AU2002308221A1 - Bath for the galvanic deposition of gold and gold alloys, and the use thereof - Google Patents

Bath for the galvanic deposition of gold and gold alloys, and the use thereof

Info

Publication number
AU2002308221A1
AU2002308221A1 AU2002308221A AU2002308221A AU2002308221A1 AU 2002308221 A1 AU2002308221 A1 AU 2002308221A1 AU 2002308221 A AU2002308221 A AU 2002308221A AU 2002308221 A AU2002308221 A AU 2002308221A AU 2002308221 A1 AU2002308221 A1 AU 2002308221A1
Authority
AU
Australia
Prior art keywords
gold
bath
galvanic deposition
alloys
gold alloys
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002308221A
Other languages
English (en)
Inventor
Susanne Rubel
Manfred Stumke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wieland Dental and Technik GmbH and Co KG
Original Assignee
Wieland Dental and Technik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2001110743 external-priority patent/DE10110743A1/de
Application filed by Wieland Dental and Technik GmbH and Co KG filed Critical Wieland Dental and Technik GmbH and Co KG
Publication of AU2002308221A1 publication Critical patent/AU2002308221A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Dental Preparations (AREA)
  • Electroplating Methods And Accessories (AREA)
AU2002308221A 2001-02-28 2002-02-28 Bath for the galvanic deposition of gold and gold alloys, and the use thereof Abandoned AU2002308221A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE2001110743 DE10110743A1 (de) 2001-02-28 2001-02-28 Bad zur galvanischen Abscheidung von Gold und Goldlegierungen sowie dessen Verwendung
DE10110743.9 2001-02-28
EP01108448.0 2001-04-04
EP01108448A EP1236814A1 (fr) 2001-02-28 2001-04-04 Bain pour le dépôt galvanique d'or et d'alliages d'or et son application
PCT/EP2002/002128 WO2002068728A1 (fr) 2001-02-28 2002-02-28 Bain electrolytique pour deposer de l'or et des alliages en or, et son utilisation

Publications (1)

Publication Number Publication Date
AU2002308221A1 true AU2002308221A1 (en) 2002-09-12

Family

ID=26008695

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002308221A Abandoned AU2002308221A1 (en) 2001-02-28 2002-02-28 Bath for the galvanic deposition of gold and gold alloys, and the use thereof

Country Status (8)

Country Link
US (1) US20040065225A1 (fr)
EP (1) EP1366219B1 (fr)
JP (1) JP4183240B2 (fr)
CN (1) CN100392155C (fr)
AU (1) AU2002308221A1 (fr)
BR (1) BR0207724A (fr)
CA (1) CA2438207A1 (fr)
WO (1) WO2002068728A1 (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1378590A1 (fr) * 2002-07-04 2004-01-07 Metalor Technologies International S.A. Bain pour dépôts electrolytiques d'or
CA2558475A1 (fr) * 2004-02-18 2005-09-01 Marianna Cooley Formulations anti-microbiennes et procedes d'utilisation de celles-ci
CN1308493C (zh) * 2004-07-27 2007-04-04 滕先弟 硫代硫酸金铵络合物及其制备方法
JP5442400B2 (ja) * 2009-11-13 2014-03-12 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
CN101781758B (zh) * 2010-04-09 2011-12-07 厦门华弘昌科技有限公司 化学镀镍稳定剂、化学镀镍溶液及化学镀镍工艺
US11579344B2 (en) 2012-09-17 2023-02-14 Government Of The United States Of America, As Represented By The Secretary Of Commerce Metallic grating
US10889908B2 (en) * 2012-09-17 2021-01-12 Government Of The United States Of America, As Represented By The Secretary Of Commerce Superconformal filling composition and superconformally filling a recessed feature of an article
ITFI20120208A1 (it) * 2012-10-12 2014-04-13 Bluclad S R L Soluzione per l'elettrodeposizione di una lega di oro e la lega da essa derivante.
ITFI20130057A1 (it) * 2013-03-18 2014-09-19 Bluclad S R L Soluzione per l¿elettrodeposizione di una lega di oro e la lega da essa derivante.
CN103938231B (zh) * 2014-03-04 2015-04-01 深圳市联合蓝海科技开发有限公司 一种电镀黄金的方法和硬质黄金的制备方法
CN103938232B (zh) * 2014-03-04 2015-04-01 深圳市联合蓝海新技术有限公司 一种无氰电镀液及其应用
CN104047037B (zh) * 2014-06-16 2015-06-03 深圳市联合蓝海科技开发有限公司 一种硬化剂
CN104862752B (zh) * 2015-06-12 2016-02-17 深圳市联合蓝海投资控股集团有限公司 改性无氰镀金液及其应用和硬质黄金的制备方法
KR20240033116A (ko) * 2021-09-16 2024-03-12 피 앤 에스, 갈바솔스 고속 순금 전기주조/전기도금 욕
JP7219847B1 (ja) * 2022-09-26 2023-02-08 Ｅｅｊａ株式会社 金電気めっき液および金電気めっき方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE754151A (fr) * 1969-08-08 1970-12-31 Sel Rex Corp Bain aqueux pour le placage electrolytique d'or ou d'alliage d'or sur un article conducteur, procede de fabrication dudit bain aqueux et utilisation de celui-ci
CH622829A5 (fr) * 1977-08-29 1981-04-30 Systemes Traitements Surfaces
JP2592246B2 (ja) * 1987-04-10 1997-03-19 株式会社ジーシー 歯冠修復用複合冠の内側冠の作製方法及び装置
DE3805627A1 (de) * 1988-02-24 1989-09-07 Wieland Edelmetalle Goldbad
US5277790A (en) * 1992-07-10 1994-01-11 Technic Incorporated Non-cyanide electroplating solution for gold or alloys thereof
DE19629658C2 (de) * 1996-07-23 1999-01-14 Degussa Cyanidfreies galvanisches Bad zur Abscheidung von Gold und Goldlegierungen
DE19845506A1 (de) * 1998-10-02 2000-04-06 Wieland Edelmetalle Verfahren zur Herstellung von prothetischen Formteilen für den Dentalbereich und prothetisches Formteil

Also Published As

Publication number Publication date
EP1366219A2 (fr) 2003-12-03
WO2002068728A1 (fr) 2002-09-06
CN100392155C (zh) 2008-06-04
BR0207724A (pt) 2004-03-23
CN1494606A (zh) 2004-05-05
WO2002068728A8 (fr) 2003-09-18
CA2438207A1 (fr) 2002-09-06
EP1366219B1 (fr) 2014-09-03
US20040065225A1 (en) 2004-04-08
JP2004527653A (ja) 2004-09-09
JP4183240B2 (ja) 2008-11-19

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase