BE534701A - - Google Patents

Info

Publication number
BE534701A
BE534701A BE534701DA BE534701A BE 534701 A BE534701 A BE 534701A BE 534701D A BE534701D A BE 534701DA BE 534701 A BE534701 A BE 534701A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of BE534701A publication Critical patent/BE534701A/xx
Priority claimed from DED17379A external-priority patent/DE1037801B/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Paints Or Removers (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Nitrogen And Oxygen As The Only Ring Hetero Atoms (AREA)
BE534701D 1954-03-22 BE534701A (enrdf_load_html_response)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DED17379A DE1037801B (de) 1954-03-22 1954-03-22 Bad zur galvanischen Herstellung von Metallueberzuegen
DED0028636 1958-07-29

Publications (1)

Publication Number Publication Date
BE534701A true BE534701A (enrdf_load_html_response)

Family

ID=25970687

Family Applications (1)

Application Number Title Priority Date Filing Date
BE534701D BE534701A (enrdf_load_html_response) 1954-03-22

Country Status (6)

Country Link
US (2) US2830014A (enrdf_load_html_response)
BE (1) BE534701A (enrdf_load_html_response)
CH (2) CH336668A (enrdf_load_html_response)
DE (1) DE1075398B (enrdf_load_html_response)
FR (1) FR1119382A (enrdf_load_html_response)
GB (2) GB804833A (enrdf_load_html_response)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1075398B (de) * 1954-03-22 1960-02-11 DEHYDAG Deutsche Hydrierwerke G.m.b.H., Düsseldorf Bad zur galvanischen Herstellung von Metallüberzügen
NL238490A (enrdf_load_html_response) * 1958-04-26
US3000799A (en) * 1960-02-10 1961-09-19 Harshaw Chem Corp Nickel plating solutions
DE1184172B (de) * 1961-08-31 1964-12-23 Dehydag Gmbh Verfahren zum galvanischen Abscheiden festhaftender und hochglaenzender Kupferueberzuege
NL291575A (enrdf_load_html_response) * 1962-04-16
FR1418244A (fr) * 1964-10-08 1965-11-19 Pernix Enthone Nouvelles sultones et leur application comme agents de nivellement des revêtements électrolytiques, notamment de nickel
FR1519645A (fr) * 1966-12-30 1968-04-05 Pernix Enthone Perfectionnements à l'étamage par voie électrolytique
US3940320A (en) * 1972-12-14 1976-02-24 M & T Chemicals Inc. Electrodeposition of copper
US3966565A (en) * 1972-12-14 1976-06-29 M & T Chemicals Inc. Electrodeposition of copper
US3956120A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3956078A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3956079A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3956084A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
DE2355581C3 (de) * 1973-11-07 1979-07-12 Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt Galvanisches Glanzgoldbad mit hoher Abscheidungsgeschwindigkeit
US4036710A (en) * 1974-11-21 1977-07-19 M & T Chemicals Inc. Electrodeposition of copper
US4014760A (en) * 1974-11-21 1977-03-29 M & T Chemicals Inc. Electrodeposition of copper
US4036711A (en) * 1975-12-18 1977-07-19 M & T Chemicals Inc. Electrodeposition of copper
DE2921241A1 (de) * 1979-04-19 1980-10-23 Alusuisse Saurer zinn-ii-haltiger elektrolyt
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
DE3817722A1 (de) * 1988-05-25 1989-12-14 Raschig Ag Verwendung von 2-substituierten ethansulfon-verbindungen als galvanotechnische hilfsstoffe
US5385661A (en) * 1993-09-17 1995-01-31 International Business Machines Corporation Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition
JP3594894B2 (ja) * 2000-02-01 2004-12-02 新光電気工業株式会社 ビアフィリングめっき方法
US6652731B2 (en) * 2001-10-02 2003-11-25 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US6709568B2 (en) 2002-06-13 2004-03-23 Advanced Technology Materials, Inc. Method for determining concentrations of additives in acid copper electrochemical deposition baths
US20050067304A1 (en) * 2003-09-26 2005-03-31 King Mackenzie E. Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanism
US20050109624A1 (en) * 2003-11-25 2005-05-26 Mackenzie King On-wafer electrochemical deposition plating metrology process and apparatus
US20050224370A1 (en) * 2004-04-07 2005-10-13 Jun Liu Electrochemical deposition analysis system including high-stability electrode
US6984299B2 (en) * 2004-04-27 2006-01-10 Advanced Technology Material, Inc. Methods for determining organic component concentrations in an electrolytic solution
US7435320B2 (en) 2004-04-30 2008-10-14 Advanced Technology Materials, Inc. Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
US7427346B2 (en) * 2004-05-04 2008-09-23 Advanced Technology Materials, Inc. Electrochemical drive circuitry and method
US7153408B1 (en) * 2006-04-13 2006-12-26 Herdman Roderick D Copper electroplating of printing cylinders
TWI374502B (en) * 2007-05-14 2012-10-11 Renesas Electronics Corp Method of manufacturing semiconductor device to decrease defect number of plating film
EP2551375A1 (en) 2011-07-26 2013-01-30 Atotech Deutschland GmbH Electroless nickel plating bath composition
CN104152877B (zh) * 2014-07-17 2017-02-15 广东致卓精密金属科技有限公司 一种化学镀镍液

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2489538A (en) * 1941-05-24 1949-11-29 Gen Motors Corp Electrodeposition of copper
US2647866A (en) * 1950-07-17 1953-08-04 Udylite Corp Electroplating of nickel
US2663684A (en) * 1952-06-02 1953-12-22 Houdaille Hershey Corp Method of and composition for plating copper
BE543413A (enrdf_load_html_response) * 1953-09-19
DE1075398B (de) * 1954-03-22 1960-02-11 DEHYDAG Deutsche Hydrierwerke G.m.b.H., Düsseldorf Bad zur galvanischen Herstellung von Metallüberzügen
NL217034A (enrdf_load_html_response) * 1956-06-15

Also Published As

Publication number Publication date
DE1075398B (de) 1960-02-11
FR1119382A (fr) 1956-06-19
CH336668A (de) 1959-02-28
US2830014A (en) 1958-04-08
US3023150A (en) 1962-02-27
GB868898A (en) 1961-05-25
GB804833A (en) 1958-11-26
CH377611A (de) 1964-05-15

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