AU7329200A - Wafer level burn-in and electrical test system and method - Google Patents

Wafer level burn-in and electrical test system and method

Info

Publication number
AU7329200A
AU7329200A AU73292/00A AU7329200A AU7329200A AU 7329200 A AU7329200 A AU 7329200A AU 73292/00 A AU73292/00 A AU 73292/00A AU 7329200 A AU7329200 A AU 7329200A AU 7329200 A AU7329200 A AU 7329200A
Authority
AU
Australia
Prior art keywords
test system
wafer level
electrical test
level burn
burn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU73292/00A
Other languages
English (en)
Inventor
John Dinh Hoang
Jerzy Lobacz
Donald Paul Ii Richmond
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aehr Test Systems Inc
Original Assignee
Aehr Test Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/353,121 external-priority patent/US6562636B1/en
Priority claimed from US09/353,214 external-priority patent/US6340895B1/en
Application filed by Aehr Test Systems Inc filed Critical Aehr Test Systems Inc
Publication of AU7329200A publication Critical patent/AU7329200A/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
AU73292/00A 1999-07-14 2000-07-13 Wafer level burn-in and electrical test system and method Abandoned AU7329200A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/353,121 US6562636B1 (en) 1999-07-14 1999-07-14 Wafer level burn-in and electrical test system and method
US09353121 1999-07-14
US09/353,214 US6340895B1 (en) 1999-07-14 1999-07-14 Wafer-level burn-in and test cartridge
US09353214 1999-07-14
PCT/US2000/019482 WO2001004641A2 (en) 1999-07-14 2000-07-13 Wafer level burn-in and electrical test system and method

Publications (1)

Publication Number Publication Date
AU7329200A true AU7329200A (en) 2001-01-30

Family

ID=26997804

Family Applications (1)

Application Number Title Priority Date Filing Date
AU73292/00A Abandoned AU7329200A (en) 1999-07-14 2000-07-13 Wafer level burn-in and electrical test system and method

Country Status (4)

Country Link
JP (1) JP2003504889A (enExample)
KR (1) KR100751068B1 (enExample)
AU (1) AU7329200A (enExample)
WO (1) WO2001004641A2 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6815966B1 (en) * 2002-06-27 2004-11-09 Aehr Test Systems System for burn-in testing of electronic devices
JP5085534B2 (ja) 2005-04-27 2012-11-28 エイアー テスト システムズ 電子デバイスを試験するための装置
KR20060122387A (ko) * 2005-05-27 2006-11-30 삼창기업 주식회사 Ａ/ｄ컨버터 모듈
CN103295949B (zh) * 2007-04-05 2016-12-28 雅赫测试系统公司 测试微电子电路的方法、测试器设备及便携式组装
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
CN101644741B (zh) * 2008-08-04 2011-11-09 京元电子股份有限公司 具有电源塔的多层预烧板结构
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
KR101215945B1 (ko) 2012-07-27 2012-12-27 (주) 에이피 시스템 Ｓｐｄｓ 및 이를 포함하는 메모리 모듈 실장 테스트 장치
KR102842851B1 (ko) 2016-01-08 2025-08-05 에어 테스트 시스템즈 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템
EP4653878A2 (en) 2017-03-03 2025-11-26 AEHR Test Systems Electronics tester
CN115210589B (zh) * 2020-03-25 2023-07-18 华为技术有限公司 一种芯片测试装置及测试方法
CN120254561A (zh) 2020-10-07 2025-07-04 雅赫测试系统公司 电子测试器
KR102386473B1 (ko) * 2020-11-05 2022-04-13 광운대학교 산학협력단 Rf 빔포밍 집적회로의 웨이퍼 레벨 테스트 방법 및 장치
CN117894364B (zh) * 2024-01-16 2025-05-09 上海启泰沣华半导体科技有限公司 半导体时延测试方法、装置、电子设备和存储介质
CN120559451B (zh) * 2025-08-04 2025-10-03 上海启泰沣华半导体科技有限公司 一种芯片颗粒的自动化测试方法、系统和设备及计算机可读存储介质

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5103168A (en) * 1988-10-27 1992-04-07 Grumman Aerospace Corporation Stress testing equipment with an integral cooling plenum
JP3151203B2 (ja) * 1988-11-23 2001-04-03 テキサス インスツルメンツ インコーポレイテツド 集積回路の自己検査装置
JP3194040B2 (ja) * 1992-04-27 2001-07-30 カシオ計算機株式会社 Ｉｃモジュール
US5442282A (en) * 1992-07-02 1995-08-15 Lsi Logic Corporation Testing and exercising individual, unsingulated dies on a wafer
US5654588A (en) * 1993-07-23 1997-08-05 Motorola Inc. Apparatus for performing wafer-level testing of integrated circuits where the wafer uses a segmented conductive top-layer bus structure
US5385487A (en) * 1993-08-30 1995-01-31 At&T Corp. Apparatus for electrically operating devices in a controlled environment
US5429510A (en) * 1993-12-01 1995-07-04 Aehr Test Systems, Inc. High-density interconnect technique
JP2925964B2 (ja) * 1994-04-21 1999-07-28 松下電器産業株式会社 半導体ウェハ収納器及び半導体集積回路の検査方法
US6577148B1 (en) * 1994-08-31 2003-06-10 Motorola, Inc. Apparatus, method, and wafer used for testing integrated circuits formed on a product wafer
US5600257A (en) * 1995-08-09 1997-02-04 International Business Machines Corporation Semiconductor wafer test and burn-in
JPH10163281A (ja) * 1996-10-04 1998-06-19 Hitachi Ltd 半導体素子およびその製造方法
JP3364134B2 (ja) * 1997-10-20 2003-01-08 松下電器産業株式会社 ウェハカセット
JP3294175B2 (ja) * 1997-11-05 2002-06-24 東京エレクトロン株式会社 信頼性試験用ウエハ収納室

Also Published As

Publication number Publication date
WO2001004641A2 (en) 2001-01-18
KR100751068B1 (ko) 2007-08-22
JP2003504889A (ja) 2003-02-04
KR20020036835A (ko) 2002-05-16
WO2001004641A3 (en) 2001-12-06

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase