AU595071B2 - Piezoelectric sensing element - Google Patents
Piezoelectric sensing element Download PDFInfo
- Publication number
- AU595071B2 AU595071B2 AU79440/87A AU7944087A AU595071B2 AU 595071 B2 AU595071 B2 AU 595071B2 AU 79440/87 A AU79440/87 A AU 79440/87A AU 7944087 A AU7944087 A AU 7944087A AU 595071 B2 AU595071 B2 AU 595071B2
- Authority
- AU
- Australia
- Prior art keywords
- piezoelectric
- gold
- germanium
- layers
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- BYDQGSVXQDOSJJ-UHFFFAOYSA-N [Ge].[Au] Chemical compound [Ge].[Au] BYDQGSVXQDOSJJ-UHFFFAOYSA-N 0.000 claims description 72
- 238000000034 method Methods 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 16
- 238000000151 deposition Methods 0.000 claims description 15
- 229910000927 Ge alloy Inorganic materials 0.000 claims description 12
- 238000005452 bending Methods 0.000 claims description 10
- 238000004544 sputter deposition Methods 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims 3
- 230000008018 melting Effects 0.000 claims 3
- 239000000463 material Substances 0.000 description 22
- 229910045601 alloy Inorganic materials 0.000 description 15
- 239000000956 alloy Substances 0.000 description 15
- 229910017401 Au—Ge Inorganic materials 0.000 description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 230000005496 eutectics Effects 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 229910052732 germanium Inorganic materials 0.000 description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 4
- 230000010287 polarization Effects 0.000 description 4
- 238000005304 joining Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000006664 bond formation reaction Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 229910000497 Amalgam Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006333 epoxy cement Polymers 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- CBBVHSHLSCZIHD-UHFFFAOYSA-N mercury silver Chemical compound [Ag].[Hg] CBBVHSHLSCZIHD-UHFFFAOYSA-N 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000013598 vector Substances 0.000 description 1
- 235000012773 waffles Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Gyroscopes (AREA)
- Measuring Fluid Pressure (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/921,520 US4769882A (en) | 1986-10-22 | 1986-10-22 | Method for making piezoelectric sensing elements with gold-germanium bonding layers |
| US921520 | 1997-09-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU7944087A AU7944087A (en) | 1988-04-28 |
| AU595071B2 true AU595071B2 (en) | 1990-03-22 |
Family
ID=25445555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU79440/87A Ceased AU595071B2 (en) | 1986-10-22 | 1987-10-07 | Piezoelectric sensing element |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US4769882A (cg-RX-API-DMAC7.html) |
| EP (1) | EP0265090B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JPS63190391A (cg-RX-API-DMAC7.html) |
| AU (1) | AU595071B2 (cg-RX-API-DMAC7.html) |
| CA (1) | CA1317478C (cg-RX-API-DMAC7.html) |
| DE (1) | DE3771831D1 (cg-RX-API-DMAC7.html) |
| IL (1) | IL83901A (cg-RX-API-DMAC7.html) |
| NO (1) | NO178317C (cg-RX-API-DMAC7.html) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU1642962A3 (ru) * | 1989-06-16 | 1991-04-15 | Е.И.Новиков | Пьезочастотный датчик силы |
| JP3039971B2 (ja) * | 1989-09-19 | 2000-05-08 | 株式会社日立製作所 | 接合型圧電装置及び製造方法並びに接合型圧電素子 |
| FR2693795B1 (fr) * | 1992-07-15 | 1994-08-19 | Commissariat Energie Atomique | Jauge de contrainte sur support souple et capteur muni de ladite jauge. |
| US6484585B1 (en) | 1995-02-28 | 2002-11-26 | Rosemount Inc. | Pressure sensor for a pressure transmitter |
| US5755909A (en) * | 1996-06-26 | 1998-05-26 | Spectra, Inc. | Electroding of ceramic piezoelectric transducers |
| US6164140A (en) * | 1998-10-09 | 2000-12-26 | Kalinoski; Richard W. | Solid state transducer for Coriolis flowmeter |
| US6561038B2 (en) | 2000-01-06 | 2003-05-13 | Rosemount Inc. | Sensor with fluid isolation barrier |
| WO2001050106A1 (en) | 2000-01-06 | 2001-07-12 | Rosemount Inc. | Grain growth of electrical interconnection for microelectromechanical systems (mems) |
| US6505516B1 (en) | 2000-01-06 | 2003-01-14 | Rosemount Inc. | Capacitive pressure sensing with moving dielectric |
| US6508129B1 (en) * | 2000-01-06 | 2003-01-21 | Rosemount Inc. | Pressure sensor capsule with improved isolation |
