BR0014986A - Circuito de vácuo para um dispositivo de tratamento de um recipiente com o auxìlio de um plasma à baixa pressão - Google Patents

Circuito de vácuo para um dispositivo de tratamento de um recipiente com o auxìlio de um plasma à baixa pressão

Info

Publication number
BR0014986A
BR0014986A BR0014986-1A BR0014986A BR0014986A BR 0014986 A BR0014986 A BR 0014986A BR 0014986 A BR0014986 A BR 0014986A BR 0014986 A BR0014986 A BR 0014986A
Authority
BR
Brazil
Prior art keywords
container
vacuum circuit
cavity
low pressure
pressure plasma
Prior art date
Application number
BR0014986-1A
Other languages
English (en)
Inventor
Jean Michel Rius
Original Assignee
Sidel Actis Services
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sidel Actis Services filed Critical Sidel Actis Services
Publication of BR0014986A publication Critical patent/BR0014986A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/045—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32834—Exhausting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
  • Discharge Heating (AREA)
  • Closures For Containers (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Containers Having Bodies Formed In One Piece (AREA)
  • Details Of Rigid Or Semi-Rigid Containers (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • ing And Chemical Polishing (AREA)
  • Furnace Details (AREA)

Abstract

"CIRCUITO DE VáCUO PARA UM DISPOSITIVO DE TRATAMENTO DE UM RECIPIENTE COM O AUXìLIO DE UM PLASMA à BAIXA PRESSãO". A invenção propõe um dispositivo para o tratamento de um recipiente (30) com o auxílio de um plasma de baixa pressão, do tipo que comporta pelo menos um posto de tratamento (14) que compreende uma cavidade fixa (32) ligada a uma fonte de depressão por intermédio de um circuito de vácuo (74) e do tipo no qual o posto de tratamento (14) comporta uma tampa móvel (34) munida de meios de suporte (54) do recipiente (30), de modo que a introdução do recipiente na cavidade (32) seja assegurada por deslocamento da tampa (34), caracterizado pelo fato de a tampa (34) comportar um canal de ligação (64) que, quando a tampa (34) está em posição de fechamento estanque da cavidade (32), coloca em comunicação a cavidade (32) com uma extremidade fixa (68) do circuito de vácuo (74).
BR0014986-1A 1999-10-25 2000-10-23 Circuito de vácuo para um dispositivo de tratamento de um recipiente com o auxìlio de um plasma à baixa pressão BR0014986A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9913638A FR2799994B1 (fr) 1999-10-25 1999-10-25 Dispositif pour le traitement d'un recipient a l'aide d'un plasma a basse pression comportant un circuit de vide perfectionne
PCT/FR2000/002941 WO2001031680A1 (fr) 1999-10-25 2000-10-23 Circuit de vide pour un dispositif de traitement d'un recipient a l'aide d'un plasma a basse pression

Publications (1)

Publication Number Publication Date
BR0014986A true BR0014986A (pt) 2002-06-18

Family

ID=9551574

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0014986-1A BR0014986A (pt) 1999-10-25 2000-10-23 Circuito de vácuo para um dispositivo de tratamento de um recipiente com o auxìlio de um plasma à baixa pressão

Country Status (14)

Country Link
US (1) US6328805B1 (pt)
EP (1) EP1228522B1 (pt)
JP (1) JP3663174B2 (pt)
KR (1) KR100472217B1 (pt)
CN (1) CN1253917C (pt)
AT (1) ATE303656T1 (pt)
AU (1) AU1032801A (pt)
BR (1) BR0014986A (pt)
CA (1) CA2388335A1 (pt)
DE (1) DE60022377T2 (pt)
ES (1) ES2248135T3 (pt)
FR (1) FR2799994B1 (pt)
MX (1) MXPA02004041A (pt)
WO (1) WO2001031680A1 (pt)

Families Citing this family (49)

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Publication number Priority date Publication date Assignee Title
DE10054653A1 (de) * 2000-11-03 2002-05-08 Ver Foerderung Inst Kunststoff Verfahren und Vorrichtung zum Beschichten von Hohlkörper
DE60206084T2 (de) * 2001-02-06 2006-01-12 Shibuya Kogyo Co., Ltd., Kanazawa Verfahren und Vorrichtung zum Modifizieren der inneren Oberfläche von Behältern aus Kunststoff
DE10202311B4 (de) * 2002-01-23 2007-01-04 Schott Ag Vorrichtung und Verfahren zur Plasmabehandlung von dielektrischen Körpern
AU2003229287A1 (en) 2002-05-24 2003-12-12 Sig Technology Ltd. Method and device for plasma treatment of work pieces
DE10253513B4 (de) * 2002-11-16 2005-12-15 Schott Ag Mehrplatz-Beschichtungsvorrichtung und Verfahren zur Plasmabeschichtung
JP2005526914A (ja) 2002-05-24 2005-09-08 エスアイジー テクノロジー リミテッド 工作物のプラズマ処理方法および装置
ATE326557T1 (de) * 2002-05-24 2006-06-15 Schott Ag Vorrichtung für cvd-behandlungen
DE10228898B4 (de) * 2002-06-27 2005-01-27 Schott Ag Vorrichtung und Verfahren für CVD-Behandlungen
WO2003100124A1 (de) 2002-05-24 2003-12-04 Sig Technology Ltd. Verfahren und vorrichtung zur plasmabehandlung von werkstücken
WO2003100117A1 (de) * 2002-05-24 2003-12-04 Sig Technology Ltd. Verfahren und vorrichtung zur plasmabehandlung von werkstücken
AU2003245890A1 (en) * 2002-05-24 2003-12-12 Schott Ag Multistation coating device and method for plasma coating
DE10224547B4 (de) * 2002-05-24 2020-06-25 Khs Corpoplast Gmbh Verfahren und Vorrichtung zur Plasmabehandlung von Werkstücken
JP4977316B2 (ja) 2002-05-24 2012-07-18 カーハーエス コーポプラスト ゲーエムベーハー 工作物のプラズマ処理方法および装置
AU2003233770A1 (en) 2002-05-24 2003-12-12 Sig Technology Ltd. Method and device for plasma treating workpieces
AU2003229285A1 (en) 2002-05-24 2003-12-12 Sig Technology Ltd. Method and device for plasma treating workpieces
AU2003237678A1 (en) * 2002-05-24 2003-12-12 Schott Ag Device and method for treating workpieces
JP4132982B2 (ja) * 2002-05-28 2008-08-13 麒麟麦酒株式会社 Ｄｌｃ膜コーティングプラスチック容器の製造装置
DE10236683B4 (de) * 2002-08-09 2016-05-12 Krones Aktiengesellschaft Vorrichtung zur Plasmabehandlung von Hohlkörpern, insbesondere Flaschen
DE10242086A1 (de) 2002-09-11 2004-04-15 Sig Technology Ltd. Behälter zur Verpackung von Produkten, Vorrichtung zur Verarbeitung von Kunstoff sowie Verfahren zur Behälterherstellung
FR2847912B1 (fr) * 2002-11-28 2005-02-18 Sidel Sa Procede et dispositif pour deposer par plasma micro-ondes un revetement sur une face d'un recipient en materiau thermoplastique
DE10300734A1 (de) * 2003-01-11 2004-07-22 Sig Technology Ltd. Verfahren und Vorrichtung zur Plasmabehandlung von Werkstücken
US7513953B1 (en) * 2003-11-25 2009-04-07 Nano Scale Surface Systems, Inc. Continuous system for depositing films onto plastic bottles and method
FR2871091B1 (fr) * 2004-06-03 2008-01-18 Commissariat Energie Atomique Procede de fabrication d'une vitesse d'etancheite d'un reservoir de type iv et reservoir de type iv
FR2872148B1 (fr) * 2004-06-24 2006-09-22 Sidel Sas Machine de traitement de bouteilles equipee d'une cartouche de raccordement interchangeable
FR2872555B1 (fr) * 2004-06-30 2006-10-06 Sidel Sas Circuit de pompage a vide et machine de traitement de recipients equipee de ce circuit
FR2889204B1 (fr) * 2005-07-26 2007-11-30 Sidel Sas Appareil pour le depot pecvd d'une couche barriere interne sur un recipient, comprenant une ligne de gaz isolee par electrovanne
FR2892425B1 (fr) * 2005-10-24 2008-01-04 Sidel Sas Appareil refroidi pour le depot par plasma d'une couche barriere sur un recipient.
FR2892652B1 (fr) * 2005-10-28 2009-06-05 Sidel Sas Machine rotative de traitement de recipients
FR2893622B1 (fr) 2005-11-24 2007-12-21 Commissariat Energie Atomique Composition a base de caprolactame,procede de fabrication d'un element d'etancheite,et reservoir
EP1884249A1 (fr) * 2006-08-01 2008-02-06 L'AIR LIQUIDE, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Procédé de traitement de bouteilles plastiques par plasma froid et dispositif permettant sa mise en oeuvre
FR2907036B1 (fr) * 2006-10-11 2008-12-26 Sidel Participations Installation de depot, au moyen d'un plasma micro-ondes, d'un revetement barriere interne dans des recipients thermoplastiques
FR2907037B1 (fr) * 2006-10-13 2009-01-09 Sidel Participations Installation de depot,au moyen d'un plasma micro-ondes,d'un revetement barriere interne dans des recipients thermoplastiques
DE102007017938C5 (de) 2007-04-13 2017-09-21 Khs Gmbh Behälterherstellungsvorrichtung und Herstellverfahren für Formkörper
CN101778719B (zh) * 2007-08-14 2013-05-01 东洋制罐株式会社 具有真空蒸镀膜的生物降解性树脂容器和真空蒸镀膜的形成方法
DE102007045141A1 (de) 2007-09-20 2009-04-02 Krones Ag Plasmabehandlungsanlage
DE102007045216A1 (de) 2007-09-21 2009-04-02 Khs Corpoplast Gmbh & Co. Kg Vorrichtung zur Plasmabehandlung von Werkstücken
DE102008016923A1 (de) 2008-03-31 2009-10-01 Khs Corpoplast Gmbh & Co. Kg Vorrichtung zur Plasmabehandlung von Werkstücken
FR2932395B1 (fr) * 2008-06-13 2011-06-10 Sidel Participations Procede de protection d'appareil(s) de mesure ou autre(s)
DE102010012501A1 (de) 2010-03-12 2011-09-15 Khs Corpoplast Gmbh Verfahren und Vorrichtung zur Plasmabehandlung von Werkstücken
DE102010023119A1 (de) 2010-06-07 2011-12-22 Khs Corpoplast Gmbh Vorrichtung zur Plasmabehandlung von Werkstücken
DE102010048960A1 (de) 2010-10-18 2012-04-19 Khs Corpoplast Gmbh Verfahren und Vorrichtung zur Plasmabehandlung von Werkstücken
DE102010055155A1 (de) 2010-12-15 2012-06-21 Khs Corpoplast Gmbh Verfahren zur Plasmabehandlung von Werkstücken sowie Werkstück mit Gasbarriereschicht
US10081864B2 (en) 2011-03-10 2018-09-25 Kaiatech, Inc Method and apparatus for treating containers
DE102011104730A1 (de) 2011-06-16 2012-12-20 Khs Corpoplast Gmbh Verfahren zur Plasmabehandlung von Werkstücken sowie Werkstück mit Gasbarriereschicht
DE102015121773B4 (de) 2015-12-14 2019-10-24 Khs Gmbh Verfahren und Vorrichtung zur Plasmabehandlung von Behältern
DE102016105548A1 (de) 2016-03-24 2017-09-28 Khs Plasmax Gmbh Verfahren und Vorrichtung zur Plasmabehandlung von Behältern
KR101965317B1 (ko) * 2017-07-14 2019-08-07 손부경 진공 밀폐 케이스
CN108131274B (zh) * 2017-11-15 2019-10-15 中国科学院合肥物质科学研究院 一种真空抽气系统
DE102018132609A1 (de) * 2018-12-18 2020-06-18 Krones Ag Vorrichtung und Verfahren zum Beschichten von Behältnissen

