ATE71770T1 - Verfahren zur herstellung elektronischer module, insbesondere fuer informationskarten. - Google Patents

Verfahren zur herstellung elektronischer module, insbesondere fuer informationskarten.

Info

Publication number
ATE71770T1
ATE71770T1 AT88114579T AT88114579T ATE71770T1 AT E71770 T1 ATE71770 T1 AT E71770T1 AT 88114579 T AT88114579 T AT 88114579T AT 88114579 T AT88114579 T AT 88114579T AT E71770 T1 ATE71770 T1 AT E71770T1
Authority
AT
Austria
Prior art keywords
hole
unit
electrodes
insulating substrate
module
Prior art date
Application number
AT88114579T
Other languages
English (en)
Inventor
Alain Juan
Jean-Claude Vuilleumier
Original Assignee
Em Microelectronic Marin Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9354898&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE71770(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Em Microelectronic Marin Sa filed Critical Em Microelectronic Marin Sa
Application granted granted Critical
Publication of ATE71770T1 publication Critical patent/ATE71770T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
AT88114579T 1987-09-14 1988-09-07 Verfahren zur herstellung elektronischer module, insbesondere fuer informationskarten. ATE71770T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8712739A FR2620586A1 (fr) 1987-09-14 1987-09-14 Procede de fabrication de modules electroniques, notamment pour cartes a microcircuits
EP88114579A EP0307773B1 (de) 1987-09-14 1988-09-07 Verfahren zur Herstellung elektronischer Module, insbesondere für Informationskarten

Publications (1)

Publication Number Publication Date
ATE71770T1 true ATE71770T1 (de) 1992-02-15

Family

ID=9354898

Family Applications (1)

Application Number Title Priority Date Filing Date
AT88114579T ATE71770T1 (de) 1987-09-14 1988-09-07 Verfahren zur herstellung elektronischer module, insbesondere fuer informationskarten.

Country Status (6)

Country Link
US (1) US4835846A (de)
EP (1) EP0307773B1 (de)
JP (1) JPH0199894A (de)
AT (1) ATE71770T1 (de)
DE (1) DE3867776D1 (de)
FR (1) FR2620586A1 (de)

Families Citing this family (54)

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FR2616995A1 (fr) * 1987-06-22 1988-12-23 Ebauchesfabrik Eta Ag Procede de fabrication de modules electroniques
FR2631200B1 (fr) * 1988-05-09 1991-02-08 Bull Cp8 Circuit imprime souple, notamment pour carte a microcircuits electroniques, et carte incorporant un tel circuit
ATE115335T1 (de) * 1988-09-30 1994-12-15 Raychem Ltd Verbindungsartikel für hybrid-mikrochip.
USRE35578E (en) * 1988-12-12 1997-08-12 Sgs-Thomson Microelectronics, Inc. Method to install an electronic component and its electrical connections on a support, and product obtained thereby
USRE35385E (en) * 1988-12-12 1996-12-03 Sgs-Thomson Microelectronics, Sa. Method for fixing an electronic component and its contacts to a support
US5282113A (en) * 1990-03-05 1994-01-25 Hitachi Maxell, Ltd. Memory card with a plurality of contact spaces
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US5404584A (en) * 1990-08-06 1995-04-04 Ericsson Ge Mobile Communications Inc. Printed circuit board having modularized circuit functions designed for early diagnostics
US5189363A (en) * 1990-09-14 1993-02-23 Ibm Corporation Integrated circuit testing system having a cantilevered contact lead probe pattern mounted on a flexible tape for interconnecting an integrated circuit to a tester
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FR2674681A1 (fr) * 1991-03-28 1992-10-02 Em Microelectronic Marin Sa Composant electronique ultramince et procede pour sa fabrication.
FR2675322A1 (fr) * 1991-04-11 1992-10-16 Ebauchesfabrik Eta Ag Micromoteur electromagnetique a flux axial.
FR2684236B1 (fr) * 1991-11-27 1998-08-21 Gemplus Card Int Dispositif de connexion de circuit integre.
US5255430A (en) * 1992-10-08 1993-10-26 Atmel Corporation Method of assembling a module for a smart card
DE4344297A1 (de) * 1993-12-23 1995-06-29 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Ausweiskarten
JP3383398B2 (ja) * 1994-03-22 2003-03-04 株式会社東芝 半導体パッケージ
EP0688050A1 (de) * 1994-06-15 1995-12-20 Philips Cartes Et Systemes Montageverfahren für IC-Karte und so erhaltene Karte
DE4421607A1 (de) * 1994-06-21 1996-01-04 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Datenträgern
FR2726106B1 (fr) * 1994-10-21 1996-11-29 Solaic Sa Carte electronique utilisable avec un lecteur de cartes sans contact et un lecteur de cartes a contacts
JPH0964240A (ja) 1995-08-25 1997-03-07 Toshiba Corp 半導体装置および半導体装置の製造方法
JPH09327990A (ja) * 1996-06-11 1997-12-22 Toshiba Corp カード型記憶装置
UA43455C2 (uk) * 1996-11-20 2001-12-17 Тексек, Інкорпорейтед Криптографічний носій інформації, спосіб формування криптографічного носія інформації та спосіб використання криптографічного носія інформації при транзакції
EP0845755B1 (de) * 1996-12-02 2004-03-10 Swisscom Mobile AG IC-Karte und Program für IC-Karten
WO1998029261A1 (fr) * 1996-12-26 1998-07-09 Hitachi, Ltd. Dispositif a semiconducteur et son procede de production
DE69837465T2 (de) * 1997-06-23 2007-12-13 Rohm Co. Ltd., Kyoto Modul für ic-karte, ic-karte und verfahren zu seiner herstellung
DE19809073A1 (de) * 1998-03-04 1999-09-16 Orga Kartensysteme Gmbh Chipmodul und Verfahren zur Herstellung einer Chipkarte
FR2778769B1 (fr) * 1998-05-15 2001-11-02 Gemplus Sca Carte a circuit integre comportant un bornier d'interface et procede de fabrication d'une telle carte
FR2781298B1 (fr) * 1998-07-20 2003-01-31 St Microelectronics Sa Procede de fabrication d'une carte a puce electronique et carte a puce electronique
US6173897B1 (en) * 1998-07-27 2001-01-16 John W. Halpern Universal card interface module for contact free cards
TW449796B (en) * 2000-08-02 2001-08-11 Chiou Wen Wen Manufacturing method for integrated circuit module
BRPI0212612B1 (pt) * 2001-09-18 2016-01-19 Nagraid Sa etiqueta eletrônica fina e método para fazer a mesma
DE10202727A1 (de) * 2002-01-24 2003-08-21 Infineon Technologies Ag Trägersubstrat für ein Chipmodul, Chipmodul und Chipkarte
JP2003341782A (ja) * 2002-05-27 2003-12-03 Oki Electric Ind Co Ltd 電子デバイス収容体、電子デバイスの搬送方法、電子デバイスの実装方法、電子デバイスの収容方法
EP1376462A1 (de) * 2002-06-19 2004-01-02 SCHLUMBERGER Systèmes Verfahren zur Herstellung eines Bandes
FI119583B (fi) 2003-02-26 2008-12-31 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
KR100651563B1 (ko) * 2005-07-07 2006-11-29 삼성전기주식회사 전자부품이 내장된 배선기판의 제조방법
FR2957175B1 (fr) * 2010-03-08 2012-08-17 Sansystems Dispositif electronique a puce et procede de fabrication par bobines.
EP2608114A1 (de) * 2011-12-19 2013-06-26 Gemalto SA Verfahren zur Herstellung eines durch ein Plättchen geschützten Chip-Moduls eines integrierten Schaltkreises
CN103473593B (zh) * 2012-06-05 2018-10-19 德昌电机(深圳)有限公司 智能卡、智能卡接触垫载板及其制造方法
USD707682S1 (en) * 2012-12-05 2014-06-24 Logomotion, S.R.O. Memory card
USD758372S1 (en) 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
USD759022S1 (en) 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
USD729808S1 (en) * 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
EP3007906A2 (de) 2013-06-09 2016-04-20 Apple Inc. Lasergeformte merkmale
EP2825001A1 (de) * 2013-07-10 2015-01-14 Gemalto SA Elektronisches Modul mit klebende dielektrische Beschichtung, und sein Herstellungsverfahren
SG11201510464UA (en) * 2013-07-10 2016-02-26 Gemalto Sa Dielectric filmless electronic module and method for manufacturing same
USD780763S1 (en) * 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
WO2017148901A1 (en) * 2016-03-01 2017-09-08 Cardlab Aps A circuit layer for an integrated circuit card
JP1647726S (de) 2018-02-01 2019-12-09
US11200386B2 (en) * 2018-09-27 2021-12-14 Apple Inc. Electronic card having an electronic interface
USD930000S1 (en) 2018-10-12 2021-09-07 Huawei Technologies Co., Ltd. Memory card

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US4042861A (en) * 1973-11-08 1977-08-16 Citizen Watch Company Limited Mounting arrangement for an integrated circuit unit in an electronic digital watch
FR2439438A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux
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FR2512990B1 (fr) * 1981-09-11 1987-06-19 Radiotechnique Compelec Procede pour fabriquer une carte de paiement electronique, et carte realisee selon ce procede
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FR2548857B1 (fr) * 1983-07-04 1987-11-27 Cortaillod Cables Sa Procede de fabrication en continu d'une carte imprimee
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FR2580416B1 (fr) * 1985-04-12 1987-06-05 Radiotechnique Compelec Procede et dispositif pour fabriquer une carte d'identification electronique
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Also Published As

Publication number Publication date
DE3867776D1 (de) 1992-02-27
US4835846A (en) 1989-06-06
EP0307773A1 (de) 1989-03-22
JPH0199894A (ja) 1989-04-18
EP0307773B1 (de) 1992-01-15
FR2620586A1 (fr) 1989-03-17

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