AU2003254812A1 - Image forming material having bluish-violet laser-photosensitive resist material layer and resist image forming method therefor - Google Patents

Image forming material having bluish-violet laser-photosensitive resist material layer and resist image forming method therefor

Info

Publication number
AU2003254812A1
AU2003254812A1 AU2003254812A AU2003254812A AU2003254812A1 AU 2003254812 A1 AU2003254812 A1 AU 2003254812A1 AU 2003254812 A AU2003254812 A AU 2003254812A AU 2003254812 A AU2003254812 A AU 2003254812A AU 2003254812 A1 AU2003254812 A1 AU 2003254812A1
Authority
AU
Australia
Prior art keywords
image forming
resist
bluish
method therefor
violet laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003254812A
Other languages
English (en)
Inventor
Rieko Fujita
Yasuhiro Kameyama
Takashi Miyazawa
Eriko Toshimitsu
Toshiyuki Urano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Corp filed Critical Mitsubishi Chemical Corp
Publication of AU2003254812A1 publication Critical patent/AU2003254812A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
    • G03F7/202—Masking pattern being obtained by thermal means, e.g. laser ablation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
AU2003254812A 2002-08-07 2003-08-05 Image forming material having bluish-violet laser-photosensitive resist material layer and resist image forming method therefor Abandoned AU2003254812A1 (en)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
JP2002/229416 2002-08-07
JP2002229416 2002-08-07
JP2002/365470 2002-12-17
JP2002365470 2002-12-17
JP2003017559 2003-01-27
JP2003/17559 2003-01-27
JP2003034161 2003-02-12
JP2003/34161 2003-02-12
JP2003/44649 2003-02-21
JP2003044649 2003-02-21
PCT/JP2003/009932 WO2004015497A1 (ja) 2002-08-07 2003-08-05 青紫色レーザー感光性レジスト材層を有する画像形成材及びそのレジスト画像形成方法

Publications (1)

Publication Number Publication Date
AU2003254812A1 true AU2003254812A1 (en) 2004-02-25

Family

ID=31721816

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003254812A Abandoned AU2003254812A1 (en) 2002-08-07 2003-08-05 Image forming material having bluish-violet laser-photosensitive resist material layer and resist image forming method therefor

Country Status (5)

Country Link
KR (2) KR20050047088A (enExample)
CN (2) CN100573321C (enExample)
AU (1) AU2003254812A1 (enExample)
TW (2) TW200839443A (enExample)
WO (1) WO2004015497A1 (enExample)

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Publication number Priority date Publication date Assignee Title
KR100970357B1 (ko) * 2003-09-25 2010-07-16 니뽄 고오세이가가꾸 고오교오 가부시끼가이샤 네가티브형 청자색 레이저 감광성 조성물, 화상 형성 재료,화상 형성재, 및 화상 형성 방법
US20080118867A1 (en) * 2004-05-12 2008-05-22 Morimasa Sato Pattern Forming Material, Pattern Forming Apparatus, And Pattern Forming Process
JP2006154740A (ja) * 2004-07-14 2006-06-15 Fuji Photo Film Co Ltd 感光性組成物、パターン形成材料、感光性積層体、並びにパターン形成装置及びパターン形成方法
EP1780599A4 (en) 2004-07-14 2010-09-01 Asahi Kasei E Materials Corp LIGHT-SENSITIVE COMPOSITION, STRUCTURAL PRODUCTION MATERIAL, LIGHT-SENSITIVE LAMINATE, STRUCTURAL PRODUCTION DEVICE AND METHOD OF STRUCTURING PRODUCTION
TW200622491A (en) * 2004-09-28 2006-07-01 Fuji Photo Film Co Ltd Pattern-forming material, pattern-forming device and pattern-forming method
TWI485064B (zh) * 2006-03-10 2015-05-21 羅門哈斯電子材料有限公司 用於光微影之組成物及製程
KR101313538B1 (ko) * 2006-04-06 2013-10-01 주식회사 동진쎄미켐 네가티브 감광성 수지 조성물
JP4975579B2 (ja) * 2007-10-01 2012-07-11 太陽ホールディングス株式会社 組成物、ドライフィルム、硬化物及びプリント配線板
TWI491982B (zh) * 2009-10-28 2015-07-11 Sumitomo Chemical Co Coloring the photosensitive resin composition
JP5296828B2 (ja) * 2011-04-15 2013-09-25 旭化成イーマテリアルズ株式会社 パターン形成材料、並びにパターン形成装置及びパターン形成方法
CN103562267B (zh) * 2011-05-31 2018-11-06 电化株式会社 能量线固化性树脂组合物
EP2682440A1 (en) * 2012-07-06 2014-01-08 Basf Se A chemical mechanical polishing (cmp) composition comprising a non-ionic surfactant and a carbonate salt
CN103298265B (zh) * 2013-04-09 2016-04-06 王俊生 一种电路板外层线路成型方法
KR102145934B1 (ko) * 2014-05-20 2020-08-19 동우 화인켐 주식회사 광경화 패턴의 형성 방법
CN105418674A (zh) * 2015-11-10 2016-03-23 中国乐凯集团有限公司 一种高折射率树脂及其应用
CN109563234B (zh) 2016-08-08 2022-08-23 日产化学株式会社 光固化性组合物及半导体装置的制造方法
US10520813B2 (en) * 2016-12-15 2019-12-31 Taiwan Semiconductor Manufacturing Co., Ltd Extreme ultraviolet photoresist with high-efficiency electron transfer
TWI816671B (zh) * 2017-04-25 2023-10-01 德商馬克專利公司 用於產生底切圖樣輪廓之負型光阻調配物以及使光阻組合物成像之方法和用於使基板上之圖樣化光阻劑金屬化之剝離方法
US20230229084A1 (en) * 2020-07-01 2023-07-20 Tokyo Ohka Kogyo Co., Ltd. Chemically amplified photosensitive composition, photosensitive dry film, production method of substrate having template for plating, and production method of plated article
US20220067489A1 (en) 2020-08-28 2022-03-03 Illumina, Inc. Detecting and Filtering Clusters Based on Artificial Intelligence-Predicted Base Calls
AU2022248999A1 (en) 2021-03-31 2023-02-02 Illumina, Inc. Artificial intelligence-based base caller with contextual awareness
CN117631439B (zh) * 2022-08-31 2025-10-31 长春人造树脂厂股份有限公司 光阻膜及其应用

Family Cites Families (11)

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Publication number Priority date Publication date Assignee Title
JPH09281698A (ja) 1996-04-11 1997-10-31 Mitsubishi Chem Corp カラーフィルター用光重合性組成物
US6468711B1 (en) * 1998-09-09 2002-10-22 Fuji Photo Film Co., Ltd. Photosensitive composition and method for manufacturing lithographic printing plate
US6335144B1 (en) 1999-04-27 2002-01-01 Fuji Photo Film Co., Ltd. Photopolymerizable composition for short wavelength semiconductor laser exposure
EP1148387A1 (en) * 2000-04-19 2001-10-24 Mitsubishi Chemical Corporation Photosensitive lithographic printing plate and method for making the printing plate
JP2002072460A (ja) * 2000-09-05 2002-03-12 Mitsui Chemicals Inc ポジ型可視光感光性樹脂組成物及びその用途
JP2002148801A (ja) * 2000-11-14 2002-05-22 Mitsui Chemicals Inc ポジ型可視光感光性樹脂組成物及びその用途
JP2002169275A (ja) * 2000-12-04 2002-06-14 Mitsui Chemicals Inc 光酸発生剤及びそれを用いた可視光感光性樹脂組成物
JP2002202598A (ja) * 2000-12-28 2002-07-19 Fuji Photo Film Co Ltd 感光性組成物およびそれを用いた光重合方法
JP4152597B2 (ja) * 2001-02-16 2008-09-17 三菱製紙株式会社 感光性組成物
JP2003167329A (ja) * 2001-09-20 2003-06-13 Mitsubishi Chemicals Corp 平版印刷版の作製方法
JP2003195526A (ja) * 2001-12-27 2003-07-09 Mitsubishi Chemicals Corp 感光性平版印刷版の刷版方法

Also Published As

Publication number Publication date
TWI326006B (enExample) 2010-06-11
CN100573321C (zh) 2009-12-23
KR101003323B1 (ko) 2010-12-22
WO2004015497A1 (ja) 2004-02-19
KR20080011351A (ko) 2008-02-01
KR20050047088A (ko) 2005-05-19
TW200416487A (en) 2004-09-01
TW200839443A (en) 2008-10-01
CN1675588A (zh) 2005-09-28
CN101135850A (zh) 2008-03-05
CN101135850B (zh) 2011-02-16

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase