WO2019224364A1

WO2019224364A1 - Method and production installation for producing a film substrate

Info

Publication number: WO2019224364A1
Application number: PCT/EP2019/063496
Authority: WO
Inventors: Ulrich Lang
Original assignee: Ulrich Lang
Priority date: 2018-05-24
Filing date: 2019-05-24
Publication date: 2019-11-28

Abstract

The invention relates to a method and a production installation for producing a transponder film substrate, wherein a chip module having a loop antenna or a "naked" chip having an integrated loop antenna is introduced into a booster antenna substrate. The transponder film substrate preferably consists only of a layer having a shaped cavity for receiving the chip modules or the "naked" chip.

Description

Process and manufacturing plant

for producing a film substrate

description

The invention relates to a method for producing a film substrate according to the preamble of claim 1 or the preamble of patent claim 5 and a manufacturing plant for carrying out such a method.

Such film substrates are used, for example, for producing

Transponder inlays used by credit and debit cards, elD cards, security cards, passports, prestige cards, etc.

Conventional standard inlays have four layers that are laminated by exposure to pressure and / or temperature for a predetermined lamination time. For receiving a chip module are punched out of the substrate window, in which the chip modules are inserted. For fixing the position

Chip modules, these can be fixed with a metered into the punching window adhesive or a curing filler, the chip module is supported at the bottom over a bottom side applied overlay.

By way of example, in the case of bank cards or credit cards, a defined antenna is welded into a core foil by means of a wire laying technique known per se and physically connected to the chip module. This bonding can be done for example by thermocompression welding by means of a tungsten electrode. In this construction with the lower-side overlay foil, the punched-out substrate, in which a plurality of windows is provided for accommodating chip modules, a further overlay and a cover sheet are then applied after the gluing / pouring.

The production of such conventional cards with mechanical / physical contacting of an antenna with a chip module is for example in the

Publications EP 2 588 998 B1, DE 101 10 939 B4, EP 2 074 560 B1 and EP 0 724 228 B1. All these patents describe the processing of conventional contactless chip modules that have a mechanical / physical

Need to contact with an antenna.

As explained, a disadvantage of such transponder inlays is that a considerable device complexity is required in order to connect the chip modules only to the respective antennas. Furthermore, the punching out of the window in the substrate layer for receiving the chip modules requires considerable device complexity. Another disadvantage is that the

Material use in such transponder inlays is very high, since for example a standard inlay consists of four layers, so that correspondingly a large logistical and organizational effort is required to the respective materials of

To provide standard inlays.

EP 0 826 190 B1 describes the basic structure of a contactless chip card, in which a chip module with a loop antenna is placed in a winding window of a booster antenna.

The document US 2014/0263663 A1 discloses a chip card module arrangement in which a recess is formed in a carrier, into which a chip card module is inserted. In this case, a chip card antenna is contactlessly coupled to the chip card module.

US 2014/004220 A1 describes a method for producing a chip card, in which a card cavity is provided in a card insert blank into which a chip card module can be inserted. In this case, antennas of the chip card module can be inductively coupled to an amplifier antenna coil of the card insert blank.

The document US 2015/0053772 A1 discloses a chip arrangement with a first and a second chip and a booster antenna. The chips have integrated antennas for communicating with an external reader and / or writer, the booster antenna being coupled to the chip-side antennas. In US 2012/024272 A1, a solution is described in which in a

Substrate a cavity is formed, in which a microcircuit is used. This insertion can be done for example by means of a "pick and place" tool.

In all these solutions, either a window for receiving the chip module has to be punched into the substrate, or else a window has to be punched in a relatively complex manner

Well are introduced, in which the chip module can be inserted. Both procedures require a considerable procedural effort.

Another disadvantage of those known methods in which the chip is attached by gluing, is that these methods provide to save the adhesive film in the region of the chip or this holding the chip module Globe Top in a complex manner.

In contrast, the invention has for its object to provide a method and a manufacturing plant, by which the production of a film substrate over the conventional solutions with increased reliability is simplified.

This object is achieved in terms of the method by the combination of features of claim 1 or by a method with the combination of features of claim 5 and in terms of the production line through the

Feature combination of the independent claim 12 solved.

Advantageous developments of the invention are the subject of the dependent claims.

The method according to the invention is used to produce a transponder film substrate that has a multiplicity of chip modules with a loop antenna (see, for example, FIGS. 5, 6, reference numeral 68) or a "bare" chip, in which the loop antenna is inserted into the silicon chip Structure (see Figure 6, reference numeral 21) is integrated, wherein the loop antenna is placed in each case in a winding window of a booster antenna and inductively coupled. The chip modules with loop antenna and / or the chip with integrated loop antenna are also called electronic data carriers. The patent describes in each case two processes which process two different data carriers. Once the chip module with loop antenna and the second a "bare" chip in which the loop antenna is integrated in one of the layers of the chip structure.

In both cases of the processing of the electronic data carrier they are placed according to an embodiment in a certain position within a booster antenna. Depending on the application and resonance behavior of the chip (chip design), a specific antenna design with a suitable quality and quality of the booster antenna is required. Both types of electronic media mentioned above have a loop antenna. The booster antenna geometry has a defined

Winding window in which the electronic data carriers must be used exactly. The various geometries of the booster antennas, or different production methods of booster antennas (wire laid, wound, etched, printed, stamped, etc.) will not be discussed here.

In an alternative solution, the booster antenna is placed on one side of the substrate, while the chip module is placed with the loop antenna

is positioned opposite to the back of the substrate. D. h., In such a solution, the chip module with the loop antenna is not in one

Winding window of the booster antenna positioned but the Anntennenbereiche lie on opposite sides of the substrate and overlap each other. Such a solution has the advantage that the induction is improved over the former solution.

If a transponder inlay with booster antenna and chip module with loop antenna or with a "chip and integrated loop antenna in an electronic field (eg a reader in passport controls, or door openers, etc.), a" mini "

Induction voltage generated. With this mini energy, the chip is now supplied with energy via inductive coupling (loop antenna / data carrier booster antenna). This energy is sufficient to bring the chip "to life" and thus the data of the chip can be sent via the booster antenna to a reader. In this context, it should be mentioned again that the prior art mentioned above relates to conventional chip modules in which a mechanical, physical connection of the chip module or the chips to the antenna is necessary. With the use of chip modules with inductive coupling or chips with integrated loop antenna, this mechanical / physical connection to the antenna is no longer necessary. Contacting, mostly

Thermocompression welding with a tungsten electrode or even a soldering process is completely eliminated. These contacting processes, such as thermo-compression welding and soldering, are still a very critical process in transponder manufacturing today.

The invention is concerned with the simplification of the production of a

Transponder film substrates, wherein an inductive coupling of data carrier and booster antennas takes place. As described, the invention eliminates the

mechanical / physical connection of the data carrier to the antenna. Another major cost savings is the processing of chips with integrated loop antennas layer, because then the module and leadframe costs can be saved in addition. Furthermore, an embodiment is described in which only one film substrate is necessary to fix the data carrier. Due to a special cavity molding to make room for the disk, does not have to be punched.

For the processing of chip modules with loop antennas, the

Chip modules in leadframe form provided. Typically in standardized 35mm tapes with a likewise standardized perforation. Blanke, or "bare" chips with integrated loop antennas in the chip structure are isolated in wafer format and fed to the film substrate.

The inventor reserves the right to direct his own patent application to this processing of "bare" chips with integrated loop antenna in wafer form.

A first method step for processing the chip modules is the processing of the tapes. In a manner known per se is on the chip module leadframe heat-activated adhesive film applied. The heat-activatable adhesive film is located on a silicone-like tape, the so-called release tape. The document EP 2 588 998 B1 describes a processing of the chip module tape in which the adhesive film is applied to the back of the tape, ie on the

opposite side where the chip is located. In the present

Patent application and the inventive method is a

heat-activated adhesive film applied to the chip side of the chip module. The, preferably full-surface, applying the heat-activatable adhesive film on the

Chip side can also be made the subject of an independent patent application.

In one variant of the invention, prior to bonding, the adhesive / adhesive film used in each case can be pre-activated by ultrasound, pressure and / or heat. This pre-activation is preferably carried out by means of pressure and short-term direct

Temperature exposure.

After bonding, a cover sheet can be applied to the film substrate. According to the invention, this cover sheet can be fixed by applying temperature or by ultrasound. The cover sheet serves primarily as a protective layer for the booster antenna, wherein winding jumps of the booster antenna are covered. The fixing points of the cover sheet are designed so that the transponder sheet for the next manufacturing step is easy to handle.

Alternatively, the winding jumps of the booster antenna can also be sunk into the substrate so that these winding jumps and the entire booster antenna are planar to the substrate surface. This sinking / embedding the

Windungssprünge can be done for example via a heated pressing tool or a suitable ultrasonic tool or otherwise.

Applicant reserves the right to make independent independent claims as to the arrangement of the booster antenna and the loop antenna on opposite sides of the substrate. Furthermore, it is advantageous if the antennas, in particular the booster antenna, undergo a quality check before inserting the data carrier (chip modules). In this case, for example by means of a network analyzer the

Resonance frequency or the Q-factor or other specific parameters of the antenna are checked. In the event that one of these antennas is faulty, no data carriers are placed in the faulty critical antenna accordingly via a suitable control.

The leadframe tape preferably consists of three layers: the leadframe, the heat-activatable adhesive film and the release tape. This three-layer leadframe tape, for example, supplied to a manufacturing facility and punching the chip modules are isolated from the leadframe and supplied to the films substrates. Shortly before punching, the release tape is removed. The punch punched on the chip side of the chip module and a vacuum applied removal tool positioned the disk in the cavity of the film substrate.

The cavity molding is preferably carried out with a mold under vertical force. The molding tool shapes the cavity for the chip module so that the chip module is, for example, flush with the top edge of the film substrate. An ultrasonic tool or other partial softening tool that serves as an anvil briefly heats the material so that embossing of the material can be accomplished more gently. The document EP 2 074 560 B1 likewise describes a cavity molding by means of an ultrasonic punch. By the invention, however, the process is significantly simplified. The ultrasonic tool is preferably a standard tool with standard frequency tuning. The mold used in the invention can be customized without retuning the ultrasonic tool. The mold can also be made of a wear-resistant material, with ultrasound application only certain materials come into question. The manufacturing plant according to the invention, which is particularly suitable for carrying out the above-mentioned method, has a substrate feed, wherein the

Substrate is preferably supplied in a sheet or endless film form.

A first process step is, as described above, the introduction of the cavity by means of a cavity molding tool. The position of the cavity is located, for example, in the corresponding winding window of the booster antenna. The geometry of the booster and loop antennas creates an inductive coupling. The geometry of the winding window of the booster antenna can also have different angular positions, thus the cavities must also follow the angular position analogously. Consequently, the chip module must follow the angular position with a rotatable removal tool.

As explained, the chip module can then be inserted into the winding window of the booster antenna, so that the loop antenna and the booster antenna are arranged on the same side. In an alternative solution, it is provided to form the booster antenna on one side of the substrate, while the chip module with the loop antenna or the chip with integrated loop antenna is inserted opposite on the other side of the substrate. The cavity can then overlap with the booster antenna.

As already described, the chip module can be punched out at the production plant. By means of vacuum, the chip module is removed, for example, from the punching tool and pressed directly into the cavity. The heat-activatable adhesive film is located on the chip module side. By means of an ultrasonic tool, on the opposite side of the cavity, the heat-activatable adhesive film

activated for a short time. The activation of the adhesive film is sufficient to fix the chip module so that it can not slip for the short onward transport of the substrate. Alternatively, an adhesive film may be used that can be otherwise activated, e.g. B. with pressure and UV light or microwaves, etc.

The film substrate with the chip module fixed in the cavity is preferably transported to a curing station. Hot stamp with a defined temperature, Pressure and time then activate the heat-activated adhesive film. In a subsequent step, the chip module is pressed again with cooled pressure punches.

Each process step can be controlled by a functional check of the transponder. At the end of production, depending on the customer requirement, a cover film or a cover sheet could be applied. Among other things, this cover sheet is used to cover winding jumps of the booster antenna.

In an alternative solution, these winding jumps of the booster antenna can also be sunk in a suitable manner in the substrate. This sinking, for example, by means of a heated press ram or by means of a

Ultrasonic tool done.

This cover sheet or cover sheet can then be fixed in a suitable manner on the core film or the substrate. The fixing can be done for example by means of a heating pin or an ultrasonic tool.

Finally, for example, a final functional check is performed and, if necessary, bad parts are marked.

The transponder film substrate, also called transponder inlay, is now ready for further processing into the final transponder product.

Similar to the chip module processing, the processing is carried out by a "bare" chip with integrated loop antenna. Only, before the chip is inserted into the cavity, an adhesive is dosed into the cavity. Then the chip is inserted. In turn, to activate an adhesive, various possibilities may be considered. Temperature, pressure, UV light, microwaves, etc.

According to one aspect of the invention, a leadframe carrier is provided with such a chip module. Furthermore, in a conventional manner a Substrate provided with a plurality of booster antennas, said substrate is partially transformed according to the invention, so that a cavity for receiving a chip module is formed. Such a cavity is provided in each case in the region of a booster antenna.

In a subsequent process step, a chip module from

Leadframe carrier separated and inserted into the cavity. In another

Process step then takes place the bonding of the chip module in the cavity.

The inventive method is characterized by the fact that the use of the above-mentioned chip modules no mechanical connection between the chip module and the booster antenna must be made because the signal transmission from the built-in chip small antenna (loop antenna) on the booster Antenna takes place by means of radio technology or the like. Another advantage is that no window has to be punched out in the substrate, since a cavity for the chip module is produced only by partial forming / embossing.

In an alternative solution, the process is further simplified by also dispensing with the leadframe carrier and the "bare" chip is inserted directly into the cavity. Otherwise, this variant corresponds to the above

Embodiment, so that further explanations are unnecessary.

The production plant according to the invention, which is particularly suitable for carrying out the abovementioned processes, has a substrate feed, wherein the substrate is preferably fed in sheet or foil form. Furthermore, one is

Feeding, in particular for the supply of a chip module or a

above-described "bare" chips with integrated loop antenna and optionally a separating station for separating a chip module provided by the leadframe. To form the cavity on the substrate, a forming device is provided, wherein the chip module can be inserted into the cavity by means of a pick-and-place station. The manufacturing plant further has an activation device for

Pre-activating, activating / curing an adhesive that fixes the chip module or the "bare" chip in the cavity.

This adhesive can be applied for example as an adhesive layer or adhesive film on the leadframe. When processing a "bare" chip, it is preferred to introduce the adhesive directly into the cavity. This adhesive can be metered in liquid or else introduced as an adhesive layer in the cavity.

As explained above, in a variant of the invention, the leadframe can be provided on the chip side with an adhesive layer. For ease of fabrication, it is preferred that the adhesive layer be made with a cover layer which is peeled off prior to singulation / separation.

As explained, alternatively, the adhesive can be introduced directly into the cavity.

The activation or curing of the adhesive or of the adhesive layer takes place, for example, by the action of heat or ultrasound and subsequent cooling.

The forming to form the cavity is carried out according to the invention by means of an ultrasonic tool and a mold, wherein the mold preferably on the chip side and the ultrasonic tool preferably act on the side facing away from the chip side of the substrate.

Depending on the requirements, after bonding the chip module to the

Foliensubstrat a cover layer are applied so that winding jumps are covered.

Alternatively, the winding jumps can also be sunk into the substrate.

As mentioned, the individual layers are preferably processed film or sheet or ribbon. The above-described molding tool is preferably designed such that it approximately corresponds to the contour of the chip module, so that it is reliably fixed in position in the cavity.

In order to improve the manufacturing quality, the production plant can still be designed with one or more test stations for functional testing of the processed chip modules. This test station can be, for example, a reading device for testing the respective chip module. Alternatively, the transponder test station can be designed such that an operating system or a Java applet can be loaded contactlessly onto a flash memory of the chip module by means of transponder technology.

In principle, the chip module or the chip with integrated loop antenna (at the module or layer level) can also be operated with etched, printed, stamped or otherwise produced antenna types. The patent applicant reserves the right to apply this principle to its own independent claim.

Preferred embodiments of the invention are explained in more detail below with reference to schematic drawings. Show it:

Figure 1 shows the basic structure of a first embodiment of a

Manufacturing plant for producing a film substrate;

FIG. 2 shows a lead frame feeder of the production plant according to FIG. 1;

FIG. 3 shows an ultrasonic tool and a forming tool of the production plant according to FIG. 1;

Figure 4 shows another embodiment of an inventive

Manufacturing plant in which an adhesive is metered directly into a cavity of the substrate; FIG. 5 shows a foil substrate which can be produced with the production plant according to FIG. 4;

FIG. 6 shows a variant of the embodiment according to FIG. 5;

FIG. 7 shows a diagram to illustrate the differences in the processing of a chip module or a chip with integrated loop antenna;

FIG. 8 shows a part of a further embodiment of a production plant for processing "bare" chip modules;

FIG. 9 shows a film substrate which is processed with a production plant according to FIG. 7;

FIG. 10 shows an individual representation of a chip module;

FIG. 11 shows a sheet with such chip modules;

Figures 12a, 12b, 12c views of an intermediate in carrying out the method according to the invention;

Figures 13a, 13b, a pressing tool for sinking winding jumps;

Figure 14 shows a variant of the embodiment according to Figures 13a, 13b and

Figure 15 is a pressing device with pressing tools according to the figures 13 or 14 in series production.

FIG. 1 shows a schematic diagram of a first exemplary embodiment of a production plant 1 for producing a film substrate, as used in the production of transponder layers. As mentioned, the production takes place in sheet or in endless format - in the illustrated embodiment is an endless format with a Width of for example 650 mm used. In that shown in Figure 1

Embodiment are to be processed chip modules, which are designed as contactless Inductive- Coupling chip modules (chip modules with integrated loop antenna), arranged on a Leadframetape 2, which is fed via a leadframe feed 4 as a band-shaped material. The production plant 1 further has a feed, not shown, for a core film, referred to below as the substrate 6.

FIG. 2 shows one of the leadframe preparation station 10 upstream of the production plant 1 shown in FIG. 1, in which the leadframe tape 2 is prepared. It is assumed that the Leadframetape 2 as a band material on a

Lead frame memory 12 is wound, wherein already said chip modules are integrated. Details of this leadframe technique are explained, for example, in the initially mentioned EP 2 588 998 B1.

According to FIG. 2, this leadframe tape 2 is provided with a heat-activated adhesive layer (HAF) also provided as a roll or strip material. This laminating takes place for example by means of a heating plate 16, against which the layer structure with the lead frame tape 2 and the adhesive layer 14 is pressed by means of silicone pressure rollers 18, so that a partial softening and

Bonding / laminating of the layers takes place.

As shown in Figure 2 below, this layer structure according to the

Lamination in principle from the lead frame tape 2, which carries the chip modules 20, which in turn are covered by the adhesive layer 14 with the cover tape 24. This masking tape 24 is arranged to the outside, so that the entire adhesive layer is covered. The cover tape 24 may be a silicone tape.

This multilayer laminate (Leadframetape 2 with adhesive layer 14 and

Masking tape 24) is then fed to a storage roll 22 or directly to the leadframe feeder 4. As shown in Figure 1, the cover tape (release tape) 24 before the

Separation of the chip modules 20 withdrawn from the adhesive layer 14 and rolled onto a roll 26 and disposed of or recycled.

The supply of the substrate 6 may be formed, for example, as a roll feed device, over which the core material provided as a roll material (substrate) unwound and along unillustrated guides the other

Processing stations can be supplied. As mentioned, the core film can also be supplied as sheet material via a suitable feed.

In a processing step, not shown, a number of specified booster antennas 8 are applied to the substrate 6 by means of an antenna laying unit in wire laying technology. These are welded into the substrate 6 in a conventional manner. The substrate 6 may consist of a conventional thermoplastic, for example polycarbonate, PVC or of a synthetic paper. The laying and welding of the antenna wire is carried out in a conventional manner via an ultrasonic converter and a laying tool.

In the region of winding windows of the booster antenna 8 arranged on the substrate 6, in each case a cavity is formed by means of a shaping device / embossing device 28, the contour of which is formed on the outer contour of the surface to be processed

Chip module 20 is adapted.

The basic structure of this forming device 28 is shown in FIG. This shows an enlarged view of the substrate 6, on which a plurality of booster antennas 8 is arranged. The forming device 28 now forms in a region which is encompassed by the booster antenna 8, the above-described cavity. According to an embodiment of the invention, the forming device 28 has a stamping or molding tool 30 whose contour corresponds to that of the cavity to be formed. The shaping device 28 further has an ultrasonic tool 32, the sonotrode 34 of which is shown in FIG. From this representation, it is apparent that the sonotrode 34 is designed with a flat active surface 36, over which the area of the substrate 6 acted upon by the ultrasound is softened, so that over the Mold 30, the cavity can be formed. In Figure 3, the profile 38 of the mold 30 is shown. The end face of this profile 38 corresponds to the base of the cavity to be formed.

The mold 30 and the ultrasonic tool 32 are guided movably in the X and Y directions simultaneously. In this case, the molding tool 30 is driven in the vertical direction (Z) via an axis system. The ultrasonic tool 32 is fixed in the vertical (Z) below the substrate 6, but movable in the X and Y directions. In this case, the mold 30 presses on the substrate 6 with an adjustable or controllable force. When the ultrasound tool 32 is switched on, heat is produced by which the substrate material is softened so that the shaping of the cavity for the material is stress-free. The embossing of the cavity can be further simplified when the mold 30 is heated. The depth of the cavity is designed so that the chip module 20 can be inserted flush into the cavity. In principle, however, it is also possible to use the chip module with a certain supernatant, this supernatant is then covered accordingly over another layer.

After detachment and winding of the cover strip 24, the chip modules 20 are separated in a separating station 40 from the leadframe tape 2. At the

illustrated embodiment, the separating station 40 is designed as a punching device.

In a further method step, the quality of the booster antennas 8 is checked. This check can be done for example by means of a network analyzer. The specified tolerances of the booster antennas 8 can be freely programmed. If the tolerances are at the limit, a warning appears and no electronic data carriers are placed in the respective faulty, critical antennas.

The singulated chip modules 20 with the leadframe tape 2 formed by the internal loop antenna are then by means of a pick-and-place unit 42nd

taken over and used in the prefabricated cavities. This placement takes place with the help of an optical monitoring system (vision system) 44. It sucks the pick-and-place unit 42, the punched chip modules 20 by means of vacuum directly from the punch of the separation station 40, wherein, for example, four chip modules 20 can be transported and placed simultaneously.

In one embodiment of the invention, the pick-and-place unit 42 has a rotation design in order to be able to deposit the chip modules 20 into the cavities of the substrate 6 at a freely selectable angle of attack. Such a rotation of the

Chip modules 20 is advantageous because it improves the bending and torsional compatibility of the electronic component provided with the substrate film.

The adhesive layer 14 formed, for example, as a HAF film is then activated by means of an activation device 48. This is the concrete solution

Activation device 48 is also designed as an ultrasonic tool, which is movably guided in the X and Y directions, so that all cavities can be approached after each other in order to activate the adhesive layer 14 - the chip module 20 is then respectively positively and non-positively secured in the cavity.

In a test station 50, the function of the respective chip modules 20 is then checked. This test station 50 can be embodied, for example, as a transponder reader, via which the chip function can be checked after each process step.

After this test, in the illustrated embodiment, a further activation of the adhesive by means of Heizstempeln 52. About this, the adhesive with a defined temperature and pressing force is applied over the entire surface, so that it reaches the activation temperature. The bond is then in another

Step act on cooling pad 54, which cool the structure, so that the adhesive hardens and reaches its final strength. This process is known per se from smart card manufacturing.

Depending on the customer request, a cover sheet 56 can then be applied to the substrate film following the curing of the adhesive. The connection of this cover sheet 56 with the substrate film 6 is then carried out by means of a fuser 58, which may for example also be designed as a heated ultrasonic unit. The Fuser 58 is preferably designed to be movable in the X, Y and Z directions, so that the cover sheet 56, which is attached according to customer requirements, is selectively welded to the core film (substrate 6).

One task of the cover sheet 56 is to cover the winding jumps of the booster antenna 8 explained in more detail below. The fixing points are to be selected so that the subsequent production steps are not hindered.

As will be explained in more detail below, these winding jumps can also be sunk into the substrate 6 via a suitable tool. In this case, it may be possible to dispense with the cover sheet 56.

According to the illustration in FIG. 1, the production plant 1 according to the invention in the exemplary embodiment shown is additionally provided with one

Marking device 60 is provided, via which a bad part marking.

This marking device may be, for example, an inkjet printer or the like.

The film substrate 6 provided in this way with the chip modules 20 is then sent for further processing.

As stated above, a test station 50 can be provided after each process step, so that a continuous process control is ensured. In this case, the UID is also stored in a database prior to stamping, and the respective determined via the test station 50 accordingly

Process parameters assigned.

