilagigen leiterplatten und multilayern |
JP2587166B2 (ja) * | 1992-05-14 | 1997-03-05 | 住友軽金属工業株式会社 | 曲面ハニカムパネル |
DE69413436T2 (de) * | 1993-03-09 | 1999-05-20 | Koninkl Philips Electronics Nv | Herstellungsverfahren eines Musters von einem elektrisch leitfähigen Polymer auf einer Substratoberfläche und Metallisierung eines solchen Musters |
US5415762A (en) * | 1993-08-18 | 1995-05-16 | Shipley Company Inc. | Electroplating process and composition |
JPH07179578A (ja) * | 1993-12-24 | 1995-07-18 | Mitsubishi Heavy Ind Ltd | 導電性組成物の製法 |
DE4436391A1 (de) * | 1994-10-12 | 1996-04-18 | Bayer Ag | Verfahren zur direkten galvanischen Durchkontaktierung von zweilagigen Leiterplatten und Multilayern |
EP0731192B2 (en) * | 1995-03-10 | 2003-01-02 | Shipley Company LLC | Electroplating process and composition |
DE19527056C1 (de) * | 1995-07-25 | 1996-11-28 | Blasberg Oberflaechentech | Verfahren zur Herstellung von durchkontaktierten Leiterplatten oder Mehrlagenleiterplatten (Multilayer) |
US6007824A (en) * | 1998-07-09 | 1999-12-28 | Duckett; Melvin J. | Natural composition and method for the treatment of sexual dysfunction |
DE19903108A1 (de) * | 1999-01-27 | 2000-08-03 | Bayer Ag | Verfahren zur direkten galvanischen Durchkontaktierung von Leiterplatten |
-
2001
- 2001-05-18 DE DE10124631A patent/DE10124631C1/de not_active Expired - Fee Related
-
2002
- 2002-05-09 TW TW091109679A patent/TW555893B/zh not_active IP Right Cessation
- 2002-05-10 MY MYPI20021703A patent/MY126221A/en unknown
- 2002-05-13 EP EP02727596A patent/EP1390568B1/en not_active Expired - Lifetime
- 2002-05-13 BR BRPI0209331-6A patent/BR0209331B1/pt not_active IP Right Cessation
- 2002-05-13 JP JP2002591550A patent/JP4686113B2/ja not_active Expired - Fee Related
- 2002-05-13 KR KR1020037015031A patent/KR100863161B1/ko not_active IP Right Cessation
- 2002-05-13 MX MXPA03010344A patent/MXPA03010344A/es active IP Right Grant
- 2002-05-13 US US10/472,374 patent/US7025867B2/en not_active Expired - Fee Related
- 2002-05-13 AT AT02727596T patent/ATE272730T1/de active
- 2002-05-13 CA CA002437105A patent/CA2437105A1/en not_active Abandoned
- 2002-05-13 WO PCT/EP2002/005250 patent/WO2002095091A2/en active IP Right Grant
- 2002-05-13 CN CNB028063082A patent/CN1329557C/zh not_active Expired - Fee Related
- 2002-05-13 DE DE60200891T patent/DE60200891T2/de not_active Expired - Lifetime
- 2002-05-13 ES ES02727596T patent/ES2225785T3/es not_active Expired - Lifetime
-
2004
- 2004-05-20 HK HK04103578A patent/HK1060753A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE10124631C1 (de) | 2002-11-21 |
US20040112755A1 (en) | 2004-06-17 |
WO2002095091A3 (en) | 2003-11-13 |
ES2225785T3 (es) | 2005-03-16 |
JP4686113B2 (ja) | 2011-05-18 |
MY126221A (en) | 2006-09-29 |
CN1612951A (zh) | 2005-05-04 |
HK1060753A1 (en) | 2004-08-20 |
MXPA03010344A (es) | 2004-03-10 |
DE60200891D1 (de) | 2004-09-09 |
BR0209331A (pt) | 2004-10-13 |
WO2002095091A2 (en) | 2002-11-28 |
CA2437105A1 (en) | 2002-11-28 |
EP1390568A2 (en) | 2004-02-25 |
KR100863161B1 (ko) | 2008-10-13 |
KR20030097882A (ko) | 2003-12-31 |
TW555893B (en) | 2003-10-01 |
CN1329557C (zh) | 2007-08-01 |
DE60200891T2 (de) | 2005-08-18 |
ATE272730T1 (de) | 2004-08-15 |
JP2004526869A (ja) | 2004-09-02 |
US7025867B2 (en) | 2006-04-11 |
EP1390568B1 (en) | 2004-08-04 |
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Legal Events
Date | Code | Title | Description |
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B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 13/05/2002, OBSERVADAS AS CONDICOES LEGAIS. |
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B21F | Lapse acc. art. 78, item iv - on non-payment of the annual fees in time |
Free format text: REFERENTE A 14A ANUIDADE. |
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B24J | Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12) |
Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2385 DE 20-09-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |