DE102018112476B4 - Method and production plant for producing a foil substrate - Google Patents

Abstract

Method for producing a transponder film substrate working according to the inductive coupling principle, which carries at least one chip module (20) with a loop antenna (68), which is used in the area of a turn window (72) of a booster antenna (8) and with the steps :- Providing a leadframe tape (2) with the chip module (20),- Providing a substrate (6) with at least one booster antenna (8) and partial reshaping of the substrate (6) in such a way that a cavity (64) for receiving the chip module (20) is formed, with the partial reshaping preferably taking place by means of an ultrasonic tool (32) and a forming tool (30), the forming tool (30) on the chip side and the ultrasonic tool (32) on the side facing away from the chip module (20). Apply substrate (6), - separating the chip module (20) from the leadframe tape (2), - inserting the chip module (20) into the cavity (64) and - gluing the chip module (20) in the cavity (64).

Description

The invention relates to a method for producing a film substrate according to the preamble of patent claim 1 or the preamble of patent claim 5 and a production plant for carrying out such a method.

Film substrates of this type are used, for example, to produce transponder inlays for credit and bank cards, eID cards, security IDs, passports, prestige cards, etc.

Conventional standard inlays have four layers that are laminated by applying pressure and/or temperature during a predetermined lamination time. To accommodate a chip module, windows are punched out of the substrate, into which the chip modules are inserted. To fix the position of the chip modules, they can be fixed with an adhesive metered into the punched window or with a hardening filling material, with the chip module being supported at the bottom by an overlay film applied on the underside.

For example, in the case of bank or credit cards, a defined antenna is welded into a core foil using a wire laying technique that is known per se and is physically connected to the chip module. This connection can be done, for example, by thermocompression welding using a tungsten electrode. After the gluing/potting, a further overlay and a cover sheet are then applied to this structure with the overlay film on the underside, the punched-out substrate in which a multiplicity of windows are provided for accommodating chip modules.

The production of such conventional cards with mechanical/physical contacting of an antenna with a chip module is, for example, in the publications EP 2 588 998 B1 , the DE 101 10 939 B4 , the EP 2 074 560 B1 and the EP 0 724 228 B1 described. All of these patents describe the processing of conventional contactless chip modules that require mechanical/physical contacting with an antenna.

As explained, a disadvantage of such transponder inlays is that a considerable outlay in terms of device technology is required in order to connect the chip modules only to the respective antennas. Furthermore, the punching out of the windows in the substrate layer to accommodate the chip modules requires a considerable outlay in terms of device technology. Another disadvantage is that the amount of material used in transponder inlays of this type is very high, since a standard inlay consists of four layers, for example, so that a great deal of logistical and organizational effort is required to provide the respective materials of the standard inlays.

In the EP 0 826 190 B1 describes the basic structure of a contactless chip card, in which a chip module with a loop antenna is placed in a winding window of a booster antenna.

The document US 2014/0263663 A1 discloses a chip card module arrangement in which a depression is formed in a carrier, into which a chip card module is inserted. A chip card antenna is coupled contactlessly to the chip card module.

In the U.S. 2014/004220 A1 a method for producing a chip card is described in which a card cavity is provided in a card insert blank, into which a chip card module can be inserted. In this case, antennas of the chip card module can be inductively coupled to an amplifier antenna coil of the card insert blank.

The document US 2015/0053772 A1 discloses a chip arrangement with a first and a second chip and a booster antenna. The chips have integrated antennas for communication with an external reading and/or writing device, with the booster antennas being coupled to the antennas on the chip.

In the U.S. 2012/0242072 A1 describes a solution in which a cavity is formed in a substrate, in which a microcircuit is inserted. This insertion can take place, for example, using a “pick and place” tool.

In all of these solutions, either a window for receiving the chip module has to be punched into the substrate, or a depression into which the chip module can be inserted has to be made in a relatively complex manner. Both procedures require a considerable process engineering effort.

A further disadvantage of those known methods in which the chip is attached by gluing is that these methods provide for the adhesive film to be cut out in the area of the chip or the globe top holding it on the chip module in a complex manner.

From the DE 10 2017 100 719 A1 a method is known in which a substrate is partially melted and a chip module is pressed into this area of the substrate that has been softened in this way.

the DE 196 45 067 A1 discloses a chip in a recess of a substrate.

In contrast, the invention is based on the object of creating a method and a production system by means of which the production of a film substrate is simplified in comparison to the conventional solutions with increased operational reliability.

With regard to the method, this object is achieved by the combination of features of patent claim 1 or by a method with the combination of features of patent claim 5 and with regard to the production plant by the combination of features of the independent patent claim 12 .

Advantageous developments of the invention are the subject matter of the dependent claims.

The method according to the invention is used to produce a transponder film substrate that has a large number of chip modules with a loop antenna (see, for example 5 , 6 , reference number 68) or a "bare" chip in which the loop antenna is integrated into the silicon chip structure (see 6 , reference numeral 21) is integrated, the loop antenna being placed in a winding window of a booster antenna and being inductively coupled. The chip modules with loop antenna and/or the chip with integrated loop antenna are also called electronic data carriers. The patent describes two processes that process two different data carriers. First the chip module with loop antenna and second a "naked" chip in which the loop antenna is integrated in one of the layers of the chip structure.

In both cases of processing the electronic data carrier, according to one exemplary embodiment, these are placed in a specific position within a booster antenna. Depending on the application and the resonance behavior of the chip (chip structure), a specific antenna design with a suitable booster antenna quality is required. Both of the above types of electronic data carriers have a loop antenna. The booster antenna geometry has a defined winding window into which the electronic data carriers must be inserted precisely. The different geometries of the booster antennas, or different types of production of booster antennas (wired, wound, etched, printed, punched, etc.) are not discussed here.

In an alternative solution, the booster antenna is arranged on one side of the substrate, while the chip module with the loop antenna is positioned opposite on the back of the substrate. That is, with such a solution, the chip module with the loop antenna is not positioned in a winding window of the booster antenna, but rather the antenna areas lie on opposite sides of the substrate and overlap one another. Such a solution has the advantage that the induction is improved compared to the first-mentioned solution.

If a transponder inlay with booster antenna and chip module with loop antenna or with a chip and integrated loop antenna comes into an electronic field (e.g. a reader at passport controls, or door opener, etc.), a "mini" induction voltage is generated . The chip is now supplied with energy using this mini-energy via inductive coupling (loop antenna/data carrier booster antenna). This energy is sufficient to "bring the chip to life" and thus the chip's data can be sent to a reading device via the booster antenna.

In this context, it should be mentioned again that the prior art mentioned at the outset relates to conventional chip modules in which a mechanical, physical connection of the chip module or the chips to the antenna is necessary. With the use of chip modules with inductive coupling or chips with an integrated loop antenna, this mechanical/physical connection to the antenna is no longer necessary. Contacting, mostly thermocompression welding with a tungsten electrode or even a soldering process, is completely eliminated. These contacting processes, such as thermocompression welding and soldering, are still a very critical process in transponder production today.

The invention deals with simplifying the production of a transponder film substrate, with an inductive coupling of data carrier and booster antennas taking place. As described, according to the invention there is no mechanical/physical connection of the data carrier to the antenna. Another major cost saving consists in the processing of chips with an integrated loop antenna layer, since the module and leadframe costs can then also be saved. Furthermore, an embodiment is described in which only one film substrate is required to fix the data carrier. A special cavity formation to create space for the data carrier does not have to be punched.

The chip modules are provided in leadframe form for processing chip modules with loop antennas. Typically in standardized 35mm tapes with an also standardized Perforation. Bare or "naked" chips with integrated loop antennas in the chip structure are separated in wafer format and fed to the foil substrate.

The inventor reserves the right to submit his own patent application for this processing of “naked” chips with an integrated loop antenna in wafer form.

A first step in processing the chip modules is the processing of the strips. A heat-activatable adhesive film is applied to the chip module leadframe in a manner known per se. The heat-activatable adhesive film is located on a silicone-like tape, the so-called release tape. The pamphlet EP 2 588 998 B1 describes a processing of the chip module tapes in which the adhesive film is applied to the back of the tape, ie on the opposite side where the chip is located. In the present patent application and according to the method according to the invention, a heat-activatable adhesive film is applied to the chip side of the chip module. The preferably full-area application of the heat-activatable adhesive film to the chip side can also be made the subject of an independent patent application.

In a variant of the invention, the adhesive/adhesive film used in each case can be preactivated by ultrasound, pressure and/or heat prior to bonding. This pre-activation preferably takes place by means of pressure and short-term direct exposure to temperature.

After bonding, a cover sheet can be applied to the film substrate. According to the invention, this cover sheet can be fixed by applying heat or by applying ultrasound. The cover sheet serves primarily as a protective layer for the booster antenna, with winding jumps of the booster antenna being covered. The fixing points of the cover sheet are designed in such a way that the transponder sheet is easy to handle for the following production step.

Alternatively, the jumps in the turns of the booster antenna can also be sunk into the substrate, so that these jumps in the turns and the entire booster antenna run planar to the substrate surface. This countersinking/embedding of the winding jumps can take place, for example, using a heated pressing tool or a suitable ultrasonic tool or in some other way.

The applicant reserves the right to submit his own independent claim to the arrangement of the booster antenna and the loop antenna on opposite sides of the substrate.

Furthermore, it is advantageous if the antennas, in particular the booster antenna, undergo a quality check before the data carriers (chip modules) are inserted. The resonant frequency or the Q factor or other specific parameters of the antenna can be checked, for example, using a network analyzer. In the event that one of these antennas is faulty, no data carriers are placed in the faulty critical antenna via a suitable control.

The leadframe tape preferably consists of three layers: the leadframe, the heat-activatable adhesive film and the release tape. This three-layer leadframe tape is fed to a production facility, for example, and the chip modules are separated from the leadframe by punching and fed to the film substrate. The release tape is removed just before punching. The punch punches out the chip module on the chip side and a vacuum-loaded removal tool positions the data carrier in the cavity of the film substrate.

The cavity formation is preferably performed with a forming tool under vertical force. The mold shapes the cavity for the chip module, so that the chip module is flush with the upper edge of the foil substrate, for example. An ultrasonic tool, which serves as an anvil, briefly heats the material so that the material can be embossed more gently. The pamphlet EP 2 074 560 B1 also describes cavity molding using an ultrasonic stamp. However, the invention significantly simplifies the process. The ultrasonic tool is preferably a standard tool with standard frequency tuning. The forming tool can be customized without retuning the ultrasonic tool. In addition, the molding tool can be made of a wear-resistant material, although only certain materials are suitable for use with ultrasound.

