AU2001279530A1 - Printed circuit board and method for producing a printed circuit board of this type and for producing a laminar composite material for such a printed circuit board - Google Patents

Printed circuit board and method for producing a printed circuit board of this type and for producing a laminar composite material for such a printed circuit board

Info

Publication number
AU2001279530A1
AU2001279530A1 AU2001279530A AU7953001A AU2001279530A1 AU 2001279530 A1 AU2001279530 A1 AU 2001279530A1 AU 2001279530 A AU2001279530 A AU 2001279530A AU 7953001 A AU7953001 A AU 7953001A AU 2001279530 A1 AU2001279530 A1 AU 2001279530A1
Authority
AU
Australia
Prior art keywords
circuit board
printed circuit
producing
composite material
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001279530A
Other languages
English (en)
Inventor
Peter Straub
Peter Weber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PPC Electronic AG
Original Assignee
PPC Electronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PPC Electronic AG filed Critical PPC Electronic AG
Publication of AU2001279530A1 publication Critical patent/AU2001279530A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulating Bodies (AREA)
AU2001279530A 2000-10-13 2001-08-02 Printed circuit board and method for producing a printed circuit board of this type and for producing a laminar composite material for such a printed circuit board Abandoned AU2001279530A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH20202000 2000-10-13
CH2020/00 2000-10-13
PCT/CH2001/000472 WO2002032199A1 (de) 2000-10-13 2001-08-02 Leiterplatte sowie verfahren zum herstellen einer solchen leiterplatte und eines schichtverbundmaterials für eine solche leiterplatte

Publications (1)

Publication Number Publication Date
AU2001279530A1 true AU2001279530A1 (en) 2002-04-22

Family

ID=4567159

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001279530A Abandoned AU2001279530A1 (en) 2000-10-13 2001-08-02 Printed circuit board and method for producing a printed circuit board of this type and for producing a laminar composite material for such a printed circuit board

Country Status (7)

Country Link
US (1) US7226653B2 (de)
EP (1) EP1325673B1 (de)
JP (1) JP2004511111A (de)
AT (1) ATE274289T1 (de)
AU (1) AU2001279530A1 (de)
DE (1) DE50103348D1 (de)
WO (1) WO2002032199A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10262143B4 (de) * 2002-12-20 2011-01-20 Ksg Leiterplatten Gmbh Lichtemittierende Anordnung
JP4829028B2 (ja) * 2006-07-31 2011-11-30 富士通株式会社 回路基板及び回路基板の製造方法
US8861214B1 (en) * 2006-11-22 2014-10-14 Marvell International Ltd. High resistivity substrate for integrated passive device (IPD) applications
US9782949B2 (en) * 2008-05-30 2017-10-10 Corning Incorporated Glass laminated articles and layered articles
US20120280368A1 (en) * 2011-05-06 2012-11-08 Sean Matthew Garner Laminated structure for semiconductor devices
WO2014098099A1 (ja) * 2012-12-18 2014-06-26 日立化成株式会社 積層体、積層板、プリント配線板、積層体の製造方法、及び積層板の製造方法
DE102013215060A1 (de) 2013-07-31 2015-02-05 Irlbacher Blickpunkt Glas Gmbh Kapazitive Sensorvorrichtung mit elektrisch leitfähig beschichteter Sensorplatte aus Dünnglas
FR3012071B1 (fr) * 2013-10-23 2021-01-01 Saint Gobain Verre feuillete mince
KR101650938B1 (ko) * 2014-09-25 2016-08-24 코닝정밀소재 주식회사 집적회로 패키지용 기판
EP3723122B1 (de) * 2019-04-10 2023-02-15 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Komponententräger mit doppelschichtstruktur
TWI744896B (zh) * 2020-05-12 2021-11-01 台灣愛司帝科技股份有限公司 導電玻璃基板以及導電玻璃基板的製造系統與製作方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2913632A (en) * 1955-08-08 1959-11-17 Austin N Stanton Micro-circuits, electric devices there-for, and methods for making same
US4017642A (en) * 1975-07-28 1977-04-12 George O. Orth Process of making food for ruminant animals from wood and/or woody products
JPS61110546A (ja) * 1984-11-06 1986-05-28 昭和電工株式会社 フレキシブルプリント基板
JPS61229389A (ja) * 1985-04-03 1986-10-13 イビデン株式会社 セラミツク配線板およびその製造方法
US5149590A (en) 1987-02-17 1992-09-22 Rogers Corporation Electrical substrate material
JPH03136294A (ja) * 1989-10-20 1991-06-11 Matsushita Electric Ind Co Ltd ガラス配線基板
WO1996022949A1 (en) 1995-01-27 1996-08-01 Sarnoff Corporation Low dielectric loss glasses
JP3954125B2 (ja) * 1996-01-30 2007-08-08 日東紡績株式会社 低誘電率ガラスペーパー及びそれを用いたプリント配線基板
JPH09270573A (ja) * 1996-03-29 1997-10-14 Cmk Corp プリント配線板及びその製造方法
US6127052A (en) 1997-06-10 2000-10-03 Canon Kabushiki Kaisha Substrate and method for producing it
JP4264517B2 (ja) 1997-10-24 2009-05-20 奇美電子股▲分▼有限公司 レーザー記録媒体及び薄いガラス層を含むデータカード
US6268058B1 (en) 1997-10-24 2001-07-31 Agfa-Gevaert Security card comprising a thin glass layer
US6287674B1 (en) * 1997-10-24 2001-09-11 Agfa-Gevaert Laminate comprising a thin borosilicate glass substrate as a constituting layer
DE19810325A1 (de) 1998-03-11 1999-09-16 Karl Otto Platz Verfahren zur Erhöhung der Kantenfestigkeit der Glaskanten einer Dünnglasscheibe
EP0972632B1 (de) * 1998-07-15 2004-08-04 Agfa-Gevaert Datenkarte mit einem Laser-Aufzeichnungsmedium und einer dünnen Glasschicht
DE10080449D2 (de) 1999-02-23 2001-11-22 Ppc Electronic Ag Cham Leiterplatte für electrische und optische Signale sowie Verfahren zu deren Herstellung
EP1500315A1 (de) 2002-04-26 2005-01-26 E.I. Du Pont De Nemours And Company Verlustarmes dielektrisches material für leiterplatten und integrierte schaltungschip-packungen

Also Published As

Publication number Publication date
ATE274289T1 (de) 2004-09-15
JP2004511111A (ja) 2004-04-08
US20040028883A1 (en) 2004-02-12
EP1325673B1 (de) 2004-08-18
US7226653B2 (en) 2007-06-05
EP1325673A1 (de) 2003-07-09
DE50103348D1 (de) 2004-09-23
WO2002032199A1 (de) 2002-04-18

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