US20090091424A1 - Transponder inlay for a personal document and method of manufacturing same - Google Patents
Transponder inlay for a personal document and method of manufacturing same Download PDFInfo
- Publication number
- US20090091424A1 US20090091424A1 US11/867,804 US86780407A US2009091424A1 US 20090091424 A1 US20090091424 A1 US 20090091424A1 US 86780407 A US86780407 A US 86780407A US 2009091424 A1 US2009091424 A1 US 2009091424A1
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- United States
- Prior art keywords
- substrate layer
- transponder
- contact surface
- layered structure
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
- G06K19/025—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being flexible or adapted for folding, e.g. paper or paper-like materials used in luggage labels, identification tags, forms or identification documents carrying RFIDs
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
Definitions
- the present invention relates to a transponder inlay for manufacturing a layered structure for a personal document with a substrate layer for arranging a transponder unit comprising an antenna coil and a chip module, said transponder unit being situated on a contact surface of the substrate layer, and a method for manufacturing the transponder inlay.
- the present invention relates to a layered structure for a personal document provided with such a transponder inlay as well as an identification document having such a layered structure.
- transponders which permit automated contactless reading of the data stored on a chip in the transponder.
- transponders include, in addition to the chip, an antenna coil that allows contactless data access.
- transponder inlays which have the transponder unit on a substrate layer. It is obvious that it is regarded as desirable to interfere with the known format of the identification documents as little as possible through implementation of such a transponder inlay in an identification document. Furthermore, handling of the identification documents, e.g., the pages in such a document, should be influenced as little as possible.
- the transponder inlays and/or the transponder units arranged on the substrate layers of the transponder inlays are of course subject to special mechanical stresses which naturally derive from the handling of these identification documents.
- transponder inlays intended for implementation in identification documents it is therefore assumed that it is especially important to design the transponder inlays intended for implementation in identification documents to be as thin as possible.
- a reduction in the thickness of the substrate layers used for the transponder inlays is limited already by the thickness of the chip modules if it is assumed that the chip modules are to be accommodated so they are essentially flush with the surface in the transponder inlays.
- the object of the present invention is therefore to propose a transponder inlay and a method of manufacturing same so that the manufacturing allows transponder inlays to be designed to be as thin as possible at a comparatively low cost.
- transponder inlay having the features of Claim 1 .
- the chip module is accommodated in a window opening formed in the substrate layer in such a way that a chip carrier of the chip module sits on a compressed peripheral shoulder of the window opening with its peripheral edge resting on the compressed peripheral shoulder.
- the peripheral shoulder of the window opening which allows the chip carrier to be accommodated in such a way that it is flush with the surface, is implemented by compressing the material of the substrate layer in the area of the window opening, in contrast with the design known from the state of the art, in which, depending on the choice of material for the substrate layer, either only one chip housing of the chip module arranged on the chip carrier is accommodated in the window opening, and the chip carrier protruding laterally beyond the chip housing rests on the surface of the substrate layer, or the chip carrier rests on a peripheral shoulder of a window formed by a milling operation in the substrate layer to accommodate the entire chip module including the chip carrier.
- antenna coil on the contact surface of the substrate layer so that it is also flush with the surface is made possible if the antenna coil is formed from a wire conductor which is provided in a coil on the contact surface and arranged to be essentially flush with the contact surface by embedding it in the contact surface.
- the substrate layer of the transponder inlay is made of a thermoelastic material, so that, on the one hand, a protective elastic sheathing is provided for the chip module, keeping mechanical stresses away from the chip because of its elasticity, and, on the other hand, a permanent compression is possible in the circumferential area of the window opening to form the peripheral shoulder through a temperature-supported pressure acting on the substrate material with a minimal expenditure of energy.
- the inventive layered structure for a personal document according to Claim 5 has, in addition to the transponder inlay, a cover layer of a book binding material for personal documents arranged as an additional layer on the contact surface of the transponder inlay.
- the inventive layered structure may thus consist of just two layers bonded together, supplemented by conventional intermediate pages in a simple manner to yield a personal document which is provided with a transponder unit despite giving the appearance of being a conventional personal document.
- the inventive layered structure thus allows the production of an identification document that essentially shows no difference from a conventional personal document from a purely external standpoint.
- the bond between the substrate layer and the cover layer may be created by arranging an adhesive intermediate layer or by direct lamination of the cover layer onto the substrate layer to produce the layered structure.
- the latter is the case, for example, when the cover layer is a textile fabric coated with thermally activatable adhesive or some other laminatable material.
- the layered structure is designed to be double-sided, with a substrate layer designed to be discontinuous, having the transponder unit on the transponder page and having a blank page that is divided from the transponder page by a fold recess and with a cover layer designed to be continuous, extending over the substrate layer.
- the inventive personal document has the features of Claim 8 .
- the inventive method for producing a transponder inlay has the features of Claim 9 .
- a through-opening is created in the substrate layer, and the peripheral edge of the through-opening is exposed to pressure and temperature to achieve a compressed peripheral shoulder with a reduced thickness.
- the treatment with pressure and temperature is accomplished by means of an ultrasonically energized stamping tool.
- the temperature treatment may be accomplished by external heating of the stamping tool or by a heating of the stamping tool and/or substrate layer induced by mechanical friction as a result of the ultrasonic oscillations of the stamping tool, i.e., without external overheating.
- stamping tool is used at the same time to form the through-opening because this allows the creation of the window opening as well as the creation of the peripheral shoulder in one machining operation using one and the same tool.
- a variant of the method that is optimized with regard to universal tool use is made possible if the stamping tool serves at the same time to embed a wire conductor, which is used to produce the antenna coil, in the contact surface of the substrate layer.
- transponder inlay A preferred embodiment of the transponder inlay is illustrated in the drawings and described with reference thereto, including an explanation of the process steps associated with production of the transponder inlay.
- FIG. 1 shows a panel sheet arrangement with three transponder inlays designed contiguously
- FIG. 2 shows a window opening of a substrate layer in an enlarged diagram according to sectional line II-II in FIG. 1 ;
- FIG. 3 shows the window opening from FIG. 2 in a view from above
- FIG. 4 shows a panel sheet arrangement with three bound pages designed contiguously for production of a layered structure for an identification document
- FIG. 5 shows a partial sectional diagram of the layered structure shown in FIG. 4 according to sectional line V-V in FIG. 4 ;
- FIG. 6 shows a bound page folded over to form a bound back cover.
- FIG. 1 shows three transponder inlays 11 that are designed to be joined together in a panel sheet arrangement 10 , each transponder inlay having a substrate layer 12 with a transponder unit 15 arranged thereon, comprising an antenna coil 13 and a chip module 14 .
- FIG. 1 also shows dividing lines 16 along which the transponder inlays 11 can be separated from the panel sheet arrangement.
- FIG. 1 shows the transponder inlays 11 in a view from above with a contact surface 17 that faces upward and has a wire conductor 18 arranged thereon in the form of a coil embedded in the contact surface 17 , as also illustrated in FIG. 2 .
- free ends 19 , 20 of the wire conductor are in contact with contact surfaces 21 , 22 of a chip carrier 23 of the chip module 14 arranged in the contact surface 17 of the substrate layer 12 .
- the chip module 14 sits in a window opening 30 , as illustrated in FIGS. 2 and 3 .
- FIGS. 2 and 3 For reasons of a simple diagram of the window opening 30 , FIGS. 2 and 3 , in deviation from the diagram in FIG. 1 , omit the chip module 14 , which is inserted into the window opening 30 .
- the window opening 30 is designed with a step gradation and has a peripheral shoulder 24 facing the contact surface 17 to accommodate the chip carrier 23 ( FIG. 5 ) and, as shown in FIG. 3 , having a accommodating cross section 25 , which is designed to be larger than the accommodating cross section 26 of a through-opening 28 that extends to an underside 27 of the substrate layer 12 and serves to accommodate a chip housing 29 of the chip module 14 ( FIG. 5 ).
- the through-opening 28 as well as the peripheral shoulder 24 are adapted to the particular chip module to be accommodated.
- the chip module 14 which is used in the present exemplary embodiment, is a chip module 14 having a chip carrier 23 that is designed to be larger than the chip housing 29 in only one dimension. Therefore, in the exemplary embodiment shown here, the peripheral shoulder 24 is designed so that the peripheral shoulder 24 forms supporting surfaces 51 , 52 for the chip carrier 23 on only two opposing edge sections ( FIG. 3 ).
- a stamping tool 31 for example, having a stamp tip 33 bordered by a stamp collar 32 may be used.
- the stamp tip 33 has a cross section corresponding to the through-opening 28
- the stamp collar 32 has a cross section corresponding to the peripheral shoulder 24 .
- the stamp tip 33 is provided with a cutting edge 35 formed peripherally on the border of its end face 34 .
- the stamping tool 31 may be advanced toward a contact surface 53 with an intermediate arrangement of the substrate layer 12 , so that the through-opening 28 is produced by the action of the cutting edge 35 on the substrate layer 12 , based essentially on a punching operation. Simultaneously with a forward movement 36 of the stamping tool 31 , this forward movement 36 may be exposed to ultrasonic vibrations in the direction of the forward movement or across that direction, so there is a relative heating of the substrate layer 12 due to the relative movement between the stamp collar 32 and the contact surface 17 of the substrate layer 12 .
- the compression of the substrate layer 12 which occurs due to the forward movement 36 is irreversible, i.e., it is a more or less frozen-in compression.
- the material chosen for the substrate layer 12 is a thermoelastic material, then a certain elasticity is retained in the compressed area of the peripheral shoulder 24 despite the thermal stress on the material. Essentially, however, it is also possible to produce a window opening in a thermoplastic material in the manner depicted in FIGS. 2 and 3 .
- peripheral shoulder 24 not in direct correlation with the design of the through-opening 28 but instead first producing the through-opening 28 in any desired manner in a first process step and then designing the peripheral shoulder 24 by means of an ultrasonically energized stamping tool.
- the transponder inlays 11 of the panel sheet arrangement 10 shown in FIG. 1 are designed to be double-sided with a transponder page 37 , on which there is a transponder unit 15 , and with a blank page 39 , which is separated from the transponder page 37 by a fold recess and has the same area as the transponder page 37 of the substrate layer 12 .
- FIGS. 4 and 5 show a layered structure 40 with bound pages 49 designed to be cohesive with one another in a panel sheet arrangement 41 .
- the panel sheet arrangement 41 consists of the panel sheet arrangement shown in FIG. 1 with the transponder inlays 11 and a panel sheet arrangement 54 arranged on the contact surface 17 and having cover layers 42 arranged in the laminate.
- FIG. 5 shows the layered structure 40 of the panel sheet arrangement 41 and/or a bound page 49 provided therein on an enlarged scale. It can be seen in particular that the chip module 14 is arranged in the window opening 30 of the substrate layer 12 in such a way that a contact side 43 of the chip carrier 23 is essentially flush with the contact surface 17 of the substrate layer 12 .
- the chip housing 29 which encloses a chip unit (not shown here) and extends downward from the chip carrier 23 is accommodated completely in the through-opening 28 of the window opening 30 .
- a housing top side 45 is situated so that it is slightly offset toward the interior into the window opening 30 or is arranged essentially flush with the bottom side 46 of the substrate layer 12 .
- the chip carrier 23 is adhesively bonded to the supporting surfaces 51 , 52 of the peripheral shoulder 24 .
- FIG. 5 also shows that an adhesive intermediate layer 47 that bonds the cover layer 42 and the transponder inlay 11 to form a fixed layered structure 40 is arranged between the cover layer 42 and the contact surface 17 of the substrate layer 12 and/or the transponder inlay 11 .
- the wire conductor ends 19 , 20 of the antenna coil 13 that are in contact with the contact surfaces 21 , 22 of the chip carrier 23 are accommodated essentially in the intermediate layer 47 , so that with an inelastic design of the cover layer 42 , no representation of the wire conductor ends 19 , 20 in an outside or a visible side 48 of the cover layer 42 need be feared.
- the bound pages 49 arranged in a cohesive laminate in the panel sheet arrangement 54 according to FIG. 4 are formed by the layered structure 40 depicted in FIG. 5 and can be separated by a punching operation along the dividing lines 16 . Since the cover layers 42 extend continuously over the fold recess 38 in the substrate layer 12 and/or the transponder inlay 11 , the bound pages 49 have a corresponding reduction in cross section in the area of the fold recesses 38 , allowing the bound pages 49 to be turned or folded about the bound back 50 defined by the fold recess 38 , as illustrated in FIG. 6 . Then any intermediate pages containing personal information in a conventional manner can be inserted into an insertion space bordered by the blank page 39 and the transponder page 37 of the transponder inlay 11 .
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
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Abstract
The invention relates to a transponder inlay (11) for manufacturing a layered structure (40) for a personal document with a substrate layer (12) for arranging a transponder unit (15) that includes an antenna coil (13) and a chip module (14) and which is situated on a contact surface (17) of the substrate layer, wherein the chip module (14) is accommodated in a window opening (30) formed in the substrate layer (12) in such a way that a chip carrier (23) of the chip module rests with its circumferential edge on a compressed peripheral shoulder (24) of the window opening (30); the invention also relates to a method for manufacturing the transponder inlay. In addition, the present invention relates to a layered structure for a personal document, which is provided with such a transponder inlay, and an identification document having such a layered structure.
Description
- The present invention relates to a transponder inlay for manufacturing a layered structure for a personal document with a substrate layer for arranging a transponder unit comprising an antenna coil and a chip module, said transponder unit being situated on a contact surface of the substrate layer, and a method for manufacturing the transponder inlay. In addition, the present invention relates to a layered structure for a personal document provided with such a transponder inlay as well as an identification document having such a layered structure.
- Current trends in the field of personal documents are in the direction of supplementing the documents that are conventionally used for personal identification with transponders which permit automated contactless reading of the data stored on a chip in the transponder. Such transponders include, in addition to the chip, an antenna coil that allows contactless data access.
- Integration or implementation of such transponders in conventional personal documents that contain a plurality of pages of paper accommodated in a document volume makes special demands of the design of the transponder units and/or the so-called transponder inlays, which have the transponder unit on a substrate layer. It is obvious that it is regarded as desirable to interfere with the known format of the identification documents as little as possible through implementation of such a transponder inlay in an identification document. Furthermore, handling of the identification documents, e.g., the pages in such a document, should be influenced as little as possible. On the other hand, the transponder inlays and/or the transponder units arranged on the substrate layers of the transponder inlays are of course subject to special mechanical stresses which naturally derive from the handling of these identification documents.
- For the reasons given above, it is therefore assumed that it is especially important to design the transponder inlays intended for implementation in identification documents to be as thin as possible. A reduction in the thickness of the substrate layers used for the transponder inlays is limited already by the thickness of the chip modules if it is assumed that the chip modules are to be accommodated so they are essentially flush with the surface in the transponder inlays.
- Designing suitable recesses or window openings in the substrate layers is therefore associated with a significant expense and complexity.
- The object of the present invention is therefore to propose a transponder inlay and a method of manufacturing same so that the manufacturing allows transponder inlays to be designed to be as thin as possible at a comparatively low cost.
- This object is achieved by a transponder inlay having the features of Claim 1.
- With the inventive transponder inlay, the chip module is accommodated in a window opening formed in the substrate layer in such a way that a chip carrier of the chip module sits on a compressed peripheral shoulder of the window opening with its peripheral edge resting on the compressed peripheral shoulder.
- The peripheral shoulder of the window opening, which allows the chip carrier to be accommodated in such a way that it is flush with the surface, is implemented by compressing the material of the substrate layer in the area of the window opening, in contrast with the design known from the state of the art, in which, depending on the choice of material for the substrate layer, either only one chip housing of the chip module arranged on the chip carrier is accommodated in the window opening, and the chip carrier protruding laterally beyond the chip housing rests on the surface of the substrate layer, or the chip carrier rests on a peripheral shoulder of a window formed by a milling operation in the substrate layer to accommodate the entire chip module including the chip carrier.
- An optimum with regard to completely accommodating the chip module in the substrate layer in such a way as to protect the chip module from mechanical stresses and with regard to the thinnest possible design of the substrate layer is possible if the chip module is accommodated in the window opening in such a way that the chip carrier is arranged to be essentially flush with the contact surface of the substrate layer, and a chip housing of a chip unit arranged on the chip carrier is situated to be essentially flush with the underside of the substrate layer opposite the contact surface.
- An arrangement of the antenna coil on the contact surface of the substrate layer so that it is also flush with the surface is made possible if the antenna coil is formed from a wire conductor which is provided in a coil on the contact surface and arranged to be essentially flush with the contact surface by embedding it in the contact surface.
- It has proven especially advantageous if the substrate layer of the transponder inlay is made of a thermoelastic material, so that, on the one hand, a protective elastic sheathing is provided for the chip module, keeping mechanical stresses away from the chip because of its elasticity, and, on the other hand, a permanent compression is possible in the circumferential area of the window opening to form the peripheral shoulder through a temperature-supported pressure acting on the substrate material with a minimal expenditure of energy.
- The inventive layered structure for a personal document according to Claim 5 has, in addition to the transponder inlay, a cover layer of a book binding material for personal documents arranged as an additional layer on the contact surface of the transponder inlay.
- The inventive layered structure may thus consist of just two layers bonded together, supplemented by conventional intermediate pages in a simple manner to yield a personal document which is provided with a transponder unit despite giving the appearance of being a conventional personal document. The inventive layered structure thus allows the production of an identification document that essentially shows no difference from a conventional personal document from a purely external standpoint.
- Depending on the choice of material and/or the composition of the material for the cover layer, the bond between the substrate layer and the cover layer may be created by arranging an adhesive intermediate layer or by direct lamination of the cover layer onto the substrate layer to produce the layered structure. The latter is the case, for example, when the cover layer is a textile fabric coated with thermally activatable adhesive or some other laminatable material.
- It is especially advantageous if the layered structure is designed to be double-sided, with a substrate layer designed to be discontinuous, having the transponder unit on the transponder page and having a blank page that is divided from the transponder page by a fold recess and with a cover layer designed to be continuous, extending over the substrate layer. Such an embodiment of the layered structure in combination with the intermediate pages of a personal document makes it possible to produce a personal document that gives the user the impression of being a conventional personal document despite the implementation of the transponder unit in the front page or the back page of the binding.
- The inventive personal document has the features of Claim 8.
- The inventive method for producing a transponder inlay has the features of Claim 9. According to this invention, to form a window opening that holds the chip module, a through-opening is created in the substrate layer, and the peripheral edge of the through-opening is exposed to pressure and temperature to achieve a compressed peripheral shoulder with a reduced thickness.
- It is especially advantageous if the treatment with pressure and temperature is accomplished by means of an ultrasonically energized stamping tool. The temperature treatment may be accomplished by external heating of the stamping tool or by a heating of the stamping tool and/or substrate layer induced by mechanical friction as a result of the ultrasonic oscillations of the stamping tool, i.e., without external overheating.
- In addition, it has also proven to be especially advantageous if the stamping tool is used at the same time to form the through-opening because this allows the creation of the window opening as well as the creation of the peripheral shoulder in one machining operation using one and the same tool.
- A variant of the method that is optimized with regard to universal tool use is made possible if the stamping tool serves at the same time to embed a wire conductor, which is used to produce the antenna coil, in the contact surface of the substrate layer.
- A preferred embodiment of the transponder inlay is illustrated in the drawings and described with reference thereto, including an explanation of the process steps associated with production of the transponder inlay.
-
FIG. 1 shows a panel sheet arrangement with three transponder inlays designed contiguously; -
FIG. 2 shows a window opening of a substrate layer in an enlarged diagram according to sectional line II-II inFIG. 1 ; -
FIG. 3 shows the window opening fromFIG. 2 in a view from above; -
FIG. 4 shows a panel sheet arrangement with three bound pages designed contiguously for production of a layered structure for an identification document; -
FIG. 5 shows a partial sectional diagram of the layered structure shown inFIG. 4 according to sectional line V-V inFIG. 4 ; -
FIG. 6 shows a bound page folded over to form a bound back cover. -
FIG. 1 shows threetransponder inlays 11 that are designed to be joined together in apanel sheet arrangement 10, each transponder inlay having asubstrate layer 12 with atransponder unit 15 arranged thereon, comprising anantenna coil 13 and achip module 14.FIG. 1 also shows dividinglines 16 along which thetransponder inlays 11 can be separated from the panel sheet arrangement. - The diagram in
FIG. 1 shows thetransponder inlays 11 in a view from above with acontact surface 17 that faces upward and has awire conductor 18 arranged thereon in the form of a coil embedded in thecontact surface 17, as also illustrated inFIG. 2 . As shown inFIG. 5 in particular,free ends contact surfaces chip carrier 23 of thechip module 14 arranged in thecontact surface 17 of thesubstrate layer 12. - The
chip module 14 sits in a window opening 30, as illustrated inFIGS. 2 and 3 . For reasons of a simple diagram of the window opening 30,FIGS. 2 and 3 , in deviation from the diagram inFIG. 1 , omit thechip module 14, which is inserted into the window opening 30. The window opening 30 is designed with a step gradation and has aperipheral shoulder 24 facing thecontact surface 17 to accommodate the chip carrier 23 (FIG. 5 ) and, as shown inFIG. 3 , having aaccommodating cross section 25, which is designed to be larger than theaccommodating cross section 26 of a through-opening 28 that extends to anunderside 27 of thesubstrate layer 12 and serves to accommodate achip housing 29 of the chip module 14 (FIG. 5 ). - The through-opening 28 as well as the
peripheral shoulder 24 are adapted to the particular chip module to be accommodated. Thechip module 14, which is used in the present exemplary embodiment, is achip module 14 having achip carrier 23 that is designed to be larger than thechip housing 29 in only one dimension. Therefore, in the exemplary embodiment shown here, theperipheral shoulder 24 is designed so that theperipheral shoulder 24forms supporting surfaces chip carrier 23 on only two opposing edge sections (FIG. 3 ). - To produce the window opening 30 shown in
FIGS. 2 and 3 , astamping tool 31, for example, having astamp tip 33 bordered by astamp collar 32 may be used. Thestamp tip 33 has a cross section corresponding to the through-opening 28, and thestamp collar 32 has a cross section corresponding to theperipheral shoulder 24. In addition, thestamp tip 33 is provided with acutting edge 35 formed peripherally on the border of itsend face 34. - To produce the window opening 30 illustrated in
FIGS. 2 and 3 , thestamping tool 31 may be advanced toward acontact surface 53 with an intermediate arrangement of thesubstrate layer 12, so that the through-opening 28 is produced by the action of thecutting edge 35 on thesubstrate layer 12, based essentially on a punching operation. Simultaneously with a forward movement 36 of thestamping tool 31, this forward movement 36 may be exposed to ultrasonic vibrations in the direction of the forward movement or across that direction, so there is a relative heating of thesubstrate layer 12 due to the relative movement between thestamp collar 32 and thecontact surface 17 of thesubstrate layer 12. As a result of this heating, the compression of thesubstrate layer 12 which occurs due to the forward movement 36 is irreversible, i.e., it is a more or less frozen-in compression. If the material chosen for thesubstrate layer 12 is a thermoelastic material, then a certain elasticity is retained in the compressed area of theperipheral shoulder 24 despite the thermal stress on the material. Essentially, however, it is also possible to produce a window opening in a thermoplastic material in the manner depicted inFIGS. 2 and 3 . - In deviation from the embodiments described above, it is also possible to produce the
peripheral shoulder 24 not in direct correlation with the design of the through-opening 28 but instead first producing the through-opening 28 in any desired manner in a first process step and then designing theperipheral shoulder 24 by means of an ultrasonically energized stamping tool. - The
transponder inlays 11 of thepanel sheet arrangement 10 shown inFIG. 1 are designed to be double-sided with atransponder page 37, on which there is atransponder unit 15, and with ablank page 39, which is separated from thetransponder page 37 by a fold recess and has the same area as thetransponder page 37 of thesubstrate layer 12. -
FIGS. 4 and 5 show alayered structure 40 withbound pages 49 designed to be cohesive with one another in apanel sheet arrangement 41. Thepanel sheet arrangement 41 consists of the panel sheet arrangement shown inFIG. 1 with thetransponder inlays 11 and apanel sheet arrangement 54 arranged on thecontact surface 17 and havingcover layers 42 arranged in the laminate. In a partial sectional diagram,FIG. 5 shows thelayered structure 40 of thepanel sheet arrangement 41 and/or abound page 49 provided therein on an enlarged scale. It can be seen in particular that thechip module 14 is arranged in the window opening 30 of thesubstrate layer 12 in such a way that acontact side 43 of thechip carrier 23 is essentially flush with thecontact surface 17 of thesubstrate layer 12. Thechip housing 29 which encloses a chip unit (not shown here) and extends downward from thechip carrier 23 is accommodated completely in the through-opening 28 of the window opening 30. Ahousing top side 45 is situated so that it is slightly offset toward the interior into the window opening 30 or is arranged essentially flush with thebottom side 46 of thesubstrate layer 12. In the exemplary embodiment depicted inFIG. 5 , thechip carrier 23 is adhesively bonded to the supportingsurfaces peripheral shoulder 24. -
FIG. 5 also shows that an adhesiveintermediate layer 47 that bonds thecover layer 42 and thetransponder inlay 11 to form a fixedlayered structure 40 is arranged between thecover layer 42 and thecontact surface 17 of thesubstrate layer 12 and/or thetransponder inlay 11. The wire conductor ends 19, 20 of theantenna coil 13 that are in contact with the contact surfaces 21, 22 of thechip carrier 23 are accommodated essentially in theintermediate layer 47, so that with an inelastic design of thecover layer 42, no representation of the wire conductor ends 19, 20 in an outside or avisible side 48 of thecover layer 42 need be feared. - The bound
pages 49 arranged in a cohesive laminate in thepanel sheet arrangement 54 according toFIG. 4 are formed by the layeredstructure 40 depicted inFIG. 5 and can be separated by a punching operation along the dividing lines 16. Since the cover layers 42 extend continuously over thefold recess 38 in thesubstrate layer 12 and/or thetransponder inlay 11, the boundpages 49 have a corresponding reduction in cross section in the area of the fold recesses 38, allowing the boundpages 49 to be turned or folded about the bound back 50 defined by thefold recess 38, as illustrated inFIG. 6 . Then any intermediate pages containing personal information in a conventional manner can be inserted into an insertion space bordered by theblank page 39 and thetransponder page 37 of thetransponder inlay 11.
Claims (12)
1. A transponder inlay for manufacturing a layered structure for a personal document, having a substrate layer for arranging a transponder unit which comprises an antenna coil and a chip module and is situated on a contact surface of the substrate layer, characterized in that:
the chip module is accommodated in a window opening formed in the substrate layer, such that a chip carrier of the chip module rests with its peripheral edge on a compressed peripheral shoulder of the window opening.
2. The transponder inlay according to claim 1 , characterized in that the chip module is accommodated in the window opening in such a way that the chip carrier is essentially flush with the contact surface of the substrate layer and a chip housing of a chip unit arranged on the chip carrier is essentially flush with a bottom side of the substrate layer opposite the contact surface.
3. The transponder inlay according to claim 1 , characterized in that the antenna coil is formed from a wire conductor arranged in a coil pattern on the contact surface, said wire conductor being arranged so that it is essentially flush with the contact surface by embedding it in the contact surface.
4. The transponder inlay according to claim 1 , characterized in that the substrate layer is made of a thermoelastic material.
5. Layered structure for a personal document having a transponder inlay according to claim 1 , wherein a cover layer of a book binding material for personal documents is arranged on the contact surface of the transponder inlay.
6. The layered structure according to claim 5 , characterized in that the transponder inlay and the cover layer are joined together by an adhesive intermediate layer.
7. The layered structure according to claim 5 , characterized in that the layered structure is designed to be double-sided, having a substrate layer, which is designed to be discontinuous and has the transponder unit on a transponder page and has a blank page separated from the transponder page by a fold recess, as well as having a cover layer that is designed to be continuous and extends over the substrate layer.
