AU2002228637A1 - Integrated cmos capacitive pressure sensor - Google Patents

Integrated cmos capacitive pressure sensor

Info

Publication number
AU2002228637A1
AU2002228637A1 AU2002228637A AU2863702A AU2002228637A1 AU 2002228637 A1 AU2002228637 A1 AU 2002228637A1 AU 2002228637 A AU2002228637 A AU 2002228637A AU 2863702 A AU2863702 A AU 2863702A AU 2002228637 A1 AU2002228637 A1 AU 2002228637A1
Authority
AU
Australia
Prior art keywords
pressure sensor
capacitive pressure
integrated cmos
cmos capacitive
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002228637A
Other languages
English (en)
Inventor
Richard J August
Bishnu P. Gogoi
Donald L. Hughes
Andrew C. Mcneil
David J. Monk
Kevin D. Neumann
David W. Odle
John E. Schmiesing
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of AU2002228637A1 publication Critical patent/AU2002228637A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
    • H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
AU2002228637A 2000-12-11 2001-11-19 Integrated cmos capacitive pressure sensor Abandoned AU2002228637A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/734,473 2000-12-11
US09/734,473 US6472243B2 (en) 2000-12-11 2000-12-11 Method of forming an integrated CMOS capacitive pressure sensor
PCT/US2001/044013 WO2002048668A2 (en) 2000-12-11 2001-11-19 Integrated cmos capacitive pressure sensor

Publications (1)

Publication Number Publication Date
AU2002228637A1 true AU2002228637A1 (en) 2002-06-24

Family

ID=24951833

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002228637A Abandoned AU2002228637A1 (en) 2000-12-11 2001-11-19 Integrated cmos capacitive pressure sensor

Country Status (6)

Country Link
US (1) US6472243B2 (ja)
EP (1) EP1344035B1 (ja)
JP (1) JP4267322B2 (ja)
AU (1) AU2002228637A1 (ja)
DE (1) DE60142406D1 (ja)
WO (1) WO2002048668A2 (ja)

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US6664909B1 (en) * 2001-08-13 2003-12-16 Impinj, Inc. Method and apparatus for trimming high-resolution digital-to-analog converter
US6828172B2 (en) * 2002-02-04 2004-12-07 Delphi Technologies, Inc. Process for a monolithically-integrated micromachined sensor and circuit
US20040206999A1 (en) * 2002-05-09 2004-10-21 Impinj, Inc., A Delaware Corporation Metal dielectric semiconductor floating gate variable capacitor
DE10245627B3 (de) * 2002-09-30 2004-05-06 Infineon Technologies Ag Fingerabdrucksensor
US7115438B2 (en) * 2004-04-29 2006-10-03 United Microelectronics Corp. Method for manufacturing a complementary metal-oxide semiconductor sensor
US7270012B2 (en) * 2004-10-01 2007-09-18 Hitachi, Ltd. Semiconductor device embedded with pressure sensor and manufacturing method thereof
US7328609B1 (en) 2004-10-29 2008-02-12 National Semiconductor Corporation Wireless pressure sensing Schrader valve
US7121146B1 (en) * 2004-10-29 2006-10-17 National Semiconductor Corporation MEMS pressure sensing device
US7109055B2 (en) * 2005-01-20 2006-09-19 Freescale Semiconductor, Inc. Methods and apparatus having wafer level chip scale package for sensing elements
JP4501715B2 (ja) * 2005-02-16 2010-07-14 セイコーエプソン株式会社 Ｍｅｍｓ素子およびｍｅｍｓ素子の製造方法
US7284418B2 (en) * 2005-06-03 2007-10-23 Temic Automotive Of North America, Inc. Tire pressure sensor assembly
US7281421B2 (en) * 2005-06-03 2007-10-16 Temic Automotive Of North America, Inc. Package for a tire pressure sensor assembly
JP4988217B2 (ja) * 2006-02-03 2012-08-01 株式会社日立製作所 Ｍｅｍｓ構造体の製造方法
US7632698B2 (en) 2006-05-16 2009-12-15 Freescale Semiconductor, Inc. Integrated circuit encapsulation and method therefor
US7528468B2 (en) * 2006-09-25 2009-05-05 Freescale Semiconductor, Inc. Capacitor assembly with shielded connections and method for forming the same
JP5127210B2 (ja) * 2006-11-30 2013-01-23 株式会社日立製作所 Ｍｅｍｓセンサが混載された半導体装置
JP4337870B2 (ja) 2006-12-15 2009-09-30 セイコーエプソン株式会社 Ｍｅｍｓレゾネータ及びｍｅｍｓレゾネータの製造方法
JP4947065B2 (ja) * 2009-01-09 2012-06-06 セイコーエプソン株式会社 Ｍｅｍｓレゾネータの製造方法
GB2467776A (en) * 2009-02-13 2010-08-18 Wolfson Microelectronics Plc Integrated MEMS transducer and circuitry
JP2011158317A (ja) * 2010-01-29 2011-08-18 Panasonic Electric Works Co Ltd 圧力センサ
CN102856177B (zh) * 2011-06-27 2015-01-28 中芯国际集成电路制造(北京)有限公司 半导体器件和用于制造半导体器件的方法
KR101781553B1 (ko) * 2011-08-22 2017-09-26 삼성전자주식회사 용량성 트랜스듀서와 그 제조 및 동작방법
US10094988B2 (en) * 2012-08-31 2018-10-09 Micron Technology, Inc. Method of forming photonics structures
DE102012023429B8 (de) * 2012-11-29 2013-10-24 Elmos Semiconductor Ag CMOS kompatibler Drucksensor auf Tunneleffekt-Basis mit Verfahren
JP5832417B2 (ja) 2012-12-07 2015-12-16 三菱電機株式会社 半導体圧力センサおよびその製造方法
EP2774891B1 (en) 2013-03-05 2019-10-23 ams AG Semiconductor device with capacitive sensor and integrated circuit
JP5933480B2 (ja) 2013-04-26 2016-06-08 三菱電機株式会社 半導体圧力センサおよびその製造方法
JP6119615B2 (ja) * 2014-01-08 2017-04-26 三菱電機株式会社 半導体装置の製造方法
JP6433349B2 (ja) * 2015-03-19 2018-12-05 三菱電機株式会社 半導体圧力センサおよびその製造方法
US20170115322A1 (en) * 2015-10-22 2017-04-27 Freescale Semiconductor, Inc. Mems sensor device having integrated multiple stimulus sensing
JP6532429B2 (ja) 2016-06-01 2019-06-19 三菱電機株式会社 半導体圧力センサ
EP3261366B1 (en) 2016-06-21 2021-09-22 Sciosense B.V. Microphone and pressure sensor package and method of producing the microphone and pressure sensor package
EP3260821B1 (en) 2016-06-21 2019-09-11 ams International AG Sensor package and method of producing the sensor package
CN108183163A (zh) * 2018-01-08 2018-06-19 杭州士兰微电子股份有限公司 一种超声波传感器的制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4042336A1 (de) 1990-02-12 1991-08-14 Fraunhofer Ges Forschung Drucksensoranordnung mit einem drucksensor und einem referenzelement
US5431057A (en) 1990-02-12 1995-07-11 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Integratable capacitative pressure sensor
US6012336A (en) * 1995-09-06 2000-01-11 Sandia Corporation Capacitance pressure sensor

Also Published As

Publication number Publication date
JP2004526299A (ja) 2004-08-26
WO2002048668A3 (en) 2002-10-10
DE60142406D1 (de) 2010-07-29
EP1344035A2 (en) 2003-09-17
EP1344035B1 (en) 2010-06-16
US6472243B2 (en) 2002-10-29
US20020072144A1 (en) 2002-06-13
WO2002048668A2 (en) 2002-06-20
JP4267322B2 (ja) 2009-05-27

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