BE781643A - Procede de fabrication d'un contact intermetallique sur un dispositif semiconducteur - Google Patents
Procede de fabrication d'un contact intermetallique sur un dispositif semiconducteurInfo
- Publication number
- BE781643A BE781643A BE781643A BE781643A BE781643A BE 781643 A BE781643 A BE 781643A BE 781643 A BE781643 A BE 781643A BE 781643 A BE781643 A BE 781643A BE 781643 A BE781643 A BE 781643A
- Authority
- BE
- Belgium
- Prior art keywords
- manufacturing
- semiconductor device
- intermetal
- contact
- intermetal contact
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/003—Anneal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/106—Masks, special
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/122—Polycrystalline
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/139—Schottky barrier
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/147—Silicides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13134071A | 1971-04-05 | 1971-04-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
BE781643A true BE781643A (fr) | 1972-07-31 |
Family
ID=22449017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE781643A BE781643A (fr) | 1971-04-05 | 1972-04-04 | Procede de fabrication d'un contact intermetallique sur un dispositif semiconducteur |
Country Status (9)
Country | Link |
---|---|
US (1) | US3753774A (fr) |
AU (1) | AU465779B2 (fr) |
BE (1) | BE781643A (fr) |
CA (1) | CA968676A (fr) |
DE (1) | DE2215357A1 (fr) |
FR (1) | FR2132167B1 (fr) |
GB (1) | GB1321034A (fr) |
IT (1) | IT950802B (fr) |
NL (1) | NL7204469A (fr) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3900344A (en) * | 1973-03-23 | 1975-08-19 | Ibm | Novel integratable schottky barrier structure and method for the fabrication thereof |
US3956527A (en) * | 1973-04-16 | 1976-05-11 | Ibm Corporation | Dielectrically isolated Schottky Barrier structure and method of forming the same |
US4000502A (en) * | 1973-11-05 | 1976-12-28 | General Dynamics Corporation | Solid state radiation detector and process |
FR2280203A1 (fr) * | 1974-07-26 | 1976-02-20 | Thomson Csf | Procede d'ajustement de tension de seuil de transistors a effet de champ |
US4042950A (en) * | 1976-03-01 | 1977-08-16 | Advanced Micro Devices, Inc. | Platinum silicide fuse links for integrated circuit devices |
IT1110843B (it) * | 1978-02-27 | 1986-01-06 | Rca Corp | Contatto affondato per dispositivi mos di tipo complementare |
US4276688A (en) * | 1980-01-21 | 1981-07-07 | Rca Corporation | Method for forming buried contact complementary MOS devices |
US5202574A (en) * | 1980-05-02 | 1993-04-13 | Texas Instruments Incorporated | Semiconductor having improved interlevel conductor insulation |
JPS5846193B2 (ja) * | 1980-07-15 | 1983-10-14 | 株式会社東芝 | 半導体装置 |
US4339869A (en) * | 1980-09-15 | 1982-07-20 | General Electric Company | Method of making low resistance contacts in semiconductor devices by ion induced silicides |
JPS584924A (ja) * | 1981-07-01 | 1983-01-12 | Hitachi Ltd | 半導体装置の電極形成方法 |
JPS59110179A (ja) * | 1982-12-16 | 1984-06-26 | Hitachi Ltd | 半導体装置およびその製造法 |
DE3304642A1 (de) * | 1983-02-10 | 1984-08-16 | Siemens AG, 1000 Berlin und 8000 München | Integrierte halbleiterschaltung mit bipolartransistor-strukturen und verfahren zu ihrer herstellung |
JPS61208869A (ja) * | 1985-03-14 | 1986-09-17 | Nec Corp | 半導体装置及びその製造方法 |
US4635347A (en) * | 1985-03-29 | 1987-01-13 | Advanced Micro Devices, Inc. | Method of fabricating titanium silicide gate electrodes and interconnections |
US4818723A (en) * | 1985-11-27 | 1989-04-04 | Advanced Micro Devices, Inc. | Silicide contact plug formation technique |
