AU2002227030A1 - Pyroelectric device on a monocrystalline semiconductor substrate - Google Patents

Pyroelectric device on a monocrystalline semiconductor substrate

Info

Publication number
AU2002227030A1
AU2002227030A1 AU2002227030A AU2703002A AU2002227030A1 AU 2002227030 A1 AU2002227030 A1 AU 2002227030A1 AU 2002227030 A AU2002227030 A AU 2002227030A AU 2703002 A AU2703002 A AU 2703002A AU 2002227030 A1 AU2002227030 A1 AU 2002227030A1
Authority
AU
Australia
Prior art keywords
semiconductor substrate
monocrystalline semiconductor
pyroelectric device
pyroelectric
monocrystalline
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002227030A
Inventor
Kurt W. Eisenbeiser
Jeffrey M. Finder
Jerald A. Hallmark
William J. Ooms
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of AU2002227030A1 publication Critical patent/AU2002227030A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N15/00Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
    • H10N15/10Thermoelectric devices using thermal change of the dielectric constant, e.g. working above and below the Curie point
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/02Epitaxial-layer growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/18Epitaxial-layer growth characterised by the substrate
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/16Oxides
    • C30B29/22Complex oxides
    • C30B29/32Titanates; Germanates; Molybdates; Tungstates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02373Group 14 semiconducting materials
    • H01L21/02381Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • H01L21/02488Insulating materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02494Structure
    • H01L21/02496Layer structure
    • H01L21/02505Layer structure consisting of more than two layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Recrystallisation Techniques (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Semiconductor Memories (AREA)
AU2002227030A 2000-12-08 2001-11-29 Pyroelectric device on a monocrystalline semiconductor substrate Abandoned AU2002227030A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/733,181 US6563118B2 (en) 2000-12-08 2000-12-08 Pyroelectric device on a monocrystalline semiconductor substrate and process for fabricating same
US09/733,181 2000-12-08
PCT/US2001/044776 WO2002047127A2 (en) 2000-12-08 2001-11-29 Pyroelectric device on a monocrystalline semiconductor substrate

Publications (1)

Publication Number Publication Date
AU2002227030A1 true AU2002227030A1 (en) 2002-06-18

Family

ID=24946567

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002227030A Abandoned AU2002227030A1 (en) 2000-12-08 2001-11-29 Pyroelectric device on a monocrystalline semiconductor substrate

Country Status (3)

Country Link
US (1) US6563118B2 (en)
AU (1) AU2002227030A1 (en)
WO (1) WO2002047127A2 (en)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6693033B2 (en) 2000-02-10 2004-02-17 Motorola, Inc. Method of removing an amorphous oxide from a monocrystalline surface
AU2001264987A1 (en) * 2000-06-30 2002-01-14 Motorola, Inc., A Corporation Of The State Of Delware Hybrid semiconductor structure and device
US6555946B1 (en) 2000-07-24 2003-04-29 Motorola, Inc. Acoustic wave device and process for forming the same
US6638838B1 (en) 2000-10-02 2003-10-28 Motorola, Inc. Semiconductor structure including a partially annealed layer and method of forming the same
US6583034B2 (en) 2000-11-22 2003-06-24 Motorola, Inc. Semiconductor structure including a compliant substrate having a graded monocrystalline layer and methods for fabricating the structure and semiconductor devices including the structure
US20020096683A1 (en) * 2001-01-19 2002-07-25 Motorola, Inc. Structure and method for fabricating GaN devices utilizing the formation of a compliant substrate
US6673646B2 (en) 2001-02-28 2004-01-06 Motorola, Inc. Growth of compound semiconductor structures on patterned oxide films and process for fabricating same
US6709989B2 (en) 2001-06-21 2004-03-23 Motorola, Inc. Method for fabricating a semiconductor structure including a metal oxide interface with silicon
US6992321B2 (en) * 2001-07-13 2006-01-31 Motorola, Inc. Structure and method for fabricating semiconductor structures and devices utilizing piezoelectric materials
US6646293B2 (en) 2001-07-18 2003-11-11 Motorola, Inc. Structure for fabricating high electron mobility transistors utilizing the formation of complaint substrates
US6693298B2 (en) 2001-07-20 2004-02-17 Motorola, Inc. Structure and method for fabricating epitaxial semiconductor on insulator (SOI) structures and devices utilizing the formation of a compliant substrate for materials used to form same
US6667196B2 (en) 2001-07-25 2003-12-23 Motorola, Inc. Method for real-time monitoring and controlling perovskite oxide film growth and semiconductor structure formed using the method
US6589856B2 (en) 2001-08-06 2003-07-08 Motorola, Inc. Method and apparatus for controlling anti-phase domains in semiconductor structures and devices
US6639249B2 (en) 2001-08-06 2003-10-28 Motorola, Inc. Structure and method for fabrication for a solid-state lighting device
US6673667B2 (en) 2001-08-15 2004-01-06 Motorola, Inc. Method for manufacturing a substantially integral monolithic apparatus including a plurality of semiconductor materials
US6872252B2 (en) * 2002-03-06 2005-03-29 Agilent Technologies, Inc. Lead-based perovskite buffer for forming indium phosphide on silicon
US6607969B1 (en) * 2002-03-18 2003-08-19 The United States Of America As Represented By The Secretary Of The Navy Method for making pyroelectric, electro-optical and decoupling capacitors using thin film transfer and hydrogen ion splitting techniques
JP4859333B2 (en) * 2002-03-25 2012-01-25 セイコーエプソン株式会社 Manufacturing method of substrate for electronic device
US6780703B2 (en) * 2002-08-27 2004-08-24 Freescale Semiconductor, Inc. Method for forming a semiconductor device
US7112860B2 (en) * 2003-03-03 2006-09-26 Cree, Inc. Integrated nitride-based acoustic wave devices and methods of fabricating integrated nitride-based acoustic wave devices
JP4663216B2 (en) * 2003-06-10 2011-04-06 ルネサスエレクトロニクス株式会社 Semiconductor memory device and manufacturing method thereof
DE10352655A1 (en) * 2003-11-11 2005-06-30 Universität Augsburg Heteroepitaxial layer and process for its preparation
GB2411521A (en) * 2004-02-27 2005-08-31 Qinetiq Ltd Fabrication method for micro-sensor device
US20060011129A1 (en) * 2004-07-14 2006-01-19 Atomic Energy Council - Institute Of Nuclear Energy Research Method for fabricating a compound semiconductor epitaxial wafer
US8208284B2 (en) * 2008-03-07 2012-06-26 Unity Semiconductor Corporation Data retention structure for non-volatile memory
FR2959657B1 (en) * 2010-05-06 2012-06-22 Commissariat Energie Atomique TIME TEMPERATURE VARIATION TRANSDUCER, ELECTRONIC CHIP INCORPORATING THE TRANSDUCER, AND METHOD OF MANUFACTURING THE SAME
CN111926295B (en) * 2020-09-01 2022-08-09 深圳大学 Huge tetragonal phase PbTiO 3 Method for producing thin film

Family Cites Families (134)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4404265A (en) 1969-10-01 1983-09-13 Rockwell International Corporation Epitaxial composite and method of making
GB1319311A (en) 1970-06-04 1973-06-06 North American Rockwell Epitaxial composite and method of making
US3766370A (en) 1971-05-14 1973-10-16 Hewlett Packard Co Elementary floating point cordic function processor and shifter
US3802967A (en) 1971-08-27 1974-04-09 Rca Corp Iii-v compound on insulating substrate and its preparation and use
US4006989A (en) 1972-10-02 1977-02-08 Raytheon Company Laser gyroscope
US4174422A (en) 1977-12-30 1979-11-13 International Business Machines Corporation Growing epitaxial films when the misfit between film and substrate is large
US4284329A (en) 1978-01-03 1981-08-18 Raytheon Company Laser gyroscope system
JPS58158944A (en) 1982-03-16 1983-09-21 Futaba Corp Semiconductor device
US4484332A (en) 1982-06-02 1984-11-20 The United States Of America As Represented By The Secretary Of The Air Force Multiple double heterojunction buried laser device
US4482906A (en) 1982-06-30 1984-11-13 International Business Machines Corporation Gallium aluminum arsenide integrated circuit structure using germanium
JPS61108187A (en) 1984-11-01 1986-05-26 Seiko Epson Corp Semiconductor photoelectronic device
US4661176A (en) 1985-02-27 1987-04-28 The United States Of America As Represented By The Secretary Of The Air Force Process for improving the quality of epitaxial silicon films grown on insulating substrates utilizing oxygen ion conductor substrates
US4846926A (en) 1985-08-26 1989-07-11 Ford Aerospace & Communications Corporation HcCdTe epitaxially grown on crystalline support
CA1292550C (en) 1985-09-03 1991-11-26 Masayoshi Umeno Epitaxial gallium arsenide semiconductor wafer and method of producing the same
JPS62119196A (en) 1985-11-18 1987-05-30 Univ Nagoya Method for growing compound semiconductor
FR2595509B1 (en) 1986-03-07 1988-05-13 Thomson Csf COMPONENT IN SEMICONDUCTOR MATERIAL EPITAXIA ON A SUBSTRATE WITH DIFFERENT MESH PARAMETER AND APPLICATION TO VARIOUS SEMICONDUCTOR COMPONENTS
JPS62216600A (en) 1986-03-18 1987-09-24 Oki Electric Ind Co Ltd Photo-acoustic transducing device
US4777613A (en) 1986-04-01 1988-10-11 Motorola Inc. Floating point numeric data processor
US4774205A (en) 1986-06-13 1988-09-27 Massachusetts Institute Of Technology Monolithic integration of silicon and gallium arsenide devices
US4891091A (en) 1986-07-14 1990-01-02 Gte Laboratories Incorporated Method of epitaxially growing compound semiconductor materials
JPS6334994A (en) 1986-07-29 1988-02-15 Mitsubishi Electric Corp Photoelectric integrated circuit device and manufacture thereof
JPH087288B2 (en) 1986-11-20 1996-01-29 日本電信電話株式会社 Method for manufacturing hybrid optical integrated circuit
US4815084A (en) 1987-05-20 1989-03-21 Spectra Diode Laboratories, Inc. Semiconductor laser with integrated optical elements
JPS6414949A (en) 1987-07-08 1989-01-19 Nec Corp Semiconductor device and manufacture of the same
US5081062A (en) 1987-08-27 1992-01-14 Prahalad Vasudev Monolithic integration of silicon on insulator and gallium arsenide semiconductor technologies
JPH0695554B2 (en) 1987-10-12 1994-11-24 工業技術院長 Method for forming single crystal magnesia spinel film
US4802182A (en) 1987-11-05 1989-01-31 Xerox Corporation Monolithic two dimensional waveguide coupled cavity laser/modulator
JP2691721B2 (en) 1988-03-04 1997-12-17 富士通株式会社 Semiconductor thin film manufacturing method
US4912087A (en) 1988-04-15 1990-03-27 Ford Motor Company Rapid thermal annealing of superconducting oxide precursor films on Si and SiO2 substrates
US5063166A (en) 1988-04-29 1991-11-05 Sri International Method of forming a low dislocation density semiconductor device
JPH01289108A (en) 1988-05-17 1989-11-21 Fujitsu Ltd Heteroepitaxy
US5221367A (en) 1988-08-03 1993-06-22 International Business Machines, Corp. Strained defect-free epitaxial mismatched heterostructures and method of fabrication
US4963949A (en) 1988-09-30 1990-10-16 The United States Of America As Represented Of The United States Department Of Energy Substrate structures for InP-based devices
DE68923756T2 (en) 1988-10-28 1996-03-07 Texas Instruments Inc., Dallas, Tex. Covered heat treatment.
US5286985A (en) 1988-11-04 1994-02-15 Texas Instruments Incorporated Interface circuit operable to perform level shifting between a first type of device and a second type of device
US4999842A (en) 1989-03-01 1991-03-12 At&T Bell Laboratories Quantum well vertical cavity laser
JPH02306680A (en) 1989-05-22 1990-12-20 Hikari Gijutsu Kenkyu Kaihatsu Kk Optoelectronic integrated circuit device and manufacture thereof
FR2650704B1 (en) 1989-08-01 1994-05-06 Thomson Csf PROCESS FOR THE MANUFACTURE BY EPITAXY OF MONOCRYSTALLINE LAYERS OF MATERIALS WITH DIFFERENT MESH PARAMETERS
US5310707A (en) 1990-03-28 1994-05-10 Superconductivity Research Laboratory International Substrate material for the preparation of oxide superconductors
FR2661040A1 (en) 1990-04-13 1991-10-18 Thomson Csf PROCESS FOR ADAPTING TWO CRYSTALLIZED SEMICONDUCTOR MATERIALS AND SEMICONDUCTOR DEVICE
US5358925A (en) 1990-04-18 1994-10-25 Board Of Trustees Of The Leland Stanford Junior University Silicon substrate having YSZ epitaxial barrier layer and an epitaxial superconducting layer
US5173474A (en) 1990-04-18 1992-12-22 Xerox Corporation Silicon substrate having an epitaxial superconducting layer thereon and method of making same
US5164359A (en) 1990-04-20 1992-11-17 Eaton Corporation Monolithic integrated circuit having compound semiconductor layer epitaxially grown on ceramic substrate
US5144409A (en) 1990-09-05 1992-09-01 Yale University Isotopically enriched semiconductor devices
US5442191A (en) 1990-09-05 1995-08-15 Yale University Isotopically enriched semiconductor devices
US5127067A (en) 1990-09-10 1992-06-30 Westinghouse Electric Corp. Local area network with star topology and ring protocol
DE4029060C2 (en) 1990-09-13 1994-01-13 Forschungszentrum Juelich Gmbh Process for the production of components for electronic, electro-optical and optical components
US5060031A (en) 1990-09-18 1991-10-22 Motorola, Inc Complementary heterojunction field effect transistor with an anisotype N+ ga-channel devices
US5418216A (en) 1990-11-30 1995-05-23 Fork; David K. Superconducting thin films on epitaxial magnesium oxide grown on silicon
US5225031A (en) 1991-04-10 1993-07-06 Martin Marietta Energy Systems, Inc. Process for depositing an oxide epitaxially onto a silicon substrate and structures prepared with the process
US5482003A (en) 1991-04-10 1996-01-09 Martin Marietta Energy Systems, Inc. Process for depositing epitaxial alkaline earth oxide onto a substrate and structures prepared with the process
US5116461A (en) 1991-04-22 1992-05-26 Motorola, Inc. Method for fabricating an angled diffraction grating
US5221413A (en) 1991-04-24 1993-06-22 At&T Bell Laboratories Method for making low defect density semiconductor heterostructure and devices made thereby
JP3130575B2 (en) 1991-07-25 2001-01-31 日本電気株式会社 Microwave and millimeter wave transceiver module
JPH0548072A (en) 1991-08-12 1993-02-26 Nippon Telegr & Teleph Corp <Ntt> Semiconductor element
US5270298A (en) 1992-03-05 1993-12-14 Bell Communications Research, Inc. Cubic metal oxide thin film epitaxially grown on silicon
US5155658A (en) 1992-03-05 1992-10-13 Bell Communications Research, Inc. Crystallographically aligned ferroelectric films usable in memories and method of crystallographically aligning perovskite films
US5326721A (en) 1992-05-01 1994-07-05 Texas Instruments Incorporated Method of fabricating high-dielectric constant oxides on semiconductors using a GE buffer layer
DE69325614T2 (en) 1992-05-01 2000-01-13 Texas Instruments Inc Oxides of high dielectric constant containing Pb / Bi using perovskites as a buffer layer which do not contain Pb / Bi
US5602418A (en) 1992-08-07 1997-02-11 Asahi Kasei Kogyo Kabushiki Kaisha Nitride based semiconductor device and manufacture thereof
US5514484A (en) 1992-11-05 1996-05-07 Fuji Xerox Co., Ltd. Oriented ferroelectric thin film
JPH06151872A (en) 1992-11-09 1994-05-31 Mitsubishi Kasei Corp Fet device
EP0600303B1 (en) 1992-12-01 2002-02-06 Matsushita Electric Industrial Co., Ltd. Method for fabrication of dielectric thin film
US5248564A (en) * 1992-12-09 1993-09-28 Bell Communications Research, Inc. C-axis perovskite thin films grown on silicon dioxide
US5347157A (en) 1992-12-17 1994-09-13 Eastman Kodak Company Multilayer structure having a (111)-oriented buffer layer
US5293050A (en) 1993-03-25 1994-03-08 International Business Machines Corporation Semiconductor quantum dot light emitting/detecting devices
US5456205A (en) 1993-06-01 1995-10-10 Midwest Research Institute System for monitoring the growth of crystalline films on stationary substrates
US5480829A (en) 1993-06-25 1996-01-02 Motorola, Inc. Method of making a III-V complementary heterostructure device with compatible non-gold ohmic contacts
US5444016A (en) 1993-06-25 1995-08-22 Abrokwah; Jonathan K. Method of making ohmic contacts to a complementary III-V semiconductor device
DE4323821A1 (en) * 1993-07-15 1995-01-19 Siemens Ag Pyrodetector element with oriented grown pyroelectric layer and method for its production
US5450812A (en) 1993-07-30 1995-09-19 Martin Marietta Energy Systems, Inc. Process for growing a film epitaxially upon an oxide surface and structures formed with the process
US5576879A (en) 1994-01-14 1996-11-19 Fuji Xerox Co., Ltd. Composite optical modulator
GB2287327A (en) 1994-03-02 1995-09-13 Sharp Kk Electro-optic apparatus
US6469357B1 (en) 1994-03-23 2002-10-22 Agere Systems Guardian Corp. Article comprising an oxide layer on a GaAs or GaN-based semiconductor body
US5478653A (en) 1994-04-04 1995-12-26 Guenzer; Charles S. Bismuth titanate as a template layer for growth of crystallographically oriented silicon
US5528414A (en) 1994-05-05 1996-06-18 Lots Technology Two dimensional electro-optic modulator array
US5436759A (en) 1994-06-14 1995-07-25 The Regents Of The University Of California Cross-talk free, low-noise optical amplifier
DE4421007A1 (en) 1994-06-18 1995-12-21 Philips Patentverwaltung Electronic component and method for its production
US5828080A (en) 1994-08-17 1998-10-27 Tdk Corporation Oxide thin film, electronic device substrate and electronic device
US5635741A (en) 1994-09-30 1997-06-03 Texas Instruments Incorporated Barium strontium titanate (BST) thin films by erbium donor doping
US5479317A (en) * 1994-10-05 1995-12-26 Bell Communications Research, Inc. Ferroelectric capacitor heterostructure and method of making same
US5778018A (en) 1994-10-13 1998-07-07 Nec Corporation VCSELs (vertical-cavity surface emitting lasers) and VCSEL-based devices
US5670798A (en) 1995-03-29 1997-09-23 North Carolina State University Integrated heterostructures of Group III-V nitride semiconductor materials including epitaxial ohmic contact non-nitride buffer layer and methods of fabricating same
US5606184A (en) 1995-05-04 1997-02-25 Motorola, Inc. Heterostructure field effect device having refractory ohmic contact directly on channel layer and method for making
US5825799A (en) 1995-05-25 1998-10-20 Northwestern University Microcavity semiconductor laser
US5926496A (en) 1995-05-25 1999-07-20 Northwestern University Semiconductor micro-resonator device
US5790583A (en) 1995-05-25 1998-08-04 Northwestern University Photonic-well Microcavity light emitting devices
US5614739A (en) 1995-06-02 1997-03-25 Motorola HIGFET and method
JP3335075B2 (en) 1995-06-06 2002-10-15 キヤノン株式会社 Network system, node device, and transmission control method
KR100189966B1 (en) 1995-06-13 1999-06-01 윤종용 Mos transistor of soi structure and method for manufacturing the same
US5753934A (en) 1995-08-04 1998-05-19 Tok Corporation Multilayer thin film, substrate for electronic device, electronic device, and preparation of multilayer oxide thin film
JPH0964477A (en) 1995-08-25 1997-03-07 Toshiba Corp Semiconductor light emitting element and its manufacture
JPH09113767A (en) 1995-09-29 1997-05-02 Motorola Inc Electronic part to match optical transmission structure
US5861966A (en) 1995-12-27 1999-01-19 Nynex Science & Technology, Inc. Broad band optical fiber telecommunications network
US5729394A (en) 1996-01-24 1998-03-17 Hewlett-Packard Company Multi-direction optical data port
FR2744578B1 (en) 1996-02-06 1998-04-30 Motorola Semiconducteurs HIGH FREQUENCY AMPLIFIER
US5729641A (en) 1996-05-30 1998-03-17 Sdl, Inc. Optical device employing edge-coupled waveguide geometry
US5733641A (en) 1996-05-31 1998-03-31 Xerox Corporation Buffered substrate for semiconductor devices
US5858814A (en) 1996-07-17 1999-01-12 Lucent Technologies Inc. Hybrid chip and method therefor
US5830270A (en) 1996-08-05 1998-11-03 Lockheed Martin Energy Systems, Inc. CaTiO3 Interfacial template structure on semiconductor-based material and the growth of electroceramic thin-films in the perovskite class
EP0917719A2 (en) 1996-08-12 1999-05-26 Energenius, Inc. Semiconductor supercapacitor system, method for making same and articles produced therefrom
US5764676A (en) 1996-09-26 1998-06-09 Xerox Corporation Transversely injected multiple wavelength diode laser array formed by layer disordering
JPH10126350A (en) 1996-10-15 1998-05-15 Nec Corp Optical network, optical branch insertion node, and fault recovery system
US5912068A (en) 1996-12-05 1999-06-15 The Regents Of The University Of California Epitaxial oxides on amorphous SiO2 on single crystal silicon
US5741724A (en) 1996-12-27 1998-04-21 Motorola Method of growing gallium nitride on a spinel substrate
US5778116A (en) 1997-01-23 1998-07-07 Tomich; John L. Photonic home area network fiber/power insertion apparatus
US5952695A (en) 1997-03-05 1999-09-14 International Business Machines Corporation Silicon-on-insulator and CMOS-on-SOI double film structures
US6008762A (en) 1997-03-31 1999-12-28 Qualcomm Incorporated Folded quarter-wave patch antenna
US6114996A (en) 1997-03-31 2000-09-05 Qualcomm Incorporated Increased bandwidth patch antenna
US5857049A (en) 1997-05-05 1999-01-05 Lucent Technologies, Inc., Precision alignment of optoelectronic devices
US5937285A (en) 1997-05-23 1999-08-10 Motorola, Inc. Method of fabricating submicron FETs with low temperature group III-V material
EP1016129B2 (en) 1997-06-24 2009-06-10 Massachusetts Institute Of Technology Controlling threading dislocation densities using graded layers and planarization
JP3813740B2 (en) 1997-07-11 2006-08-23 Tdk株式会社 Substrates for electronic devices
US6222654B1 (en) 1997-08-04 2001-04-24 Lucent Technologies, Inc. Optical node system for a ring architecture and method thereof
US5940691A (en) 1997-08-20 1999-08-17 Micron Technology, Inc. Methods of forming SOI insulator layers and methods of forming transistor devices
US6002375A (en) 1997-09-02 1999-12-14 Motorola, Inc. Multi-substrate radio-frequency circuit
US5981400A (en) 1997-09-18 1999-11-09 Cornell Research Foundation, Inc. Compliant universal substrate for epitaxial growth
AU9674498A (en) 1997-10-10 1999-05-03 Cornell Research Foundation Inc. Methods for growing defect-free heteroepitaxial layers
US6058131A (en) 1997-11-17 2000-05-02 E-Tek Dynamics, Inc. Wavelength stabilization of laser source using fiber Bragg grating feedback
US6020222A (en) 1997-12-16 2000-02-01 Advanced Micro Devices, Inc. Silicon oxide insulator (SOI) semiconductor having selectively linked body
JPH11274467A (en) 1998-03-26 1999-10-08 Murata Mfg Co Ltd Photo-electronic integrated-circuit device
US6055179A (en) 1998-05-19 2000-04-25 Canon Kk Memory device utilizing giant magnetoresistance effect
US6064078A (en) 1998-05-22 2000-05-16 Xerox Corporation Formation of group III-V nitride films on sapphire substrates with reduced dislocation densities
US6113690A (en) 1998-06-08 2000-09-05 Motorola, Inc. Method of preparing crystalline alkaline earth metal oxides on a Si substrate
KR20000003975A (en) 1998-06-30 2000-01-25 김영환 Method for manufacturing bonding-type soi wafer having a field oxide
US6121642A (en) 1998-07-20 2000-09-19 International Business Machines Corporation Junction mott transition field effect transistor (JMTFET) and switch for logic and memory applications
US6128178A (en) 1998-07-20 2000-10-03 International Business Machines Corporation Very thin film capacitor for dynamic random access memory (DRAM)
US6103008A (en) * 1998-07-30 2000-08-15 Ut-Battelle, Llc Silicon-integrated thin-film structure for electro-optic applications
JP3159255B2 (en) 1998-09-16 2001-04-23 日本電気株式会社 Sputter growth method for electrodes used in ferroelectric capacitors
US6355939B1 (en) 1998-11-03 2002-03-12 Lockheed Martin Corporation Multi-band infrared photodetector
US6173474B1 (en) 1999-01-08 2001-01-16 Fantom Technologies Inc. Construction of a vacuum cleaner head
US6180486B1 (en) 1999-02-16 2001-01-30 International Business Machines Corporation Process of fabricating planar and densely patterned silicon-on-insulator structure
US6143072A (en) 1999-04-06 2000-11-07 Ut-Battelle, Llc Generic process for preparing a crystalline oxide upon a group IV semiconductor substrate
US6392257B1 (en) * 2000-02-10 2002-05-21 Motorola Inc. Semiconductor structure, semiconductor device, communicating device, integrated circuit, and process for fabricating the same

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