AU2015219268A1 - Efficient heat transfer from conduction-cooled circuit cards - Google Patents

Efficient heat transfer from conduction-cooled circuit cards Download PDF

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Publication number
AU2015219268A1
AU2015219268A1 AU2015219268A AU2015219268A AU2015219268A1 AU 2015219268 A1 AU2015219268 A1 AU 2015219268A1 AU 2015219268 A AU2015219268 A AU 2015219268A AU 2015219268 A AU2015219268 A AU 2015219268A AU 2015219268 A1 AU2015219268 A1 AU 2015219268A1
Authority
AU
Australia
Prior art keywords
conduction
thermal management
management interface
chassis
wedgelock
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2015219268A
Other languages
English (en)
Inventor
Charles H. Dando Iii
Clint Long
Randall J. Stutzman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lockheed Martin Corp
Original Assignee
Lockheed Corp
Lockheed Martin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lockheed Corp, Lockheed Martin Corp filed Critical Lockheed Corp
Publication of AU2015219268A1 publication Critical patent/AU2015219268A1/en
Priority to AU2019261815A priority Critical patent/AU2019261815A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/06—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of high energy impulses, e.g. magnetic energy
    • B23K20/08—Explosive welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AU2015219268A 2014-02-18 2015-02-13 Efficient heat transfer from conduction-cooled circuit cards Abandoned AU2015219268A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2019261815A AU2019261815A1 (en) 2014-02-18 2019-11-08 Efficient heat transfer from conduction-cooled circuit cards

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/182,803 2014-02-18
US14/182,803 US9357670B2 (en) 2014-02-18 2014-02-18 Efficient heat transfer from conduction-cooled circuit cards
PCT/US2015/015769 WO2015126745A1 (en) 2014-02-18 2015-02-13 Efficient heat transfer from conduction-cooled circuit cards

Related Child Applications (1)

Application Number Title Priority Date Filing Date
AU2019261815A Division AU2019261815A1 (en) 2014-02-18 2019-11-08 Efficient heat transfer from conduction-cooled circuit cards

Publications (1)

Publication Number Publication Date
AU2015219268A1 true AU2015219268A1 (en) 2016-08-18

Family

ID=52595472

Family Applications (2)

Application Number Title Priority Date Filing Date
AU2015219268A Abandoned AU2015219268A1 (en) 2014-02-18 2015-02-13 Efficient heat transfer from conduction-cooled circuit cards
AU2019261815A Abandoned AU2019261815A1 (en) 2014-02-18 2019-11-08 Efficient heat transfer from conduction-cooled circuit cards

Family Applications After (1)

Application Number Title Priority Date Filing Date
AU2019261815A Abandoned AU2019261815A1 (en) 2014-02-18 2019-11-08 Efficient heat transfer from conduction-cooled circuit cards

Country Status (5)

Country Link
US (1) US9357670B2 (de)
EP (1) EP3108727A1 (de)
AU (2) AU2015219268A1 (de)
CA (1) CA2939101A1 (de)
WO (1) WO2015126745A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
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US9357670B2 (en) * 2014-02-18 2016-05-31 Lockheed Martin Corporation Efficient heat transfer from conduction-cooled circuit cards
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US10470338B2 (en) * 2017-01-10 2019-11-05 Aselsan Elektronik Sanayi Ve Ticaret Anonim Sirketi Cooling system
US11503701B1 (en) * 2021-10-26 2022-11-15 Eagle Technology, Llc Electronic device having heat transfer clamp and associated methods
US11665856B2 (en) 2021-10-26 2023-05-30 Eagle Technology, Llc Electronic device having flexible, heat conductive layer and associated methods

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Also Published As

Publication number Publication date
AU2019261815A1 (en) 2019-12-05
WO2015126745A8 (en) 2015-11-05
US20150237763A1 (en) 2015-08-20
EP3108727A1 (de) 2016-12-28
CA2939101A1 (en) 2015-08-27
US9357670B2 (en) 2016-05-31
WO2015126745A1 (en) 2015-08-27

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Legal Events

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MK5 Application lapsed section 142(2)(e) - patent request and compl. specification not accepted