BE724277A - - Google Patents
Info
- Publication number
- BE724277A BE724277A BE724277DA BE724277A BE 724277 A BE724277 A BE 724277A BE 724277D A BE724277D A BE 724277DA BE 724277 A BE724277 A BE 724277A
- Authority
- BE
- Belgium
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
- H10D64/681—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator having a compositional variation, e.g. multilayered
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/112—Constructional design considerations for preventing surface leakage or controlling electric field concentration for preventing surface leakage due to surface inversion layers, e.g. by using channel stoppers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
- H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
- H10D84/84—Combinations of enhancement-mode IGFETs and depletion-mode IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL6715753.A NL162250C (nl) | 1967-11-21 | 1967-11-21 | Halfgeleiderinrichting met een halfgeleiderlichaam, waarvan aan een hoofdoppervlak het halfgeleideroppervlak plaatselijk met een oxydelaag is bedekt, en werkwijze voor het vervaardigen van planaire halfgeleider- inrichtingen. |
Publications (1)
Publication Number | Publication Date |
---|---|
BE724277A true BE724277A (xx) | 1969-05-21 |
Family
ID=19801764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE724277D BE724277A (xx) | 1967-11-21 | 1968-11-21 |
Country Status (12)
Country | Link |
---|---|
US (1) | US3649886A (xx) |
JP (1) | JPS5528217B1 (xx) |
AT (1) | AT320737B (xx) |
BE (1) | BE724277A (xx) |
BR (1) | BR6804218D0 (xx) |
CH (1) | CH527497A (xx) |
DE (1) | DE1809817A1 (xx) |
ES (1) | ES360408A1 (xx) |
FR (1) | FR1592750A (xx) |
GB (1) | GB1250509A (xx) |
NL (1) | NL162250C (xx) |
SE (1) | SE354378B (xx) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4089992A (en) * | 1965-10-11 | 1978-05-16 | International Business Machines Corporation | Method for depositing continuous pinhole free silicon nitride films and products produced thereby |
DE2047998A1 (de) * | 1970-09-30 | 1972-04-06 | Licentia Gmbh | Verfahren zum Herstellen einer Planaranordnung |
US3856587A (en) * | 1971-03-26 | 1974-12-24 | Co Yamazaki Kogyo Kk | Method of fabricating semiconductor memory device gate |
US3853496A (en) * | 1973-01-02 | 1974-12-10 | Gen Electric | Method of making a metal insulator silicon field effect transistor (mis-fet) memory device and the product |
DE2316096B2 (de) * | 1973-03-30 | 1975-02-27 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur Herstellung von integrierten Schaltungen mit Feldeffekttransistoren unterschiedlichen Leltungszustandes |
US3924024A (en) * | 1973-04-02 | 1975-12-02 | Ncr Co | Process for fabricating MNOS non-volatile memories |
JPS6022497B2 (ja) * | 1974-10-26 | 1985-06-03 | ソニー株式会社 | 半導体装置 |
JPS5922381B2 (ja) * | 1975-12-03 | 1984-05-26 | 株式会社東芝 | ハンドウタイソシノ セイゾウホウホウ |
JPS54149469A (en) * | 1978-05-16 | 1979-11-22 | Toshiba Corp | Semiconductor device |
JPS5627935A (en) * | 1979-08-15 | 1981-03-18 | Toshiba Corp | Semiconductor device |
GB2087147B (en) * | 1980-11-06 | 1985-03-13 | Nat Res Dev | Methods of manufacturing semiconductor devices |
US4412242A (en) * | 1980-11-17 | 1983-10-25 | International Rectifier Corporation | Planar structure for high voltage semiconductor devices with gaps in glassy layer over high field regions |
US5043293A (en) * | 1984-05-03 | 1991-08-27 | Texas Instruments Incorporated | Dual oxide channel stop for semiconductor devices |
