ATE545107T1 - Herstellungstechniken für elektrische einrichtung - Google Patents

Herstellungstechniken für elektrische einrichtung

Info

Publication number
ATE545107T1
ATE545107T1 AT06845457T AT06845457T ATE545107T1 AT E545107 T1 ATE545107 T1 AT E545107T1 AT 06845457 T AT06845457 T AT 06845457T AT 06845457 T AT06845457 T AT 06845457T AT E545107 T1 ATE545107 T1 AT E545107T1
Authority
AT
Austria
Prior art keywords
chip
thermoplastic substrate
antenna structure
substrate
electrical device
Prior art date
Application number
AT06845457T
Other languages
English (en)
Inventor
Scott W Ferguson
Ali Mehrabi
Reza Mehrabi
Original Assignee
Avery Dennison Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avery Dennison Corp filed Critical Avery Dennison Corp
Application granted granted Critical
Publication of ATE545107T1 publication Critical patent/ATE545107T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0855—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using microwave
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/361—Moulds for making articles of definite length, i.e. discrete articles with pressing members independently movable of the parts for opening or closing the mould, e.g. movable pistons
    • B29C2043/3615—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2519/00—Labels, badges
    • B32B2519/02—RFID tags
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/20—Structure, shape, material or disposition of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01059—Praseodymium [Pr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01065—Terbium [Tb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Details Of Aerials (AREA)
  • Near-Field Transmission Systems (AREA)
  • Wire Bonding (AREA)
AT06845457T 2005-12-21 2006-12-14 Herstellungstechniken für elektrische einrichtung ATE545107T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/314,988 US8067253B2 (en) 2005-12-21 2005-12-21 Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film
PCT/US2006/047777 WO2007075352A2 (en) 2005-12-21 2006-12-14 Rfid tag film embossing manufacturing techniques

Publications (1)

Publication Number Publication Date
ATE545107T1 true ATE545107T1 (de) 2012-02-15

Family

ID=38134794

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06845457T ATE545107T1 (de) 2005-12-21 2006-12-14 Herstellungstechniken für elektrische einrichtung

Country Status (6)

Country Link
US (2) US8067253B2 (de)
EP (2) EP2323079A3 (de)
CN (1) CN101346735A (de)
AT (1) ATE545107T1 (de)
ES (1) ES2382209T3 (de)
WO (1) WO2007075352A2 (de)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7785932B2 (en) * 2005-02-01 2010-08-31 Nagraid S.A. Placement method of an electronic module on a substrate and device produced by said method
US8119458B2 (en) * 2005-02-01 2012-02-21 Nagraid S.A. Placement method of an electronic module on a substrate
DE102006025000A1 (de) * 2006-03-03 2007-09-06 Hamedani, Soheil Aus Edelmetall bestehendes Objekt mit RFID-Identifiziervorrichtung
WO2007141836A1 (ja) * 2006-06-02 2007-12-13 Hitachi, Ltd. Ｉｃタグ用インレットの製造方法
US20080179404A1 (en) * 2006-09-26 2008-07-31 Advanced Microelectronic And Automation Technology Ltd. Methods and apparatuses to produce inlays with transponders
JP4950676B2 (ja) * 2007-01-18 2012-06-13 リンテック株式会社 回路基板の製造方法
JP4952280B2 (ja) * 2007-02-09 2012-06-13 富士通株式会社 電子装置製造システムおよび電子装置製造方法
US20090091424A1 (en) 2007-10-05 2009-04-09 Manfred Rietzler Transponder inlay for a personal document and method of manufacturing same
DE102007050102A1 (de) * 2007-10-16 2009-04-23 Smartrac Ip B.V. Verfahren zur Herstellung eines Übertragungsmoduls sowie Übertragungsmodul
JP5141187B2 (ja) * 2007-10-26 2013-02-13 富士通株式会社 Ｒｆｉｄタグ製造方法
US8695207B2 (en) 2008-06-02 2014-04-15 Nxp B.V. Method for manufacturing an electronic device
WO2009147547A1 (en) 2008-06-02 2009-12-10 Nxp B.V. Electronic device and method of manufacturing an electronic device
JP2010237877A (ja) * 2009-03-30 2010-10-21 Fujitsu Ltd Ｒｆｉｄタグおよびｒｆｉｄタグの製造方法
US8089362B2 (en) * 2009-04-08 2012-01-03 Avery Dennison Corporation Merchandise security kit
WO2010132117A1 (en) * 2009-05-13 2010-11-18 American Bank Note Company Cover and method of manufacturing the same
DE102009043587A1 (de) * 2009-09-30 2011-05-19 Smartrac Ip B.V. Funktionelles Laminat
FR2951867A1 (fr) * 2009-10-27 2011-04-29 Arjowiggins Security Procede de fabrication d'un support comportant un dispositif electronique
FR2951866B1 (fr) 2009-10-27 2011-11-25 Arjowiggins Security Procede de fabrication d'un support integrant un dispositif electronique
US8936197B2 (en) * 2009-11-17 2015-01-20 Avery Dennison Corporation Integral tracking tag for consumer goods
US8701271B2 (en) * 2010-04-14 2014-04-22 Avery Dennison Corporation Method of assembly of articles
US8584955B2 (en) * 2010-09-17 2013-11-19 Apple Inc. Systems and methods for integrating radio-frequency identification circuitry into flexible circuits
USRE48018E1 (en) 2010-10-14 2020-05-26 Stora Enso Oyj Method and arrangement for attaching a chip to a printed conductive surface
US8628018B2 (en) * 2012-04-17 2014-01-14 Nxp, B.V. RFID circuit and method
US9501733B2 (en) * 2012-07-12 2016-11-22 Assa Abloy Ab Method of manufacturing a functional inlay
US8866292B2 (en) * 2012-10-19 2014-10-21 Infineon Technologies Ag Semiconductor packages with integrated antenna and methods of forming thereof
US9721920B2 (en) 2012-10-19 2017-08-01 Infineon Technologies Ag Embedded chip packages and methods for manufacturing an embedded chip package
US9899339B2 (en) * 2012-11-05 2018-02-20 Texas Instruments Incorporated Discrete device mounted on substrate
US9064681B2 (en) * 2013-03-15 2015-06-23 Heraeus Noblelight America Llc UV lamp and a cavity-less UV lamp system
