AU2001251054A1 - Form-in-place gasket for electronic applications - Google Patents
Form-in-place gasket for electronic applicationsInfo
- Publication number
- AU2001251054A1 AU2001251054A1 AU2001251054A AU5105401A AU2001251054A1 AU 2001251054 A1 AU2001251054 A1 AU 2001251054A1 AU 2001251054 A AU2001251054 A AU 2001251054A AU 5105401 A AU5105401 A AU 5105401A AU 2001251054 A1 AU2001251054 A1 AU 2001251054A1
- Authority
- AU
- Australia
- Prior art keywords
- place gasket
- electronic applications
- mug
- curing
- thixotropic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/14—Sealings between relatively-stationary surfaces by means of granular or plastic material, or fluid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
- B29C67/246—Moulding high reactive monomers or prepolymers, e.g. by reaction injection moulding [RIM], liquid injection moulding [LIM]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/08—Epoxidised polymerised polyenes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
- F16J15/10—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing
- F16J15/102—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing characterised by material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/26—Sealing devices, e.g. packaging for pistons or pipe joints
- B29L2031/265—Packings, Gaskets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Gasket Seals (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09736896 | 2000-12-14 | ||
US09/736,896 US6346330B1 (en) | 2000-12-14 | 2000-12-14 | Form-in-place gasket for electronic applications |
PCT/US2001/009941 WO2002048584A1 (fr) | 2000-12-14 | 2001-03-27 | Joint forme en place destine a des applications electroniques |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001251054A1 true AU2001251054A1 (en) | 2002-06-24 |
Family
ID=24961764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001251054A Abandoned AU2001251054A1 (en) | 2000-12-14 | 2001-03-27 | Form-in-place gasket for electronic applications |
Country Status (7)
Country | Link |
---|---|
US (1) | US6346330B1 (fr) |
EP (1) | EP1342025B1 (fr) |
JP (1) | JP2004515643A (fr) |
AT (1) | ATE328226T1 (fr) |
AU (1) | AU2001251054A1 (fr) |
DE (1) | DE60120215T2 (fr) |
WO (1) | WO2002048584A1 (fr) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6670017B2 (en) * | 2000-12-14 | 2003-12-30 | 3M Innovative Properties Company | Photocurable form-in-place gasket for electronic applications |
CN100390444C (zh) * | 2002-09-12 | 2008-05-28 | Nok株式会社 | 垫圈 |
US20060111497A1 (en) * | 2004-11-23 | 2006-05-25 | Hochgesang Paul J | Liquid rubber article in situ compounding into a forming mold |
US7723441B2 (en) * | 2005-12-29 | 2010-05-25 | Corning Incorporated | Low out-gassing room temperature curable rubbery polymer, preparation thereof and device comprising same |
KR20110135862A (ko) * | 2009-02-25 | 2011-12-19 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 내투습성을 갖는 개스킷을 구비한 용품 및 방법 |
US20110073344A1 (en) * | 2009-09-29 | 2011-03-31 | Hyperion Catalysis International, Inc. | Gasket containing carbon nanotubes |
US8547710B2 (en) | 2009-10-16 | 2013-10-01 | Emprimus, Llc | Electromagnetically shielded power module |
US8642900B2 (en) * | 2009-10-16 | 2014-02-04 | Emprimus, Llc | Modular electromagnetically shielded enclosure |
