MX2009005695A - Transponder inlay for a personal document and method for the production thereof. - Google Patents
Transponder inlay for a personal document and method for the production thereof.Info
- Publication number
- MX2009005695A MX2009005695A MX2009005695A MX2009005695A MX2009005695A MX 2009005695 A MX2009005695 A MX 2009005695A MX 2009005695 A MX2009005695 A MX 2009005695A MX 2009005695 A MX2009005695 A MX 2009005695A MX 2009005695 A MX2009005695 A MX 2009005695A
- Authority
- MX
- Mexico
- Prior art keywords
- transponder
- production
- personal document
- chip module
- layer structure
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
- G06K19/025—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being flexible or adapted for folding, e.g. paper or paper-like materials used in luggage labels, identification tags, forms or identification documents carrying RFIDs
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Credit Cards Or The Like (AREA)
- Adornments (AREA)
Abstract
The invention relates to a transponder inlay (11) for the production of a layer structure (40) for a personal document having a substrate layer (12) for disposing a transponder unit (15) comprising an antenna coil (13) and a chip module (14), said transponder unit being located on a contact surface (17) of the substrate layer, wherein the chip module (14) is accommodated in a window opening (30) formed in the substrate layer (12) such that a chip carrier (23) of the chip module rests on a compressed edge section (24) of the window opening (30). The invention further relates to a method for producing the transponder inlays. The invention additionally relates to a layer structure for a personal document provided with such a transponder inlay and a passport document comprising such a layer structure.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/867,804 US20090091424A1 (en) | 2007-10-05 | 2007-10-05 | Transponder inlay for a personal document and method of manufacturing same |
PCT/EP2008/007049 WO2009046791A1 (en) | 2007-10-05 | 2008-08-28 | Transponder inlay for a personal document and method for the production thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2009005695A true MX2009005695A (en) | 2009-06-08 |
Family
ID=40043959
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2009005695A MX2009005695A (en) | 2007-10-05 | 2008-08-28 | Transponder inlay for a personal document and method for the production thereof. |
Country Status (11)
Country | Link |
---|---|
US (2) | US20090091424A1 (en) |
EP (1) | EP2074560B1 (en) |
KR (1) | KR101035048B1 (en) |
AT (1) | ATE527627T1 (en) |
AU (1) | AU2008310104B2 (en) |
CA (1) | CA2669079C (en) |
EG (1) | EG26352A (en) |
ES (1) | ES2371694T3 (en) |
MX (1) | MX2009005695A (en) |
PL (1) | PL2074560T3 (en) |
WO (1) | WO2009046791A1 (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8608080B2 (en) | 2006-09-26 | 2013-12-17 | Feinics Amatech Teoranta | Inlays for security documents |
WO2010132117A1 (en) * | 2009-05-13 | 2010-11-18 | American Bank Note Company | Cover and method of manufacturing the same |
DE102009038802A1 (en) | 2009-08-25 | 2011-03-10 | Mühlbauer Ag | Value and security document in the form of a book, method of making such a value and security document |
DE102010011504A1 (en) | 2010-03-16 | 2012-06-14 | Mühlbauer Ag | Method for manufacturing transponder antenna for radio frequency identification tag for, e.g. debit card, involves fixing metal foil on antenna support layer, contouring antenna structure, and removing residual structure surrounding foil |
FR2959581B1 (en) | 2010-04-28 | 2012-08-17 | Arjowiggins Security | FIBROUS INSERT CONSISTS OF A SINGLE LAYER AND EQUIPPED WITH AN ELECTRONIC DEVICE WITH CONTACTLESS COMMUNICATION. |
US8991712B2 (en) | 2010-08-12 | 2015-03-31 | Féinics Amatech Teoranta | Coupling in and to RFID smart cards |
US9112272B2 (en) | 2010-08-12 | 2015-08-18 | Feinics Amatech Teoranta | Antenna modules for dual interface smart cards, booster antenna configurations, and methods |
US8789762B2 (en) | 2010-08-12 | 2014-07-29 | Feinics Amatech Teoranta | RFID antenna modules and methods of making |
US9195932B2 (en) | 2010-08-12 | 2015-11-24 | Féinics Amatech Teoranta | Booster antenna configurations and methods |
US9033250B2 (en) | 2010-08-12 | 2015-05-19 | Féinics Amatech Teoranta | Dual interface smart cards, and methods of manufacturing |
EP2718876A1 (en) | 2011-06-04 | 2014-04-16 | Féinics AmaTech Teoranta | Preparing a substrate for embedding wire |
US8763914B2 (en) | 2012-01-17 | 2014-07-01 | On Track Innovations Ltd. | Decoupled contactless bi-directional systems and methods |