In a final test by means of another testing station 50, not shown, the function is then checked again. Depending on how the further processing is to be carried out, the strip material can be cut into sheets and stacked at the end. FIG. 4 shows a variant of the exemplary embodiment explained in FIG. A difference between the two manufacturing plants 1 is that when

Embodiment according to Figure 4, a standard lead frame tape 2 without adhesive layer 14 is used. The adhesive required for fixing the position of the chip module 20 is then introduced via an adhesive metering device 62 directly into the previously formed cavities.

In the case where "bare" chips 21 are processed, the chip module feed may be replaced by a wafer unit. It will, however

be necessary to adjust according to the cavity and thus the forming device and the mold and also the pick-and-place unit and the heating punch and the cold stamp accordingly.

Figure 5 shows a partial view of the substrate (film substrate) 6, on which the booster antenna 8 is arranged. About the above-described forming device 28, the cavity 64 was formed in the substrate 6. As explained, adhesive 66 is then metered via the adhesive metering device 62. As can be seen from the illustration according to FIG. 5, the cavity 64 is preferably centered with respect to

Amplifier windings (Windungsfenster) of the booster antenna 8 is arranged.

After dosing the adhesive 66, the chip module 20 is then placed in the cavity 64 and on the adhesive 66 by means of the pick-and-place unit 42 and activated in the manner described above, so that the chip module 20 is fixed in position. 5 shows the integrated into the chip module 20 loop antenna 68. The further processing is analogous to Figure 1, so that more

Explanations are dispensable.

FIG. 6 shows a further variant of the production method according to the invention or a production plant according to the invention. In this embodiment, no dosage of an adhesive 66, but it is about a suitable

Feeding an adhesive film, such as a HAF blank 70 inserted into the cavity 64 to pre-fix the chip module 20. It then takes place again an adhesive activation in the manner described above by means of temperature, time and pressure.

In principle, the activation, in particular in the case of metering of an adhesive 66 according to FIG. 5, can also be effected by means of UV radiation, which from below, i. from the side facing away from the chip module 20 side of the substrate 6 applied.

In the embodiments described above, the chip modules 20 are each arranged on a leadframe tape 2. An embodiment is explained with reference to FIGS. 8 and 9, in which the "naked" chips 21 explained in the introduction, i. not provided with a Leadframetape 2 Chips21, are processed.

The difference between an Inductive Coupling Contactless chip module and a "bare" chip 21 will be clarified again with reference to FIG. There, the chip module 20 is shown overhead. This carries the actual chip, which is connected via conductor tracks (directly bonded) to the loop antenna 68. This chip module 20 is then inserted into the said winding window 72 of the booster antenna 8 of the transponder inlay, previously in this area in the

a cavity has been introduced as described above.

Figure 7 shows the said "bare" chip 21 latest design. In these chips 21, the loop antenna is integrated into one of the silicon layers of the chip 21, so that practically the chip module with the bonded loop antenna can be dispensed with and the chip 21 requires a much smaller area than the chip module 20. This "bare" chip 21 is then in turn inserted into the winding window (72) of the booster antenna 8, and according to the small dimensions of the chip 21 also less space for the winding window 72 is needed. The

Processing of such chips 21 is very advantageous, since in such a solution, the module costs would be eliminated and also the processing is much easier. Another advantage is that the "bare" chips 21 are provided in wafer format. In addition, these chips 21 are almost invisible in the substrate and thus take a back seat. FIG. 8 shows five main steps of such a production. FIG. 8 shows the substrate 6 with the booster antenna 8 laid thereon. As in the embodiments described above, the cavity 64 for receiving the bare chip 21 is first formed via the forming device 28 with the forming tool 30 and the ultrasonic tool 32. In a next production step, adhesive is then metered into this cavity 64 by means of an adhesive metering device 62 and a bare chip 21 is inserted into the cavity 64 by means of the pick-and-place unit 42. In a subsequent step, the adhesive is then first applied via a heating die 52 during a predetermined period of time with pressure and temperature, so that the adhesive is activated. The bond is then cooled by means of the cooling stamp 54, so that the adhesive cures accordingly.

After this bonding, the "naked" chip 21 with the integrated loop antenna is fixed in position in the cavity 64 and positioned relative to the booster antenna 8 of the substrate 6 such that an inductive signal transmission from the loop layer integrated in the chip layer. Antenna to the booster antenna 8 is enabled.

The big advantage of the above described methods is the simplicity of the

Process, wherein the resulting transponder inlay (substrate film) can be formed extremely thin with a thickness of less than 200 pm.

It is particularly advantageous if the antenna is laid on a thermoplastic substrate / inlay. This has the advantage over an antenna formed by etching on PET that there is no "foreign body" in the complete structure.

Furthermore, the processing of such PET substrates is problematic, since usually cards for banking, transport, elD products made of PVC or PC exist and also synthetic paper (Teslin) is included and these materials difficult with PET by lamination or gluing to be processed. In the embodiments described above, the loop antenna 68 is inserted into a winding window 72 of the booster antenna 8. Accordingly, these two antennas are arranged on the same side of the substrate 6.

In the following, a variant is described in which the booster antenna 8 and the loop antenna 68 are arranged on opposite sides of the substrate 6, wherein the windings of the antennas overlap each other at least in sections, so that the induction is improved compared to the solution described above.

FIG. 10 again shows an individual representation of a device according to the invention

Chip module 20, in which approximately the center of the actual chip 74 is arranged, which is contacted with the loop antenna 68. Whose turns are wrapped around the chip 74, wherein in the illustrated embodiment, approximately rectangular windings are provided, of course, also a different geometry can be formed.

FIG. 11 shows a leadframe tape 2 on which a multiplicity of chip modules 20 are arranged. As explained above, this Leadframetape 2 is on a

Lead frame memory 12 wound, then during processing the

Chip modules 20 are punched out.

Figures 12a, 12b, 12c show an intermediate product which is used in the

inventive production is incurred. FIG. 12a shows the punched-out, transparently illustrated substrate 6 on whose large area visible in FIG. 12a the booster antenna 8 has been laid.

FIG. 12b shows the corner region of the substrate 6 lying at the top right in FIG. 12a, in which the actual booster antenna 8 with the above-described

Winding window 72 is formed. In this corner region, the booster antenna 8 is formed with a plurality of turns extending from outside to inside. The end portion of the antenna wire is then placed over the previously laid turns out of the center of the booster antenna 8, so that there is a winding jump 76 in this area, which projects slightly upwards to the viewer and thus represents a potential hazard, since in the further production or in the use of this uneven area can lead to snagging or the like. A corresponding winding jump 78 arises in the area of the other

Antennendrahtendes, which extends out of the frame formed only by a few large windings, which surrounds the actual booster antenna 8.

FIG. 12c shows the rear side of the substrate 6, which is shown as transparent, so that the above-described winding jump 76 is visible. In the representation according to FIG. 12c, the rear side of the chip module 20 is visible, on which the loop antenna 68 visible in FIG. 12b is formed, which is thus arranged on this rear side of the substrate 6. The turns of the loop antenna 68 overlap in sections with the turns of the booster antenna 8 - while it can

actual Windungsfenster 72 can be minimized because no space for the chip module must remain. D. h., In addition to the advantage of improved induction, the variant according to Figures 11 and 12 are also made more compact, since the loop antenna 68 and booster antenna 8 are arranged opposite to each other and are spaced apart only by the substrate film. As mentioned above, in the substrate film 6, the cavity 64 is formed, in which the chip module 20 is inserted flush.

As previously explained, the cover sheet 56 serves as previously described

Embodiment also to cover the winding jumps 76, 78.

In principle, however, it is also possible to dispense with this cover sheet 56 and to embed / embed the winding jumps 76, 78 into the substrate 6 by suitable mechanical loading.

FIG. 13a shows a possibility of sinking these turns 30, 76 into the substrate 6 so that they no longer project out of the substrate surface. In the exemplary embodiment according to FIG. 13 a, a pressing tool 80 for pressing in the winding jumps 76, 78 into the substrate 6 is used. The latter is doing with the

Booster antenna 8 and formed thereon Windungssprüngen 76, 78 upwards (view of Figure 13a) pointing to a heated pad 82 placed. The Press tool 80 has a likewise heated press plate 84, which is held on an extendable in the direction of the support 82 press head 86. By the

Lowering the heated press plate 84 on the likewise heated support 82 and applying a suitable pressing pressure then the two winding jumps 76, 78 are pressed into the substrate 6, so that the end portions of

Antenna wire no longer protrude.

FIG. 13b shows an enlarged view of the pressing tool 80 according to FIG. 13a. It can be seen clearly in this illustration, the press plate 84 indicative booster antenna 8 and the two Windungssprünge 76, 78, which are then pressed on further lowering of the press plate 84 in the substrate 6, said substrate 6 rests on the support 82.

FIG. 14 shows a variant in which the substrate 6 with the booster antenna points to the support 82. The booster antenna 8 then rests on this heated support 82 and the chip module 20 points towards the press plate 84. The two winding jumps 76, 78 are also in this relative position on the support 82, so that when lowering the press plate 34 by the pressure and temperature influence the

Windungssprünge 76, 78 are also pressed into the substrate material.

Finally, FIG. 15 shows one that can be used in series production

Pressing device 88 for pressing the winding jumps 76, 78. This

Pressing device 88 has a plurality of pressing tools 80a to 80i, which are held on a gantry 90 and whose pressing plates 84 (only the pressing plate 84i is provided with a reference numeral) are lowerable towards a substrate sheet on which a plurality of booster antennas are laid. The winding jumps 76, 78 of these booster antennas 8 are then pressed into the substrate by lowering the pressing tools 80a to 80i simultaneously. The processing of the substrate / the transponder layer before or after this pressing device then takes place in the

above-described manner, wherein - as explained - can be dispensed with the application of a cover sheet. Of course, instead of the pressing tool, another suitable tool such as an ultrasonic tool or the like can be used to embed the winding jumps 76, 78 in the substrate sheet. Disclosed are a method and a production plant for producing a transponder film substrate, wherein a chip module with loop antenna or a "naked" chip with integrated loop antenna is inserted into a booster antenna substrate. The transponder film substrate preferably consists only of a layer with a shaped cavity for receiving the chip module or the "bare" chip.

LIST OF REFERENCES:

1 production plant

2 lead frame tape with chip modules

4 leadframe feeder

6 substrate

8 booster antenna

10 lead frame preparation station

12 lead frame memory

14 adhesive layer (HAF)

16 heating plate

18 contact rollers

20 chip module

21 "naked" chip with integrated loop antenna

22 storage roll

24 masking tape

26 roll

28 forming device

30 mold

32 ultrasonic tool

34 sonotrode

36 active area

38 profile

40 separation station

42 pick-and-place unit

44 vision system

48 activation device

50 test station

52 hot stamp

54 cooling stamp

56 cover sheet

58 fuser Marking device adhesive metering device cavity

Glue

Loop antenna

Blank / Glue Winding window chip

Winding jump Windungssprung pressing tool

edition

Press plate

press head

Pressing device portal

Claims

claims

1. A method for producing a according to the inductive coupling principle

operating transponder film substrate which carries at least one chip module (20) with loop antenna (68) which is used in the region of a winding window (72) of a booster antenna (8) and with the steps:

Providing a leadframe tape (2) with the chip module (20),

- Providing a substrate (6) with at least one booster antenna (8) and partial deformation of the substrate (6) such that a cavity (64) for

Receiving the chip module (20) is formed, wherein the partial forming preferably by means of a tool, preferably a

Ultrasound tool (32) and / or a mold (30), wherein the mold (30) on the chip side and the tool, preferably the

Ultrasonic tool (32) act on the substrate (6) from the side remote from the chip module (20),

Separating the chip module (20) from the leadframe tape (2),

- Inserting the chip module (20) in the cavity (64) and

- Gluing the chip module (20) in the cavity (64).

2. The method according to claim 1, wherein the lead frame tape (2) on the chip side with a, preferably full-surface applied, adhesive layer (14) or an adhesive film is provided.

3. The method according to claim 2, wherein the adhesive layer (14) has a cover strip (24), which is withdrawn before a separation / separation of the chip module (20).

4. The method according to any one of the preceding claims, wherein an adhesive (66) or the adhesive layer (14) are pre-activated by heat and / or pressure and / or activated and / or cured.

5. A method for producing a according to the inductive coupling principle

working transponder film substrate carrying at least one "bare" chip (21) with built-in chip structure loop antenna, preferably in Wafer format is provided and in the region of a winding window (72) of a booster antenna (8) is used, with the steps:

Providing the chip (21) with integrated loop antenna, preferably from a wafer,

Providing a substrate (6) with at least one booster antenna (8) and partially reshaping the substrate (6) in such a way that a cavity (64) for receiving the chip (21) is formed, wherein the partial forming by means of a tool, preferably an ultrasonic tool (32) and / or a molding tool (30), wherein the mold (30) on the chip side and the tool, preferably the ultrasonic tool (32) act on the substrate (6) from the side remote from the chip module (20),

- Inserting the chip (21) in the cavity (64), preferably after preactivation of an adhesive by means of ultrasound or heat, and

- Gluing the chip (21) in the cavity (64).

6. The method according to claim 5, wherein an adhesive (66) in the cavity (64)

is introduced.

7. The method according to any one of the preceding claims, wherein after bonding a cover sheet (56) applied to the film substrate (6) and, preferably by means of temperature or ultrasound applied, is fixed.

8. The method according to any one of the claims 1 to 6, wherein winding jumps of the booster antenna (8) are sunk into the substrate (6).

9. The method according to any one of the preceding claims, wherein before the

Inserting the chip (21) with integrated loop antenna or the chip module (20) into the cavity (64) a quality control of the booster antenna (8) is performed.

10. The method according to any one of the preceding claims, wherein the chip (21) with integrated loop antenna or the chip module (20) with etched, printed, stamped or otherwise manufactured antenna types operable.

11. The method according to any one of the preceding claims, wherein the

Winding window (72) of the booster antenna (8) on one side of the substrate (6) and the chip module (20) with the loop antenna (68) or the chip (21) with integrated loop antenna opposite on the other side of the substrate (6) is arranged.

12. Production plant, in particular for carrying out the method according to one of the preceding claims, with a substrate feeder, a chip feeder, in particular a leadframe feeder (4) for supplying a chip module (20) or a chip (21) with an integrated loop Antenna, optionally a separating station (40) for separating a chip module (20) from

Leadframe (2), a forming device (28) for forming a cavity (64) in the substrate (6), wherein the forming device (28) has a molding tool (30) and an ultrasonic tool (32), a pick-and-place Unit (42) for placing the chip module (20) or the chip (21) in the cavity (64) and a

Activation device (48) for activating / curing an adhesive (66) via which the chip module (20) or the chip (21) in the cavity (64) is to be fixed in position.

13. A production line according to claim 12, wherein the molding tool (30) is adapted to the contour of the chip module (20) or chip (21).

14. Production system according to claim 12 or 13, with a test station (50) for functional testing of the chip module (20) or chips (21), wherein the test station (50) is preferably a reader or is designed, an operating system or a Java applet a memory, preferably a flash memory of the

Chip module contactless to load