JP5547456B2 (ja) * | 2009-11-10 | 2014-07-16 | スリーエム イノベイティブ プロパティズ カンパニー | 一液型エポキシ樹脂組成物及びそれを用いた接着方法 |
US8760859B2 (en) | 2010-05-03 | 2014-06-24 | Emprimus, Llc | Electromagnetically-shielded portable storage device |
US8599576B2 (en) | 2010-10-29 | 2013-12-03 | Emprimus, Llc | Electromagnetically-protected electronic equipment |
US8643772B2 (en) | 2010-11-05 | 2014-02-04 | Emprimus, Llc | Electromagnetically shielded video camera and shielded enclosure for image capture devices |
US8754980B2 (en) | 2010-11-05 | 2014-06-17 | Emprimus, Llc | Electromagnetically shielded camera and shielded enclosure for image capture devices |
US9420219B2 (en) | 2010-12-20 | 2016-08-16 | Emprimus, Llc | Integrated security video and electromagnetic pulse detector |
WO2012088134A2 (fr) | 2010-12-20 | 2012-06-28 | Emprimus, Inc. | Émetteur à radiofréquence réparti et localisé de faible puissance |
WO2012139024A1 (fr) | 2011-04-06 | 2012-10-11 | Emprimus, Inc. | Système optique blindé de façon électromagnétique |
US9701388B2 (en) | 2011-05-11 | 2017-07-11 | Aviation Devices & Electronic Components, Llc | Gasket having a pliable resilient body with a perimeter having characteristics different than the body |
EP2721914A4 (fr) | 2011-06-17 | 2015-07-22 | Aviat Devices & Electronic Components Llc | Joint d'étanchéité collant sur un seul côté |
US8863625B2 (en) | 2011-06-21 | 2014-10-21 | Aviation Devices & Electronics Components, LLC | Elastomeric gasket squeeze out removal method and kit |
US8691033B1 (en) | 2011-07-06 | 2014-04-08 | Aviation Devices & Electronic Components, Llc | Positioning a workpiece on a sticky gasket |
US9246035B2 (en) | 2011-09-30 | 2016-01-26 | Day and Night Solar, LLC | Portable solar panel power source |
US9702464B1 (en) | 2011-10-03 | 2017-07-11 | The Patent Well LLC | Non-planar stick gaskets for receipt between a base and a workpiece |
US9303447B1 (en) | 2012-05-15 | 2016-04-05 | Aviation Devices & Electronic Components LLC | Elastomeric gasket for fuel access door of an aircraft wing and a method for making the same |
US9751244B2 (en) | 2012-05-15 | 2017-09-05 | The Patent Well LLC | Elastomeric gasket for fuel access door of an aircraft wing and a method for making the same |
US9671023B2 (en) | 2012-07-10 | 2017-06-06 | Aviation Devices & Electronic Components, Llc | Spacer and gasket assembly for use on an aircraft |
US9016697B2 (en) | 2012-07-10 | 2015-04-28 | Aviation Devices & Electronic Components, Llc | Spacer and gasket assembly for use on an aircraft |
MX348516B (es) | 2013-03-14 | 2017-06-16 | Emprimus Llc | Gabinete electronico protegido electromagneticamente. |
DE102013205347A1 (de) * | 2013-03-26 | 2014-10-02 | Hilti Aktiengesellschaft | Additiv-Zusammensetzung für Amin-Härter, deren Verwendung sowie diese enthaltende Amin-Härterzusammensetzung |
US9394436B2 (en) | 2013-08-26 | 2016-07-19 | Dymax Corporation | Form in-place gasket with tack free surface |
CA2981852A1 (fr) | 2015-04-08 | 2016-10-13 | Aviation Devices & Electronic Components, L.L.C. | Treillis metallique comportant un revetement de conversion a faible resistance electrique pour une utilisation avec des structures d'aeronef |
CN112424440A (zh) * | 2018-09-17 | 2021-02-26 | 哈利伯顿能源服务公司 | 用于静态井下工具应用的两件式粘结密封 |