8. The personal document characterized by a layered structure according to claim 5 .
9. A method for manufacturing a transponder inlay for a layered structure of a personal document, wherein a substrate layer is provided on a contact surface with an antenna coil and a chip module, characterized in that:
to form a window opening that accommodates the chip module and has a compressed peripheral shoulder, a through-opening is produced in the substrate layer, and the circumferential edge of the through-opening is subjected to pressure and temperature to achieve a reduced thickness of the substrate layer in the area of the circumferential edge.
10. The method according to claim 9 , characterized in that the treatment with pressure and temperature is performed by means of an ultrasonically energized stamping tool.
11. The method according to claim 10 , characterized int hat the stamping tool also serves at the same time to form the through-opening.
12. The method according to claim 10 , characterized in that the stamping tool serves at the same time to embed a wire conductor that is used to produce the antenna coil in the contact surface of the substrate layer.
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/867,804 US20090091424A1 (en) | 2007-10-05 | 2007-10-05 | Transponder inlay for a personal document and method of manufacturing same |
KR1020070119104A KR101035048B1 (en) | 2007-10-05 | 2007-11-21 | Transponder inlay for a personal document and method of manufacturing same |
PCT/EP2008/007049 WO2009046791A1 (en) | 2007-10-05 | 2008-08-28 | Transponder inlay for a personal document and method for the production thereof |
MX2009005695A MX2009005695A (en) | 2007-10-05 | 2008-08-28 | Transponder inlay for a personal document and method for the production thereof. |
CA2669079A CA2669079C (en) | 2007-10-05 | 2008-08-28 | Transponder inlay for a personal document and method for the production thereof |
EP08785744A EP2074560B1 (en) | 2007-10-05 | 2008-08-28 | Method for the production of a transponder inlay for a personal document |
AU2008310104A AU2008310104B2 (en) | 2007-10-05 | 2008-08-28 | Transponder inlay for a personal document and method for the production thereof |
AT08785744T ATE527627T1 (en) | 2007-10-05 | 2008-08-28 | METHOD FOR PRODUCING A TRANSPONDER INLAY FOR A PERSONAL DOCUMENT |
PL08785744T PL2074560T3 (en) | 2007-10-05 | 2008-08-28 | Method for the production of a transponder inlay for a personal document |
ES08785744T ES2371694T3 (en) | 2007-10-05 | 2008-08-28 | PROCEDURE FOR THE MANUFACTURE OF A TRANSPONDING INSERT FOR A PERSONAL DOCUMENT. |
EG2009060958A EG26352A (en) | 2007-10-05 | 2009-06-22 | Transponder inlay for a personal document and method for the production thereof |
US13/043,718 US8188867B2 (en) | 2007-10-05 | 2011-03-09 | Transponder inlay for a personal document and method for the production thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/867,804 US20090091424A1 (en) | 2007-10-05 | 2007-10-05 | Transponder inlay for a personal document and method of manufacturing same |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/043,718 Continuation US8188867B2 (en) | 2007-10-05 | 2011-03-09 | Transponder inlay for a personal document and method for the production thereof |
Publications (1)
Publication Number | Publication Date |
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US20090091424A1 true US20090091424A1 (en) | 2009-04-09 |
Family
ID=40043959
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/867,804 Abandoned US20090091424A1 (en) | 2007-10-05 | 2007-10-05 | Transponder inlay for a personal document and method of manufacturing same |
US13/043,718 Active US8188867B2 (en) | 2007-10-05 | 2011-03-09 | Transponder inlay for a personal document and method for the production thereof |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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US13/043,718 Active US8188867B2 (en) | 2007-10-05 | 2011-03-09 | Transponder inlay for a personal document and method for the production thereof |
Country Status (11)
Country | Link |
---|---|
US (2) | US20090091424A1 (en) |
EP (1) | EP2074560B1 (en) |
KR (1) | KR101035048B1 (en) |
AT (1) | ATE527627T1 (en) |
AU (1) | AU2008310104B2 (en) |
CA (1) | CA2669079C (en) |
EG (1) | EG26352A (en) |
ES (1) | ES2371694T3 (en) |
MX (1) | MX2009005695A (en) |
PL (1) | PL2074560T3 (en) |
WO (1) | WO2009046791A1 (en) |
Cited By (8)
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US20090315320A1 (en) * | 2006-09-26 | 2009-12-24 | Advanced Microelectronic And Automation Technology Ltd. | Inlays for security documents |
US20100295286A1 (en) * | 2009-05-13 | 2010-11-25 | Goldstein Keith E | Cover and method of manufacturing the same |
EP2564361B1 (en) | 2010-04-28 | 2017-09-20 | Arjo Systems | Fiber inlay formed in a single layer and equipped with a contactless electronic |
US11755874B2 (en) | 2021-03-03 | 2023-09-12 | Sensormatic Electronics, LLC | Methods and systems for heat applied sensor tag |
US11769026B2 (en) | 2019-11-27 | 2023-09-26 | Sensormatic Electronics, LLC | Flexible water-resistant sensor tag |
US11861440B2 (en) | 2019-09-18 | 2024-01-02 | Sensormatic Electronics, LLC | Systems and methods for providing tags adapted to be incorporated with or in items |
US11869324B2 (en) | 2021-12-23 | 2024-01-09 | Sensormatic Electronics, LLC | Securing a security tag into an article |
US11928538B2 (en) | 2019-09-18 | 2024-03-12 | Sensormatic Electronics, LLC | Systems and methods for laser tuning and attaching RFID tags to products |
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DE102009038802A1 (en) | 2009-08-25 | 2011-03-10 | Mühlbauer Ag | Value and security document in the form of a book, method of making such a value and security document |
DE102010011504A1 (en) | 2010-03-16 | 2012-06-14 | Mühlbauer Ag | Method for manufacturing transponder antenna for radio frequency identification tag for, e.g. debit card, involves fixing metal foil on antenna support layer, contouring antenna structure, and removing residual structure surrounding foil |
US8991712B2 (en) | 2010-08-12 | 2015-03-31 | Féinics Amatech Teoranta | Coupling in and to RFID smart cards |
US8789762B2 (en) | 2010-08-12 | 2014-07-29 | Feinics Amatech Teoranta | RFID antenna modules and methods of making |
US9033250B2 (en) | 2010-08-12 | 2015-05-19 | Féinics Amatech Teoranta | Dual interface smart cards, and methods of manufacturing |
US9195932B2 (en) | 2010-08-12 | 2015-11-24 | Féinics Amatech Teoranta | Booster antenna configurations and methods |
US9112272B2 (en) | 2010-08-12 | 2015-08-18 | Feinics Amatech Teoranta | Antenna modules for dual interface smart cards, booster antenna configurations, and methods |
EP2718876A1 (en) | 2011-06-04 | 2014-04-16 | Féinics AmaTech Teoranta | Preparing a substrate for embedding wire |
US8763914B2 (en) | 2012-01-17 | 2014-07-01 | On Track Innovations Ltd. | Decoupled contactless bi-directional systems and methods |
DE102012010560B4 (en) | 2012-05-29 | 2020-07-09 | Mühlbauer Gmbh & Co. Kg | Transponder, method for manufacturing a transponder and device for manufacturing the transponder |
FR2995709A1 (en) | 2012-09-18 | 2014-03-21 | Arjowiggins Security | METHOD FOR MANUFACTURING ELECTRONIC CHIP STRUCTURE AND STRUCTURE THUS MANUFACTURED |
DE102018112476B4 (en) | 2017-06-02 | 2022-01-27 | Ulrich Lang | Method and production plant for producing a foil substrate |
WO2019224364A1 (en) | 2018-05-24 | 2019-11-28 | Ulrich Lang | Method and production installation for producing a film substrate |
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- 2008-08-28 EP EP08785744A patent/EP2074560B1/en not_active Not-in-force
- 2008-08-28 AU AU2008310104A patent/AU2008310104B2/en not_active Ceased
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US11928538B2 (en) | 2019-09-18 | 2024-03-12 | Sensormatic Electronics, LLC | Systems and methods for laser tuning and attaching RFID tags to products |
US11769026B2 (en) | 2019-11-27 | 2023-09-26 | Sensormatic Electronics, LLC | Flexible water-resistant sensor tag |
US11755874B2 (en) | 2021-03-03 | 2023-09-12 | Sensormatic Electronics, LLC | Methods and systems for heat applied sensor tag |
US11869324B2 (en) | 2021-12-23 | 2024-01-09 | Sensormatic Electronics, LLC | Securing a security tag into an article |
Also Published As
Publication number | Publication date |
---|---|
CA2669079A1 (en) | 2009-04-16 |
KR101035048B1 (en) | 2011-05-19 |
AU2008310104B2 (en) | 2012-09-20 |
EG26352A (en) | 2013-08-26 |
AU2008310104A1 (en) | 2009-04-16 |
MX2009005695A (en) | 2009-06-08 |
KR20090035406A (en) | 2009-04-09 |
ES2371694T3 (en) | 2012-01-09 |
CA2669079C (en) | 2012-05-01 |
WO2009046791A1 (en) | 2009-04-16 |
ATE527627T1 (en) | 2011-10-15 |
EP2074560A1 (en) | 2009-07-01 |
EP2074560B1 (en) | 2011-10-05 |
US8188867B2 (en) | 2012-05-29 |
US20110155811A1 (en) | 2011-06-30 |
PL2074560T3 (en) | 2012-03-30 |
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Legal Events
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AS | Assignment |
Owner name: SMARTRAC IP B.V., NETHERLANDS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:RIETZLER, MANFRED;REEL/FRAME:020042/0720 Effective date: 20071011 |
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STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |