ATE9043T1 - Laminierungsverfahren. - Google Patents

Laminierungsverfahren.

Info

Publication number
ATE9043T1
ATE9043T1 AT81103965T AT81103965T ATE9043T1 AT E9043 T1 ATE9043 T1 AT E9043T1 AT 81103965 T AT81103965 T AT 81103965T AT 81103965 T AT81103965 T AT 81103965T AT E9043 T1 ATE9043 T1 AT E9043T1
Authority
AT
Austria
Prior art keywords
liquid
substrate surface
lamination
photosensitive layer
layer
Prior art date
Application number
AT81103965T
Other languages
English (en)
Inventor
Jerold Samuel Weiner
Samuel Small
Original Assignee
E.I. Du Pont De Nemours And Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22548064&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE9043(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by E.I. Du Pont De Nemours And Company filed Critical E.I. Du Pont De Nemours And Company
Application granted granted Critical
Publication of ATE9043T1 publication Critical patent/ATE9043T1/de

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223One or more of the layers being plastic
    • B32B37/226Laminating sheets, panels or inserts between two continuous plastic layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0038Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving application of liquid to the layers prior to lamination, e.g. wet laminating
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/161Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/16Drying; Softening; Cleaning
    • B32B38/162Cleaning
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Reinforced Plastic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Photoreceptors In Electrophotography (AREA)
AT81103965T 1980-05-27 1981-05-23 Laminierungsverfahren. ATE9043T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15363780A 1980-05-27 1980-05-27
EP81103965A EP0040842B1 (de) 1980-05-27 1981-05-23 Laminierungsverfahren

Publications (1)

Publication Number Publication Date
ATE9043T1 true ATE9043T1 (de) 1984-09-15

Family

ID=22548064

Family Applications (1)

Application Number Title Priority Date Filing Date
AT81103965T ATE9043T1 (de) 1980-05-27 1981-05-23 Laminierungsverfahren.

Country Status (8)

Country Link
EP (1) EP0040842B1 (de)
JP (1) JPS5721891A (de)
AT (1) ATE9043T1 (de)
BR (1) BR8103186A (de)
CA (1) CA1168140A (de)
DE (1) DE3165542D1 (de)
IE (1) IE51810B1 (de)
ZA (1) ZA813495B (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0614185B2 (ja) * 1984-04-02 1994-02-23 日立化成工業株式会社 感光性樹脂組成物及びこれを用いた積層体
DE3420429A1 (de) * 1984-06-01 1985-12-05 ELTI Apparatebau und Elektronik GmbH, 6106 Erzhausen Verfahren zum laminieren eines films unter druck und waerme und vorrichtung zur durchfuehrung des verfahrens
DE3420409A1 (de) * 1984-06-01 1985-12-05 ELTI Apparatebau und Elektronik GmbH, 6106 Erzhausen Laminierstation
CA1263125A (en) * 1984-06-01 1989-11-21 Hans-Guenter E. Kuehnert Apparatus for the automatic feeding of a laminating station
JPS61109322A (ja) * 1984-11-01 1986-05-27 Hokuyo Automatic Co 電子カウンタ
GB2171571B (en) * 1985-02-27 1989-06-14 Hughes Microelectronics Ltd Non-volatile memory with predictable failure modes and method of data storage and retrieval
DE3510852A1 (de) * 1985-03-26 1986-10-09 ELTI Apparatebau und Elektronik GmbH, 6106 Erzhausen Greifereinrichtung in einer laminiervorrichtung
DE3538117A1 (de) * 1985-10-26 1987-04-30 Hoechst Ag Trennvorrichtung fuer platten
DE3736509A1 (de) * 1987-10-28 1989-05-11 Hoechst Ag Vorrichtung zum laminieren und schneiden von fotoresistbahnen
US4976817A (en) * 1988-12-09 1990-12-11 Morton International, Inc. Wet lamination process and apparatus
US7067226B2 (en) 2001-03-29 2006-06-27 Hitachi Chemical Co., Ltd. Photosensitive film for circuit formation and process for producing printed wiring board
CN101430507A (zh) * 2007-08-27 2009-05-13 E.I.内穆尔杜邦公司 基片上的可光聚合干膜的湿层叠以及与湿层叠有关的组合物
CN102485482A (zh) * 2010-12-03 2012-06-06 珠海丰洋化工有限公司 线路板贴膜设备及线路板湿贴膜方法
JP6397245B2 (ja) * 2014-07-23 2018-09-26 旭化成株式会社 レジストパターンの製造方法
CN113490344A (zh) * 2021-07-08 2021-10-08 江西柔顺科技有限公司 一种柔性线路板及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3365348A (en) * 1963-11-01 1968-01-23 Fmc Corp Film laminating method
US3607544A (en) * 1969-04-30 1971-09-21 Fmc Corp Mixture of steam, alcohol and polyalkyleneimine as adhesion promoter for laminates
US4069076A (en) * 1976-11-29 1978-01-17 E. I. Du Pont De Nemours And Company Liquid lamination process
DE3062778D1 (en) * 1979-11-08 1983-05-19 Gretag Ag Optical image intensifier
JPS6025769B2 (ja) * 1979-12-06 1985-06-20 セイコーエプソン株式会社 液晶表示装置

Also Published As

Publication number Publication date
BR8103186A (pt) 1982-02-09
EP0040842A1 (de) 1981-12-02
IE811159L (en) 1981-11-27
JPS5721891A (en) 1982-02-04
JPH0143943B2 (de) 1989-09-25
DE3165542D1 (en) 1984-09-20
IE51810B1 (en) 1987-04-01
ZA813495B (en) 1983-01-26
EP0040842B1 (de) 1984-08-15
CA1168140A (en) 1984-05-29

Similar Documents

Publication Publication Date Title
ATE9043T1 (de) Laminierungsverfahren.
JPS53135348A (en) Etching method for multilayer film
BR8103184A (pt) Processo para laminacao de uma camada foto-sensivel suportada para a forma de uma superficie de substrato limpa
EP0117055A3 (en) A method and apparatus for laminating foil to a substrate
ATE18471T1 (de) Laminierverfahren.
JPS5333050A (en) Production of semiconductor element
JPS5332114A (en) Quantitative determination of antigen and antibody
DK158644C (da) Fremgangsmaade til fremstilling af et antistof eller antiserum, anvendelse af denne fremgangsmaade til opnaaelse af pattedyrsceller, der er i stand til at producere et saadant antistof, og anvendelse af det saaledes fremstillede antistof eller antiserum til immunoassay.
JPS52131751A (en) Measuring method for thickness of transparent film
JPS5411693A (en) Processig method for elastic surface wave substrate
JPS52114632A (en) Pressure sensitive adhesive tape or sheet
JPS5679245A (en) Ion sensor
JPS5795405A (en) Bending method for surface-hardened synthetic resin sheet
JPS53112673A (en) Mask alignment method in semiconductor device manufacturing process and photo mask used for its execution
JPS5726443A (en) Method of stabilizing surface of silicon device
JPS5323877A (en) Refining apparatus
JPS541284A (en) Method of separating gas
JPS57160180A (en) Manufacture of semiconductor device
JPS57103418A (en) Production for quartz oscillator
JPS57102047A (en) Manufacture of amorphous semiconductor device
JPS5730394A (en) Semiconductor light emitting device and manufacture thereof
JPS57106124A (en) Wiring electrode
JPS5536812A (en) Formation method for sand blast resist image of photosensitive resin
JPS56160079A (en) Semiconductor device
JPS51147250A (en) Treatment method of semiconductor substrate

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee
RZN Patent revoked