US11133866B2 (en) 2014-02-25 2021-09-28 Pharmaseq, Inc. All optical identification and sensor system with power on discovery
FR3020591B1 (fr) * 2014-04-30 2016-05-20 Etancheite Et Frottement J Massot Dispositif comprenant une partie en elastomere, et procede de fabrication associe.
US10049319B2 (en) 2014-12-16 2018-08-14 Avery Dennison Retail Information Services, Llc Method of assembly using moving substrates, including creating RFID inlays
EP3259708A1 (de) * 2015-02-20 2017-12-27 Nid Sa Verfahren zur herstellung einer vorrichtung mit mindestens einem elektronischen element im zusammenhang mit einem substrat und einer antenne
US9418895B1 (en) 2015-03-14 2016-08-16 International Business Machines Corporation Dies for RFID devices and sensor applications
JP6574367B2 (ja) * 2015-09-29 2019-09-11 小林クリエイト株式会社 帳票紙片におけるｒｆｉｄラベルの貼付構造、およびｒｆｉｄラベルの貼付方法
US10882258B1 (en) * 2016-01-22 2021-01-05 Pharmaseq, Inc. Microchip affixing probe and method of use
ES2584656B1 (es) 2016-05-13 2017-02-17 Grifols, S.A. Etiqueta rfid para su disposición en una botella para productos derivados de la sangre y uso de la misma
US20180034162A1 (en) * 2016-08-01 2018-02-01 Honeywell International Inc. Flexible printed antenna devices, methods, and systems
US10320054B2 (en) * 2016-10-28 2019-06-11 Avery Dennison Retail Information Services, Llc RFID tags designed to work on difficult substrates
EP4092575B1 (de) * 2017-09-29 2024-08-07 Avery Dennison Retail Information Services LLC Bandmontageverfahren für drahtformatantennen
US11203501B2 (en) 2017-09-29 2021-12-21 Avery Dennison Retail Information Services Llc Systems and methods for transferring a flexible conductor onto a moving web
SE542007C2 (en) 2017-10-13 2020-02-11 Stora Enso Oyj A method and an apparatus for producing a radio-frequency identification transponder
DE102017129625B3 (de) 2017-12-12 2019-05-23 Mühlbauer Gmbh & Co. Kg Verfahren und Vorrichtung zur Bestückung einer Antennenstruktur mit einem elektronischen Bauelement
CN114341257A (zh) * 2019-08-29 2022-04-12 Ａｇｃ株式会社 组合物、天线的制造方法和成形品
US10783424B1 (en) 2019-09-18 2020-09-22 Sensormatic Electronics, LLC Systems and methods for providing tags adapted to be incorporated with or in items
US11443160B2 (en) 2019-09-18 2022-09-13 Sensormatic Electronics, LLC Systems and methods for laser tuning and attaching RFID tags to products
DE102019128088A1 (de) * 2019-10-17 2021-04-22 Rastal Gmbh & Co. Kg Verfahren zum Verbinden eines Geschirrteils mit einem Informationsträger und Vorrichtung mit einem Geschirrteil und einem Informationsträger
US12079682B2 (en) * 2019-10-18 2024-09-03 Linxens Holding Card-type information substrate including a frame
US11055588B2 (en) 2019-11-27 2021-07-06 Sensormatic Electronics, LLC Flexible water-resistant sensor tag
JP2023522540A (ja) 2020-02-14 2023-05-31 ピー－チップ・アイピー・ホールディングス・インコーポレイテッド 光トリガ式トランスポンダ
CN111276790A (zh) * 2020-03-31 2020-06-12 西安理工大学 一种提升丝网印刷rfid读写器天线性能的方法
US20220085992A1 (en) 2020-09-17 2022-03-17 P-Chip Ip Holdings Inc. Devices, systems, and methods using microtransponders
FR3118514B1 (fr) * 2020-12-31 2023-03-03 Axem Tech Procédé de fabrication d’un identifiant RFID
US11755874B2 (en) 2021-03-03 2023-09-12 Sensormatic Electronics, LLC Methods and systems for heat applied sensor tag
US11869324B2 (en) 2021-12-23 2024-01-09 Sensormatic Electronics, LLC Securing a security tag into an article

