AU9784998A - Programmed pulse electroplating process - Google Patents

Programmed pulse electroplating process

Info

Publication number
AU9784998A
AU9784998A AU97849/98A AU9784998A AU9784998A AU 9784998 A AU9784998 A AU 9784998A AU 97849/98 A AU97849/98 A AU 97849/98A AU 9784998 A AU9784998 A AU 9784998A AU 9784998 A AU9784998 A AU 9784998A
Authority
AU
Australia
Prior art keywords
electroplating process
programmed pulse
pulse electroplating
programmed
pulse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU97849/98A
Other languages
English (en)
Inventor
James L. Martin
Stephane Menard
David Michelen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
LeaRonal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LeaRonal Inc filed Critical LeaRonal Inc
Publication of AU9784998A publication Critical patent/AU9784998A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
AU97849/98A 1997-10-06 1998-10-05 Programmed pulse electroplating process Abandoned AU9784998A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/944,753 US6071398A (en) 1997-10-06 1997-10-06 Programmed pulse electroplating process
US08944753 1997-10-06
PCT/US1998/020867 WO1999018266A1 (en) 1997-10-06 1998-10-05 Programmed pulse electroplating process

Publications (1)

Publication Number Publication Date
AU9784998A true AU9784998A (en) 1999-04-27

Family

ID=25482003

Family Applications (1)

Application Number Title Priority Date Filing Date
AU97849/98A Abandoned AU9784998A (en) 1997-10-06 1998-10-05 Programmed pulse electroplating process

Country Status (6)

Country Link
US (2) US6071398A (cg-RX-API-DMAC7.html)
EP (1) EP1042540A4 (cg-RX-API-DMAC7.html)
JP (1) JP2001519480A (cg-RX-API-DMAC7.html)
KR (1) KR100572433B1 (cg-RX-API-DMAC7.html)
AU (1) AU9784998A (cg-RX-API-DMAC7.html)
WO (1) WO1999018266A1 (cg-RX-API-DMAC7.html)

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US6071398A (en) * 1997-10-06 2000-06-06 Learonal, Inc. Programmed pulse electroplating process
DE19845506A1 (de) * 1998-10-02 2000-04-06 Wieland Edelmetalle Verfahren zur Herstellung von prothetischen Formteilen für den Dentalbereich und prothetisches Formteil
SE512160C2 (sv) * 1999-03-02 2000-02-07 Mecer Holdings Corp Förfarande för återvinning av koppar från ett alkaliskt etsbad
US6344419B1 (en) 1999-12-03 2002-02-05 Applied Materials, Inc. Pulsed-mode RF bias for sidewall coverage improvement
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DE10061186C1 (de) * 2000-12-07 2002-01-17 Astrium Gmbh Verfahren und Anordnung zur galvanischen Abscheidung von Nickel, Kobalt, Nickellegierungen oder Kobaltlegierungen mit periodischen Strompulsen und Verwendung des Verfahrens
JP2002235189A (ja) * 2001-02-05 2002-08-23 Sansha Electric Mfg Co Ltd めっき電流供給電源装置
US6881318B2 (en) * 2001-07-26 2005-04-19 Applied Materials, Inc. Dynamic pulse plating for high aspect ratio features
US6723219B2 (en) * 2001-08-27 2004-04-20 Micron Technology, Inc. Method of direct electroplating on a low conductivity material, and electroplated metal deposited therewith
KR20030025523A (ko) * 2001-09-21 2003-03-29 지에스티 반도체장비(주) Ｐｃｂ 전해도금장치
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JP2003183879A (ja) * 2001-12-18 2003-07-03 Learonal Japan Inc 電解めっき方法
JP3976564B2 (ja) * 2001-12-20 2007-09-19 日本リーロナール有限会社 ビアフィリング方法
US6919011B2 (en) * 2001-12-27 2005-07-19 The Hong Kong Polytechnic University Complex waveform electroplating
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DE10311575B4 (de) * 2003-03-10 2007-03-22 Atotech Deutschland Gmbh Verfahren zum elektrolytischen Metallisieren von Werkstücken mit Bohrungen mit einem hohen Aspektverhältnis
DE10314502B4 (de) * 2003-03-31 2008-06-12 Advanced Micro Devices, Inc., Sunnyvale Verfahren zum elektrolytischen Beschichten einer Halbleiterstruktur
US20060237324A1 (en) * 2003-05-21 2006-10-26 Fred Hayward Pulse plating process for deposition of gold-tin alloy
US20050157475A1 (en) * 2004-01-15 2005-07-21 Endicott Interconnect Technologies, Inc. Method of making printed circuit board with electroplated conductive through holes and board resulting therefrom
DE602005022650D1 (de) * 2004-04-26 2010-09-16 Rohm & Haas Elect Mat Verbessertes Plattierungsverfahren
DE102004041813A1 (de) * 2004-08-26 2006-03-02 Siemens Ag Oberfläche mit einer haftungsvermindernden Mikrostruktur und Verfahren zu deren Herstellung
DE102004045451B4 (de) 2004-09-20 2007-05-03 Atotech Deutschland Gmbh Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer
SE0403047D0 (sv) * 2004-12-14 2004-12-14 Polymer Kompositer I Goeteborg Pulse-plating method and apparatus
WO2006078549A1 (en) * 2005-01-21 2006-07-27 Technic, Inc. Pulse plating process for deposition of gold-tin alloy
DE102005006014A1 (de) * 2005-02-04 2006-08-10 Siemens Ag Bauteil mit einer Beschichtung zur Verringerung der Benetzbarkeit der Oberfläche und Verfahren zu dessen Herstellung
US7425255B2 (en) * 2005-06-07 2008-09-16 Massachusetts Institute Of Technology Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition
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US20100096850A1 (en) * 2006-10-31 2010-04-22 Massachusetts Institute Of Technology Nanostructured alloy coated threaded metal surfaces and methods of producing same
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CN102639758B (zh) 2009-06-08 2016-05-18 莫杜美拓有限公司 用于防腐蚀的电镀纳米叠层涂层和包层
US9631282B2 (en) * 2010-06-30 2017-04-25 Schauenburg Ruhrkunststoff Gmbh Method for depositing a nickel-metal layer
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US8512541B2 (en) 2010-11-16 2013-08-20 Trevor Pearson Electrolytic dissolution of chromium from chromium electrodes
JP6161863B2 (ja) * 2010-12-28 2017-07-12 株式会社荏原製作所 電気めっき方法
EP2568063A1 (en) * 2011-09-09 2013-03-13 Rohm and Haas Electronic Materials LLC Low internal stress copper electroplating method
WO2013074702A1 (en) 2011-11-15 2013-05-23 Ashwin-Ushas Corporation, Inc. Complimentary polymer electrochromic device
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CN108486622B (zh) 2013-03-15 2020-10-30 莫杜美拓有限公司 具有高硬度的镍铬纳米层压涂层
CN105593409A (zh) * 2013-08-07 2016-05-18 艾克泽基因公司 传感器生长控制器
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CN107109652B (zh) * 2014-12-31 2021-01-26 依视路国际公司 用于对光学物品进行反射镜涂覆的方法
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US6071398A (en) * 1997-10-06 2000-06-06 Learonal, Inc. Programmed pulse electroplating process

Also Published As

Publication number Publication date
EP1042540A1 (en) 2000-10-11
US6071398A (en) 2000-06-06
KR20010024422A (ko) 2001-03-26
KR100572433B1 (ko) 2006-04-18
WO1999018266A1 (en) 1999-04-15
JP2001519480A (ja) 2001-10-23
EP1042540A4 (en) 2006-05-10
US6402924B1 (en) 2002-06-11

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase