ATE60733T1 - Verfahren und vorrichtung mit ein- und ausgangsbehandlungskammern zum laminieren unter reduziertem druck. - Google Patents

Verfahren und vorrichtung mit ein- und ausgangsbehandlungskammern zum laminieren unter reduziertem druck.

Info

Publication number
ATE60733T1
ATE60733T1 AT86111989T AT86111989T ATE60733T1 AT E60733 T1 ATE60733 T1 AT E60733T1 AT 86111989 T AT86111989 T AT 86111989T AT 86111989 T AT86111989 T AT 86111989T AT E60733 T1 ATE60733 T1 AT E60733T1
Authority
AT
Austria
Prior art keywords
base board
reduced pressure
container
light sensitive
sensitive material
Prior art date
Application number
AT86111989T
Other languages
English (en)
Inventor
Yoshiaki Tomisawa
Tadaji Satou
Nobuyuki Hayashi
Higashicho
Yusuke Miyamae
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of ATE60733T1 publication Critical patent/ATE60733T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223—One or more of the layers being plastic
    • B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B32B38/1841—Positioning, e.g. registration or centering during laying up
    • B32B38/185—Positioning, e.g. registration or centering during laying up combined with the cutting of one or more layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/006—Using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317—Means feeding plural workpieces to be joined
    • Y10T156/1343—Cutting indefinite length web after assembly with discrete article

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Fluid-Pressure Circuits (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
AT86111989T 1985-08-30 1986-08-29 Verfahren und vorrichtung mit ein- und ausgangsbehandlungskammern zum laminieren unter reduziertem druck. ATE60733T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60192789A JPS6252552A (ja) 1985-08-30 1985-08-30 減圧貼り合わせ方法及び装置
EP86111989A EP0215358B1 (de) 1985-08-30 1986-08-29 Verfahren und Vorrichtung mit Ein- und Ausgangsbehandlungskammern zum Laminieren unter reduziertem Druck

Publications (1)

Publication Number Publication Date
ATE60733T1 true ATE60733T1 (de) 1991-02-15

Family

ID=16297021

Family Applications (1)

Application Number Title Priority Date Filing Date
AT86111989T ATE60733T1 (de) 1985-08-30 1986-08-29 Verfahren und vorrichtung mit ein- und ausgangsbehandlungskammern zum laminieren unter reduziertem druck.

Country Status (8)

Country Link
US (1) US4986869A (de)
EP (1) EP0215358B1 (de)
JP (1) JPS6252552A (de)
KR (1) KR900007774B1 (de)
AT (1) ATE60733T1 (de)
DE (1) DE3677437D1 (de)
HK (1) HK95591A (de)
SG (1) SG78591G (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63259559A (ja) * 1987-04-16 1988-10-26 Hitachi Condenser Co Ltd 印刷配線板のパタ−ン形成方法
US4992354A (en) * 1988-02-26 1991-02-12 Morton International, Inc. Dry film photoresist for forming a conformable mask and method of application to a printed circuit board or the like
US5078820A (en) * 1988-03-25 1992-01-07 Somar Corporation Method and apparatus for pressure sticking a thin film to a base plate
EP0392226A1 (de) * 1989-03-23 1990-10-17 Mitsubishi Gas Chemical Company, Inc. Kontinuierliches Postenverfahren und Vorrichtung zur Herstellung von Verbundstoffen unter Vakuum
JP2983253B2 (ja) * 1990-06-04 1999-11-29 伯東株式会社 真空ラミネータ
US5653846A (en) * 1991-11-11 1997-08-05 Canon Aptex Inc. Laminating apparatus
FR2693167A1 (fr) * 1992-07-06 1994-01-07 Bernard Andre Procédé et dispositif pour recouvrir une surface plane par un film adhésif.
EP1009206A3 (de) * 1998-12-02 2003-01-15 Ajinomoto Co., Inc. Verfahren zur Vakuumlaminierung eines Klebefilms
CN110709246A (zh) * 2017-10-11 2020-01-17 深圳市柔宇科技有限公司 真空贴合机和贴合方法
CN112172115A (zh) * 2020-07-20 2021-01-05 泉州台商投资区飞翔机械设计服务中心 一种贴膜玻璃生产用真空自动贴膜装置及其贴膜方法
CN114311631A (zh) * 2022-03-07 2022-04-12 江油星联电子科技有限公司 一种铜箔基板的压膜设备

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1430367A (en) * 1972-08-04 1976-03-31 Secr Defence Vacuum chamber
DE2544553C2 (de) * 1974-10-08 1983-08-04 E.I. du Pont de Nemours and Co., 19898 Wilmington, Del. Verfahren zum Aufbringen einer photopolymerisierbaren festen Resistschicht auf ein Substrat
JPS593740B2 (ja) * 1975-07-30 1984-01-25 日立化成工業株式会社 凹凸表面に感光層の形成された固体板の製造法
JPS5216405A (en) * 1975-07-31 1977-02-07 Mitsubishi Heavy Ind Ltd High purification process for liquid metals
US4047624A (en) * 1975-10-21 1977-09-13 Airco, Inc. Workpiece handling system for vacuum processing
JPS5266581A (en) * 1975-12-01 1977-06-02 Hitachi Chemical Co Ltd Apparatus for continuous plying * sticking each other under vacuum
JPS574194A (en) * 1980-06-10 1982-01-09 Hitachi Chemical Co Ltd Sealing structure for continuous pressure reduction bonding device
US4405435A (en) * 1980-08-27 1983-09-20 Hitachi, Ltd. Apparatus for performing continuous treatment in vacuum
US4511419A (en) * 1982-04-23 1985-04-16 Firma Erwin Kampf Gmbh & Co. Method and device for laminating foils
US4473922A (en) * 1982-10-29 1984-10-02 Weihe Clyde R Tray dryer
JPH01119672A (ja) * 1987-10-30 1989-05-11 Sumitomo Electric Ind Ltd 高硬度窒化ホウ素被覆部品

Also Published As

Publication number Publication date
EP0215358A3 (en) 1988-06-01
JPS6252552A (ja) 1987-03-07
KR870002485A (ko) 1987-03-31
HK95591A (en) 1991-12-06
US4986869A (en) 1991-01-22
EP0215358A2 (de) 1987-03-25
KR900007774B1 (ko) 1990-10-19
EP0215358B1 (de) 1991-02-06
SG78591G (en) 1991-11-15
DE3677437D1 (de) 1991-03-14

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee