CN101029409B - 印制线路板直接孔金属化的前处理溶液及方法 - Google Patents
印制线路板直接孔金属化的前处理溶液及方法 Download PDFInfo
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- CN101029409B CN101029409B CN200610097978XA CN200610097978A CN101029409B CN 101029409 B CN101029409 B CN 101029409B CN 200610097978X A CN200610097978X A CN 200610097978XA CN 200610097978 A CN200610097978 A CN 200610097978A CN 101029409 B CN101029409 B CN 101029409B
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CN101029409A CN101029409A (zh) | 2007-09-05 |
CN101029409B true CN101029409B (zh) | 2011-03-16 |
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Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101294229B1 (ko) * | 2012-12-10 | 2013-08-07 | 와이엠티 주식회사 | 인쇄회로기판의 쓰루 홀 또는 비아 홀 내벽에 전도성폴리머층을 형성하는 방법 |
CN103957670A (zh) * | 2014-05-21 | 2014-07-30 | 广东达进电子科技有限公司 | 一种线路板的直接电镀工艺 |
CN104582324B (zh) * | 2015-01-07 | 2018-04-10 | 台山市精诚达电路有限公司 | 柔性电路板孔金属化方法 |
CN104744974B (zh) * | 2015-03-10 | 2017-10-17 | 广州市天承化工有限公司 | 一种pcb用改进型活化液及在pcb通孔和盲孔内生成高分子导电膜的生产工艺 |
CN104703412B (zh) * | 2015-04-07 | 2016-04-13 | 深圳市化讯应用材料有限公司 | 一种孔金属化的方法 |
CN105132977B (zh) * | 2015-08-31 | 2017-12-29 | 广东东硕科技有限公司 | 一种用于线路板制造的调整液及其制备方法 |
CN106686911A (zh) * | 2017-03-21 | 2017-05-17 | 胜华电子(惠阳)有限公司 | 一种导电膜的生产方法 |
CN108848629A (zh) * | 2018-06-11 | 2018-11-20 | 江门市奔力达电路有限公司 | 一种孔电pcb生产工艺 |
CN110029382B (zh) * | 2019-05-22 | 2021-09-24 | 电子科技大学 | 一种用于直接电镀的表面处理工艺及其相关直接电镀工艺 |
CN111741614B (zh) * | 2020-06-05 | 2021-12-17 | 广州美维电子有限公司 | 一种精细线路pcb板加工方法 |
CN113507793B (zh) * | 2021-07-07 | 2022-10-28 | 深圳市贝加电子材料有限公司 | 电荷调整剂及其制备方法和应用 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0731192A1 (en) * | 1995-03-10 | 1996-09-11 | Shipley Company LLC | Electroplating process and composition |
CN1505461A (zh) * | 2002-12-03 | 2004-06-16 | 叶清祥 | 一种镀通孔的无甲醛电解厚铜制造方法 |
CN1612951A (zh) * | 2001-05-18 | 2005-05-04 | 埃托特克德国有限公司 | 非导电基底的直接电解镀金属 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0731192A1 (en) * | 1995-03-10 | 1996-09-11 | Shipley Company LLC | Electroplating process and composition |
CN1612951A (zh) * | 2001-05-18 | 2005-05-04 | 埃托特克德国有限公司 | 非导电基底的直接电解镀金属 |
CN1505461A (zh) * | 2002-12-03 | 2004-06-16 | 叶清祥 | 一种镀通孔的无甲醛电解厚铜制造方法 |
Non-Patent Citations (1)
Title |
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JP特开平6-81190A 1994.03.22 |
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