Family Cites Families (139)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3497171A (en) * 1968-03-08 1970-02-24 Utility Products Mfg Co Means for supporting electrical devices
US3724737A (en) * 1971-10-06 1973-04-03 E Bodnar Spreader for slit web material
US3989575A (en) * 1975-04-16 1976-11-02 Oliver Machinery Company Split labeling apparatus
NL7713758A (nl) * 1977-12-13 1979-06-15 Philips Nv Halfgeleiderinrichting.
DE2919998A1 (de) 1979-05-17 1980-11-27 Siemens Ag Befestigen der anschlussdraehte von halbleitersystemen auf den traegerelementen
US4284466A (en) * 1979-12-17 1981-08-18 Western Electric Co., Inc. Bonding head
US4670084A (en) * 1983-06-20 1987-06-02 David Durand Apparatus for applying a dye image to a member
US4706050A (en) * 1984-09-22 1987-11-10 Smiths Industries Public Limited Company Microstrip devices
US4715923A (en) * 1985-12-26 1987-12-29 The Boeing Company Apparatus for consolidating composite materials
US4786907A (en) 1986-07-14 1988-11-22 Amtech Corporation Transponder useful in a system for identifying objects
JP2579937B2 (ja) * 1987-04-15 1997-02-12 株式会社東芝 電子回路装置およびその製造方法
US4816839A (en) * 1987-12-18 1989-03-28 Amtech Corporation Transponder antenna
US5019417A (en) * 1989-08-15 1991-05-28 Northcutt Gerald G Pipe lining system
US5006856A (en) * 1989-08-23 1991-04-09 Monarch Marking Systems, Inc. Electronic article surveillance tag and method of deactivating tags
JPH0821790B2 (ja) * 1990-02-15 1996-03-04 松下電器産業株式会社 ロータリーヘッド式電子部品実装装置
US5182427A (en) * 1990-09-20 1993-01-26 Metcal, Inc. Self-regulating heater utilizing ferrite-type body
DE69230171T2 (de) * 1991-04-03 2000-04-13 Integrated Silicon Design Pty. Ltd., Adelaide Warensortiersystem
EP0547807A3 (en) * 1991-12-16 1993-09-22 General Electric Company Packaged electronic system
US5660787A (en) * 1992-10-09 1997-08-26 Illinois Tool Works Inc. Method for producing oriented plastic strap
US5525287A (en) * 1992-10-09 1996-06-11 Signode Corporation Method for producing oriented plastic strap
US5707660A (en) * 1992-10-09 1998-01-13 Signode Corporation Apparatus for producing oriented plastic strap
US5760530A (en) * 1992-12-22 1998-06-02 The United States Of America As Represented By The Secretary Of The Air Force Piezoelectric tactile sensor
US5585193A (en) * 1993-07-16 1996-12-17 Avery Dennison Corporation Machine-direction oriented label films and die-cut labels prepared therefrom
US5564888A (en) * 1993-09-27 1996-10-15 Doan; Carl V. Pick and place machine
US5557279A (en) * 1993-09-28 1996-09-17 Texas Instruments Incorporated Unitarily-tuned transponder/shield assembly
US5430441A (en) * 1993-10-12 1995-07-04 Motorola, Inc. Transponding tag and method
US5491483A (en) * 1994-01-05 1996-02-13 Texas Instruments Incorporated Single loop transponder system and method
CA2128947A1 (en) 1994-07-27 1996-01-28 Jean-Noel Audoux Process for inserting a microcircuit into the body of an intelligent card and/or memory card, and card comprising a microcircuit thus inserted
FR2724263B1 (fr) 1994-09-05 1996-11-08 Valeo Electronique Antenne utilisee pour l'emission ou la reception d'un signal radiofrequence, un emetteur et un recepteur de telecommande et un systeme de telecommande pour vehicule l'incorporant
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
DE4435802A1 (de) * 1994-10-06 1996-04-11 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Datenträgern mit eingebetteten Elementen und Vorrichtung zur Durchführung des Verfahrens
US5606136A (en) * 1995-04-10 1997-02-25 Breed Automotive Technology, Inc. Electrical lead crossover, sensing cell with electrical lead crossover, and method for making same
DE19518936A1 (de) 1995-05-23 1995-12-21 Christian Dr Ing Philipp Verfahren zum Befestigen eines Teils an einer thermoplastischen Wand eines Erzeugnisses
US5965494A (en) * 1995-05-25 1999-10-12 Kabushiki Kaisha Toshiba Tunable resonance device controlled by separate permittivity adjusting electrodes
US6243013B1 (en) * 1999-01-08 2001-06-05 Intermec Ip Corp. Cascaded DC voltages of multiple antenna RF tag front-end circuits