US4873205A (en) * | 1987-12-21 | 1989-10-10 | International Business Machines Corporation | Method for providing silicide bridge contact between silicon regions separated by a thin dielectric |
US4966868A (en) * | 1988-05-16 | 1990-10-30 | Intel Corporation | Process for selective contact hole filling including a silicide plug |
US5196360A (en) * | 1990-10-02 | 1993-03-23 | Micron Technologies, Inc. | Methods for inhibiting outgrowth of silicide in self-aligned silicide process |
US5100838A (en) * | 1990-10-04 | 1992-03-31 | Micron Technology, Inc. | Method for forming self-aligned conducting pillars in an (IC) fabrication process |
US5074941A (en) * | 1990-12-10 | 1991-12-24 | Cornell Research Foundation, Inc. | Enhancing bonding at metal-ceramic interfaces |
US5173354A (en) * | 1990-12-13 | 1992-12-22 | Cornell Research Foundation, Inc. | Non-beading, thin-film, metal-coated ceramic substrate |
JP2611726B2 (ja) * | 1993-10-07 | 1997-05-21 | 日本電気株式会社 | 半導体装置の製造方法 |
US5670417A (en) * | 1996-03-25 | 1997-09-23 | Motorola, Inc. | Method for fabricating self-aligned semiconductor component |
DE19828846C2 (de) | 1998-06-27 | 2001-01-18 | Micronas Gmbh | Verfahren zum Beschichten eines Substrats |
US7226835B2 (en) * | 2001-12-28 | 2007-06-05 | Texas Instruments Incorporated | Versatile system for optimizing current gain in bipolar transistor structures |
CN101826472A (zh) * | 2010-03-04 | 2010-09-08 | 江阴新顺微电子有限公司 | 芯片背面复合材料多层金属化方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3274670A (en) * | 1965-03-18 | 1966-09-27 | Bell Telephone Labor Inc | Semiconductor contact |
US3615929A (en) * | 1965-07-08 | 1971-10-26 | Texas Instruments Inc | Method of forming epitaxial region of predetermined thickness and article of manufacture |
US3410250A (en) * | 1965-10-19 | 1968-11-12 | Western Electric Co | Spray nozzle assembly |
DE1806980A1 (de) * | 1967-11-15 | 1969-06-19 | Fairchild Camera Instr Co | Halbleiter-Bauelement |
US3574008A (en) * | 1968-08-19 | 1971-04-06 | Trw Semiconductors Inc | Mushroom epitaxial growth in tier-type shaped holes |
US3558366A (en) * | 1968-09-17 | 1971-01-26 | Bell Telephone Labor Inc | Metal shielding for ion implanted semiconductor device |
US3632436A (en) * | 1969-07-11 | 1972-01-04 | Rca Corp | Contact system for semiconductor devices |
BE755371A (fr) * | 1969-08-27 | 1971-02-01 | Ibm | Contacts ohmiques pour dispositifs semi-conducteurs |
US3604986A (en) * | 1970-03-17 | 1971-09-14 | Bell Telephone Labor Inc | High frequency transistors with shallow emitters |
-
1971
- 1971-04-05 US US00131340A patent/US3753774A/en not_active Expired - Lifetime
-
1972
- 1972-03-08 CA CA136,598A patent/CA968676A/en not_active Expired
- 1972-03-27 IT IT22442/72A patent/IT950802B/it active
- 1972-03-29 FR FR7210987A patent/FR2132167B1/fr not_active Expired
- 1972-03-29 GB GB1469272A patent/GB1321034A/en not_active Expired
- 1972-03-29 DE DE19722215357 patent/DE2215357A1/de active Pending
- 1972-04-04 BE BE781643A patent/BE781643A/fr unknown
- 1972-04-04 NL NL7204469A patent/NL7204469A/xx unknown
- 1972-04-05 AU AU40780/72A patent/AU465779B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE2215357A1 (de) | 1972-10-12 |
US3753774A (en) | 1973-08-21 |
IT950802B (it) | 1973-06-20 |
CA968676A (en) | 1975-06-03 |
AU465779B2 (en) | 1973-10-11 |
NL7204469A (fr) | 1972-10-09 |
AU4078072A (en) | 1973-10-11 |
GB1321034A (en) | 1973-06-20 |
FR2132167B1 (fr) | 1977-08-19 |
FR2132167A1 (fr) | 1972-11-17 |
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