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DE4316349C2 (de) 1993-05-15 1996-09-05 Ver Foerderung Inst Kunststoff Verfahren zur Innenbeschichtung von Hohlkörpern mit organischen Deckschichten durch Plasmapolymerisation, sowie Vorrichtung zur Durchführung des Verfahrens
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Also Published As

Publication number Publication date
CA2388335A1 (fr) 2001-05-03
WO2001031680A1 (fr) 2001-05-03
US6328805B1 (en) 2001-12-11
MXPA02004041A (es) 2003-12-11
CN1382303A (zh) 2002-11-27
FR2799994A1 (fr) 2001-04-27
KR100472217B1 (ko) 2005-03-10
EP1228522B1 (fr) 2005-08-31
JP2003512977A (ja) 2003-04-08
FR2799994B1 (fr) 2002-06-07
DE60022377T2 (de) 2006-06-08
ATE303656T1 (de) 2005-09-15
ES2248135T3 (es) 2006-03-16
EP1228522A1 (fr) 2002-08-07
KR20020053826A (ko) 2002-07-05
JP3663174B2 (ja) 2005-06-22
AU1032801A (en) 2001-05-08
DE60022377D1 (de) 2005-10-06
CN1253917C (zh) 2006-04-26

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Legal Events

Date Code Title Description
B15K Others concerning applications: alteration of classification

Free format text: ALTERADA A CLASSIFICACAO DE H01J 37/32; C23C 16/04 PARA INT. CL.2012.01 B65D 1/00; B65D 25/02; C23C16/04; C23C 16/455; C23C 16/505; H01J 37/32; H05H 1/46 E C23C 16/50.

Ipc: B65D 1/00 (2006.01), B65D 25/02 (2006.01), C23C 16

B15K Others concerning applications: alteration of classification

Free format text: ALTERADA A CLASSIFICACAO DE B65D 1/00, B65D 25/02, C23C 16/04, C23C 16/455, C23C 15/505, H01J 37/23, H05H 1/46, C23C 16/50 PARA INT. CL. F17C 13/06, H05H 1/46.

Ipc: F17C 13/06 (2006.01), H05H 1/46 (2006.01)

B09A Decision: intention to grant [chapter 9.1 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 15A ANUIDADE.

B11D Dismissal acc. art. 38, par 2 of ipl - failure to pay fee after grant in time
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2330 DE 01/09/2015.