The production plant according to the invention, which is particularly suitable for carrying out the above-mentioned method, has a substrate feed, the substrate preferably being fed in the form of a sheet or endless film.

As described above, a first process step is the introduction of the cavity using a cavity stamping tool. The position of the cavity is, for example, approximately in the corresponding winding window of the booster system threshing floor The geometry of the booster and loop antennas creates an inductive coupling. The geometry of the winding window of the booster antenna can also have different angular positions, so the cavities must also follow the angular position analogously. Consequently, the chip module must also follow the angular position with a rotatable removal tool.

As explained, the chip module can then be inserted into the winding window of the booster antenna, so that the loop antenna and the booster antenna are arranged on the same side. An alternative solution provides for the booster antenna to be formed on one side of the substrate, while the chip module with the loop antenna or the chip with an integrated loop antenna is inserted opposite on the other side of the substrate. The cavity can then overlap with the booster antenna.

As already described, the chip module can be punched out at the production facility. The chip module is removed from the stamping tool, for example, by means of a vacuum and pressed directly into the cavity. The heat-activatable adhesive film is on the chip module side. The heat-activatable adhesive film is briefly activated on the opposite side of the cavity using an ultrasonic tool. Activation of the adhesive film is sufficient to fix the chip module so that it cannot slip during the brief onward transport of the substrate. Alternatively, an adhesive film can also be used that can be activated in some other way, e.g. B. with pressure and UV light or microwaves, etc.

The film substrate with the chip module fixed in the cavity is preferably transported to a curing station. Heating stamps with a defined temperature, pressure and time then activate the heat-activatable adhesive film. In a subsequent step, the chip module is pressed again with cooled pressure stamps.

Each process step can be checked with a functional check of the transponder. Depending on customer requirements, a cover film or cover sheet could be applied at the end of production. This cover sheet is used, among other things, to cover the jumps in the turns of the booster antenna.

In an alternative solution, these jumps in the turns of the booster antenna can also be sunk into the substrate in a suitable manner. This countersinking can be done, for example, by means of a heated ram or by means of an ultrasonic tool.

This cover film or this cover sheet can then be fixed in a suitable manner on the core film or the substrate. Fixing can take place, for example, by means of a heating pin or an ultrasonic tool.

Finally, for example, a final functional check is carried out and, if necessary, bad parts are marked.

The transponder film substrate, also known as the transponder inlay, is now ready for further processing into the final transponder product.

Similar to the chip module processing, the processing of a "naked" chip with an integrated loop antenna is also carried out. Only before the chip is inserted into the cavity is an adhesive dosed into the cavity. The chip is then inserted. In order to activate an adhesive, various possibilities can again be considered. Temperature, pressure, UV light, microwaves, etc.

According to one aspect of the invention, a leadframe carrier with such a chip module is provided. Furthermore, a substrate with a multiplicity of booster antennas is provided in a manner known per se, with this substrate being partially formed according to the invention, so that a cavity for receiving a chip module is formed. Such a cavity is provided in each case in the area of a booster antenna.

In a subsequent process step, a chip module is separated from the leadframe carrier and placed in the cavity. In a further process step, the chip module is then glued in the cavity.

The inventive method is characterized in that no mechanical connection between the chip module and the booster antenna must be made by using the above chip modules, since the signal transmission from the chip integrated into the small antenna (loop antenna) on the booster -Antenna using radio technology or the like. A further advantage is that no window has to be punched out in the substrate, since a cavity for the chip module is only produced by partial forming/embossing.

In an alternative solution, the process is further simplified by dispensing with the leadframe carrier and inserting the “naked” chip directly into the cavity. Otherwise, this variant corresponds to the above-described off example, so that further explanations are unnecessary.

The production plant according to the invention, which is particularly suitable for carrying out the above-mentioned methods, has a substrate feed, the substrate preferably being fed in sheet or foil form. Furthermore, a supply is provided, in particular for supplying a chip module or an above-described “bare” chip with an integrated loop antenna and optionally a separating station for separating a chip module from the leadframe. A forming device is provided to form the cavity on the substrate, it being possible for the chip module to be inserted into the cavity by means of a pick-and-place station.

The production plant also has an activation device for pre-activating, activating/hardening an adhesive, via which the chip module or the “bare” chip is fixed in position in the cavity.

This adhesive can be applied to the leadframe, for example, as an adhesive layer or adhesive film. When processing a "bare" chip, it is preferable to apply the adhesive directly into the cavity. This adhesive can be dispensed in liquid form or applied to the cavity as an adhesive layer.

As explained above, in one variant of the invention, the leadframe can be provided with an adhesive layer on the chip side. In order to simplify production, it is preferred that the adhesive layer is designed with a covering layer that is removed before the individualization/separation.

As explained, the adhesive can alternatively be introduced directly into the cavity.

The adhesive or the adhesive layer is activated or cured, for example, by the action of heat or ultrasound and subsequent cooling.

According to the invention, the reshaping to form the cavity takes place by means of an ultrasonic tool and a shaping tool, the shaping tool preferably acting on the substrate on the chip side and the ultrasonic tool preferably acting on the side facing away from the chip.

