BE724277A - - Google Patents

Info

Publication number
BE724277A
BE724277A BE724277DA BE724277A BE 724277 A BE724277 A BE 724277A BE 724277D A BE724277D A BE 724277DA BE 724277 A BE724277 A BE 724277A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE724277A publication Critical patent/BE724277A/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/66Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/68Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
    • H10D64/681Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator having a compositional variation, e.g. multilayered
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/112Constructional design considerations for preventing surface leakage or controlling electric field concentration for preventing surface leakage due to surface inversion layers, e.g. by using channel stoppers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/84Combinations of enhancement-mode IGFETs and depletion-mode IGFETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass
BE724277D 1967-11-21 1968-11-21 BE724277A (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6715753.A NL162250C (nl) 1967-11-21 1967-11-21 Halfgeleiderinrichting met een halfgeleiderlichaam, waarvan aan een hoofdoppervlak het halfgeleideroppervlak plaatselijk met een oxydelaag is bedekt, en werkwijze voor het vervaardigen van planaire halfgeleider- inrichtingen.

Publications (1)

Publication Number Publication Date
BE724277A true BE724277A (en:Method) 1969-05-21

Family

ID=19801764

Family Applications (1)

Application Number Title Priority Date Filing Date
BE724277D BE724277A (en:Method) 1967-11-21 1968-11-21

Country Status (12)

Country Link
US (1) US3649886A (en:Method)
JP (1) JPS5528217B1 (en:Method)
AT (1) AT320737B (en:Method)
BE (1) BE724277A (en:Method)
BR (1) BR6804218D0 (en:Method)
CH (1) CH527497A (en:Method)
DE (1) DE1809817A1 (en:Method)
ES (1) ES360408A1 (en:Method)
FR (1) FR1592750A (en:Method)
GB (1) GB1250509A (en:Method)
NL (1) NL162250C (en:Method)
SE (1) SE354378B (en:Method)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4089992A (en) * 1965-10-11 1978-05-16 International Business Machines Corporation Method for depositing continuous pinhole free silicon nitride films and products produced thereby
DE2047998A1 (de) * 1970-09-30 1972-04-06 Licentia Gmbh Verfahren zum Herstellen einer Planaranordnung
US3856587A (en) * 1971-03-26 1974-12-24 Co Yamazaki Kogyo Kk Method of fabricating semiconductor memory device gate
US3853496A (en) * 1973-01-02 1974-12-10 Gen Electric Method of making a metal insulator silicon field effect transistor (mis-fet) memory device and the product
DE2316096B2 (de) * 1973-03-30 1975-02-27 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung von integrierten Schaltungen mit Feldeffekttransistoren unterschiedlichen Leltungszustandes
US3924024A (en) * 1973-04-02 1975-12-02 Ncr Co Process for fabricating MNOS non-volatile memories
JPS6022497B2 (ja) * 1974-10-26 1985-06-03 ソニー株式会社 半導体装置
JPS5922381B2 (ja) * 1975-12-03 1984-05-26 株式会社東芝 ハンドウタイソシノ セイゾウホウホウ
JPS54149469A (en) * 1978-05-16 1979-11-22 Toshiba Corp Semiconductor device
JPS5587444A (en) 1978-12-26 1980-07-02 Fujitsu Ltd Method of forming insulating film on semiconductor surface
JPS5627935A (en) * 1979-08-15 1981-03-18 Toshiba Corp Semiconductor device
GB2087147B (en) * 1980-11-06 1985-03-13 Nat Res Dev Methods of manufacturing semiconductor devices
US4412242A (en) * 1980-11-17 1983-10-25 International Rectifier Corporation Planar structure for high voltage semiconductor devices with gaps in glassy layer over high field regions
US4430663A (en) 1981-03-25 1984-02-07 Bell Telephone Laboratories, Incorporated Prevention of surface channels in silicon semiconductor devices
US5043293A (en) * 1984-05-03 1991-08-27 Texas Instruments Incorporated Dual oxide channel stop for semiconductor devices
US5260233A (en) * 1992-11-06 1993-11-09 International Business Machines Corporation Semiconductor device and wafer structure having a planar buried interconnect by wafer bonding
JPH1187663A (ja) * 1997-09-11 1999-03-30 Nec Corp 半導体集積回路装置およびその製造方法
US6168859B1 (en) * 1998-01-29 2001-01-02 The Dow Chemical Company Filler powder comprising a partially coated alumina powder and process to make the filler powder
US7067861B1 (en) * 1998-11-25 2006-06-27 Micron Technology, Inc. Device and method for protecting against oxidation of a conductive layer in said device
US6303972B1 (en) 1998-11-25 2001-10-16 Micron Technology, Inc. Device including a conductive layer protected against oxidation
DE19923466B4 (de) 1999-05-21 2005-09-29 Infineon Technologies Ag Junctionsisolierter Lateral-MOSFET für High-/Low-Side-Schalter
JP2007165492A (ja) * 2005-12-13 2007-06-28 Seiko Instruments Inc 半導体集積回路装置
US10211326B2 (en) * 2016-03-31 2019-02-19 Stmicroelectronics (Tours) Sas Vertical power component
FR3049769B1 (fr) * 2016-03-31 2018-07-27 Stmicroelectronics (Tours) Sas Composant de puissance vertical
FR3049770B1 (fr) * 2016-03-31 2018-07-27 Stmicroelectronics (Tours) Sas Composant de puissance vertical

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA667423A (en) * 1963-07-23 Northern Electric Company Limited Semiconductor device and method of manufacture
US3477886A (en) * 1964-12-07 1969-11-11 Motorola Inc Controlled diffusions in semiconductive materials
US3484313A (en) * 1965-03-25 1969-12-16 Hitachi Ltd Method of manufacturing semiconductor devices
US3463974A (en) * 1966-07-01 1969-08-26 Fairchild Camera Instr Co Mos transistor and method of manufacture
US3455020A (en) * 1966-10-13 1969-07-15 Rca Corp Method of fabricating insulated-gate field-effect devices
US3475234A (en) * 1967-03-27 1969-10-28 Bell Telephone Labor Inc Method for making mis structures
US3550256A (en) * 1967-12-21 1970-12-29 Fairchild Camera Instr Co Control of surface inversion of p- and n-type silicon using dense dielectrics

Also Published As

Publication number Publication date
AT320737B (de) 1975-02-25
NL162250B (nl) 1979-11-15
US3649886A (en) 1972-03-14
FR1592750A (en:Method) 1970-05-19
NL162250C (nl) 1980-04-15
SE354378B (en:Method) 1973-03-05
JPS5528217B1 (en:Method) 1980-07-26
GB1250509A (en:Method) 1971-10-20
NL6715753A (en:Method) 1969-05-23
CH527497A (de) 1972-08-31
ES360408A1 (es) 1970-10-16
BR6804218D0 (pt) 1973-04-17
DE1809817A1 (de) 1969-12-11

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