US5260233A (en) * | 1992-11-06 | 1993-11-09 | International Business Machines Corporation | Semiconductor device and wafer structure having a planar buried interconnect by wafer bonding |
JPH1187663A (ja) * | 1997-09-11 | 1999-03-30 | Nec Corp | 半導体集積回路装置およびその製造方法 |
US6168859B1 (en) * | 1998-01-29 | 2001-01-02 | The Dow Chemical Company | Filler powder comprising a partially coated alumina powder and process to make the filler powder |
US6303972B1 (en) | 1998-11-25 | 2001-10-16 | Micron Technology, Inc. | Device including a conductive layer protected against oxidation |
US7067861B1 (en) | 1998-11-25 | 2006-06-27 | Micron Technology, Inc. | Device and method for protecting against oxidation of a conductive layer in said device |
DE19923466B4 (de) * | 1999-05-21 | 2005-09-29 | Infineon Technologies Ag | Junctionsisolierter Lateral-MOSFET für High-/Low-Side-Schalter |
JP2007165492A (ja) * | 2005-12-13 | 2007-06-28 | Seiko Instruments Inc | 半導体集積回路装置 |
FR3049770B1 (fr) * | 2016-03-31 | 2018-07-27 | Stmicroelectronics (Tours) Sas | Composant de puissance vertical |
US10211326B2 (en) * | 2016-03-31 | 2019-02-19 | Stmicroelectronics (Tours) Sas | Vertical power component |
FR3049769B1 (fr) * | 2016-03-31 | 2018-07-27 | Stmicroelectronics (Tours) Sas | Composant de puissance vertical |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA667423A (en) * | 1963-07-23 | Northern Electric Company Limited | Semiconductor device and method of manufacture | |
US3477886A (en) * | 1964-12-07 | 1969-11-11 | Motorola Inc | Controlled diffusions in semiconductive materials |
US3484313A (en) * | 1965-03-25 | 1969-12-16 | Hitachi Ltd | Method of manufacturing semiconductor devices |
US3463974A (en) * | 1966-07-01 | 1969-08-26 | Fairchild Camera Instr Co | Mos transistor and method of manufacture |
US3455020A (en) * | 1966-10-13 | 1969-07-15 | Rca Corp | Method of fabricating insulated-gate field-effect devices |
US3475234A (en) * | 1967-03-27 | 1969-10-28 | Bell Telephone Labor Inc | Method for making mis structures |
US3550256A (en) * | 1967-12-21 | 1970-12-29 | Fairchild Camera Instr Co | Control of surface inversion of p- and n-type silicon using dense dielectrics |
-
1967
- 1967-11-21 NL NL6715753.A patent/NL162250C/xx not_active IP Right Cessation
-
1968
- 1968-11-09 ES ES360408A patent/ES360408A1/es not_active Expired
- 1968-11-18 CH CH1719568A patent/CH527497A/de not_active IP Right Cessation
- 1968-11-18 SE SE15645/68A patent/SE354378B/xx unknown
- 1968-11-18 GB GB1250509D patent/GB1250509A/en not_active Expired
- 1968-11-19 AT AT1121968A patent/AT320737B/de not_active IP Right Cessation
- 1968-11-19 US US776922A patent/US3649886A/en not_active Expired - Lifetime
- 1968-11-20 DE DE19681809817 patent/DE1809817A1/de not_active Ceased
- 1968-11-20 JP JP8461568A patent/JPS5528217B1/ja active Pending
- 1968-11-21 BR BR204218/68A patent/BR6804218D0/pt unknown
- 1968-11-21 FR FR1592750D patent/FR1592750A/fr not_active Expired
- 1968-11-21 BE BE724277D patent/BE724277A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
SE354378B (xx) | 1973-03-05 |
GB1250509A (xx) | 1971-10-20 |
NL6715753A (xx) | 1969-05-23 |
NL162250B (nl) | 1979-11-15 |
CH527497A (de) | 1972-08-31 |
AT320737B (de) | 1975-02-25 |
DE1809817A1 (de) | 1969-12-11 |
BR6804218D0 (pt) | 1973-04-17 |
NL162250C (nl) | 1980-04-15 |
JPS5528217B1 (xx) | 1980-07-26 |
US3649886A (en) | 1972-03-14 |
ES360408A1 (es) | 1970-10-16 |
FR1592750A (xx) | 1970-05-19 |