FR1119382A - Procédé d'obtention de revêtements métalliques - Google Patents

Procédé d'obtention de revêtements métalliques

Info

Publication number
FR1119382A
FR1119382A FR1119382DA FR1119382A FR 1119382 A FR1119382 A FR 1119382A FR 1119382D A FR1119382D A FR 1119382DA FR 1119382 A FR1119382 A FR 1119382A
Authority
FR
France
Prior art keywords
metallic coatings
obtaining metallic
obtaining
coatings
metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DEHYDAG
Dehydag Deutsche Hydrierwerke GmbH
Original Assignee
DEHYDAG
Dehydag Deutsche Hydrierwerke GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DED17379A external-priority patent/DE1037801B/de
Application filed by DEHYDAG, Dehydag Deutsche Hydrierwerke GmbH filed Critical DEHYDAG
Application granted granted Critical
Publication of FR1119382A publication Critical patent/FR1119382A/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
FR1119382D 1954-03-22 1955-02-16 Procédé d'obtention de revêtements métalliques Expired FR1119382A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DED17379A DE1037801B (de) 1954-03-22 1954-03-22 Bad zur galvanischen Herstellung von Metallueberzuegen
DED0028636 1958-07-29

Publications (1)

Publication Number Publication Date
FR1119382A true FR1119382A (fr) 1956-06-19

Family

ID=25970687

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1119382D Expired FR1119382A (fr) 1954-03-22 1955-02-16 Procédé d'obtention de revêtements métalliques

Country Status (6)

Country Link
US (2) US2830014A (fr)
BE (1) BE534701A (fr)
CH (2) CH336668A (fr)
DE (1) DE1075398B (fr)
FR (1) FR1119382A (fr)
GB (2) GB804833A (fr)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1075398B (de) * 1954-03-22 1960-02-11 DEHYDAG Deutsche Hydrierwerke G.m.b.H., Düsseldorf Bad zur galvanischen Herstellung von Metallüberzügen
NL238490A (fr) * 1958-04-26
US3000799A (en) * 1960-02-10 1961-09-19 Harshaw Chem Corp Nickel plating solutions
DE1184172B (de) * 1961-08-31 1964-12-23 Dehydag Gmbh Verfahren zum galvanischen Abscheiden festhaftender und hochglaenzender Kupferueberzuege
NL291575A (fr) * 1962-04-16
FR1418244A (fr) * 1964-10-08 1965-11-19 Pernix Enthone Nouvelles sultones et leur application comme agents de nivellement des revêtements électrolytiques, notamment de nickel
FR1519645A (fr) * 1966-12-30 1968-04-05 Pernix Enthone Perfectionnements à l'étamage par voie électrolytique
US3956078A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3966565A (en) * 1972-12-14 1976-06-29 M & T Chemicals Inc. Electrodeposition of copper
US3956120A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3956079A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3956084A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3940320A (en) * 1972-12-14 1976-02-24 M & T Chemicals Inc. Electrodeposition of copper
DE2355581C3 (de) * 1973-11-07 1979-07-12 Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt Galvanisches Glanzgoldbad mit hoher Abscheidungsgeschwindigkeit
US4036710A (en) * 1974-11-21 1977-07-19 M & T Chemicals Inc. Electrodeposition of copper
US4014760A (en) * 1974-11-21 1977-03-29 M & T Chemicals Inc. Electrodeposition of copper
US4036711A (en) * 1975-12-18 1977-07-19 M & T Chemicals Inc. Electrodeposition of copper
DE2921241A1 (de) * 1979-04-19 1980-10-23 Alusuisse Saurer zinn-ii-haltiger elektrolyt
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
DE3817722A1 (de) * 1988-05-25 1989-12-14 Raschig Ag Verwendung von 2-substituierten ethansulfon-verbindungen als galvanotechnische hilfsstoffe
US5385661A (en) * 1993-09-17 1995-01-31 International Business Machines Corporation Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition
JP3594894B2 (ja) * 2000-02-01 2004-12-02 新光電気工業株式会社 ビアフィリングめっき方法
US6652731B2 (en) * 2001-10-02 2003-11-25 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US6709568B2 (en) 2002-06-13 2004-03-23 Advanced Technology Materials, Inc. Method for determining concentrations of additives in acid copper electrochemical deposition baths
US20050067304A1 (en) * 2003-09-26 2005-03-31 King Mackenzie E. Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanism
US20050109624A1 (en) * 2003-11-25 2005-05-26 Mackenzie King On-wafer electrochemical deposition plating metrology process and apparatus
US20050224370A1 (en) * 2004-04-07 2005-10-13 Jun Liu Electrochemical deposition analysis system including high-stability electrode
US6984299B2 (en) * 2004-04-27 2006-01-10 Advanced Technology Material, Inc. Methods for determining organic component concentrations in an electrolytic solution
US7435320B2 (en) 2004-04-30 2008-10-14 Advanced Technology Materials, Inc. Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
US7427346B2 (en) * 2004-05-04 2008-09-23 Advanced Technology Materials, Inc. Electrochemical drive circuitry and method
US7153408B1 (en) * 2006-04-13 2006-12-26 Herdman Roderick D Copper electroplating of printing cylinders
US20080283404A1 (en) * 2007-05-14 2008-11-20 Nec Electronics Corporation Method of manufacturing semiconductor device to decrease defect number of plating film
EP2551375A1 (fr) 2011-07-26 2013-01-30 Atotech Deutschland GmbH Composition de bain pour placage autocatalytique de nickel
CN104152877B (zh) * 2014-07-17 2017-02-15 广东致卓精密金属科技有限公司 一种化学镀镍液

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2489538A (en) * 1941-05-24 1949-11-29 Gen Motors Corp Electrodeposition of copper
US2647866A (en) * 1950-07-17 1953-08-04 Udylite Corp Electroplating of nickel
US2663684A (en) * 1952-06-02 1953-12-22 Houdaille Hershey Corp Method of and composition for plating copper
NL109804C (fr) * 1953-09-19
DE1075398B (de) * 1954-03-22 1960-02-11 DEHYDAG Deutsche Hydrierwerke G.m.b.H., Düsseldorf Bad zur galvanischen Herstellung von Metallüberzügen
BE556462A (fr) * 1956-06-15

Also Published As

Publication number Publication date
GB868898A (en) 1961-05-25
DE1075398B (de) 1960-02-11
CH336668A (de) 1959-02-28
GB804833A (en) 1958-11-26
US2830014A (en) 1958-04-08
CH377611A (de) 1964-05-15
US3023150A (en) 1962-02-27
BE534701A (fr)

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