US5817207A (en) * 1995-10-17 1998-10-06 Leighton; Keith R. Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards
US5866952A (en) * 1995-11-30 1999-02-02 Lockheed Martin Corporation High density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrate
US6281850B1 (en) * 1996-02-16 2001-08-28 Intermec Ip Corp. Broadband multiple element antenna system
US6145901A (en) * 1996-03-11 2000-11-14 Rich; Donald S. Pick and place head construction
US6215401B1 (en) * 1996-03-25 2001-04-10 Intermec Ip Corp. Non-laminated coating for radio frequency transponder (RF tag)
US5841193A (en) * 1996-05-20 1998-11-24 Epic Technologies, Inc. Single chip modules, repairable multichip modules, and methods of fabrication thereof
FR2749687B1 (fr) * 1996-06-07 1998-07-17 Solaic Sa Carte a memoire et procede de fabrication d'une telle carte
JPH1032429A (ja) * 1996-07-18 1998-02-03 Matsushita Electric Ind Co Ltd 電圧制御共振器およびその調整方法
DE19731737A1 (de) 1997-07-23 1998-09-17 Siemens Ag Chipmodul für einen kartenförmigen Datenträger, entsprechender Kartenkörper sowie Verfahren zur Befestigung des Chipmoduls im Kartenkörper
US6339385B1 (en) * 1997-08-20 2002-01-15 Micron Technology, Inc. Electronic communication devices, methods of forming electrical communication devices, and communication methods
US6164551A (en) * 1997-10-29 2000-12-26 Meto International Gmbh Radio frequency identification transponder having non-encapsulated IC chip
US6329915B1 (en) * 1997-12-31 2001-12-11 Intermec Ip Corp RF Tag having high dielectric constant material
US6019865A (en) * 1998-01-21 2000-02-01 Moore U.S.A. Inc. Method of forming labels containing transponders
US6133836A (en) * 1998-02-27 2000-10-17 Micron Technology, Inc. Wireless communication and identification packages, communication systems, methods of communicating, and methods of forming a communication device
US6147606A (en) * 1998-03-26 2000-11-14 Intermec Ip Corp. Apparatus and method for radio frequency transponder with improved read distance
US6107920A (en) * 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
US6091332A (en) * 1998-06-09 2000-07-18 Motorola, Inc. Radio frequency identification tag having printed circuit interconnections
US6018299A (en) * 1998-06-09 2000-01-25 Motorola, Inc. Radio frequency identification tag having a printed antenna and method
US6262292B1 (en) 1998-06-30 2001-07-17 Showa Denko K.K. Method for producing cyanophenyl derivatives
US6394330B1 (en) 1998-08-13 2002-05-28 3M Innovative Properties Company Method for slitting and processing a web into plural use supply forms
US6140967A (en) * 1998-08-27 2000-10-31 Lucent Technologies Inc. Electronically variable power control in microstrip line fed antenna systems
KR100629923B1 (ko) 1998-09-30 2006-09-29 돗빤호무즈가부시기가이샤 도전성페이스트와 도전성페이스트의 경화방법, 및 도전성페이스트를 이용한 비접촉형 데이터송수신체용 안테나의 형성방법과, 비접촉형 데이터송수신체
US6100804A (en) * 1998-10-29 2000-08-08 Intecmec Ip Corp. Radio frequency identification system
US6285342B1 (en) * 1998-10-30 2001-09-04 Intermec Ip Corp. Radio frequency tag with miniaturized resonant antenna
US6262692B1 (en) * 1999-01-13 2001-07-17 Brady Worldwide, Inc. Laminate RFID label and method of manufacture
EP1035503B2 (de) * 1999-01-23 2010-03-03 X-ident technology GmbH RFID-Transponder mit bedruckbarer Oberfläche
JP2000244232A (ja) * 1999-02-17 2000-09-08 Ngk Spark Plug Co Ltd マイクロストリップアンテナ
US6891110B1 (en) 1999-03-24 2005-05-10 Motorola, Inc. Circuit chip connector and method of connecting a circuit chip
ES2453486T3 (es) 1999-03-24 2014-04-07 Motorola Solutions, Inc. Conector de chip de circuito y método de conexión de un chip de circuito
US6278413B1 (en) * 1999-03-29 2001-08-21 Intermec Ip Corporation Antenna structure for wireless communications device, such as RFID tag
US6645327B2 (en) 1999-04-21 2003-11-11 Intermec Ip Corp. RF tag application system
US6376769B1 (en) * 1999-05-18 2002-04-23 Amerasia International Technology, Inc. High-density electronic package, and method for making same
JP2000332523A (ja) 1999-05-24 2000-11-30 Hitachi Ltd 無線タグ、その製造方法及びその配置方法
US6140146A (en) * 1999-08-03 2000-10-31 Intermec Ip Corp. Automated RFID transponder manufacturing on flexible tape substrates