Depending on the requirements, after the chip module has been glued to the film substrate, a cover layer can be applied so that winding jumps are covered.

Alternatively, the winding jumps can also be sunk into the substrate.

As mentioned, the individual layers are preferably processed in the form of films, sheets or strips.

The molding tool described above is preferably designed in such a way that it approximately corresponds to the contour of the chip module, so that it is reliably fixed in position in the cavity.

To improve the production quality, the production facility can also be designed with one or more test stations for functional testing of the processed chip modules. This test station can, for example, be a reading device for testing the respective chip module. Alternatively, the transponder test station can be designed in such a way that an operating system or a Java applet can be loaded contactlessly onto a flash memory of the chip module using transponder technology.

In principle, the chip module or the chip with an integrated loop antenna (at the module or layer level) can also be operated with antenna types that are etched, printed, stamped or produced in some other way. The patent applicant reserves the right to base his own independent patent claim on this principle.

• 1 den Grundaufbau eines ersten Ausführungsbeispiels einer Fertigungsanlage zur Herstellung eines Foliensubstrats;
• 2 eine Leadframe-Zuführung der Fertigungsanlage gemäß 1;
• 3 ein Ultraschallwerkzeug und ein Formwerkzeug der Fertigungsanlage gemäß 1;
• 4 ein weiteres Ausführungsbeispiel einer erfindungsgemäßen Fertigungsanlage, bei der ein Kleber direkt in eine Kavität des Substrats dosiert wird;
• 5 ein Foliensubstrat, das mit der Fertigungsanlage gemäß 4 herstellbar ist;
• 6 eine Variante des Ausführungsbeispiels gemäß 5;
• 7 eine Abbildung zur Verdeutlichung der Unterschiede bei der Verarbeitung eines Chipmoduls bzw. eines Chips mit integrierter Loop-Antenne;
• 8 einen Teil eines weiteren Ausführungsbeispiels einer Fertigungsanlage zur Verarbeitung von „nackten“ Chipmodulen;
• 9 ein Foliensubstrat, das mit einer Fertigungsanlage gemäß 7 verarbeitet wird;
• 10 eine Einzeldarstellung eines Chipmoduls;
• 11 einen Bogen mit derartigen Chipmodulen;
• 12a, 12b, 12c Ansichten eines Zwischenproduktes bei der Durchführung des erfindungsgemäßen Verfahrens;
• 13a, 13b ein Presswerkzeug zum Versenken von Windungssprüngen;
• 14 eine Variante des Ausführungsbeispiels gemäß den 13a, 13b und
• 15 eine Presseinrichtung mit Presswerkzeugen gemäß den 13 oder 14 in der Serienfertigung.

Preferred exemplary embodiments of the invention are explained in more detail below using schematic drawings. Show it:

• 1 the basic structure of a first exemplary embodiment of a production plant for the production of a film substrate;
• 2 according to a leadframe feed of the manufacturing plant 1 ;
• 3 an ultrasonic tool and a molding tool according to the manufacturing facility 1 ;
• 4 a further exemplary embodiment of a production system according to the invention, in which an adhesive is dosed directly into a cavity of the substrate;
• 5 a film substrate made in accordance with the manufacturing facility 4 is manufacturable;
• 6 a variant of the embodiment according to 5 ;
• 7 a figure to clarify the differences in the processing of a chip module or a chip with an integrated loop antenna;
• 8th part of a further exemplary embodiment of a production system for processing “bare” chip modules;
• 9 a film substrate with a manufacturing facility according to 7 is processed;
• 10 an individual representation of a chip module;
• 11 a bow with such chip modules;
• 12a , 12b , 12c Views of an intermediate product when carrying out the method according to the invention;
• 13a , 13b a pressing tool for countersinking coil jumps;
• 14 a variant of the embodiment according to 13a , 13b and
• 15 a pressing device with pressing tools according to 13 or 14 in series production.

1 shows a schematic representation of a first exemplary embodiment of a production system 1 for producing a film substrate, as is used in the production of transponder layers. As mentioned, production takes place in sheets or in continuous format--in the exemplary embodiment shown, a continuous format with a width of, for example, 650 mm is used. At the in 1 illustrated embodiment are to be processed chip modules, which are designed as contactless inductive coupling chip modules (chip modules with integrated loop antenna), arranged on a leadframe tape 2, which is fed via a leadframe feeder 4 as a strip-shaped material. The production plant 1 also has a feed (not shown) for a core film, called substrate 6 below.

2 shows one of the in 1 shown production plant 1 upstream leadframe preparation station 10 in which the leadframe tape 2 is prepared. It is assumed here that the leadframe tape 2 is wound up as a strip material on a leadframe store 12, with the chip modules mentioned already being integrated. Details of this leadframe technology are, for example, in the document mentioned at the outset EP 2 588 998 B1 explained.

This leadframe tape 2 is in accordance with 2 provided with a heat-activatable adhesive layer (HAF (Heat Activated Film)), also provided as roll or tape material. This lamination is carried out, for example, by means of a heating plate 16 against which the layer structure with the leadframe tape 2 and the adhesive layer 14 is pressed by means of silicone pressure rollers 18 so that the layers are partially softened and bonded/laminated.