| US6520020B1 (en) | 2000-01-06 | 2003-02-18 | Rosemount Inc. | Method and apparatus for a direct bonded isolated pressure sensor |
| JP2002144239A (ja) * | 2000-11-08 | 2002-05-21 | Alps Engineering:Kk | ノズル |
| US6672168B2 (en) | 2001-09-24 | 2004-01-06 | Andrew Braugh | Multi-level machine vibration tester marker pen |
| US6848316B2 (en) | 2002-05-08 | 2005-02-01 | Rosemount Inc. | Pressure sensor assembly |
| WO2004023572A1 (en) * | 2002-08-30 | 2004-03-18 | Usc Corporation | Piezoelectric generator |
| US7548012B2 (en) * | 2003-09-17 | 2009-06-16 | Kistler Holding, Ag | Multi-layer piezoelectric measuring element, and pressure sensor or force sensor comprising such a measuring element |
| JP3866258B2 (ja) * | 2004-08-24 | 2007-01-10 | 太平洋セメント株式会社 | 圧電デバイスおよびこれを備える圧電スイッチ |
| JP2009534651A (ja) * | 2006-04-20 | 2009-09-24 | ヴェクトロン インターナショナル，インク | 高圧環境用の電気音響センサ |
| WO2011035147A2 (en) * | 2009-09-18 | 2011-03-24 | Delaware Capital Formation, Inc. | Controlled compressional wave components of thickness shear mode multi-measurand sensors |
| EP3948967B1 (en) * | 2019-03-23 | 2023-04-19 | Secretary, Department Of Atomic Energy | Diffusion bonding of piezoelectric crystal to metal wear plate |
| CN110379916B (zh) * | 2019-07-05 | 2020-10-27 | 中国科学院物理研究所 | 压电陶瓷元件的制备方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3281612A (en) * | 1962-09-12 | 1966-10-25 | List Hans | Piezoelectric device, particularly a force measuring instrument and the process of manufacturing same |
| US3448503A (en) * | 1961-09-14 | 1969-06-10 | Us Navy | Method for joining piezoelectric elements |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2709147A (en) * | 1951-09-12 | 1955-05-24 | Bell Telephone Labor Inc | Methods for bonding silica bodies |
| US3590467A (en) * | 1968-11-15 | 1971-07-06 | Corning Glass Works | Method for bonding a crystal to a solid delay medium |
| FR2182295A5 (cg-RX-API-DMAC7.html) * | 1972-04-25 | 1973-12-07 | Thomson Csf | |
| US3897628A (en) * | 1973-11-19 | 1975-08-05 | Rca Corp | Method of forming a thin piezoelectric body metallically bonded to a propagation medium crystal |
| US3986251A (en) * | 1974-10-03 | 1976-10-19 | Motorola, Inc. | Germanium doped light emitting diode bonding process |
| US4042951A (en) * | 1975-09-25 | 1977-08-16 | Texas Instruments Incorporated | Gold-germanium alloy contacts for a semiconductor device |
| US4109031A (en) * | 1976-12-27 | 1978-08-22 | United Technologies Corporation | Stress relief of metal-ceramic gas turbine seals |
| US4078711A (en) * | 1977-04-14 | 1978-03-14 | Rockwell International Corporation | Metallurgical method for die attaching silicon on sapphire devices to obtain heat resistant bond |
| US4295373A (en) * | 1980-04-03 | 1981-10-20 | United Technologies Corporation | Fluidic angular rate sensor with integrated impulse jet pump assembly |
| JPS59145583A (ja) * | 1983-02-09 | 1984-08-21 | Matsushita Electric Ind Co Ltd | 積層型圧電変位素子 |
-
1986
- 1986-10-22 US US06/921,520 patent/US4769882A/en not_active Expired - Lifetime
-
1987
- 1987-09-15 IL IL8390187A patent/IL83901A/en not_active IP Right Cessation
- 1987-09-23 CA CA000547658A patent/CA1317478C/en not_active Expired - Fee Related
- 1987-09-25 DE DE8787308529T patent/DE3771831D1/de not_active Expired - Fee Related
- 1987-09-25 EP EP87308529A patent/EP0265090B1/en not_active Expired - Lifetime
- 1987-10-07 AU AU79440/87A patent/AU595071B2/en not_active Ceased
- 1987-10-21 NO NO874390A patent/NO178317C/no unknown
- 1987-10-22 JP JP62267591A patent/JPS63190391A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3448503A (en) * | 1961-09-14 | 1969-06-10 | Us Navy | Method for joining piezoelectric elements |
| US3281612A (en) * | 1962-09-12 | 1966-10-25 | List Hans | Piezoelectric device, particularly a force measuring instrument and the process of manufacturing same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63190391A (ja) | 1988-08-05 |
| EP0265090B1 (en) | 1991-07-31 |
| CA1317478C (en) | 1993-05-11 |
| NO178317B (no) | 1995-11-20 |
| EP0265090A2 (en) | 1988-04-27 |
| AU7944087A (en) | 1988-04-28 |
| EP0265090A3 (en) | 1988-09-21 |
| NO178317C (no) | 1996-02-28 |
| US4769882A (en) | 1988-09-13 |
| IL83901A (en) | 1994-08-26 |
| DE3771831D1 (de) | 1991-09-05 |
| JPH0346991B2 (cg-RX-API-DMAC7.html) | 1991-07-17 |
| NO874390L (no) | 1988-04-25 |
| NO874390D0 (no) | 1987-10-21 |
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