DE102016217044B4 - Process for processing a substrate with a punch - Google Patents

Abstract

The invention relates to a method for processing a substrate (100) with a punch, the substrate (100) extending at least partially in a plane (206), the method comprising: - punching out an opening (208) in which the Plane (206) extending part of the substrate (100) through the punch, the punch (204) being in a first punching position when punching out in the direction of the plane (206), - After punching out, carrying out a relative movement of the punch (204 ) and substrate (100) in a direction parallel to the plane (206), with the punch (204) coming to rest over a desired filling material (202) in a second punching position due to the relative movement in the direction of the plane (206), In the second punching position, a filling element (102) is punched out of the desired filling material (202) by the punch, with the filling element (102) remaining in the punch (204), - a relative movement of the punch (204) and substrate (100 ) in a direction parallel to the plane (206), the punch (204) coming to rest over the opening (208) of the substrate (100) in the first punching position due to the relative movement in the direction of the plane (206),- insertion of the filling element (102) remaining in the punch (204) through the punch (204) into the opening (208) of the substrate (100).

Description

The invention relates to a method for processing a substrate with a punch.

Documents such as value or security documents are usually made up of one or more substrate layers. The selection of the materials used here and the special structure, in particular of multi-layer documents, is often made in such a way that subsequent copying or falsification of the document is made considerably more difficult. One way of increasing the counterfeit security of a document is that individual or multiple substrate layers are not made of the same material over the entire area, but that different materials are used at least in sections. For example, it is possible for a document to have a transparent window.

The DE 10 2014 000 133 B4 discloses a method for processing a flat, at least single-layer substrate, in that the substrate is guided through a processing tool together with a film material on different levels and a punch produces an opening at a predetermined point in the substrate. The punch is then moved to an area outside the opening and in a further stroke of a filling material, an element corresponding to the cross-section of the opening is punched out by the punch, then moved by the punch in the direction of the opening of the fixed substrate and the element through the punch inserted into the opening of the substrate.

The DE 10 2008 018 491 B3 discloses a method for implanting a chip module in a chip card body, the chip module being fed on a module belt and punched out of it by means of a punch, inserted into a cavity of the chip card body and permanently fixed there. The module tape is passed between the punch and the chip card body, and the chip module is inserted into the cavity of the chip card body by means of the punch. In addition, the invention relates to a corresponding device, the punch being set up both for punching out the chip module from the module strip and for implanting the chip module in the cavity of the chip card body.

The DE 12 49 066 A discloses a device for punching holes, tongues or the like in a running material web, in particular paper web, in which a punching blade and an anvil plate located opposite it on the other side of the material web are used at time intervals dependent on the distance between the punches and the running speed of the material web to carry out the Section are mutually movable. The anvil plate, which can be adjusted to the material web, is flexibly suspended above the material web on a spring member opposite the punching blade connected to a lifting drive and interacts with an electrical voice coil that imparts small amplitude and high frequency oscillating movements perpendicular to the material web.

The object of the invention is to provide a method for processing a substrate.

The object on which the invention is based is achieved by the features of independent patent claim 1 . Preferred embodiments of the method are specified in the dependent patent claims.

• - Ausstanzen einer Öffnung in dem sich in der Ebene erstreckenden Teil des Substrats durch den Stanzstempel, wobei sich der Stanzstempel beim Ausstanzen in der Richtung der Ebene gesehen in einer ersten Stanzposition befindet,
• - nachdem Ausstanzen Durchführung einer Relativbewegung von Stanzstempel und Substrat in Richtung parallel zu der Ebene, wobei aufgrund der Relativbewegung in Richtung der Ebene gesehen der Stanzstempel über einem gewünschten Füllmaterial in einer zweiten Stanzposition zu liegen kommt,
• - in der zweiten Stanzposition, Ausstanzen eines Füllelements aus dem gewünschten Füllmaterial durch den Stanzstempel, wobei das Füllelement in dem Stanzstempel verbleibt,
• - erneutes Durchführen einer Relativbewegung von Stanzstempel und Substrat in einer Richtung parallel zu der Ebene, wobei aufgrund der Relativbewegung in Richtung der Ebene gesehen der Stanzstempel über der Öffnung des Substrats in der ersten Stanzposition zu liegen kommt,
• - Einsetzen des in dem Stanzstempel verbliebenen Füllelements durch den Stanzstempel in die Öffnung des Substrats.

A method is described for processing a substrate with a punch, the substrate extending at least partially in one plane, the method comprising:

• - punching out an opening in the part of the substrate extending in the plane by the punch, the punch being in a first punching position when punching out, viewed in the direction of the plane,
• - After punching, a relative movement of the punch and substrate is carried out in a direction parallel to the plane, with the punch coming to lie over a desired filling material in a second punching position as a result of the relative movement in the direction of the plane,
• - in the second punching position, punching out a filling element from the desired filling material by the punch, the filling element remaining in the punch,
• - performing a relative movement of the punch and the substrate again in a direction parallel to the plane, with the punch coming to lie over the opening of the substrate in the first punching position due to the relative movement in the direction of the plane,
• - Insertion of the filling element remaining in the stamping die through the stamping die into the opening of the substrate.

A substrate is generally understood to be a single-layer layer made from one material or a multi-layer layer made from one or more materials, with paper, cardboard or plastic and metal foils being used as the material can. The substrate can generally be the carrier material of a valuable or security document or at least one layer of the carrier material of a valuable or security document. The carrier material can in turn be a card body, for example, if the value or security document is a card-shaped document.

A document is generally understood to be paper-based and/or plastic-based documents, such as ID documents, in particular passports, ID cards, visas, driver's licenses, vehicle registration documents, vehicle registration documents, company ID cards, health cards or other ID documents, as well as chip cards, means of payment, in particular Debit and credit cards, bills of lading or other proof of entitlement. Documents of value can also be banknotes in particular.

Embodiments of the invention could have the advantage that a filling element can be inserted into a substrate with high precision using a tool structure of the processing tool used to carry out the method which is mechanically simple and therefore less error-prone when used. The filling material used for this purpose can in turn have a single-layer or multi-layer structure and consist of different layers of material and can also be based on paper, cardboard, metal or plastic.

In contrast to the prior art mentioned above DE 10 2014 000 133 B4 according to the idea of the present invention, substrate and filling material are not arranged one above the other, but next to one another. This could eliminate the need for moving anvil strips, for example. A further advantage could be that the first and second punching positions can be selected flexibly parallel to the plane. So instead of, as in the prior art DE 10 2014 000 133 B4 described to process the substrate and filling material at exactly predefined points with the punch, the method described could make it possible to flexibly and even individually define the respective punching positions for each substrate and/or filling material.

According to one embodiment of the invention, the punching out of the opening results in a substrate element that corresponds to the cross section of the opening, the substrate element being removed from the punch before the filling element is punched out. For example, a ram could be used here, which pushes the substrate element located therein downward through the punch through the punch. When the substrate element is pressed out, the punch is preferably located above a corresponding container for receiving the substrate element that results as a waste product.

According to one embodiment of the invention, the punch is subjected to ultrasound when the opening is punched out and/or when the desired filling material is punched out. The application of ultrasound could bring about an ultrasound-induced softening of the material to be punched out, so that the force required by the punch for the actual punching out is reduced. Instead of punching out a hard material, a material that has been softened by the ultrasound is punched out due to the impact of the ultrasound. This in turn could mean that the performance requirements of the robot guiding the punch can be reduced with regard to the forces to be applied. This could, for example, enable the punch to be guided by a robot that does not have to have extreme requirements in terms of force and high precision. A relatively simple robot could therefore be used, the only main requirement of which is high precision, since the forces to be applied by the robot via the punch could be reduced due to the application of ultrasound.

• - Durchführung einer Hubbewegung des Stanzstempels senkrecht zu der Ebene, wobei aufgrund der Hubbewegung der Stanzstempel in der Öffnung des Substrats oder in einer Ebene unmittelbar oberhalb der Ebene des Substrats zu liegen kommt,
• - Bewegung des Füllelements in die Öffnung durch den Stößel.

According to one embodiment of the invention, the insertion of the filling element comprises:

• - Carrying out a lifting movement of the punch perpendicular to the plane, with the lifting movement of the punch coming to rest in the opening of the substrate or in a plane directly above the plane of the substrate,
• - Movement of the filling element into the opening by the ram.

According to an embodiment of the invention, the part of the substrate extending in the plane is supported by a stationary stop in the direction perpendicular to the plane. As already mentioned above, the use of movable anvil strips in particular can be dispensed with since it is not necessary to eject the substrate element at the first punching position due to the movability of the punch. For example, the substrate element is removed in a punching position of the punch that differs from the first and the second punching position.

The substrate element is therefore not removed as in the prior art DE 10 2014 000 133 B4 described through the opening produced in the substrate, but here there is almost any freedom as to the punching position at which the removal of the substrate element has to take place. This, too, could simplify the geometric structure of the device used to carry out the method, in particular with regard to the removal of the substrate elements as waste product.

According to one embodiment of the invention, the punch has an outer cutting surface, the punching angle of the cutting surface being less than 90°. First of all, this could be realized by moving different elements of the punch. In the case of a rectangular punch, this would require four movable elements which carry out the punching process individually at a punching angle of <90°. For example, a trapezoidal punching could be made possible, which, due to the trapezoidal shape and with regard to the filling element to be inserted into the opening, limits the possible degrees of freedom of the filling element in the opening to a single degree of freedom. Due to the trapezoidal shape, the filling material is held in the opening both laterally and downwards.

According to one embodiment of the invention, when the filling element is inserted, the punch touches the edge of the opening of the substrate. In addition, when the filling element is inserted, the punch is subjected to ultrasound. This could have the advantage that, particularly in the case of substrates made of plastic, the edge of the opening softens, e.g. is plasticized, when the filling element is inserted. The edge softened in this way can now enter into a preferably materially bonded connection with the filling element when the punch is withdrawn. In this way, the filling element could not only be mechanically "clamped" in the punched-out opening, but could even be welded into the opening.

According to one embodiment of the invention, the substrate is held by a processing tool when the opening is punched out and the filling element is inserted, the relative movement taking place when the punch is transferred between the first punching position and the second punching position by moving the punch relative to the machining tool. The machining tool could therefore be designed to be rigid and the punch could be moved along the machining tool, for example by a robot.

According to one embodiment of the invention, the punch is arranged on an arm, the movement of the punch comprising rotating the arm about an axis of the machining tool extending perpendicular to the plane. This could also simplify the mechanical structure of the device used to carry out the method, so that a corresponding device could be produced in a cost-effective manner: it would have to be ensured, for example, that the arm can be rotated about an axis, in addition in the direction perpendicular to the plane mobility of the punch either together with the arm or relative to the arm would be necessary. Although this could also be implemented with a robot arm that can be moved as desired in all three dimensions and a punching die located thereon, it is at significantly higher costs and possibly with less precision in carrying out the method.

According to an embodiment of the invention, a first magazine has a set of filling materials, the filling materials of the set of filling materials being arranged in series in the first magazine, the method further comprising, before punching out the filling element, moving the first magazine so that the desired filling material Seen in the direction of the plane comes to rest in the second punching position.

According to one embodiment of the invention, the first magazine comprises a first turntable, the filling materials of the set of filling materials being arranged in a circle one behind the other on the first turntable, the movement of the magazine comprising rotating the first turntable.

The use of the magazine with the filling materials arranged one behind the other in it could have the advantage that a flexible availability of filling materials can be guaranteed with the same mobility and movement of the punch. Especially with regard to Industry 4.0 and the associated need for flexibility, it could be necessary, for example, to use substrate-specific or document-specific filling materials.

This could indeed be solved in that a three-dimensionally movable robot can approach different filling materials at different punching positions seen in the direction of the plane and punch out corresponding filling elements therefrom. However, this would necessitate high mechanical requirements in terms of mobility while maintaining the same precision of a corresponding robot. In particular, when the magazine includes a first turntable, the circular arrangement of the filling materials on the first turntable and the “turning” of the for the Filling material required for the instantaneous punching operation circumvents this challenge, since usually with regard to the turntable due to the single degree of rotational freedom, an inherently high level of precision in the positioning of filling material can be guaranteed.

Instead of using a turntable, it is also possible for the individual filling materials of the set of filling materials to be arranged one behind the other on a carriage, so that the carriage only has to be moved along a linear path into the appropriate second punching position, so that the desired filling material can be fed in the direction of the Seen level comes to rest in the second punching position.

As described with regard to the filling materials, it is also possible to proceed analogously with different substrates. For example, according to one embodiment of the invention, a second magazine can have a set of substrates, the substrates of the set of substrates being arranged one behind the other in the second magazine and the substrate comprising an opening to be punched out, the method further comprising moving the opening before the opening is punched out second magazine in such a way that the substrate with the opening to be punched out does not come to lie in the first punching position when viewed in the plane.

Here, too, the second magazine can comprise a second turntable, the substrate and the set of substrates being arranged in a circle one behind the other on the second turntable and the movement of the magazine comprising rotating the second turntable.

This could make it possible, for example, for the substrates to be positioned in the second magazine at a punching position that differs from the first punching position. For example, laminated or partially laminated substrates provided in a prepared work step could be prefixed in a suitable manner in the second magazine in a punching position that differs from the first punching position. The substrate pre-fixed in this way is then conveyed to the first punching position in order to then be subjected to the method described above. The removal of the substrate processed in this way for inserting the filling element into the opening produced could take place by conveying the processed substrate further into a further punching position, preferably different from the first punching position. In particular in the case of a turntable, the onward conveyance means that a substrate which has subsequently been made available in the meantime is automatically conveyed back into the first punching position. In this way, a supply of substrates and a removal of processed substrates could be ensured in a mechanically simple and space-saving manner.

According to one embodiment of the invention, the substrate is the carrier material, for example the card body, of a valuable or security document or at least one layer of a carrier material of a valuable or security document.

According to one embodiment of the invention, the filling material is transparent and the substrate element is opaque in the wavelength range of visible light. In this context, transparent is understood to mean a transmission t>0.7 and an opaque material is understood to mean a transmission t<0.1.

• - Ausstanzen einer Öffnung in dem sich in der Ebene erstreckenden Teil des Substrats auf dem Stanzstempel, wobei sich der Stanzstempel beim Ausstanzen in Richtung der Ebene gesehen in einer ersten Stanzposition befindet,
• - nach dem Ausstanzen, Durchführen einer Relativbewegung von Stanzstempeln im Substrat in einer Richtung parallel zu der Ebene, wobei aufgrund der Relativbewegung in Richtung der Ebene gesehen der Stanzstempel mit einem gewünschten Füllmaterial in einer zweiten Stanzposition zu liegen kommt,
• - in der zweiten Stanzposition, Ausstanzen eines Füllelements aus dem gewünschten Füllmaterial durch den Stanzstempel,
• - erneutes Durchführen einer Relativbewegung von Stanzstempel und Substrat in einer Richtung parallel zu der Ebene, wobei aufgrund der Relativbewegung in Richtung der Ebene gesehen der Stanzstempel über der Öffnung des Substrats in der ersten Stanzposition zu liegen kommt,
• - Einsetzen des Füllelements durch den Stanzstempel in die Öffnung des Substrats.

In a further aspect, the invention relates to a processing tool for processing a substrate, the processing tool having a punch, the substrate extending at least partially in one plane, the processing tool being designed for:

• - punching out an opening in the part of the substrate extending in the plane on the punch, the punch being in a first punching position when punching out, viewed in the direction of the plane,
• - after the punching, performing a relative movement of punches in the substrate in a direction parallel to the plane, wherein due to the relative movement seen in the direction of the plane, the punch comes to rest with a desired filling material in a second punching position,
• - in the second punching position, punching out a filling element from the desired filling material using the punch,
• - performing a relative movement of the punch and the substrate again in a direction parallel to the plane, with the punch coming to lie over the opening of the substrate in the first punching position due to the relative movement in the direction of the plane,
• - Insertion of the filling element through the punch in the opening of the substrate.

• 1 eine schematische Ansicht eines Sicherheitsdokuments,
• 2 verschiedene Verfahrensschritte zur Bearbeitung eines Substrats mit einem Stanzstempel,
• 3 eine schematische Ansicht eines Bearbeitungswerkzeugs zur Bearbeitung eines Substrats mit Drehteller für Substrate und Füllmaterialien,
• 4 eine schematische Ansicht eines Bearbeitungswerkzeugs zur Bearbeitung eines Substrats mit einem gemeinsamen Drehteller für ein Substrat und ein Füllmaterial,
• 5 eine schematische Querschnittsansicht eines Substrats mit Öffnung und einem darin einzusetzendes Substratelements.

Embodiments of the invention are explained in more detail below with reference to the drawings. Show it:

• 1 a schematic view of a security document,
• 2 various process steps for processing a substrate with a punch,
• 3 a schematic view of a processing tool for processing a substrate with a turntable for substrates and filling materials,
• 4 a schematic view of a processing tool for processing a substrate with a common turntable for a substrate and a filling material,
• 5 a schematic cross-sectional view of a substrate with an opening and a substrate element to be inserted therein.

Elements that are similar to one another are identified below with the same reference symbols.

The 1 shows a schematic view of a security document, for example an identity card. The badge has a body which is referred to as substrate 100 hereinafter.

In addition to various security features and identification features such as a photo of the owner of the ID card and his name and address, the ID card also has an element 102, e.g. a transparent window 102. It is both possible that the transparent window 102 is only provided as a purely transparent window in the ID card or it is also possible that the transparent window itself carries various security features. It is possible, for example, that when looking through the transparent window, structures contained in the window become visible, which are intended to ensure that the ID card is protected against forgery. In addition to directly visible structures, the transparent window 102 can also have various microstructures which only reveal corresponding defined information by projecting laser light shining through the window onto a surface.

In the following it is assumed, without loss of generality, that the substrate 100 is the substrate, ie the card body or a part of a card body of an ID card, and that the element 102 is a transparent see-through window. Generally speaking, however, the substrate 100 can represent any carrier material of a valuable or security document or a layer of the carrier material of a valuable or security document. It is also possible for the element 102 to be any type of filling element, which, however, preferably represents a specific security feature of the valuable or security document. A corresponding transparency of the filling element 102 is not absolutely necessary.

In order to introduce the filling element 102 into the substrate 100 during the production process, a corresponding method for processing the substrate is necessary. This process is shown schematically with various process steps in the 2a until 2e shown.

In the 2a it is assumed that the substrate 100 extends in one plane. In 2 this plane is a horizontal plane. “Extend in the plane” is generally understood in the context of the entire description to mean that in the case of a three-dimensional body, the largest extension and extent of the body in terms of surface area lies in the said plane.

Said level is in the 2 indicated by the reference numeral 206 and extends in the horizontal direction.

In the 2a is now shown how the substrate 100 is processed with a punch 204. The punch 204 reciprocates toward the substrate 100 and punches an opening in the in-plane portion of the substrate. The punch 204 is seen in the direction of the plane 206 in a first punching position.

The result of the punching process is in the 2 B 1, where the punched opening 208 in the substrate 100 can now be seen. The substrate element 200 still located in the punch 204 due to the punching process is now removed from the punch 204 in the next step. For example, a ram 201 can be used here, which pushes the substrate element 200 still located in the punch downwards through the punch.

The punch 204 is then moved further parallel to the plane 206 to a second punching position. The substrate element is therefore ejected at a punching position of the punch which differs from the first punching position and the second punching position of the punch.

In the 2c the punch 204 is shown in said second punching position. He is now above the filling material 202, from which the filling element 102 is to be equipped.

Although in the 2 the filling material and the substrate extend along a common plane 206, this is to realize the described procedure is not absolutely necessary. It is also possible for the substrate and filling material to be on different, preferably parallel planes. They should, however, be positioned spatially next to each other as seen with respect to the plane 206 and not one above the other or overlapping.

In 2c In the second punching position, the filling element 102 is now carried out of the filling material 202 by the punch 204 by performing a lifting movement of the punch in the direction of the filling material 202. The result is in 2 B shown.

Due to the punching process of the filling element, the filling element 102 is located in the punch 204. In this state, the punch 204 is moved from the second punching position (to the 2 the right punching position) back to the first punching position (left punching position). The punched-out filling element 102 leaves an opening 210 in the filling material 202, but this is not relevant to the present description ( 2d ).

Finally, in the last step, according to 2e inserting the filling element 102 remaining in the punch 204 through the punch into the opening 208 of the substrate 100. The insertion can in turn be carried out with the aid of the ram 201, which, after lowering the punch 200 onto the top side of the substrate 100, pushes the filling element 102 into the Opening 208 pushes in. The corresponding result is in 2e shown, with the opening 208 now being closed with the filling element 102 .

It is now possible that when the opening is punched, when the filling element is punched and when the filling element is inserted into the opening 208, the punch 204 is subjected to ultrasound in such a way that the substrate touched by the punch or the filling material softens. Because the punch is subjected to ultrasound, when the punch touches the substrate or the filling material, ultrasonic energy is transmitted to the substrate or the filling material, so that the contact area between the punch and the substrate or the filling material is heated and the material touched by the punch is softened .

• Ein erster Vorteil könnte darin bestehen, dass aufgrund der geringer benötigten Stanzkraft das zur Führung des Stanzstempels benötigte Werkzeugteil auch nur für den entsprechend geringeren Krafteintrag mechanisch ausgelegt werden muss. Daher könnte für die Führung des Stanzstempels insbesondere ein Roboter zum Einsatz kommen, welche eine hohe Positioniergenauigkeit, jedoch eine reduzierte Fähigkeit zur Aufbringung der benötigten Stanzkraft aufweist. Dies resultiert damit in der Möglichkeit der Wahl entsprechend kostengünstiger Roboter.

As a result, the subsequent actual punching process is carried out with respect to a softened material. The actual punching process can therefore take place with reduced force and thus reduced mechanical energy input compared to the hardened material. This could have two distinct benefits:

• A first advantage could be that due to the lower required punching force, the tool part required to guide the punching die also only has to be mechanically designed for the correspondingly lower force input. Therefore, a robot in particular could be used for guiding the punching die, which has a high positioning accuracy but a reduced ability to apply the required punching force. This results in the possibility of choosing correspondingly more cost-effective robots.

A second advantage could be that due to the reduced forces that prevail, the compression of the material to be punched that results during the punching process is also reduced. A corresponding punching process could thus deliver significantly more precise punching results than would be possible with direct processing of the material in the hard state.

A further advantage could be that a reduction in mechanical tool wear is possible, resulting in a better service life of the punching tool.

Since the aim of the method is to reinsert the punched-out filling element into the opening of the substrate, a precise punching result is particularly useful here both for the substrate opening and for the filling element.

The 3 shows a schematic plan view of a processing tool for processing the substrate 100. The punch 204, which is arranged on an arm 302, is used again. The arm can be pivoted about an axis 310 so that the punch 204 can be moved from its in 3 left first punching position in the right second punching position (shown in phantom) is pivotable. The left punching position corresponds to the 2 that punching position of the punch 204 in which both the opening 208 can be punched and the filling element 102 is inserted into the substrate 100. Correspondingly, the right-hand punching position of the punch 204 in FIG 3 that punching position in the 2 , in which the punch punches out the filling element from the filling material.

To carry out the method, essentially two movements are carried out, namely on the one hand pivoting and thus moving the punch 204 in the plane 206 between the left and the right punching position and on the other hand moving the punch perpendicular to the plane 206 to the through the actual punching process, i.e. the execution of a lifting movement.

In the 3 different substrates 100 are now arranged in a circle one behind the other on a turntable. The turntable 301 can be rotated as desired in a direction of rotation 304, so that the desired substrate 100 of the set of substrates located on the turntable 301 comes to rest in the first punching position. It is conceivable, for example, that the turntable 301 can rotate clockwise.

A in this particular case in the 3 A substrate located in the 1 o'clock position can be subjected to the punching process, whereas a substrate located in the 3 o'clock position with inserted filling element can be removed there and fed to further processing, for example lamination or personalization. A substrate blank can be fed to the turntable 301 at the 5 o'clock position. By cycling the process, it is now possible to subject different substrates to the punching process one after the other, then remove them, add new substrates, etc., in order to ensure that the process runs smoothly in this way.

In an analogous way is in the 3 a turntable 303 for various filling materials arranged in a circle on the turntable 303 one behind the other. This turntable can also be rotated as desired about an axis (direction of rotation 306), for example again clockwise here. Those skilled in the art will be able to transfer the principle explained with regard to the turntable 301 to the turntable 303 and the filling materials 202 located there. The 1 o'clock position would be the removal position of the filling material subjected to the stamping process and the 3 o'clock position would be the feeding position at which new filling material can be fed to the turntable 303 .

In order to increase the flexibility of the machining tool even further, it is also possible that instead of a rigid arm 302 which can be rotated about an axis 310, a three-dimensionally movable robot which guides the punch 204 is used. In a simple variant, it is possible, for example, for the arm 302 to also be movable in the direction in which the arm extends, so that any punching position on the substrate 100 or the filling material 202 can be approached in connection with the rotation about the axis 310 before the punching process. In particular, this can also be controlled individually for each substrate, so that the flexibility required with regard to Industry 4.0 is guaranteed when processing any substrates and filling materials.

With regard to the filling materials 202 on the turntable 303, it should also be noted that it is possible for the filling materials 202 on the turntable 303 to have partially different material compositions or different security features. It is also possible here to punch out the desired substrate element from the filling material rotated to the right-hand punching position and insert it into the opening previously created in the substrate by rotating the turntable 303 accordingly. It could be of great use here if the punch is fully movable in all directions, since then with one and the same filling material (e.g. a sheet of material) it is possible to punch out the filling elements at different points and thus a given filling material (a given sheet of filling material) used several times and can be used correspondingly often.

The 4 12 shows a variant in which, in the simplest form, the arm 302 is rigid and in particular immobile with respect to the axis 310. FIG. In order to nevertheless realize the first and second punching position, substrate 100 and filling material 202 are located on a turntable 400 and are thus brought into the corresponding punching position by any rotation in direction 402, seen from the perspective of the substrate or filling material. In the position of the turntable 400 shown in the figure, the process of punching the opening in the substrate 100 and inserting the filling element into the opening can thus take place, whereas punching out the filling element requires that the filling material 202 be rotated to the punching position in which the 4 currently the substrate 100 is located.

In order to increase the flexibility with regard to the positioning of the stamping die relative to the substrate 100 or to the filling material 202, the arm 302 could again be able to move both in the direction of extension of the arm, i.e. in the radial direction to the axis 310, as well as a mobility of the arm in any direction 300, i.e. a rotation of the arm around the axis 310 can be helpful. However, since the punching positions are limited to a relatively small area within the substrate, the mobility of the punch required for this purpose is limited to just that area and a corresponding robot guidance of the punch can be restricted to precisely this area. This could significantly simplify the mechanical structure of the robot used for this purpose.

Within the scope of the entire description, a robot is generally understood to mean a device which is able to bring the punch into a desired punching position. This can be a robot in the conventional sense, which may have a number of different joints around which corresponding robot arms are pivoted or rotated to position the punch. However, a robot is also understood to mean a device such as that described above with regard to 3 and the 4 with an axis of rotation 310 and an arm 302.

The 5 shows a cross-sectional view through a substrate 100 with a trapezoidal opening 208. Similarly, the filling element 102 has a trapezoidal shape with a sloping edge 500. In order to achieve such a trapezoidal shape with the punch, it is necessary for the punch to have several outer cut surfaces, with the punching angle α the cutting surface is less than 90°. For example, the case of a rectangular cross-section of opening or substrate or filling element seen in plane 206 could be realized by four punching cutters, which carry out the punching process at said angle α on the four edges of this rectangle. The punching blades thus cut into the substrate or the filling material at an angle α in order to punch out and obtain trapezoidal openings or the corresponding trapezoidal filling element.

The use of a trapezoidal shape, for example, or generally a cut surface <90° would be advantageous in that after inserting the filling element 302 into the opening 208, the degrees of freedom of movement of the filling element 102 are restricted to only one direction opposite to the direction of insertion. This could increase the mechanical stability with which the filling element is held in the substrate.

Optionally, during the process of inserting the filling element into the opening, the edge of the opening 208 and the filling element 102 are touched by the ultrasonic punch of the stamping die, which is acted upon by ultrasound Material connection after inserting the filling element 102 into the substrate 100 is made possible. This further increases the force with which the filling element 102 is fixed in the substrate 100 .

Reference List

100

substrate

102

filling element

200

substrate element

201

pestle

202

filling material

204

punch stamp

206

level

208

opening

300

direction of rotation

301

turntable

302

axis

303

turntable

304

direction of rotation

306

direction of rotation

310

axis

400

turntable

402

direction of rotation

500

interface

Claims (17)

Method for processing a substrate (100) with a punch, the substrate (100) extending at least partially in a plane (206), the method comprising: - Punching out an opening (208) in the part of the substrate (100) extending in the plane (206) by the punch, the punch (204) being in a first punching position when punching out in the direction of the plane (206), - After punching, performing a relative movement of the punch (204) and substrate (100) in a direction parallel to the plane (206), with the punch (204) seen over a desired filling material due to the relative movement in the direction of the plane (206). (202) comes to rest in a second punching position, - In the second punching position, punching out a filling element (102) from the desired filling material (202) by the punch, the filling element (102) remaining in the punch (204), - Again performing a relative movement of the punch (204) and the substrate (100) in a direction parallel to the plane (206), wherein due to the relative movement in the direction of the plane (206), the punch (204) above the opening (208) of the substrate (100) comes to rest in the first punching position, - Inserting the filling element (102) remaining in the punch (204) through the punch (204) into the opening (208) of the substrate (100). procedure after claim 1 , wherein the punching out of the opening (208) results in a substrate element (200) corresponding to the cross section of the opening (208), the substrate element (200) being removed from the punch (204) before the filling element (102) is punched out. Method according to one of the preceding claims, in which the punch (204) is subjected to ultrasound when the opening (208) is punched out and/or when the desired filling material (202) is punched out. Method according to one of the preceding claims, wherein the insertion of the filling element (102) comprises: - Carrying out a lifting movement of the punch (204) perpendicular to the plane (206), due to the lifting movement of the punch (204) in the opening (208) of the substrate (100) or in a plane (206) directly above the plane (206) of the substrate (100) comes to rest, - Movement of the filling element (102) into the opening (208) by a ram (201). procedure after claim 4 , wherein when the filling element (102) is inserted, the punch (204) touches the edge of the opening (208) of the substrate (100) and is subjected to ultrasound. A method according to any one of the preceding claims, wherein the part of the substrate (100) extending in the plane (206) is supported by an immovable stop in the direction perpendicular to the plane (206). procedure after claim 2 , wherein the substrate element (200) is removed in a position of the punch (204) that differs from the first and the second punching position. Method according to one of the preceding claims, in which the punch (204) has an outer cutting surface (500), the cutting angle of the cutting surface being less than 90 degrees. Method according to one of the preceding claims, wherein the substrate (100) is held by a processing tool when the opening (208) is punched out and the filling element (102) is inserted, the relative movement occurring with the transfer of the punch (204) between the first punching position and the second punching position by moving the punch (204) relative to the machining tool. procedure after claim 9 , wherein the process of the punch (204) is carried out by a robot. procedure after claim 9 or 10 , wherein the punch (204) is arranged on an arm (302), wherein the movement of the punch (204) comprises rotating the arm (302) about an axis of the machining tool extending perpendicularly to the plane (206). A method according to any one of the preceding claims, wherein a first magazine has a set of filling materials, the filling materials of the set of filling materials being arranged in series in the first magazine, the method further comprising moving the first magazine before punching out the filling element (102). that the desired filling material (202) seen in the direction of the plane (206) comes to lie in the second punching position. procedure after claim 12 , wherein the first magazine comprises a first turntable (303), wherein the filling materials of the set of filling materials are arranged in a circular manner one behind the other on the first turntable, wherein the movement of the magazine comprises rotating the first turntable (303). Method according to one of the preceding claims, wherein a second magazine has a set of substrates, the substrates of the set of substrates being arranged one behind the other in the second magazine and comprising the substrate (100) with the opening (208) to be punched out, the method further comprising the punching out of the opening (208) comprises moving the second magazine such that the substrate (100) with the opening (208) to be punched out comes to lie in the first punching position as viewed in the direction of the plane (206). procedure after Claim 14 , wherein the second magazine comprises a second turntable (301), wherein the substrates of the set of substrates on the second turntable (301) are arranged in a circular manner one behind the other, wherein the movement of the magazine comprises rotating the second turntable (301). Method according to one of the preceding claims, wherein the substrate (100) is the carrier material of a valuable or security document or at least one layer of the carrier material of a valuable or security document. Method according to one of the preceding claims, in which the filling material (202) is transparent and the substrate element (200) is opaque in the wavelength range of visible light.

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