As in 2 shown below, after lamination, this layered structure basically consists of the leadframe tape 2, which carries the chip modules 20, which in turn are covered with the cover tape 24 via the adhesive layer 14. This cover tape 24 is arranged on the outside, so that the entire adhesive layer is covered. The masking tape 24 can be a silicone tape.

This multi-layer laminate (leadframe tape 2 with adhesive layer 14 and cover tape 24) is then fed to a storage roll 22 or directly to the leadframe feeder 4.

As in 1 shown, the cover tape (release tape) 24 is pulled off the adhesive layer 14 before the chip modules 20 are separated and rolled up onto a roll 26 and disposed of or fed to recycling.

The substrate 6 can be fed in, for example, as a roll feed device, via which the core film (substrate) provided as roll material can be unwound and fed to the further processing stations along guides that are not shown. As mentioned, the core foil can also be fed in as sheets via a suitable feed.

In a processing step that is not shown, a number of specified booster antennas 8 are applied to the substrate 6 by means of an antenna laying unit using wire laying technology. These are welded into the substrate 6 in a manner known per se. The substrate 6 can consist of a conventional thermoplastic, for example polycarbonate, PVC or of a synthetic paper. The antenna wire is laid and welded in a manner known per se using an ultrasonic converter and a laying tool.

In the area of winding windows of the booster antenna 8 arranged on the substrate 6, a cavity is formed by means of a shaping device/embossing device 28, the contour of which is adapted to the outer contour of the chip module 20 to be processed.

The basic structure of this forming device 28 is 3 shown. This shows an enlarged representation of the substrate 6 on which a multiplicity of booster antennas 8 are arranged. The reshaping device 28 now forms the above-described cavity in an area surrounded by the booster antenna 8 . According to an exemplary embodiment according to the invention, the forming device 28 has an embossing or forming tool 30 whose contour corresponds to that of the cavity to be formed. The forming facility 28 also has an ultrasonic tool 32, whose sonotrode 34 in 3 is displayed. This representation shows that the sonotrode 34 is designed with a flat active surface 36 via which the area of the substrate 6 subjected to the ultrasound is softened, so that the cavity can be formed via the mold 30 . In 3 the profile 38 of the molding tool 30 is also shown. The face of this profile 38 corresponds to the base of the cavity to be formed.

The forming tool 30 and the ultrasonic tool 32 are simultaneously guided in the X and Y directions so that they can be moved. In this case, the forming tool 30 is driven in the vertical direction (Z) via an axis system. The ultrasonic tool 32 is fixed in the vertical (Z) below the substrate 6, but can be moved in the X and Y directions. The shaping tool 30 presses onto the substrate 6 with an adjustable or controllable force. When the ultrasonic tool 32 is switched on, heat is generated, which softens the substrate material so that the cavity is shaped without stress for the material. The embossing of the cavity can be further simplified if the mold 30 is heated. The depth of the cavity is designed in such a way that the chip module 20 can be inserted flush into the cavity. In principle, however, it is also possible to use the chip module with a certain overhang, with this overhang then being correspondingly covered by a further layer.

After the cover tape 24 has been detached and wound up, the chip modules 20 are separated from the leadframe tape 2 in a separating station 40 . In the illustrated embodiment, the separating station 40 is designed as a punching device.

In a further method step, the quality of the booster antennas 8 is checked. This check can be carried out, for example, using a network analyzer. The specified tolerances of the booster antennas 8 can be freely programmed. If the tolerances are at the limit, a warning appears and no electronic data carriers are placed in the respective faulty, critical antennas.

The isolated chip modules 20 with the internal loop antenna formed by the leadframe tape 2 are then taken over by means of a pick-and-place unit 42 and inserted into the prefabricated cavities. This placement is carried out with the aid of an optical monitoring system (vision system) 44. The pick-and-place unit 42 sucks the punched chip modules 20 directly from the punch of the separating station 40 by means of a vacuum, with four chip modules 20, for example, being able to be transported and placed at the same time .

In an exemplary embodiment of the invention, the pick-and-place unit 42 has a rotary design in order to be able to place the chip modules 20 in the cavities of the substrate 6 at a freely selectable angle of incidence. Twisting the chip modules 20 in this way is advantageous because it improves the bending and torsional tolerance of the electronic component that is provided with the substrate film.

The adhesive layer 14 embodied as an HAF film, for example, is then activated by means of an activation device 48 . In the specific solution, this activation device 48 is also designed as an ultrasonic tool that can be moved in the X and Y directions, so that all cavities can be approached one after the other in order to activate the adhesive layer 14 - the chip module 20 is then moldable and firmly secured in the cavity.

The function of the respective chip modules 20 is then tested in a test station 50 . This test station 50 can be designed, for example, as a transponder reader, via which the chip function can be checked after each process step.

After this test, in the exemplary embodiment shown, the adhesive is activated further by means of heating stamps 52. The adhesive is then subjected to a defined temperature and pressing force over its entire surface, so that it reaches the activation temperature. In a further work step, the bond is then subjected to cooling dies 54, which cool the structure so that the adhesive hardens and reaches its final strength. This process is known per se from chip card production.

Depending on the customer's requirements, a cover sheet 56 can then be applied to the substrate film after the adhesive has hardened. This cover sheet 56 is then connected to the substrate film 6 by means of a fixing station 58, which can also be designed as a heated ultrasonic unit, for example. The fixing station 58 is preferably designed to be movable in the X, Y and Z directions, so that the cover sheet 56, which is attached depending on the customer's requirements, is spot-welded to the core film (substrate 6).

One task of the cover sheet 56 is to cover the jumps in the turns of the booster antenna 8, which are explained in more detail below. The fixing points are to be selected in such a way that the subsequent production steps are not impeded.

As will be explained in more detail below, these winding jumps can also be sunk into the substrate 6 using a suitable tool. In this case, under certain circumstances, the cover sheet 56 can be dispensed with.

According to the illustration in 1 the production plant 1 according to the invention is additionally provided with a marking device 60 in the exemplary embodiment shown, via which a defective part is marked. This marking device can be, for example, an inkjet printer or the like.

The film substrate 6 provided with the chip modules 20 in this way is then fed to further processing.

As explained above, a test station 50 can be provided after each process step, so that continuous process control is ensured. In this case, the UID is also stored in a database before punching, managed and assigned accordingly to the respective process parameters determined via the test station 50 .

The function is then tested again in a final test using a further test station 50 (not shown). Depending on how further processing is to be carried out, the strip material can be cut into sheets and stacked at the end.

4 shows a variant of the in 1 illustrated embodiment. A difference between the two manufacturing plants 1 is that in the embodiment according to 4 a standard lead frame tape 2 without an adhesive layer 14 is used. The adhesive required to fix the position of the chip module 20 is then introduced directly into the previously formed cavities via an adhesive metering device 62 .

In the case where "bare" chips 21 are processed, the chip module feed can be replaced by a wafer unit. In this case, however, it will also be necessary to adapt the cavity and thus the forming device and the forming tool and also the pick-and-place unit and the heating stamp and the cooling stamp accordingly.

5 shows a partial representation of the substrate (foil substrate) 6 on which the booster antenna 8 is arranged. The cavity 64 was formed in the substrate 6 via the shaping device 28 explained above. As explained, adhesive 66 is then metered via the adhesive metering device 62 . As per the illustration 5 shows, the cavity 64 is preferably arranged centrally with respect to the amplifier windings (winding window) of the booster antenna 8 .

After dispensing the adhesive 66, the chip module 20 is then placed in the cavity 64 and on the adhesive 66 by means of the pick-and-place unit 42 and this is activated in the manner described above, so that the chip module 20 is fixed in position. In the representation according to 5 one can also see the loop antenna 68 integrated into the chip module 20. The further processing is analogous to FIG 1 , so that further explanations are superfluous.

6 shows a further variant of the production method according to the invention or a production plant according to the invention. In this exemplary embodiment, an adhesive 66 is not metered, but an adhesive film, for example an HAF blank 70, is inserted into the cavity 64 via a suitable feed in order to prefix the chip module 20.

The adhesive is then activated again in the manner described above using temperature, time and pressure.

In principle, the activation, in particular when dosing an adhesive 66 according to 5 also take place by means of UV radiation, which acts on the substrate 6 from below, ie from the side facing away from the chip module 20 .

In the exemplary embodiments described above, the chip modules 20 are each arranged on a leadframe tape 2 . Based on 8th and 9 an exemplary embodiment is explained in which the “bare” chips 21 explained at the outset, ie chips 21 not provided with a leadframe tape 2, are processed.

The difference between an inductive coupling contactless chip module and a "bare" chip 21 is again based on 7 clarified. The chip module 20 is shown there on top. This carries the actual chip, which is connected to the loop antenna 68 via conductor tracks (directly bonded). This chip module 20 is then inserted into the named turn window 72 of the booster antenna 8 of the transponder inlay, a cavity having previously been introduced in this area in the manner described above.

7 shows the aforementioned "naked" chip 21 of the latest design. In these chips 21, the loop antenna is integrated into one of the silicon layers of the chip 21, so that the chip module with the bonded loop antenna can be omitted and the chip 21 accordingly requires a much smaller area than the chip module 20. This "naked" chip 21 is then turned into the wind ungswindow 72 of the booster antenna 8 used, with corresponding to the small dimensions of the chip 21 less space for the turn window 72 is required. The processing of chips 21 of this type is very advantageous since the module costs would be eliminated with such a solution and the processing is also significantly simplified. Another advantage is that the "bare" chips 21 are provided in wafer format. In addition, these chips 21 are almost invisible in the substrate and thus fade into the background.

In 8th five main steps of such a production are shown. In 8th one can see the substrate 6 with the booster antenna 8 laid thereon. As in the exemplary embodiments described above, the cavity 64 for receiving the bare chip 21 is first formed via the forming device 28 with the forming tool 30 and the ultrasonic tool 32 . In a next production step, adhesive is then metered into this cavity 64 by means of an adhesive metering device 62 and a bare chip 21 is inserted into the cavity 64 by means of the pick-and-place unit 42 . In a subsequent work step, pressure and temperature are first applied to the adhesive via a heating die 52 for a predetermined period of time, so that the adhesive is activated. The bond is then cooled by means of the cooling die 54 so that the adhesive hardens accordingly.

After this bonding, the "naked" chip 21 with the integrated loop antenna is then fixed in position in the cavity 64 and positioned relative to the booster antenna 8 of the substrate 6 in such a way that an inductive signal transmission from the loop antenna integrated into the chip layer Antenna for booster antenna 8 is enabled.

The great advantage of the method described above is the simplicity of the process, with the resulting transponder inlay (substrate film) being able to be made extremely thin with a thickness of less than 200 μm.

It is particularly advantageous if the antenna is installed on a thermoplastic substrate/inlay. This has the advantage over an antenna formed by etching on PET that there is no "foreign body" present in the complete assembly.

Furthermore, the processing of such PET substrates is problematic, since cards for banking, transport, eID products are usually made of PVC or PC and also contain synthetic paper (Teslin) and these materials are difficult to combine with PET by laminating or gluing are to be processed.

In the exemplary embodiments described above, the loop antenna 68 is inserted into a turn window 72 in the booster antenna 8 . Accordingly, these two antennas are arranged on the same side of the substrate 6. FIG.

A variant is described below in which the booster antenna 8 and the loop antenna 68 are arranged on opposite sides of the substrate 6, with the windings of the antennas overlapping one another at least in sections, so that the induction is improved compared to the solution described above.

10 FIG. 12 again shows an individual illustration of a chip module 20 according to the invention, in which the actual chip 74, which is contacted with the loop antenna 68, is arranged approximately in the middle. Its windings are laid around the chip 74, with the illustrated exemplary embodiment providing approximately rectangular windings, although a different geometry can of course also be formed.

11 shows a leadframe tape 2 on which a plurality of chip modules 20 are arranged. As explained at the outset, this leadframe tape 2 is wound onto a leadframe store 12, the chip modules 20 then being punched out during processing.

the 12a , 12b , 12c show an intermediate product that is obtained in the production according to the invention. 12a shows the punched-out, transparent substrate 6, on the in 12a Visible large area the booster antenna 8 is laid.

12b shows the in 12a upper right lying corner region of the substrate 6, in which the actual booster antenna 8 is formed with the winding window 72 described above. In this corner area, the booster antenna 8 is designed with a large number of windings, which extend from the outside to the inside. The end section of the antenna wire is then placed over the previously laid turns from the center of the booster antenna 8, so that there is a jump in the turns 76 in this area, which protrudes slightly upwards towards the viewer and thus represents a potential hazard because this uneven area can lead to snagging or the like during further production or during use. A corresponding jump in turns 78 also occurs in the region of the other end of the antenna wire, which extends out of the frame formed by only a few large turns and which encompasses the actual booster antenna 8 .

12c shows the back of the substrate 6, which is shown transparent, so that the winding jump 76 described above is visible. In the representation according to 12c you can see the back of the chip module 20, on which the in 12b internally visible loop antenna 68 is formed, which is thus arranged on this rear side of the substrate 6. The windings of the loop antenna 68 overlap in sections with the windings of the booster antenna 8—in this way the actual winding window 72 can be minimized since no space has to remain for the chip module. That is, in addition to the advantage of improved induction, the variant according to the 11 and 12 can also be made more compact, since loop antenna 68 and booster antenna 8 are arranged opposite one another and are only spaced apart from one another by the substrate film. As mentioned above, the cavity 64 is formed in the substrate film 6, in which the chip module 20 is inserted flush.

As previously explained, the cover sheet 56 of the embodiment described above also serves to cover the winding jumps 76,78.

In principle, however, it is also possible to dispense with this cover sheet 56 and to sink/embed the winding jumps 76, 78 into the substrate 6 by suitable mechanical action.

13a shows a way of sinking these jumps 76, 78 into the substrate 6, so that they no longer protrude from the substrate surface. In the embodiment according to 13a a pressing tool 80 is used to press the winding jumps 76 , 78 into the substrate 6 . The latter is raised upwards with the booster antenna 8 and the winding jumps 76, 78 formed thereon (view according to 13a) placed pointing to a heated pad 82. The pressing tool 80 has a likewise heated press plate 84 which is held on a press head 86 which can be extended in the direction of the support 82 . By lowering the heated press plate 84 onto the likewise heated support 82 and applying a suitable pressure, the two winding jumps 76, 78 are then pressed into the substrate 6 so that the end sections of the antenna wire no longer protrude.

13b shows an enlarged representation of the pressing tool 80 according to FIG 13a . The booster antenna 8 pointing to the press plate 84 and the two winding jumps 76, 78, which are then pressed into the substrate 6 when the press plate 84 is lowered further, can be clearly seen in this representation, with this substrate 6 resting on the support 82.

14 shows a variant in which the substrate 6 with the booster antenna points to the support 82 . The booster antenna 8 then rests on this heated support 82 and the chip module 20 points towards the press plate 84 . The two winding jumps 76, 78 also rest on the support 82 in this relative position, so that when the press plate 34 is lowered by the pressure and temperature effects, the winding jumps 76, 78 are also pressed into the substrate material.

15 Finally, FIG ) can be lowered in the direction of a substrate sheet on which a plurality of booster antennas 8 are laid. The winding jumps 76, 78 of these booster antennas 8 are then simultaneously pressed into the substrate by lowering the pressing tools 80a to 80i. The processing of the substrate/the transponder layer before or after this pressing device then takes place in the manner described above, it being possible, as explained, to dispense with the application of a cover sheet. Of course, instead of the pressing tool, another suitable tool, for example an ultrasonic tool or the like, can also be used in order to embed the winding jumps 76, 78 in the substrate sheet.

A method and a production system for producing a transponder film substrate are disclosed, with a chip module having a loop antenna or a "naked" chip having an integrated loop antenna being inserted into a booster antenna substrate. The transponder foil substrate preferably consists of only one layer with a shaped cavity for accommodating the chip module or the "bare" chip.

Reference List

1

manufacturing plant

2

Leadframe tape with chip modules

4

Leadframe Feeder

6

substrate

8th

booster antenna

10

Leadframe Prep Station

12

Leadframe Storage

14

Adhesive layer (HAF)

16

hotplate

18

pinch rollers

20

chip module

21

"bare" chip with integrated loop antenna

22

storage roll

24

masking tape

26

role

28

forming device

30

molding tool

32

ultrasonic tool

34

sonotrode

36

active surface

38

profile

40

separation station

42

Pick and place unit

44

vision system

48

activation device

50

test station

52

heating stamp

54

cooling stamp

56

cover sheet

58

fuser

60

marking device

62

Glue dosing device

64

cavity

66

Glue

68

loop antenna

70

cutting/gluing

72

whorl window

74

chip

76

coil jump

78

coil jump

80

pressing tool

82

edition

84

press plate

86

press head

88

pressing device

90

portal

Claims (14)

Method for producing a transponder film substrate working according to the inductive coupling principle, which carries at least one chip module (20) with a loop antenna (68), which is used in the area of a turn window (72) of a booster antenna (8) and with the steps : - Providing a leadframe tape (2) with the chip module (20), - Providing a substrate (6) with at least one booster antenna (8) and partially reshaping the substrate (6) in such a way that a cavity (64) for receiving the chip module (20) is formed, the partial reshaping preferably using an ultrasonic tool (32) and a molding tool (30), the molding tool (30) acting on the chip side and the ultrasonic tool (32) acting on the substrate (6) on the side facing away from the chip module (20), - Separating the chip module (20) from the leadframe tape (2), - Insertion of the chip module (20) in the cavity (64) and - Gluing the chip module (20) in the cavity (64). procedure after Claim 1 , wherein the leadframe tape (2) on the chip side is provided with an adhesive layer (14) or an adhesive film, preferably applied over the entire surface. procedure after patent claim 2 , wherein the adhesive layer (14) has a cover tape (24) which is pulled off prior to singulation/separation of the chip module (20). Method according to one of the preceding claims, in which an adhesive (66) or the adhesive layer (14) is preactivated and/or activated and/or cured by the action of heat and/or pressure. Method for producing a transponder film substrate working according to the inductive coupling principle, which carries at least one "bare" chip (21) with a loop antenna integrated in the chip structure, which is preferably provided in wafer format and in the area of a winding window (72) of a booster antenna (8) is used, with the steps: - providing the chip (21) with an integrated loop antenna, preferably from a wafer, - providing a substrate (6) with at least one booster antenna (8) and partial reshaping of the substrate ( 6) in such a way that a cavity (64) is formed for receiving the chip (21), the partial forming being carried out by means of an ultrasonic tool (32) and a forming tool (30), the forming tool (30) being on the chip side and the ultrasonic tool (32 ) from the chip module (20) act on the substrate (6) on the opposite side, - inserting the chip (21) into the cavity (64), preferably after preactivation of an adhesive by means of ultrasound or heat, and - gluing the chip (21) in the cavity (64). procedure after Claim 5 , wherein an adhesive (66) is introduced into the cavity (64). Method according to one of the preceding patent claims, in which, after the gluing, a cover sheet (56) is applied to the film substrate (6) and fixed, preferably by means of temperature application or ultrasound application. Procedure according to one of patent claims 1 until 6 , wherein turns jumps of the booster antenna (8) are sunk into the substrate (6). Method according to one of the preceding claims, in which the quality of the booster antenna (8) is checked before the chip (21) with integrated loop antenna or the chip module (20) is inserted into the cavity (64). Method according to one of the preceding claims, in which the chip (21) with an integrated loop antenna or the chip module (20) can also be operated with antenna types that are etched, printed, punched or produced in some other way. Method according to one of the preceding claims, wherein the winding window (72) of the booster antenna (8) on one side of the substrate (6) and the chip module (20) with the loop antenna (68) or the chip (21) with integrated loop antenna is arranged opposite on the other side of the substrate (6). Production plant, in particular for carrying out the method according to one of the preceding claims, with a substrate feed, a chip feed, in particular a leadframe feed (4) for feeding a chip module (20) or a chip (21) with an integrated loop antenna , optionally a separating station (40) for separating a chip module (20) from the leadframe (2), a shaping device (28) for forming a cavity (64) in the substrate (6), the shaping device (28) having a shaping tool (30) and an ultrasonic tool (32), a pick-and-place unit (42) for placing the chip module (20) or the chip (21) in the cavity (64) and an activation device (48) for activating/curing an adhesive (66) via which the chip module (20) or the chip (21) is to be fixed in position in the cavity (64). manufacturing plant Claim 12 wherein the mold (30) is adapted to the contour of the chip module (20) or chip (21). manufacturing plant Claim 12 or 13 , With a test station (50) for functional testing of the chip module (20) or chips (21), wherein the test station (50) is preferably a reader or is designed, an operating system or a Java applet on a memory, preferably a flash memory of the chip module for contactless charging.

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