ATE554149T1 - Klebefolie zum abschleifen der oberfläche eines halbleiterwafers und verfahren zum abschleifen der oberfläche eines halbleiterwafers unter verwendung der klebefolie - Google Patents

Klebefolie zum abschleifen der oberfläche eines halbleiterwafers und verfahren zum abschleifen der oberfläche eines halbleiterwafers unter verwendung der klebefolie

Info

Publication number
ATE554149T1
ATE554149T1 AT09002783T AT09002783T ATE554149T1 AT E554149 T1 ATE554149 T1 AT E554149T1 AT 09002783 T AT09002783 T AT 09002783T AT 09002783 T AT09002783 T AT 09002783T AT E554149 T1 ATE554149 T1 AT E554149T1
Authority
AT
Austria
Prior art keywords
semiconductor wafer
grinding
adhesive film
back surface
intermediate layer
Prior art date
Application number
AT09002783T
Other languages
English (en)
Inventor
Fumiteru Asai
Noriyoshi Kawashima
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of ATE554149T1 publication Critical patent/ATE554149T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2431/00—Presence of polyvinyl acetate
    • C09J2431/006—Presence of polyvinyl acetate in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/006—Presence of (meth)acrylic polymer in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
AT09002783T 2008-02-29 2009-02-26 Klebefolie zum abschleifen der oberfläche eines halbleiterwafers und verfahren zum abschleifen der oberfläche eines halbleiterwafers unter verwendung der klebefolie ATE554149T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008049878A JP5318435B2 (ja) 2008-02-29 2008-02-29 半導体ウエハの裏面研削用粘着シート及びこの裏面研削用粘着シートを用いる半導体ウエハの裏面研削方法

Publications (1)

Publication Number Publication Date
ATE554149T1 true ATE554149T1 (de) 2012-05-15

Family

ID=40677773

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09002783T ATE554149T1 (de) 2008-02-29 2009-02-26 Klebefolie zum abschleifen der oberfläche eines halbleiterwafers und verfahren zum abschleifen der oberfläche eines halbleiterwafers unter verwendung der klebefolie

Country Status (7)

Country Link
US (1) US20090221215A1 (de)
EP (1) EP2096153B1 (de)
JP (1) JP5318435B2 (de)
KR (1) KR101294435B1 (de)
CN (1) CN101518887B (de)
AT (1) ATE554149T1 (de)
TW (1) TWI459455B (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5705447B2 (ja) * 2010-03-31 2015-04-22 古河電気工業株式会社 表面保護用粘着テープ
CN103026469B (zh) * 2010-07-28 2016-06-15 三井-杜邦聚合化学株式会社 层合膜及使用其的半导体制造用膜
JP6230354B2 (ja) * 2013-09-26 2017-11-15 株式会社ディスコ デバイスウェーハの加工方法
JP6595296B2 (ja) 2015-10-19 2019-10-23 デクセリアルズ株式会社 保護テープ、及び半導体装置の製造方法
JP6906843B2 (ja) * 2017-04-28 2021-07-21 株式会社ディスコ ウェーハの加工方法
JP6940217B2 (ja) 2017-05-18 2021-09-22 株式会社ディスコ ウェハ処理に使用する為の保護シーティング、ウェハ、ウェハ及び保護シーティングの組合せの取扱いシステム
KR101982197B1 (ko) * 2017-09-26 2019-05-24 에스케이씨 주식회사 반도체용 테이프
CN109825215A (zh) * 2017-11-23 2019-05-31 上海海优威新材料股份有限公司 用于晶圆研磨的多层复合膜及其制备方法
JP7147163B2 (ja) * 2017-12-21 2022-10-05 昭和電工マテリアルズ株式会社 仮固定用樹脂フィルム、仮固定用樹脂フィルムシート、及び半導体装置の製造方法
JP7218514B2 (ja) * 2018-08-03 2023-02-07 住友ベークライト株式会社 仮固定用テープ
JP7164351B2 (ja) * 2018-08-07 2022-11-01 日東電工株式会社 バックグラインドテープ
KR20220152328A (ko) * 2020-05-22 2022-11-15 미쓰이 가가쿠 토세로 가부시키가이샤 점착성 적층 필름 및 전자 장치의 제조 방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0789546B2 (ja) * 1985-05-15 1995-09-27 三井東圧化学株式会社 ウエハ加工用フィルム
US5149586A (en) * 1987-07-08 1992-09-22 Furukawa Electric Co., Ltd. Radiation-curable adhesive tape
JPH09186121A (ja) * 1995-12-28 1997-07-15 Mitsui Toatsu Chem Inc 半導体ウエハの裏面研削方法
JP3773358B2 (ja) * 1998-07-01 2006-05-10 三井化学株式会社 半導体ウエハの裏面研削用粘着フィルム及びそれを用いる半導体ウエハの裏面研削方法
CN1137028C (zh) * 1998-11-20 2004-02-04 琳得科株式会社 压敏粘合片及其使用方法
US6730595B2 (en) * 2000-12-12 2004-05-04 Mitsui Chemicals, Inc. Protecting method for semiconductor wafer and surface protecting adhesive film for semiconductor wafer used in said method
JP4170839B2 (ja) * 2003-07-11 2008-10-22 日東電工株式会社 積層シート
TWI402325B (zh) * 2005-05-12 2013-07-21 Nitto Denko Corp 切割用黏著片以及使用此黏著片的切割方法
JP4563257B2 (ja) * 2005-05-31 2010-10-13 電気化学工業株式会社 粘着シート及び電子部品製造方法
JP2007084722A (ja) * 2005-09-22 2007-04-05 Nitto Denko Corp 粘着シートとその製造方法、及び、製品の加工方法
JP2008049878A (ja) 2006-08-25 2008-03-06 Hino Motors Ltd アクスルの取付構造

Also Published As

Publication number Publication date
KR101294435B1 (ko) 2013-08-07
CN101518887A (zh) 2009-09-02
US20090221215A1 (en) 2009-09-03
EP2096153B1 (de) 2012-04-18
EP2096153A3 (de) 2010-07-21
KR20090093878A (ko) 2009-09-02
CN101518887B (zh) 2013-04-24
JP2009206435A (ja) 2009-09-10
TWI459455B (zh) 2014-11-01
EP2096153A2 (de) 2009-09-02
TW200952058A (en) 2009-12-16
JP5318435B2 (ja) 2013-10-16

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