AU2002220923A1 - Thermoelectric spot coolers for rf and microwave communication integrated circuits - Google Patents

Thermoelectric spot coolers for rf and microwave communication integrated circuits

Info

Publication number
AU2002220923A1
AU2002220923A1 AU2002220923A AU2092302A AU2002220923A1 AU 2002220923 A1 AU2002220923 A1 AU 2002220923A1 AU 2002220923 A AU2002220923 A AU 2002220923A AU 2092302 A AU2092302 A AU 2092302A AU 2002220923 A1 AU2002220923 A1 AU 2002220923A1
Authority
AU
Australia
Prior art keywords
integrated circuits
microwave communication
communication integrated
thermoelectric
spot coolers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002220923A
Other languages
English (en)
Inventor
Given Not
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of AU2002220923A1 publication Critical patent/AU2002220923A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
AU2002220923A 2000-12-11 2001-12-11 Thermoelectric spot coolers for rf and microwave communication integrated circuits Abandoned AU2002220923A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/734,519 2000-12-11
US09/734,519 US6588217B2 (en) 2000-12-11 2000-12-11 Thermoelectric spot coolers for RF and microwave communication integrated circuits
PCT/GB2001/005469 WO2002049105A2 (en) 2000-12-11 2001-12-11 Thermoelectric spot coolers for rf and microwave communication integrated circuits

Publications (1)

Publication Number Publication Date
AU2002220923A1 true AU2002220923A1 (en) 2002-06-24

Family

ID=24952016

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002220923A Abandoned AU2002220923A1 (en) 2000-12-11 2001-12-11 Thermoelectric spot coolers for rf and microwave communication integrated circuits

Country Status (10)

Country Link
US (1) US6588217B2 (ko)
EP (1) EP1342267A2 (ko)
JP (1) JP4478388B2 (ko)
KR (1) KR100543858B1 (ko)
CN (1) CN100409432C (ko)
AU (1) AU2002220923A1 (ko)
CA (1) CA2426562C (ko)
IL (2) IL156321A0 (ko)
TW (1) TW538515B (ko)
WO (1) WO2002049105A2 (ko)

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US8722222B2 (en) 2011-07-11 2014-05-13 Gentherm Incorporated Thermoelectric-based thermal management of electrical devices
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DE112014000419T5 (de) 2013-01-14 2015-10-15 Gentherm Incorporated Auf Thermoelektrik basierendes Thermomanagement elektrischer Vorrichtungen
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US10162394B2 (en) 2014-09-10 2018-12-25 Arizona Board Of Regents On Behalf Of Arizona State University Systems and methods for sustainable self-cooling of central processing unit thermal hot spots using thermoelectric materials
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US10937762B2 (en) 2018-10-04 2021-03-02 iCometrue Company Ltd. Logic drive based on multichip package using interconnection bridge
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CN113167510A (zh) 2018-11-30 2021-07-23 金瑟姆股份公司 热电调节系统和方法
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Also Published As

Publication number Publication date
IL156321A (en) 2007-05-15
WO2002049105A3 (en) 2002-12-05
EP1342267A2 (en) 2003-09-10
CN1650422A (zh) 2005-08-03
IL156321A0 (en) 2004-01-04
WO2002049105A2 (en) 2002-06-20
CA2426562A1 (en) 2002-06-20
US20020092307A1 (en) 2002-07-18
JP2004516653A (ja) 2004-06-03
JP4478388B2 (ja) 2010-06-09
KR20040014435A (ko) 2004-02-14
TW538515B (en) 2003-06-21
CN100409432C (zh) 2008-08-06
US6588217B2 (en) 2003-07-08
KR100543858B1 (ko) 2006-01-23
CA2426562C (en) 2007-07-31

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