US6236314B1 (en) * 1999-09-02 2001-05-22 Micron Technology, Inc. Transponder modules, RF tagging system, method of operating a transponder module and methods of tagging an object having a conductive surface
US7710273B2 (en) 1999-09-02 2010-05-04 Round Rock Research, Llc Remote communication devices, radio frequency identification devices, wireless communication systems, wireless communication methods, radio frequency identification device communication methods, and methods of forming a remote communication device
US6259369B1 (en) * 1999-09-30 2001-07-10 Moore North America, Inc. Low cost long distance RFID reading
US6518885B1 (en) * 1999-10-14 2003-02-11 Intermec Ip Corp. Ultra-thin outline package for integrated circuit
US6538210B2 (en) * 1999-12-20 2003-03-25 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module, radio device having the same, and method for producing the same
EP1126517B1 (de) 2000-02-09 2007-01-17 Interuniversitair Micro-Elektronica Centrum Verfahren zur flip-chip-Montage von Halbleitervorrichtungen mit Klebstoffen
DE10012967A1 (de) 2000-03-16 2001-09-20 Andreas Plettner Transponder
TW569424B (en) * 2000-03-17 2004-01-01 Matsushita Electric Ind Co Ltd Module with embedded electric elements and the manufacturing method thereof
AU2001253142A1 (en) 2000-04-04 2001-10-30 Parlex Corporation High speed flip chip assembly process
DE10017431C2 (de) 2000-04-07 2002-05-23 Melzer Maschinenbau Gmbh Verfahren und Vorrichtung zum Herstellen von Datenträgern mit integriertem Transponder
WO2001080174A1 (en) 2000-04-13 2001-10-25 International Paper Integrated package and rfid antenna
SE518813C2 (sv) 2000-04-18 2002-11-26 Ericsson Telefon Ab L M Flerbandsantenn och portabel telekommunikationsapparat innefattande en sådan antenn
US6806812B1 (en) 2000-04-26 2004-10-19 Micron Technology, Inc. Automated antenna trim for transmitting and receiving semiconductor devices
JP4450948B2 (ja) 2000-05-11 2010-04-14 株式会社アマダ 折曲げ加工方法及び折曲げ加工システム
US6535175B2 (en) 2000-06-01 2003-03-18 Intermec Ip Corp. Adjustable length antenna system for RF transponders
US6483473B1 (en) * 2000-07-18 2002-11-19 Marconi Communications Inc. Wireless communication device and method
US7098850B2 (en) 2000-07-18 2006-08-29 King Patrick F Grounded antenna for a wireless communication device and method
JP4448242B2 (ja) 2000-09-05 2010-04-07 本田技研工業株式会社 スティフンドパネル用成形補助治具
US6542114B1 (en) 2000-09-07 2003-04-01 Savi Technology, Inc. Method and apparatus for tracking items using dual frequency tags
TW511405B (en) * 2000-12-27 2002-11-21 Matsushita Electric Ind Co Ltd Device built-in module and manufacturing method thereof
US6486433B2 (en) 2001-01-11 2002-11-26 Branson Ultrasonics Corporation Transparent pressure bladder
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
JP4516228B2 (ja) 2001-02-23 2010-08-04 株式会社ハーマンプロ グリル焼網用剥がしヘラ
JP2002252534A (ja) 2001-02-26 2002-09-06 Matsushita Electric Ind Co Ltd 高周波フィルタ
JP2002261189A (ja) 2001-03-05 2002-09-13 Murata Mfg Co Ltd 高周波用回路チップ及びその製造方法
US6824857B2 (en) * 2001-04-02 2004-11-30 Nashua Corporation Circuit elements having an embedded conductive trace and methods of manufacture
JP4513235B2 (ja) 2001-05-31 2010-07-28 ソニー株式会社 フリップチップ実装装置
US6606247B2 (en) 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
US6855892B2 (en) * 2001-09-27 2005-02-15 Matsushita Electric Industrial Co., Ltd. Insulation sheet, multi-layer wiring substrate and production processes thereof
US6705522B2 (en) 2001-10-03 2004-03-16 Accenture Global Services, Gmbh Mobile object tracker
US6701605B2 (en) 2001-10-09 2004-03-09 Sonoco Development, Inc. Conductive electrical element and antenna with ink additive technology
JP3811047B2 (ja) 2001-10-19 2006-08-16 日精樹脂工業株式会社 Ｉｃカードの製造装置及び製造方法
JP4392157B2 (ja) * 2001-10-26 2009-12-24 パナソニック電工株式会社 配線板用シート材及びその製造方法、並びに多層板及びその製造方法
EP1446766B1 (de) 2001-10-29 2010-06-09 Mineral Lassen LLC Einrichtung und verfahren zur drahtlosen kommunikation mit wellenantenne
JP4064808B2 (ja) 2001-12-25 2008-03-19 東芝松下ディスプレイテクノロジー株式会社 熱圧着装置及び熱圧着方法
US20030132528A1 (en) 2001-12-28 2003-07-17 Jimmy Liang Method and apparatus for flip chip device assembly by radiant heating
TW200302685A (en) * 2002-01-23 2003-08-01 Matsushita Electric Ind Co Ltd Circuit component built-in module and method of manufacturing the same
US6975016B2 (en) 2002-02-06 2005-12-13 Intel Corporation Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof
US6882318B2 (en) 2002-03-04 2005-04-19 Siemens Information & Communications Mobile, Llc Broadband planar inverted F antenna
US6888502B2 (en) 2002-03-05 2005-05-03 Precision Dynamics Corporation Microstrip antenna for an identification appliance
JP2003283120A (ja) 2002-03-25 2003-10-03 Toppan Forms Co Ltd 導電接続部同士の接続方法
WO2003092174A2 (en) 2002-04-24 2003-11-06 Marconi Intellectual Property (Us) Inc Manufacturing method for a wireless communication device and manufacturing apparatus
US6642893B1 (en) 2002-05-09 2003-11-04 Centurion Wireless Technologies, Inc. Multi-band antenna system including a retractable antenna and a meander antenna
US6731246B2 (en) 2002-06-27 2004-05-04 Harris Corporation Efficient loop antenna of reduced diameter
US6665193B1 (en) 2002-07-09 2003-12-16 Amerasia International Technology, Inc. Electronic circuit construction, as for a wireless RF tag
JP2005535149A (ja) 2002-08-02 2005-11-17 シンボル テクノロジーズ インコーポレイテッド 無線周波識別タグの大量アセンブリの方法および装置
US20040130057A1 (en) 2002-08-02 2004-07-08 Reza Mehrabi Process and apparatus for microreplication
US7117581B2 (en) 2002-08-02 2006-10-10 Symbol Technologies, Inc. Method for high volume assembly of radio frequency identification tags
US6964881B2 (en) * 2002-08-27 2005-11-15 Micron Technology, Inc. Multi-chip wafer level system packages and methods of forming same
JP4109039B2 (ja) 2002-08-28 2008-06-25 株式会社ルネサステクノロジ 電子タグ用インレットおよびその製造方法
JP2004094553A (ja) 2002-08-30 2004-03-25 Nooza:Kk 医療情報処理サービスシステム、医療情報処理サービス方法、及び当該サービスを提供するためのサーバー及びクライアント
GB2393076A (en) 2002-09-12 2004-03-17 Rf Tags Ltd Radio frequency identification tag which has a ground plane not substantially larger than the area spanned by the patch antenna
US20040052203A1 (en) 2002-09-13 2004-03-18 Brollier Brian W. Light enabled RFID in information disks
US6667092B1 (en) 2002-09-26 2003-12-23 International Paper Company RFID enabled corrugated structures
TW575931B (en) * 2002-10-07 2004-02-11 Advanced Semiconductor Eng Bridge connection type of chip package and process thereof
WO2004036689A1 (en) 2002-10-16 2004-04-29 Hrl Laboratories, Llc Low profile slot or aperture antenna using backside fed frequency selective surface
US6919508B2 (en) * 2002-11-08 2005-07-19 Flipchip International, Llc Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing
SG106662A1 (en) 2002-11-15 2004-10-29 Smartag S Pte Ltd Rfid tag for an object having metallic portions, tag coupler and method thereof
US6940408B2 (en) 2002-12-31 2005-09-06 Avery Dennison Corporation RFID device and method of forming
US6960124B2 (en) * 2003-01-31 2005-11-01 Wy Peron Lee Cutting machine with environment control arrangement
US7183552B2 (en) 2003-03-07 2007-02-27 Ric Investments, Llc Optical system for a gas measurement system
JP4082242B2 (ja) * 2003-03-06 2008-04-30 ソニー株式会社 素子転写方法
US6848616B2 (en) 2003-03-11 2005-02-01 Zih Corp., A Delaware Corporation With Its Principal Office In Hamilton, Bermuda System and method for selective communication with RFID transponders
US6925701B2 (en) 2003-03-13 2005-08-09 Checkpoint Systems, Inc. Method of making a series of resonant frequency tags
JP4479209B2 (ja) * 2003-10-10 2010-06-09 パナソニック株式会社 電子回路装置およびその製造方法並びに電子回路装置の製造装置
US7495344B2 (en) * 2004-03-18 2009-02-24 Sanyo Electric Co., Ltd. Semiconductor apparatus
US7158037B2 (en) 2004-03-22 2007-01-02 Avery Dennison Corporation Low cost method of producing radio frequency identification tags with straps without antenna patterning
US20050282355A1 (en) 2004-06-18 2005-12-22 Edwards David N High density bonding of electrical devices
TWI241007B (en) * 2004-09-09 2005-10-01 Phoenix Prec Technology Corp Semiconductor device embedded structure and method for fabricating the same
JP2007162144A (ja) 2005-12-09 2007-06-28 Toray Ind Inc 炭素繊維束の製造方法

