IL156321A0 - Thermoelectric spot coolers for rf and microwave communication integrated circuits - Google Patents

Thermoelectric spot coolers for rf and microwave communication integrated circuits

Info

Publication number
IL156321A0
IL156321A0 IL15632101A IL15632101A IL156321A0 IL 156321 A0 IL156321 A0 IL 156321A0 IL 15632101 A IL15632101 A IL 15632101A IL 15632101 A IL15632101 A IL 15632101A IL 156321 A0 IL156321 A0 IL 156321A0
Authority
IL
Israel
Prior art keywords
integrated circuits
microwave communication
communication integrated
thermoelectric
spot coolers
Prior art date
Application number
IL15632101A
Other languages
English (en)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of IL156321A0 publication Critical patent/IL156321A0/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
IL15632101A 2000-12-11 2001-12-11 Thermoelectric spot coolers for rf and microwave communication integrated circuits IL156321A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/734,519 US6588217B2 (en) 2000-12-11 2000-12-11 Thermoelectric spot coolers for RF and microwave communication integrated circuits
PCT/GB2001/005469 WO2002049105A2 (en) 2000-12-11 2001-12-11 Thermoelectric spot coolers for rf and microwave communication integrated circuits

Publications (1)

Publication Number Publication Date
IL156321A0 true IL156321A0 (en) 2004-01-04

Family

ID=24952016

Family Applications (2)

Application Number Title Priority Date Filing Date
IL15632101A IL156321A0 (en) 2000-12-11 2001-12-11 Thermoelectric spot coolers for rf and microwave communication integrated circuits
IL156321A IL156321A (en) 2000-12-11 2003-06-04 Spot thermoelectric coolers for microwave and FR communication chips

Family Applications After (1)

Application Number Title Priority Date Filing Date
IL156321A IL156321A (en) 2000-12-11 2003-06-04 Spot thermoelectric coolers for microwave and FR communication chips

Country Status (10)

Country Link
US (1) US6588217B2 (ko)
EP (1) EP1342267A2 (ko)
JP (1) JP4478388B2 (ko)
KR (1) KR100543858B1 (ko)
CN (1) CN100409432C (ko)
AU (1) AU2002220923A1 (ko)
CA (1) CA2426562C (ko)
IL (2) IL156321A0 (ko)
TW (1) TW538515B (ko)
WO (1) WO2002049105A2 (ko)

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US20050150536A1 (en) * 2004-01-13 2005-07-14 Nanocoolers, Inc. Method for forming a monolithic thin-film thermoelectric device including complementary thermoelectric materials
US20050150539A1 (en) * 2004-01-13 2005-07-14 Nanocoolers, Inc. Monolithic thin-film thermoelectric device including complementary thermoelectric materials
US20050160752A1 (en) * 2004-01-23 2005-07-28 Nanocoolers, Inc. Apparatus and methodology for cooling of high power density devices by electrically conducting fluids
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US7286359B2 (en) * 2004-05-11 2007-10-23 The U.S. Government As Represented By The National Security Agency Use of thermally conductive vias to extract heat from microelectronic chips and method of manufacturing
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KR101928005B1 (ko) * 2011-12-01 2019-03-13 삼성전자주식회사 열전 냉각 패키지 및 이의 열관리 방법
JP6513577B2 (ja) 2013-01-14 2019-05-15 ジェンサーム インコーポレイテッドＧｅｎｔｈｅｒｍ Ｉｎｃｏｒｐｏｒａｔｅｄ 電気装置の熱電ベースの熱管理
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US10162394B2 (en) 2014-09-10 2018-12-25 Arizona Board Of Regents On Behalf Of Arizona State University Systems and methods for sustainable self-cooling of central processing unit thermal hot spots using thermoelectric materials
US9899711B2 (en) 2014-09-12 2018-02-20 Gentherm Incorporated Graphite thermoelectric and/or resistive thermal management systems and methods
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US11309334B2 (en) 2018-09-11 2022-04-19 iCometrue Company Ltd. Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells
US10937762B2 (en) 2018-10-04 2021-03-02 iCometrue Company Ltd. Logic drive based on multichip package using interconnection bridge
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Also Published As

Publication number Publication date
CN100409432C (zh) 2008-08-06
CA2426562C (en) 2007-07-31
KR20040014435A (ko) 2004-02-14
TW538515B (en) 2003-06-21
US6588217B2 (en) 2003-07-08
US20020092307A1 (en) 2002-07-18
EP1342267A2 (en) 2003-09-10
CN1650422A (zh) 2005-08-03
CA2426562A1 (en) 2002-06-20
JP2004516653A (ja) 2004-06-03
WO2002049105A2 (en) 2002-06-20
WO2002049105A3 (en) 2002-12-05
AU2002220923A1 (en) 2002-06-24
JP4478388B2 (ja) 2010-06-09
KR100543858B1 (ko) 2006-01-23
IL156321A (en) 2007-05-15

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