US11622460B2 (en) | 2019-10-23 | 2023-04-04 | Advanced Illumination, Inc. | Hermetic fastener-less enclosures and methods of sealing the same |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2411688A2 (fr) * | 1977-12-14 | 1979-07-13 | Curty Soc | Procede de depot d'un cordon en elastomere ou thermodurcissable sur un support metallique |
JPS608007B2 (ja) * | 1977-12-19 | 1985-02-28 | エヌオーケー株式会社 | カルボキシル基含有エラストマ−加硫配合物 |
JPS55110116A (en) * | 1979-02-19 | 1980-08-25 | Asahi Chem Ind Co Ltd | Epoxy sealing compound |
JPS57159864A (en) * | 1981-03-30 | 1982-10-02 | Bridgestone Corp | Self-adhesive composition |
IT1182305B (it) | 1984-10-01 | 1987-10-05 | Tako Spa | Procedimento di fabbricazione di guarnizioni di tenuta e prodotto ottenuto col procedimento |
IT1180102B (it) | 1984-10-22 | 1987-09-23 | Tako Spa | Procedimento per la fabbricazione di guarnizioni di tenuta rinforzate e prodotto ottenuto col procedimento |
EP0349248A3 (fr) * | 1988-07-01 | 1991-01-02 | Southland Industries, Inc. | Procédé de fabrication d'un joint moulé sur place |
JPH0814980B2 (ja) * | 1991-03-08 | 1996-02-14 | 信越化学工業株式会社 | ハードディスク装置用カバー・パッキング組立体及びその製造方法 |
US5399626A (en) * | 1991-04-29 | 1995-03-21 | Shell Oil Company | Viscous conjugated diene block copolymers |
JPH06116363A (ja) * | 1992-10-02 | 1994-04-26 | Nippon Petrochem Co Ltd | 架橋性難燃組成物 |
JPH06192625A (ja) * | 1992-12-24 | 1994-07-12 | Three Bond Co Ltd | 油分の付着された被着面の接着方法 |
JP3325070B2 (ja) * | 1993-03-09 | 2002-09-17 | 鐘淵化学工業株式会社 | 硬化性ガスケット材料 |
JP3296033B2 (ja) * | 1993-07-20 | 2002-06-24 | 株式会社スリーボンド | 光硬化性樹脂組成物 |
CA2129073C (fr) | 1993-09-10 | 2007-06-05 | John P. Kalinoski | Joints moulants iem |
US5349817A (en) | 1993-11-12 | 1994-09-27 | Benteler Industries, Inc. | Air gap manifold port flange connection |
CA2187763A1 (fr) * | 1994-04-15 | 1995-10-26 | Michael Alan Masse | Modificateurs de durcissement d'un caoutchouc de faible viscosite ayant subi une epoxydation, destines a des resines epoxy |
DK1041869T3 (da) * | 1995-01-20 | 2009-07-13 | Parker Hannifin Corp | På anvendelsesstedet udformet EMI pakning |
US5641438A (en) | 1995-01-24 | 1997-06-24 | Bunyan; Michael H. | Method for forming an EMI shielding gasket |
FR2732976B1 (fr) | 1995-04-14 | 1997-07-04 | Rhone Poulenc Chimie | Composition silicone reticulable en gel adhesif |
JPH0912892A (ja) | 1995-07-04 | 1997-01-14 | Toray Dow Corning Silicone Co Ltd | 現場成形ガスケット用シリコーンゴム組成物 |
JP3482769B2 (ja) * | 1996-05-27 | 2004-01-06 | Nok株式会社 | 低硬度ゴム組成物 |
JPH10152672A (ja) * | 1996-11-21 | 1998-06-09 | Three Bond Co Ltd | ガスケットの形成方法 |
JPH10237420A (ja) * | 1997-02-20 | 1998-09-08 | Three Bond Co Ltd | 嫌気硬化性シール剤組成物 |
JP3893422B2 (ja) * | 1997-09-29 | 2007-03-14 | 新日本石油株式会社 | 電気電子素子封止用樹脂組成物 |
US5985952A (en) * | 1998-03-23 | 1999-11-16 | Alvin C. Levy & Associates, Inc. | Radiation curable primary coating composition for an optical fiber |
FR2780165B1 (fr) * | 1998-06-17 | 2003-06-13 | Fort Fibres Optiques Rech Tech | Fibre optique munie d'un revetement de protection et procede de fabrication de cette fibre |
JP2000154212A (ja) * | 1998-08-20 | 2000-06-06 | Kanegafuchi Chem Ind Co Ltd | 重合体およびエポキシ樹脂系組成物 |
US6265459B1 (en) * | 1998-12-31 | 2001-07-24 | 3M Innovative Properties Company | Accelerators useful for energy polymerizable compositions |
JP2000240802A (ja) * | 1999-02-25 | 2000-09-08 | Bridgestone Corp | 枠付ガスケット及びその製造方法 |
-
2000
- 2000-12-14 US US09/736,896 patent/US6346330B1/en not_active Expired - Lifetime
-
2001
- 2001-03-27 DE DE2001620215 patent/DE60120215T2/de not_active Expired - Fee Related
- 2001-03-27 WO PCT/US2001/009941 patent/WO2002048584A1/fr active IP Right Grant
- 2001-03-27 AT AT01924396T patent/ATE328226T1/de not_active IP Right Cessation
- 2001-03-27 AU AU2001251054A patent/AU2001251054A1/en not_active Abandoned
- 2001-03-27 JP JP2002549864A patent/JP2004515643A/ja active Pending
- 2001-03-27 EP EP20010924396 patent/EP1342025B1/fr not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE60120215D1 (de) | 2006-07-06 |
DE60120215T2 (de) | 2007-12-27 |
ATE328226T1 (de) | 2006-06-15 |
EP1342025B1 (fr) | 2006-05-31 |
EP1342025A1 (fr) | 2003-09-10 |
JP2004515643A (ja) | 2004-05-27 |
WO2002048584A1 (fr) | 2002-06-20 |
US6346330B1 (en) | 2002-02-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU2001251054A1 (en) | Form-in-place gasket for electronic applications | |
AU2001278870A1 (en) | Equipment and techniques for increasing the dynamic range of a projection system | |
GB2424896A (en) | Crosslinkable substituted fluorene compounds and congugated oligomers or polymers based thereon | |
WO2004078853A3 (fr) | Produit d'addition epoxyde/elastomere, son procede de production et materiaux et objets fabriques a partir d'un tel produit | |
TW200510467A (en) | Dielectric composite material | |
WO2004092495A3 (fr) | Systeme de confinement d'eclats et son procede de production | |
TW200721934A (en) | Electronic component embedded board and its manufacturing method | |
MXPA05007122A (es) | Composiciones de polieter fluorado. | |
SG128412A1 (en) | Resin composition for sealing semiconductor, semiconductor device using the same semiconductor waferand mounted structure of semiconductor device | |
AU2003280168A1 (en) | Stress-free composite substrate and method of manufacturing such a composite substrate | |
AU4544800A (en) | Sealing material, seal and method for sealing openings and use thereof | |
PL1735369T3 (pl) | Polidiorganosiloksany ulegające szybkiemu utwardzaniu | |
MY139162A (en) | Novolak resins and rubber compositions comprising the same | |
EP1484781A3 (fr) | Structure d'étanchéité et matériau d'étanchéité pour celle-ci. | |
YU5800A (sh) | Univerzalno primenljiva krvna plazma | |
AU2002314943A1 (en) | Capacitor having epoxy dielectric layer cured with aminophenylfluorenes | |
DE60021922D1 (de) | Beschleuniger geeignet für durch energie polymerisierbare zusammensetzungen | |
ATE129000T1 (de) | Epoxy-harzzusammensetzung zum abdichten von halbleiteranordnungen. | |
AU5547299A (en) | Novel latex compositions for deposition on various substrates | |
WO2002062897A8 (fr) | Composition de polyorganosiloxane | |
TW200606513A (en) | A wiring substrate and method using the same | |
MY124375A (en) | Elastically stretchable laminated sheet and process for making the same | |
MY119604A (en) | Epoxy resin and resin-sealed type semiconductor apparatus. | |
MY114498A (en) | Fractionated novolak resin and photoresist composition therefrom | |
EP0940418A3 (fr) | Composition d'élastoméres contenant des groupements époxy |