Also Published As

Publication number Publication date
EP1964034B1 (de) 2012-02-08
US8067253B2 (en) 2011-11-29
WO2007075352A2 (en) 2007-07-05
EP2323079A2 (de) 2011-05-18
WO2007075352A3 (en) 2007-10-11
EP1964034A2 (de) 2008-09-03
US20070141760A1 (en) 2007-06-21
US20090206474A1 (en) 2009-08-20
CN101346735A (zh) 2009-01-14
EP2323079A3 (de) 2013-05-22
ES2382209T3 (es) 2012-06-06

Similar Documents

Publication Publication Date Title
ATE545107T1 (de) Herstellungstechniken für elektrische einrichtung
WO2010013810A1 (ja) Ｒｆｉｄタグおよびその製造方法、インピーダンス調整方法及び樹脂シート及びその製造方法
DE602006012184D1 (de) Hybrides leitfähiges Beschichtungsverfahren zur elektrischen Brückenverbindung von RFID-Einzelchips mit einer Verbundantenne
MX2009012573A (es) Metodo para producir un dispositivo que comprende una antena transpondedora conectada a adaptadores de contacto y dispositivo que se obtiene.
US9335034B2 (en) Flexible circuit board for electronic applications, light source containing same, and method of making
US20090151150A1 (en) Manufacturing method for a card and card obtained by said method
HK1116298A1 (en) Integrated circuit package and manufacture method thereof
CN105051923A (zh) 发光装置及其制造方法
EP2455991A4 (de) Led-chip-anordnung, led-verpackung une herstellungsverfahren für led-verpackung
CN1985351A (zh) 电气器件的高密度结合
ATE440346T1 (de) Smartcard-kírper, smartcard und herstellungsverfahren
CN104303195B (zh) 转频层及其制造方法
RU2005106775A (ru) Способ изготовления бесконтактной чип-карты и бесконтактная чип-карта
WO2009002478A3 (en) Integrated antenna and chip package and method of manufacturing thereof
WO2006132822A3 (en) Method for making electronic devices
FR2904145B1 (fr) Composant electronique a transfert de chaleur par ebullition et condensation et procede de fabrication
CN101097611A (zh) Rfid标签制造方法及rfid标签
TW200629497A (en) Substrate structure embedded method with semiconductor chip and the method for making the same
CN104978595A (zh) 双接口ic卡组件及用于制造双接口ic卡组件的方法
BRPI0907493A8 (pt) processo de fabricação de um elemento aquecedor por depósito de camadas finas sobre um substrato isolante e o elemento obtido
CN104067299A (zh) 生产避免芯片和数据载体主体之间的机械应力的数据载体的方法
WO2009147546A1 (en) Method for manufacturing an electronic device
WO2002086910A3 (en) A method and system for forming electrically conductive pathways
CN104339511A (zh) 按压装置和树脂片的固化方法
WO2013156568A3 (de) Schaltungsanordnung zur thermisch leitfähigen chipmontage und herstellungsverfahren