ATE554149T1 - Klebefolie zum abschleifen der oberfläche eines halbleiterwafers und verfahren zum abschleifen der oberfläche eines halbleiterwafers unter verwendung der klebefolie - Google Patents

Klebefolie zum abschleifen der oberfläche eines halbleiterwafers und verfahren zum abschleifen der oberfläche eines halbleiterwafers unter verwendung der klebefolie

Info

Publication number
ATE554149T1
ATE554149T1 AT09002783T AT09002783T ATE554149T1 AT E554149 T1 ATE554149 T1 AT E554149T1 AT 09002783 T AT09002783 T AT 09002783T AT 09002783 T AT09002783 T AT 09002783T AT E554149 T1 ATE554149 T1 AT E554149T1
Authority
AT
Austria
Prior art keywords
semiconductor wafer
grinding
adhesive film
back surface
intermediate layer
Prior art date
Application number
AT09002783T
Other languages
English (en)
Inventor
Fumiteru Asai
Noriyoshi Kawashima
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of ATE554149T1 publication Critical patent/ATE554149T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H10P52/00—
    • H10P72/74—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2431/00—Presence of polyvinyl acetate
    • C09J2431/006—Presence of polyvinyl acetate in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/006—Presence of (meth)acrylic polymer in the substrate
    • H10P72/7422—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
AT09002783T 2008-02-29 2009-02-26 Klebefolie zum abschleifen der oberfläche eines halbleiterwafers und verfahren zum abschleifen der oberfläche eines halbleiterwafers unter verwendung der klebefolie ATE554149T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008049878A JP5318435B2 (ja) 2008-02-29 2008-02-29 半導体ウエハの裏面研削用粘着シート及びこの裏面研削用粘着シートを用いる半導体ウエハの裏面研削方法

Publications (1)

Publication Number Publication Date
ATE554149T1 true ATE554149T1 (de) 2012-05-15

Family

ID=40677773

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09002783T ATE554149T1 (de) 2008-02-29 2009-02-26 Klebefolie zum abschleifen der oberfläche eines halbleiterwafers und verfahren zum abschleifen der oberfläche eines halbleiterwafers unter verwendung der klebefolie

Country Status (7)

Country Link
US (1) US20090221215A1 (de)
EP (1) EP2096153B1 (de)
JP (1) JP5318435B2 (de)
KR (1) KR101294435B1 (de)
CN (1) CN101518887B (de)
AT (1) ATE554149T1 (de)
TW (1) TWI459455B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5705447B2 (ja) * 2010-03-31 2015-04-22 古河電気工業株式会社 表面保護用粘着テープ
EP2600391A1 (de) * 2010-07-28 2013-06-05 Du Pont-Mitsui Polychemicals Co., Ltd. Laminatfolie und folie zur verwendung bei der herstellung von halbleitern damit
JP6230354B2 (ja) * 2013-09-26 2017-11-15 株式会社ディスコ デバイスウェーハの加工方法
JP6595296B2 (ja) * 2015-10-19 2019-10-23 デクセリアルズ株式会社 保護テープ、及び半導体装置の製造方法
JP6906843B2 (ja) * 2017-04-28 2021-07-21 株式会社ディスコ ウェーハの加工方法
KR102345923B1 (ko) * 2017-05-18 2022-01-03 가부시기가이샤 디스코 웨이퍼를 프로세싱하는데 사용하기 위한 보호 시팅, 웨이퍼에 대한 핸들링 시스템, 및 웨이퍼 및 보호 시팅의 조합체
KR101982197B1 (ko) * 2017-09-26 2019-05-24 에스케이씨 주식회사 반도체용 테이프
CN109825215A (zh) * 2017-11-23 2019-05-31 上海海优威新材料股份有限公司 用于晶圆研磨的多层复合膜及其制备方法
JP7147163B2 (ja) * 2017-12-21 2022-10-05 昭和電工マテリアルズ株式会社 仮固定用樹脂フィルム、仮固定用樹脂フィルムシート、及び半導体装置の製造方法
JP7218514B2 (ja) * 2018-08-03 2023-02-07 住友ベークライト株式会社 仮固定用テープ
JP7164351B2 (ja) * 2018-08-07 2022-11-01 日東電工株式会社 バックグラインドテープ
CN113226754A (zh) * 2019-03-27 2021-08-06 琳得科株式会社 工件加工用片
JP7464706B2 (ja) * 2020-05-22 2024-04-09 三井化学東セロ株式会社 電子装置の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0789546B2 (ja) * 1985-05-15 1995-09-27 三井東圧化学株式会社 ウエハ加工用フィルム
US5149586A (en) * 1987-07-08 1992-09-22 Furukawa Electric Co., Ltd. Radiation-curable adhesive tape
JPH09186121A (ja) * 1995-12-28 1997-07-15 Mitsui Toatsu Chem Inc 半導体ウエハの裏面研削方法
JP3773358B2 (ja) * 1998-07-01 2006-05-10 三井化学株式会社 半導体ウエハの裏面研削用粘着フィルム及びそれを用いる半導体ウエハの裏面研削方法
CN1137028C (zh) * 1998-11-20 2004-02-04 琳得科株式会社 压敏粘合片及其使用方法
US6730595B2 (en) * 2000-12-12 2004-05-04 Mitsui Chemicals, Inc. Protecting method for semiconductor wafer and surface protecting adhesive film for semiconductor wafer used in said method
JP4170839B2 (ja) * 2003-07-11 2008-10-22 日東電工株式会社 積層シート
TWI402325B (zh) * 2005-05-12 2013-07-21 日東電工股份有限公司 切割用黏著片以及使用此黏著片的切割方法
JP4563257B2 (ja) * 2005-05-31 2010-10-13 電気化学工業株式会社 粘着シート及び電子部品製造方法
JP2007084722A (ja) * 2005-09-22 2007-04-05 Nitto Denko Corp 粘着シートとその製造方法、及び、製品の加工方法
JP2008049878A (ja) 2006-08-25 2008-03-06 Hino Motors Ltd アクスルの取付構造

Also Published As

Publication number Publication date
KR101294435B1 (ko) 2013-08-07
JP2009206435A (ja) 2009-09-10
EP2096153A2 (de) 2009-09-02
JP5318435B2 (ja) 2013-10-16
TWI459455B (zh) 2014-11-01
US20090221215A1 (en) 2009-09-03
EP2096153B1 (de) 2012-04-18
CN101518887A (zh) 2009-09-02
KR20090093878A (ko) 2009-09-02
TW200952058A (en) 2009-12-16
EP2096153A3 (de) 2010-07-21
CN101518887B (zh) 2013-04-24

Similar Documents

Publication Publication Date Title
ATE554149T1 (de) Klebefolie zum abschleifen der oberfläche eines halbleiterwafers und verfahren zum abschleifen der oberfläche eines halbleiterwafers unter verwendung der klebefolie
WO2009001732A1 (ja) 半導体ウエハ研削方法とそれに用いる樹脂組成物及び保護シート
TW200633001A (en) Substrate stiffness method and resulting devices for layer transfer processes
DE60335137D1 (de) Verfahren zum durchtrennung einen halbleiter substrat und verwendung einer schutzschicht für jenes verfahren
ATE449666T1 (de) Verfahren zur verbesserten ätzung eines optischen artikels durch bereitstellung einer temporären schicht aus einem organischen material
TW200801155A (en) Pressure-sensitive adhesive sheet and method for processing semiconductor wafer or semiconductor substrate
WO2009050785A1 (ja) 粘着剤、粘着シート、多層粘着シート及び電子部品の製造方法
WO2011087591A3 (en) Multiple surface finishes for microelectronic package substrates
ATE555643T1 (de) Verfahren zur bildung eines strukturierten substrats
EP1895581A3 (de) Verfahren zur Bearbeitung der Rückseite eines Halbleiterwafers, Verfahren zur Bearbeitung der Rückseite eines Substrats und strahlungshärtbare druckempfindliche Klebefolie
MX2011009495A (es) Metodos para formar imagenes sobre sustratos con curado parcial de tinta y nivelacion de contacto y aparatos utiles en la formacion de imagenes sobre sustratos.
SE0802294L (sv) Förfarande för tillverkning av en kiselkarbid-halvledarkrets
WO2009116830A3 (ko) 반도체 소자 및 그 제조방법
FR2926671B1 (fr) Procede de traitement de defauts lors de collage de plaques
ATE528139T1 (de) VERFAHREN ZUR HERSTELLUNG EINES SUBSTRATS FÜR EINEN FLÜSSIGKEITSAUSSTOßKOPF
DE602008005817D1 (de) Verfahren zum Recycling eines Substrats, Herstellungsverfahren für einen beschichteten Wafer und dazu passendes recyceltes Donorsubstrat
WO2009050786A1 (ja) 粘着剤、粘着シート、多層粘着シート及び電子部品の製造方法
SG10201804761PA (en) Dicing tape-combined adhesive sheet
WO2010014657A3 (en) Passivation of aluminum nitride substrates
ATE525500T1 (de) Verfahren zur herstellung von diamantsubstraten
WO2011090572A3 (en) A method to form lateral pad on edge of wafer
WO2009076255A3 (en) Abrasive articles and methods for making same
SG151235A1 (en) Glass substrate for magnetic disc and manufacturing method thereof
PL2043474T5 (pl) Maszyna i odpowiedni sposób do nanoszenia warstwy klejącej na powierzchnię przedmiotu, takiego jak wkładka do buta
WO2009028308A1 (ja) ダイヤモンド薄膜積層体