AU2000225767A1 - Semiconductor integrated circuit and its manufacturing method - Google Patents

Semiconductor integrated circuit and its manufacturing method

Info

Publication number
AU2000225767A1
AU2000225767A1 AU2000225767A AU2576700A AU2000225767A1 AU 2000225767 A1 AU2000225767 A1 AU 2000225767A1 AU 2000225767 A AU2000225767 A AU 2000225767A AU 2576700 A AU2576700 A AU 2576700A AU 2000225767 A1 AU2000225767 A1 AU 2000225767A1
Authority
AU
Australia
Prior art keywords
manufacturing
integrated circuit
semiconductor integrated
semiconductor
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2000225767A
Other languages
English (en)
Inventor
Hiroshi Fukuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of AU2000225767A1 publication Critical patent/AU2000225767A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528Geometry or layout of the interconnection structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0207Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
AU2000225767A 2000-02-22 2000-02-22 Semiconductor integrated circuit and its manufacturing method Abandoned AU2000225767A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2000/001001 WO2001063673A1 (en) 2000-02-22 2000-02-22 Semiconductor integrated circuit and its manufacturing method

Publications (1)

Publication Number Publication Date
AU2000225767A1 true AU2000225767A1 (en) 2001-09-03

Family

ID=11735705

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2000225767A Abandoned AU2000225767A1 (en) 2000-02-22 2000-02-22 Semiconductor integrated circuit and its manufacturing method

Country Status (3)

Country Link
JP (1) JPWO2001063673A1 (ja)
AU (1) AU2000225767A1 (ja)
WO (1) WO2001063673A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006028066A1 (ja) * 2004-09-08 2006-03-16 Matsushita Electric Industrial Co., Ltd. パターン生成方法
US7667332B2 (en) 2004-11-05 2010-02-23 Kabushiki Kaisha Toshiba Method for generating pattern, method for manufacturing semiconductor device, semiconductor device, and computer program product
JP2008258425A (ja) * 2007-04-05 2008-10-23 Matsushita Electric Ind Co Ltd 標準セルおよびこれを有する半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2829072B2 (ja) * 1989-12-18 1998-11-25 富士通株式会社 Lsi配線変更方法
JPH04329672A (ja) * 1991-04-30 1992-11-18 Nec Corp ゲートアレイ半導体装置の製造方法
JPH07249065A (ja) * 1994-03-10 1995-09-26 Fujitsu Ltd 配線経路探索方法
JP3352851B2 (ja) * 1995-07-31 2002-12-03 株式会社東芝 半導体集積回路装置の配線方法
JPH0964186A (ja) * 1995-08-28 1997-03-07 Fujitsu Ltd 配線設計方法及び半導体装置

Also Published As

Publication number Publication date
WO2001063673A1 (en) 2001-08-30
JPWO2001063673A1 (ja) 2004-01-08

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