DE102012010560B4 (en) | 2012-05-29 | 2020-07-09 | Mühlbauer Gmbh & Co. Kg | Transponder, method for manufacturing a transponder and device for manufacturing the transponder |
FR2995709A1 (en) | 2012-09-18 | 2014-03-21 | Arjowiggins Security | METHOD FOR MANUFACTURING ELECTRONIC CHIP STRUCTURE AND STRUCTURE THUS MANUFACTURED |
DE102018112476B4 (en) | 2017-06-02 | 2022-01-27 | Ulrich Lang | Method and production plant for producing a foil substrate |
WO2019224364A1 (en) | 2018-05-24 | 2019-11-28 | Ulrich Lang | Method and production installation for producing a film substrate |
US11443160B2 (en) | 2019-09-18 | 2022-09-13 | Sensormatic Electronics, LLC | Systems and methods for laser tuning and attaching RFID tags to products |
US10783424B1 (en) | 2019-09-18 | 2020-09-22 | Sensormatic Electronics, LLC | Systems and methods for providing tags adapted to be incorporated with or in items |
US11055588B2 (en) | 2019-11-27 | 2021-07-06 | Sensormatic Electronics, LLC | Flexible water-resistant sensor tag |
US11755874B2 (en) | 2021-03-03 | 2023-09-12 | Sensormatic Electronics, LLC | Methods and systems for heat applied sensor tag |
US11869324B2 (en) | 2021-12-23 | 2024-01-09 | Sensormatic Electronics, LLC | Securing a security tag into an article |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4483067A (en) * | 1981-09-11 | 1984-11-20 | U.S. Philips Corporation | Method of manufacturing an identification card and an identification manufactured, for example, by this method |
EP0128822B1 (en) * | 1983-06-09 | 1987-09-09 | Flonic S.A. | Method of producing memory cards, and cards obtained thereby |
FR2579799B1 (en) * | 1985-03-28 | 1990-06-22 | Flonic Sa | METHOD FOR MANUFACTURING ELECTRONIC MEMORY CARDS AND CARDS OBTAINED ACCORDING TO SAID METHOD |
CH672285A5 (en) * | 1987-04-14 | 1989-11-15 | Landis & Gyr Ag | |
DE4241482A1 (en) * | 1992-12-09 | 1994-06-16 | Siemens Ag | Chip-carrying card mfr. - involves chip recess prodn. by forming blind hole and then embossing |
DE4410732C2 (en) * | 1994-03-28 | 1997-05-07 | Amatech Gmbh & Co Kg | Method for arranging a transponder unit having at least one chip and a wire coil on a substrate, as well as chip card with a correspondingly arranged transponder unit |
US6492717B1 (en) * | 1999-08-03 | 2002-12-10 | Motorola, Inc. | Smart card module and method of assembling the same |
DE10328776B3 (en) * | 2003-06-25 | 2005-01-27 | Groz-Beckert Kg | Punching device for flat objects |
DE102004004469A1 (en) * | 2003-12-22 | 2005-08-18 | Smartrac Technology Ltd. | Production of a security layered structure for identification documents |
US7612677B2 (en) * | 2005-01-28 | 2009-11-03 | Smartrac Ip B.V. | Method for producing a security layered construction and security layered construction and identification documents containing such a construction |
FR2881252A1 (en) * | 2005-01-24 | 2006-07-28 | Ask Sa | MEDIUM-RESISTANT RADIOFREQUENCY IDENTIFICATION DEVICE AND METHOD FOR MANUFACTURING THE SAME |
US8067253B2 (en) * | 2005-12-21 | 2011-11-29 | Avery Dennison Corporation | Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film |
US20080186186A1 (en) * | 2007-02-06 | 2008-08-07 | Opsec Security Group, Inc. | Apparatus and method for selectively permitting and resisting reading of radio frequency chips |
-
2007
- 2007-10-05 US US11/867,804 patent/US20090091424A1/en not_active Abandoned
- 2007-11-21 KR KR1020070119104A patent/KR101035048B1/en active IP Right Grant
-
2008
- 2008-08-28 WO PCT/EP2008/007049 patent/WO2009046791A1/en active Application Filing
- 2008-08-28 PL PL08785744T patent/PL2074560T3/en unknown
- 2008-08-28 CA CA2669079A patent/CA2669079C/en active Active
- 2008-08-28 AU AU2008310104A patent/AU2008310104B2/en not_active Ceased
- 2008-08-28 AT AT08785744T patent/ATE527627T1/en active
- 2008-08-28 MX MX2009005695A patent/MX2009005695A/en active IP Right Grant
- 2008-08-28 ES ES08785744T patent/ES2371694T3/en active Active
- 2008-08-28 EP EP08785744A patent/EP2074560B1/en not_active Not-in-force
-
2009
- 2009-06-22 EG EG2009060958A patent/EG26352A/en active
-
2011
- 2011-03-09 US US13/043,718 patent/US8188867B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2009046791A1 (en) | 2009-04-16 |
AU2008310104B2 (en) | 2012-09-20 |
CA2669079C (en) | 2012-05-01 |
KR101035048B1 (en) | 2011-05-19 |
EP2074560A1 (en) | 2009-07-01 |
ES2371694T3 (en) | 2012-01-09 |
US20090091424A1 (en) | 2009-04-09 |
US20110155811A1 (en) | 2011-06-30 |
EP2074560B1 (en) | 2011-10-05 |
US8188867B2 (en) | 2012-05-29 |
AU2008310104A1 (en) | 2009-04-16 |
ATE527627T1 (en) | 2011-10-15 |
KR20090035406A (en) | 2009-04-09 |
CA2669079A1 (en) | 2009-04-16 |
EG26352A (en) | 2013-08-26 |
PL2074560T3 (en) | 2012-03-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant or registration |