AU2002221039A1 - Observation device and its manufacturing method, exposure device, and method formanufacturing micro device - Google Patents

Observation device and its manufacturing method, exposure device, and method formanufacturing micro device

Info

Publication number
AU2002221039A1
AU2002221039A1 AU2002221039A AU2103902A AU2002221039A1 AU 2002221039 A1 AU2002221039 A1 AU 2002221039A1 AU 2002221039 A AU2002221039 A AU 2002221039A AU 2103902 A AU2103902 A AU 2103902A AU 2002221039 A1 AU2002221039 A1 AU 2002221039A1
Authority
AU
Australia
Prior art keywords
manufacturing
formanufacturing
micro
observation
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002221039A
Other languages
English (en)
Inventor
Tadashi Nagayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of AU2002221039A1 publication Critical patent/AU2002221039A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7019—Calibration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/02—Testing optical properties
    • G01M11/0242—Testing optical properties by measuring geometrical properties or aberrations
    • G01M11/0257—Testing optical properties by measuring geometrical properties or aberrations by analyzing the image formed by the object to be tested
    • G01M11/0264—Testing optical properties by measuring geometrical properties or aberrations by analyzing the image formed by the object to be tested by using targets or reference patterns
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/0004—Microscopes specially adapted for specific applications
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/0004—Microscopes specially adapted for specific applications
    • G02B21/002—Scanning microscopes
    • G02B21/0024—Confocal scanning microscopes (CSOMs) or confocal "macroscopes"; Accessories which are not restricted to use with CSOMs, e.g. sample holders
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/0004—Microscopes specially adapted for specific applications
    • G02B21/002—Scanning microscopes
    • G02B21/0024—Confocal scanning microscopes (CSOMs) or confocal "macroscopes"; Accessories which are not restricted to use with CSOMs, e.g. sample holders
    • G02B21/0052—Optical details of the image generation
    • G02B21/0072—Optical details of the image generation details concerning resolution or correction, including general design of CSOM objectives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G03F7/706—Aberration measurement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Lenses (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
AU2002221039A 2000-12-06 2001-11-22 Observation device and its manufacturing method, exposure device, and method formanufacturing micro device Abandoned AU2002221039A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000370871A JP2002175964A (ja) 2000-12-06 2000-12-06 観察装置およびその製造方法、露光装置、並びにマイクロデバイスの製造方法
JP2000-370871 2000-12-06
PCT/JP2001/010257 WO2002047130A1 (fr) 2000-12-06 2001-11-22 Methode de production de bisphenol a

Publications (1)

Publication Number Publication Date
AU2002221039A1 true AU2002221039A1 (en) 2002-06-18

Family

ID=18840681

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002221039A Abandoned AU2002221039A1 (en) 2000-12-06 2001-11-22 Observation device and its manufacturing method, exposure device, and method formanufacturing micro device

Country Status (7)

Country Link
US (1) US20040027549A1 (zh)
EP (1) EP1349201A4 (zh)
JP (1) JP2002175964A (zh)
KR (1) KR20040028689A (zh)
CN (1) CN1479940A (zh)
AU (1) AU2002221039A1 (zh)
WO (1) WO2002047130A1 (zh)

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DE10258715B4 (de) * 2002-12-10 2006-12-21 Carl Zeiss Smt Ag Verfahren zur Herstellung eines optischen Abbildungssystems
JP2006516766A (ja) * 2003-02-04 2006-07-06 ゼテテック インスティテュート 非共焦点、共焦点、および、干渉型共焦点顕微鏡観察で生じる基板−媒体界面における屈折率ミスマッチ作用の補償
GB0304568D0 (en) 2003-02-27 2003-04-02 Isis Innovation Microscopic imaging device
JP2005114400A (ja) * 2003-10-03 2005-04-28 Nikon Corp 光学特性の計測方法、反射防止膜、光学系及び投影露光装置
US7116398B2 (en) * 2003-11-07 2006-10-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN1918513B (zh) * 2004-02-05 2011-02-02 皇家飞利浦电子股份有限公司 掩模检查装置和方法
US7277231B2 (en) 2004-04-02 2007-10-02 Carl Zeiss Smt Ag Projection objective of a microlithographic exposure apparatus
JP2006126078A (ja) * 2004-10-29 2006-05-18 Nikon Corp マーク位置検出装置及び設計方法及び評価方法
WO2006053751A2 (de) * 2004-11-18 2006-05-26 Carl Zeiss Smt Ag Projektionsobjektiv einer mikrolithographischen projektionsbelichtungsanlage
JP4645271B2 (ja) * 2005-04-05 2011-03-09 株式会社ニコン 投影光学系の製造方法、露光装置及びマイクロデバイスの製造方法
EP1875292A2 (en) * 2005-04-26 2008-01-09 Carl Zeiss SMT AG Illumination system for a microlithgraphic exposure apparatus
WO2007010011A2 (en) * 2005-07-19 2007-01-25 Carl Zeiss Smt Ag Optical element module
US7372633B2 (en) * 2006-07-18 2008-05-13 Asml Netherlands B.V. Lithographic apparatus, aberration correction device and device manufacturing method
RU2009105892A (ru) * 2006-07-20 2010-08-27 Конинклейке Филипс Электроникс Н.В. (Nl) Многоцветный биодатчик
DE102006045838A1 (de) * 2006-09-27 2008-04-03 Carl Zeiss Sms Gmbh Mikroskop zur Untersuchung von Masken mit unterschiedlicher Dicke
JP2010506388A (ja) * 2006-10-02 2010-02-25 カール・ツァイス・エスエムティー・アーゲー 光学システムの結像特性を改善する方法及びその光学システム
JP5270109B2 (ja) * 2007-05-23 2013-08-21 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
DE102008017645A1 (de) * 2008-04-04 2009-10-08 Carl Zeiss Smt Ag Vorrichtung zur mikrolithographischen Projektionsbelichtung sowie Vorrichtung zur Inspektion einer Oberfläche eines Substrats
DE102008001892A1 (de) * 2008-05-21 2009-11-26 Carl Zeiss Smt Ag Optisches System für die Mikrolithographie
JP5312058B2 (ja) * 2009-01-19 2013-10-09 キヤノン株式会社 投影光学系、露光装置及びデバイス製造方法
JP5532881B2 (ja) * 2009-04-10 2014-06-25 株式会社リコー 撮像装置、車載撮像装置、撮像装置の製造方法及び製造装置
CN102375352B (zh) * 2010-08-11 2013-07-17 上海微电子装备有限公司 一种环境补偿对准系统
WO2014010593A1 (ja) * 2012-07-10 2014-01-16 株式会社ニコン マーク及びその形成方法、並びに露光装置
DE102012214610A1 (de) * 2012-08-16 2013-09-12 Carl Zeiss Smt Gmbh Messvorrichtung zur interferometrischen Vermessung einer Teleskopoptik
JP6410406B2 (ja) * 2012-11-16 2018-10-24 キヤノン株式会社 投影光学系、露光装置および物品の製造方法
JP5925972B2 (ja) * 2012-11-30 2016-05-25 キューイーディー・テクノロジーズ・インターナショナル・インコーポレーテッド 一体型の波面センサおよび粗面計
JP2014120682A (ja) * 2012-12-18 2014-06-30 Canon Inc 露光装置、露光方法及びデバイス製造方法
JP6971637B2 (ja) * 2016-06-29 2021-11-24 キヤノン株式会社 アタッチメント光学系、撮像光学系、および、撮像装置
WO2018028971A1 (en) 2016-08-11 2018-02-15 Asml Holding N.V. Variable corrector of a wave front
JP7178932B2 (ja) * 2019-03-12 2022-11-28 キヤノン株式会社 露光装置、および物品製造方法
CN110514142B (zh) * 2019-09-29 2020-09-08 中国科学院长春光学精密机械与物理研究所 一种面形检测装置及面形检测方法

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Also Published As

Publication number Publication date
US20040027549A1 (en) 2004-02-12
JP2002175964A (ja) 2002-06-21
KR20040028689A (ko) 2004-04-03
EP1349201A1 (en) 2003-10-01
WO2002047130A1 (fr) 2002-06-13
CN1479940A (zh) 2004-03-03
EP1349201A4 (en) 2008-05-21

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