BE534701A
(pt)
*
|
1954-03-22 |
|
|
|
NL238490A
(pt)
*
|
1958-04-26 |
|
|
|
US3000799A
(en)
*
|
1960-02-10 |
1961-09-19 |
Harshaw Chem Corp |
Nickel plating solutions
|
DE1184172B
(de)
*
|
1961-08-31 |
1964-12-23 |
Dehydag Gmbh |
Verfahren zum galvanischen Abscheiden festhaftender und hochglaenzender Kupferueberzuege
|
NL291575A
(pt)
*
|
1962-04-16 |
|
|
|
FR1418244A
(fr)
*
|
1964-10-08 |
1965-11-19 |
Pernix Enthone |
Nouvelles sultones et leur application comme agents de nivellement des revêtements électrolytiques, notamment de nickel
|
FR1519645A
(fr)
*
|
1966-12-30 |
1968-04-05 |
Pernix Enthone |
Perfectionnements à l'étamage par voie électrolytique
|
US3956079A
(en)
*
|
1972-12-14 |
1976-05-11 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
US3966565A
(en)
*
|
1972-12-14 |
1976-06-29 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
US3956084A
(en)
*
|
1972-12-14 |
1976-05-11 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
US3956120A
(en)
*
|
1972-12-14 |
1976-05-11 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
US3940320A
(en)
*
|
1972-12-14 |
1976-02-24 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
US3956078A
(en)
*
|
1972-12-14 |
1976-05-11 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
DE2355581C3
(de)
*
|
1973-11-07 |
1979-07-12 |
Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt |
Galvanisches Glanzgoldbad mit hoher Abscheidungsgeschwindigkeit
|
US4014760A
(en)
*
|
1974-11-21 |
1977-03-29 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
US4036710A
(en)
*
|
1974-11-21 |
1977-07-19 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
US4036711A
(en)
*
|
1975-12-18 |
1977-07-19 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
DE2921241A1
(de)
*
|
1979-04-19 |
1980-10-23 |
Alusuisse |
Saurer zinn-ii-haltiger elektrolyt
|
US4376685A
(en)
*
|
1981-06-24 |
1983-03-15 |
M&T Chemicals Inc. |
Acid copper electroplating baths containing brightening and leveling additives
|
DE3817722A1
(de)
*
|
1988-05-25 |
1989-12-14 |
Raschig Ag |
Verwendung von 2-substituierten ethansulfon-verbindungen als galvanotechnische hilfsstoffe
|
US5385661A
(en)
*
|
1993-09-17 |
1995-01-31 |
International Business Machines Corporation |
Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition
|
JP3594894B2
(ja)
*
|
2000-02-01 |
2004-12-02 |
新光電気工業株式会社 |
ビアフィリングめっき方法
|
US6652731B2
(en)
*
|
2001-10-02 |
2003-11-25 |
Shipley Company, L.L.C. |
Plating bath and method for depositing a metal layer on a substrate
|
US6709568B2
(en)
|
2002-06-13 |
2004-03-23 |
Advanced Technology Materials, Inc. |
Method for determining concentrations of additives in acid copper electrochemical deposition baths
|
US20050067304A1
(en)
*
|
2003-09-26 |
2005-03-31 |
King Mackenzie E. |
Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanism
|
US20050109624A1
(en)
*
|
2003-11-25 |
2005-05-26 |
Mackenzie King |
On-wafer electrochemical deposition plating metrology process and apparatus
|
US20050224370A1
(en)
*
|
2004-04-07 |
2005-10-13 |
Jun Liu |
Electrochemical deposition analysis system including high-stability electrode
|
US6984299B2
(en)
*
|
2004-04-27 |
2006-01-10 |
Advanced Technology Material, Inc. |
Methods for determining organic component concentrations in an electrolytic solution
|
US7435320B2
(en)
|
2004-04-30 |
2008-10-14 |
Advanced Technology Materials, Inc. |
Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
|
US7427346B2
(en)
*
|
2004-05-04 |
2008-09-23 |
Advanced Technology Materials, Inc. |
Electrochemical drive circuitry and method
|
US7153408B1
(en)
*
|
2006-04-13 |
2006-12-26 |
Herdman Roderick D |
Copper electroplating of printing cylinders
|
TWI374502B
(en)
*
|
2007-05-14 |
2012-10-11 |
Renesas Electronics Corp |
Method of manufacturing semiconductor device to decrease defect number of plating film
|
EP2551375A1
(en)
*
|
2011-07-26 |
2013-01-30 |
Atotech Deutschland GmbH |
Electroless nickel plating bath composition
|
CN104152877B
(zh)
*
|
2014-07-17 |
2017-02-15 |
广东致卓精密金属科技有限公司 |
一种化学镀镍液
|