EP4219183B1 - Device and method for producing a bonded card comprising a light-transparent window - Google Patents

Description

The invention relates to a device and a method for producing a joined card with a light-transparent window.

From the EN 10 2014 000 133 A1 A method and a device for processing a substrate are known in which a window opening is made in the substrate and then a filling material is inserted into the opening. Plastic cards with such windows are used, for example, as identification, valuables and/or security documents. In the above-mentioned publication, the punching out of the window substrate and the insertion of the punched-out filling material into an opening are carried out using one and the same punching stamp.

In the EP 3 389 963 A1 also describes a method for producing a window in a layer of soft plastic, in which a double punch is used to punch the window substrate on the one hand and the card substrate on the other. The insertion of the window part into the opening in the card substrate can be carried out using both punches.

It is therefore the object of the present invention to provide a device and a method for producing a joined card with a light-transparent window, by means of which the window can be additionally secured in the opening.

This object is achieved by a device having the features of claim 1 and by a method having the features of claim 12. Advantageous embodiments with expedient further developments of the invention are specified in the dependent claims.

The device according to the invention comprises a film joining device for joining a carrier film with a single-layer or multi-layer card substrate. The device also comprises a punching device which has a die holder which is fixed to a punching stand and on which there is a first die which is associated with a first punching die for punching the card substrate. The die holder also has a second die which is associated with a second punching die which can be moved coaxially to the first punching die and has the same contour as the first punching die for punching a window substrate, the first die being arranged at a distance from the second die in an adjustment direction of the punching dies. The punching device is adjustable perpendicularly with respect to the adjustment direction of the punching dies at least between a punching position and a joining position. In the punching position, the first punch and the first die are positioned relative to the card substrate in such a way that they create an opening in the card substrate when the first punch moves, with the second punch and the second die being positioned relative to the window substrate in such a way that they punch out a window part from the window substrate that is adapted to the dimensions of the opening when the second punch moves, with the window part being able to be inserted into the opening by the simultaneous movement of the first punch together with the second punch. In the joining position, there is also an area on the first die that serves as an abutment for a pressure plate of the film joining device.

In this way, the punching device can fulfil a dual function, namely, on the one hand, punching holes in the window substrate and the card substrate and inserting the window part into the opening through the simultaneous movement of the punching dies. And, on the other hand, forming an abutment when joining the carrier film. In this way, a particularly compact device is available for producing a joined card with a light-transparent window.

"Joining" is understood to mean the permanent connection of two or more joining parts, in this case in particular individual film layers. The individual joining parts, in particular the film layers, can be joined together by welding. Alternatively, the individual film layers can be coated with a shapeless material so that the joining is done by gluing. Preferably, the individual joining parts, in particular the film layers, are joined together without any auxiliary material. joined together so that the individual parts are laminated. The film layers can be hot laminated, for example, to be permanently connected. Alternatively, the film layers can be laminated using presses. Cold lamination of the film layers using an adhesive is also possible.

The above-mentioned "joining position" can thus also be understood and referred to as a "welding position" or as a "laminating position".

In order to ensure that the card substrate is not displaced during the punching process, especially when it is designed in multiple layers, it is advantageous if the first die is assigned a hold-down device that can be adjusted coaxially with respect to the adjustment movement of the punching dies along the punching stand. The hold-down device is preferably spring-loaded; however, this is not mandatory.

It has proven advantageous to have a suction and/or blowing device which is directed with its nozzle towards a space between the first die and the second die. In this way, the material punched out by the first punch can be blown out or sucked out of the card substrate so that it does not block the trajectory for the window part punched out of the window substrate.

In order to be able to produce a particularly large number of joined cards with light-transparent windows, it has proven to be advantageous if the punching device has a further die holder fixed to a further punching stand, on which there is a further first die, to which a further first punching die is assigned for punching the card substrate, and on which there is a further second die, to which a further second punching die is assigned, which can be moved coaxially to the further first punching die and has the same contour as the latter, for punching the window substrate, wherein the further first die is arranged in an adjustment direction of the further punching dies at a distance from the further second die, and wherein the further punching stand and the further punching dies are simultaneously with the Punching stands and punching dies are adjustable. In this way, a redundantly designed device is created.

To provide the single-layer or multi-layer card substrate, it has proven advantageous if a supply station is available and if a suction gripper is present to position the card substrate opposite the punching device for assuming the punching position and/or the joining position. The suction gripper can be designed with a positioning pin to ensure that the card substrate is stored in the correct position. In other words, reliable gripping of the card substrate is ensured by the suction gripper having at least one positioning pin that is designed to hold the pre-punched card substrate in the correct position.

In order to be able to produce a particularly large number of joined cards with light-transparent windows, it has proven advantageous to have an unwinding device for unwinding the carrier film and then providing the carrier film to the film joining device. The film joining device can be a film laminating device or a film welding device.

In order to be able to fix the carrier film in the correct position on the suction gripper, it has proven advantageous if a hole punch is installed between the unwinding device and the punching device to create holes in the carrier film.

In order to be able to introduce the carrier film into the area of the punching device and the film joining device in an operationally reliable manner, it has proven advantageous if a gripper that can be adjusted vertically with respect to the adjustment direction of the punching dies is present for gripping the carrier film, which gripper in turn is designed to position the carrier film in the joining position between the card substrate and the pressure plate of the joining device.

In order to make this positioning as accurate as possible, it has proven advantageous if the gripper is parallel to the adjustment direction of the The punching stamp is adjustable, especially for threading the perforated carrier film onto the positioning pins of the suction gripper.

A reliable separation of the carrier film can also be achieved by interposing a cross-cutting device between the punching device and the unwinding device for severing the carrier film provided in web form.

The advantages, advantageous embodiments and effects described in connection with the device according to the invention apply in the same way to the method according to the invention for producing a joined card with a light-transparent window. This method uses in particular a device as described above.

• Bereitstellung des einlagigen oder mehrlagigen Kartensubstrats an eine Stanzeinrichtung, die einen an einem Stanzständer festgelegten Matrizenhalter aufweist, an welchem eine erste Matrize vorliegt, der ein erster Stanzstempel zum Stanzen des Kartensubstrats zugeordnet ist, und an welchem eine zweite Matrize vorliegt, der ein koaxial zum ersten Stanzstempel verfahrbarer und zu diesem konturgleich gebildeter zweiter Stanzstempel zum Stanzen eines Fenstersubstrats zugeordnet ist, wobei die erste Matrize in einer Verstellrichtung der Stanzstempel unter einem Abstand bezüglich der zweiten Matrize angeordnet ist, wobei die Stanzeinrichtung senkrecht bezüglich der Verstellrichtung der Stanzstempel wenigstens zwischen einer Stanzposition und einer Fügeposition verstellbar ist,
• Verstellen der Stanzeinrichtung in die Stanzposition, sofern diese nicht bereits eingenommen wurde,
• Verstellen des ersten Stanzstempels und Einbringen einer Öffnung in das Kartensubstrat,
• Verstellen des zweiten Stanzstempels und Ausstanzen eines an die Abmessungen der Öffnung angepassten Fensterteils aus dem Fenstersubstrat,
• Beaufschlagen der dem zweiten Stanzstempel abgewandten Seite des Fensterteils durch den ersten Stanzstempel,
• simultanes Bewegen des ersten Stanzstempels zusammen mit dem zweiten Stanzstempel und Einsetzen des Fensterteils in die Öffnung,
• Überführen der Stanzeinrichtung in die Fügeposition, wodurch ein an der ersten Matrize vorhandener Bereich als Widerlager für eine Andruckplatte einer Folienfügeeinrichtung dient, und
• Andrücken und Fügen einer Trägerfolie mittels der Andruckplatte der Folienfügeeinrichtung, wobei die Trägerfolie an das um das Fensterteil ergänzte Kartensubstrat gepresst wird und die erste Matrize das Widerlager beim Herstellen der gefügten Karte mit dem lichttransparenten Fenster bildet.

It includes in particular the following - preferably consecutive - steps:

• Providing the single-layer or multi-layer card substrate to a punching device which has a die holder fixed to a punching stand, on which there is a first die, to which a first punching die is assigned for punching the card substrate, and on which there is a second die, to which a second punching die which can be moved coaxially to the first punching die and has the same contour as the latter is assigned for punching a window substrate, wherein the first die is arranged at a distance from the second die in an adjustment direction of the punching dies, wherein the punching device is adjustable perpendicularly with respect to the adjustment direction of the punching dies at least between a punching position and a joining position,
• Adjusting the punching device to the punching position if this has not already been taken,
• Adjusting the first punch and making an opening in the card substrate,
• Adjusting the second punch and punching out a window part adapted to the dimensions of the opening from the window substrate,
• Applying pressure to the side of the window part facing away from the second punching die by the first punching die,
• simultaneously moving the first punch together with the second punch and inserting the window part into the opening,
• Transferring the punching device into the joining position, whereby an area on the first die serves as an abutment for a pressure plate of a film joining device, and
• Pressing and joining a carrier film by means of the pressure plate of the film joining device, whereby the carrier film is pressed onto the card substrate supplemented by the window part and the first matrix forms the abutment when producing the joined card with the light-transparent window.

This method also provides a dual function for the punching device, namely, on the one hand, for punching the substrates themselves and, on the other hand, for providing an abutment for the pressing process of the carrier film by the joining device. The joining device can be a welding device or a laminating device.

In order to be able to carry out the process with a higher degree of automation, it has proven advantageous if the carrier film is provided by an unwinding device, pulled off by a gripper for joining the carrier film and positioned with respect to the card substrate.

In order to be able to position the carrier film accurately relative to the card substrate for the joining process, it has proven advantageous if the carrier film is perforated before positioning and if it is threaded onto positioning pins of a suction gripper for positioning, onto which the card substrate with the window part is also threaded.

It has proven to be advantageous if the carrier film is part of a film web that is separated before or after joining, for which purpose a cross-cutting device can preferably be used. This ensures that as little waste as possible occurs.

Figur 1

Eine perspektivische Ansicht auf eine Vorrichtung zum Herstellen einer gefügten Karte mit einem lichttransparenten Fenster, wobei ein Saugreifer an einem Andienplatz gegenüber einem vorgehefteten mehrlagigen Kartensubstrat (Folienstapel) platziert ist,

Figur 2

die Vorrichtung aus Figur 1, bei der der Saufgreifer das Kartensubstrat gegenüber einer Stanzeinrichtung und einer Folienfügeeinrichtung positioniert hat,

Figur 3

die Vorrichtung aus Figur 1, bei der die Stanzeinrichtung die Stanzposition eingenommen hat,

Figur 4

eine perspektivische Detailansicht der Stanzeinrichtung in der Stanzposition gemäß Figur 3,

Figur 5

eine Detailseitenansicht auf die Stanzeinrichtung vor dem Stanzvorgang,

Figur 6

eine der Figur 5 entsprechende Darstellung der Stanzeinrichtung, bei der das Kartensubstrat von einem Niederhalter fixiert ist, noch vor dem Stanzvorgang,

Figur 7

eine der Figur 5 entsprechende Darstellung der Stanzeinrichtung, bei der der erste Stanzstempel das Kartensubstrat gestanzt hat,

Figur 8

eine der Figur 5 entsprechende Darstellung der Stanzeinrichtung, bei der der erste Stanzstempel am Fenstersubstrat nahezu anliegt,

Figur 9

eine der Figur 5 entsprechende Darstellung der Stanzeinrichtung, bei der der zweite Stanzstempel das Fenstersubstrats stanzt,

Figur 10

eine der Figur 5 entsprechende Darstellung der Stanzeinrichtung die die fortwährende Bewegung der beiden Stanzstempel illustriert, welche das Fensterteil zwischen sich halten,

Figur 11

eine der Figur 5 entsprechende Darstellung der Stanzeinrichtung, bei der die beiden Stanzstempel das Fensterteil in die in das Kartensubstrat eingebrachte Öffnung eingesetzt haben,

Figur 12

eine der Figur 1 entsprechende Darstellung der Vorrichtung, bei der die Stanzeinrichtung lateral bezüglich der Verstellbewegung der Stanzstempel von dem Saugreifer entfernt positioniert ist, damit eine Trägerfolie gegenüber dem um ein Fensterteil ergänztes Kartensubstrat von einem Greifer positioniert werden kann,

Figur 13

eine der Figur 5 entsprechende Darstellung, bei der die Trägerfolie unterhalb des Kartensubstrats mit Fensterteil positioniert ist,

Figur 14

eine der Figur 1 entsprechende Darstellung der Vorrichtung, bei der die Andruckplatte der Folienfügeeinrichtung unterhalb der Trägerfolie platziert ist, um die Trägerfolie mit dem Kartensubstrat und dem Fensterteil in der Öffnung zu fügen,

Figur 15

eine Detailansicht des Fügevorgangs, bei dem die erste Matrize als Widerlager für die Andruckplatte im Bereich der Öffnung des Kartensubstrats und damit im Bereich des Fensterteils genutzt wird, wobei sich die Stanzeinrichtung in der Fügeposition befindet.

Further features, properties and advantages of the present invention are described in more detail below using embodiment variants with reference to the attached figure. The embodiment variants described below are merely examples which do not, however, limit the subject matter of the invention. In this figure:

Figure 1

A perspective view of a device for producing a joined card with a light-transparent window, wherein a suction gripper is placed at a delivery station opposite a pre-stitched multi-layer card substrate (foil stack),

Figure 2

the device from Figure 1 , in which the suction gripper has positioned the card substrate opposite a punching device and a foil joining device,

Figure 3

the device from Figure 1 , where the punching device has taken the punching position,

Figure 4

a perspective detailed view of the punching device in the punching position according to Figure 3 ,

Figure 5

a detailed side view of the punching device before the punching process,

Figure 6

one of the Figure 5 corresponding representation of the punching device, in which the card substrate is fixed by a hold-down device, before the punching process,

Figure 7

one of the Figure 5 corresponding representation of the punching device in which the first punch has punched the card substrate,

Figure 8

one of the Figure 5 corresponding representation of the punching device, in which the first punching die is almost in contact with the window substrate,

Figure 9

one of the Figure 5 corresponding representation of the punching device, in which the second punch punches the window substrate,

Figure 10

one of the Figure 5 corresponding representation of the punching device which illustrates the continuous movement of the two punches which hold the window part between them,

Figure 11

one of the Figure 5 corresponding representation of the punching device, in which the two punching dies have inserted the window part into the opening in the card substrate,

Figure 12

one of the Figure 1 corresponding representation of the device in which the punching device is positioned laterally with respect to the adjustment movement of the punching dies away from the suction gripper so that a carrier film can be positioned by a gripper opposite the card substrate supplemented by a window part,

Figure 13

one of the Figure 5 corresponding representation, in which the carrier film is positioned below the card substrate with window part,

Figure 14

one of the Figure 1 corresponding representation of the device in which the pressure plate of the foil joining device is placed below the carrier foil in order to join the carrier foil with the card substrate and the window part in the opening,

Figure 15

a detailed view of the joining process, in which the first die is used as an abutment for the pressure plate in the area of the opening of the card substrate and thus in the area of the window part, with the punching device in the joining position.

The figures show a device 100 for producing a joined, in particular laminated card with a light-transparent window. This device 100 comprises a film joining device 102 for joining by gluing, in particular laminating, or for joining by welding a carrier film 204 with a single-layer or multi-layer card substrate 200. In addition, a punching device 104 is present. The film joining device 102 for joining the carrier film 204 comprises in particular a pressure plate 120, which is in particular heatable.

The structure of the punching device 104 of the device 100 is shown in the detailed side view according to Figure 5 explained. The punching device 104 comprises a punching stand 106 to which a die holder 108 is fixed. On this die holder 108 there is a first die 110, to which a first punching die 112 is assigned for punching the card substrate 200. On the die holder 108 there is also a second die 114, to which a second punching die 116 is assigned, which can be moved coaxially to the first punching die 112 and has the same contour as the latter, for punching a window substrate 202, wherein the first die 110 is arranged at a distance from the second die 114 in an adjustment direction of the punching dies 112, 116.

Out of Figure 1 It follows that the punching device 104 is designed redundantly for the production of large quantities and therefore has a further die holder 128 fixed to a further punching stand 126. On the further die holder 128 there is a further first die 130, to which a further first punching punch 132 is assigned for punching the card substrate 200, and on which there is a further die 134, to which a further second punching punch 136 is assigned for punching the window substrate 202, which can be moved coaxially to the further first punching punch 132 and has the same contour as it. The further first die 130 is formed analogously to the two dies 110, 114 and is thus arranged at a distance from the further second die 134. The two further punching punches 132, 136 can be adjusted in particular simultaneously with the other two punching punches 112, 116.

In addition, the punching device 104 is adjustable vertically with respect to the adjustment direction of the punching dies 112, 116, 132, 136, in particular between a punching position and a joining or laminating position. In the installation position, the punching device is moved horizontally into the punching position or the joining position. Other positions of the Punching devices 104 are also possible, in particular those that enable positioning of the carrier film 204.

In Figure 1 the picking up of the card substrate 200 by a suction gripper 140 from a delivery station 138 is shown, which in this case is implemented by a mover or a transport trolley. This mover moves with the pre-stapled foil stack, thus with the pre-stapled multi-layer card substrate 200, into a delivery position. When the mover is adjusted, the card substrate 200 is held by means of positioning pins. The suction gripper 140 can remove the card substrate 200 from these positioning pins, for which purpose it is also equipped with at least one positioning pin, for example.

When the suction gripper has picked up the card substrate 200, it positions it with respect to the punching device 104. In Figure 2 this punching device 104 is still shown in a configuration in which it has neither assumed the punching position nor the joining position.

The punching device 104 is then moved into the punching position perpendicular to the adjustment direction of the punching dies 112, 116. In this case, one of the dies 110, 114 is inserted into a recess 142 of the suction gripper 140, which is particularly important in Figure 3 can be seen. The other matrices 130, 132 rest at their ends on an end face of the suction gripper 140, so that an exact positioning of the punching device 104 with respect to the suction gripper 140 is realized in order to carry out the punching process.

In Figure 4 This punching position can be seen in detail, whereby it is clear that the suction gripper 140 is not only provided with a recess 142 for receiving the two matrices 110, 114, but also has an undercut 152, whereby the suction gripper 140 reserves space for part of the first die 110. The overhang of the first die 110 is therefore used by the suction gripper 140 for the movement of the first punch 112 and the introduction of the opening 208 into the card substrate 200.

The actual punching and insertion process is described below using the Figures 5 to 11 explained.

Figure 5 shows the situation in which the card substrate 200 was positioned opposite the first die 110 by the suction gripper 140. The punching device 104 is in the punching position. First, a hold-down device 122 is moved towards the card substrate 200, which is spring-loaded and can be moved along the punching stand 106. The spring-loaded hold-down device is not absolutely necessary. Its adjustment movement is therefore coaxial with respect to the adjustment movement of the punching dies 112, 116 along the punching stand 106.

As soon as the hold-down device 122 Figure 6 has assumed the configuration shown and the card substrate 200 is fixed in its position, the first punch 112 is also adjusted in the direction of the card substrate 200. The hold-down device 122 comprises an axial passage through which the first punch 112 can pass.

In Figure 7 the situation is shown in which the first punch 112 has passed through the first die 110 and has introduced the opening 208 into the card substrate 200. In Figure 7 the first punch projects into the space between the first die 110 and the second die 114, wherein a suction and/or blowing device 124 is outlined, which blows or sucks the part punched out of the card substrate 200 out of this intermediate space.

According to Figure 8 with the first punch 112 then further adjusted to the second die 114, in particular until it rests on the window substrate 202.

According to Figure 9 the second punch 116 is then adjusted in the direction of the card substrate 200, whereby the window substrate 202 is punched out in such a way that a window part 206 is clamped between the first punch 112 and the second punch 116. This window part 206 is adapted to the dimensions of the opening 208 in the card substrate 200. Due to the simultaneous movement of the first punch 112 together with the second The window part 206 is then inserted into the opening 208 of the card substrate 200 using the punch 116.

The simultaneous adjustment of the two punches 112, 116 is achieved by Figure 10 illustrated, wherein the insertion of the window part 206 into the opening 208 by Figure 11 is illustrated.

In Figure 12 the situation is shown after the punching has been completed and the window part 206 has been inserted into the opening 208 of the card substrate 200, with the punching device 104 again being moved out of the suction gripper 140 perpendicularly with respect to the adjustment movement of the punching dies 112, 116. The carrier film 204 provided by the unwinding device 144 is pre-punched with a hole punch 146 for reliable positioning of the carrier film 204 relative to the other substrates in order to provide holes in the carrier film 204 that are adapted to the dimensions of the positioning pins on the suction gripper 140. A roller take-off device 154 is connected downstream of the hole punch 146. In order to unwind the carrier film 204, a gripper 148 is also present, which is designed to position the carrier film 204 in the joining position between the card substrate 200 and the pressure plate 120 of the film joining device 102. For this purpose, the gripper 148 can be moved vertically with respect to the adjustment direction of the punches 112, 116. After adjusting the gripper 148 together with the end of the carrier film 204, the Figure 13 illustrated situation in which the carrier film 204 is arranged below the card substrate 200 provided with a window part 206.

In order to laminate the carrier film 204 with the card substrate 200, the pressure plate 120 is provided by Figure 14 under the carrier foil 204 and heated if necessary. The punching device 104 is then transferred to the joining position, which in the detailed view according to Figure 15 can also be seen in more detail. The projection present on the first die 110 is used as an abutment 118 for the pressure plate 120 of the film joining device 102. In this way, it is ensured that the window part 206 is not pressed out of the card substrate 200 during lamination and reliably forms an adhesive bond with both the carrier film 204 and the card substrate 200.

The primary purpose is to ensure that the carrier film 204 is stapled to the window part 206. The carrier film 204 can be separated before or after lamination, for which purpose a cross-cutting device 150 for cutting through the carrier film 204 provided in web form is interposed between the punching device 104 and the unwinding device 144. When the carrier film 204 is cut through, the roller take-off 154 reliably prevents it from slipping.

After lamination, the suction gripper 140 can transfer the card substrate 200, which has been supplemented with a window part 206 and laminated with the carrier film 204, back to the delivery station 138, i.e. to the mover.

The present device and the present method are characterized by their very compact design, which reliably saves the available installation space in large production plants for the production of card-shaped identification, value and/or security documents.

LIST OF REFERENCE SYMBOLS

100

contraption

102

Film joining device

104

Punching device

106

Punching stand

108

Die holder

110

first matrix (for creating the opening)

112

first punch

114

second die (for punching out the window part)

116

second punch

118

Abutment

120

Pressure plate

122

Hold-down clamp

124

Suction and/or blowing device

126

additional punching stand

128

additional die holder

130

further first matrix

132

another first punch

134

further second matrix

136

additional second punch

138

Andienplatz

140

Suction cup

142

Recess (for die holder)

144

Unwinding device

146

Perforator

148

Gripper

150

Cross cutting device

152

Undercut (to accommodate the overhang of the first die)

154

Roller take-off

200

Card substrate

202

Window substrate

204

Carrier film

206

Window part

208

opening

Claims (15)

1. A device (100) for producing a joined card with a light-transparent window,

   with a film joining unit (102) for joining a carrier film (204) to a single-layer or multi-layer card substrate (200),

   and with a punching unit (104),

   which has a die holder (108) fixed to a punching stand (106), on which a first die (110) is present, to which a first punch (112) for punching the card substrate (200) is assigned,

   and on which a second die (114) is present, to which a second punch (116), which can be moved coaxially to the first punch (112) and is formed with the same contour as the latter, is assigned for punching a window substrate (202), the first die (110) being arranged in a displacement direction of the punches (112, 116) at a distance with respect to the second die (114),

   wherein the punching unit (104) is adjustable perpendicularly with respect to the direction of adjustment of the punches (112, 116) at least between a punching position and a joining position,

   wherein, in the punching position, the first punch (112) and the first die (110) are positioned relative to the card substrate (200) in such a way that they create an opening (208) in the card substrate (200) during the adjusting movement of the first punch (112), wherein the second punch (116) and the second die (114) are positioned relative to the window substrate (202) in such a way that these punch out a window part (206) adapted to the dimensions of the opening (208) from the window substrate (202) during the adjusting movement of the second punch (116) in order to insert the window part (206) into the opening (208) by the simultaneous movement of the first punch (112) together with the second punch (116),

   and wherein, in the joining position, a region present on the first die (110) is present as an abutment (118) for a pressure plate (120) of the film joining unit (102).
2. The device (100) according to claim 1, characterized in that the first die (110) is assigned a hold-down unit (122) which can be adjusted coaxially with respect to the adjusting movement of the punches (112, 116) along the punching stand (106).
3. The device (100) according to claim 1 or 2, characterized in that a suction and/or blowing unit (124) is present, which is directed with its nozzle towards a space between the first die (110) and the second die (114).
4. The device (100) according to any one of claims 1 to 3, characterized in that the punching unit (104) has a further die holder (128) which is fixed to a further punching stand (126) and on which a further first die (130) is present, to which a further first punch (132) for punching the card substrate (200) is assigned, and on which a further second die (134) is present, with which there is associated a further second punch (136) for punching the window substrate (202), which punch can be moved coaxially with respect to the further first punch (132) and is formed with the same contour as the latter, the further first die (130) being displaced in a displacement direction of the further punches (132, 136) at a distance relative to the further second die (134), and wherein the further punching stand (126) and the further punching punches (132, 136) are simultaneously adjustable with the punching stand (106) and the punching punches (112, 116).
5. The device (100) according to any one of claims 1 to 4, characterized in that a serving station (138) is present for providing the single-layer or multi-layer card substrate (200), and in that a suction gripper (140) is present for positioning the card substrate (200) relative to the punching unit (104) for assuming the punching position and the joining position.
6. The device (100) according to claim 5, characterized in that the suction gripper (140) has at least one positioning pin which is set up to pick up the pre-punched card substrate (200) in a precise position.
7. The device (100) according to any one of claims 1 to 6, characterized in that an unwinding unit (144) is provided for unwinding the carrier film (204) and subsequently providing the carrier film (204) to the film joining unit (102).
8. The device (100) according to claim 7, characterized in that a hole punch (146) for producing holes in the carrier film (204) is interposed between the unwinding device (144) and the punching unit (104).
9. The device (100) according to claim 7 or 8, characterized in that a gripper (148) for gripping the carrier film (204) is provided, which is adjustable vertically with respect to the direction of adjustment of the punches (112, 116) and is set up to position the carrier film (204) in the joining position between the card substrate (200) and the pressure plate (120).
10. The device (100) according to claim 9, characterized in that the gripper (148) is adjustable parallel to the adjustment direction of the punches (112, 116).
11. The device (100) according to any one of claims 7 to 10, characterized in that a cross-cutting device (150) for cutting through the carrier film (204) provided in web form is interposed between the punching unit (104) and the unwinding unit (144).
12. A method for producing a joined card with a light-transparent window, in particular by means of an apparatus (100) according to any one of claims 1 to 11, comprising the steps of:

    - providing the single-layer or multi-layer card substrate (200) to a punching unit (104), which has a die holder (108) fixed to a punching stand (106), on which a first die (110) is present, to which a first punch (112) for punching the card substrate (200) is assigned,
    and on which a second die (114) is present, to which a second punch (116), which can be moved coaxially to the first punch (112) and is formed with the same contour as the latter, is assigned for punching a window substrate (202), the first die (110) being arranged in a displacement direction of the punches (112, 116) at a distance with respect to the second die (114), wherein the punching unit (102) is adjustable perpendicularly with respect to the direction of adjustment of the punching punches (112, 116) at least between a punching position and a joining position,

    - positioning the punching unit (102) in the punching position, if this has not already been assumed,

    - positioning the first punch (112) and making an opening (208) in the card substrate (200),

    - positioning the second punch (116) and punching out a window part (206) adapted to the dimensions of the opening (208) from the window substrate (202),

    - the side of the window part (206) facing away from the second punch (116) is struck by the first punch (112),

    - simultaneous movement of the first punch (112) together with the second punch (116) and insertion of the window part (206) into the opening (208),

    - transferring the punching unit (104) into the joining position, whereby a region present on the first die (110) serves as an abutment (118) for a pressure plate (120) of a film joining unit (102), and

    - pressing on and joining a carrier film (204) by means of the pressure plate (120) of the film joining unit (102), wherein the carrier film (204) is pressed against the card substrate (200) supplemented by the window part (206) and the first die (110) forms the abutment (118) during the production of the joined card with the light-transparent window.
13. The method according to claim 12, characterized in that the carrier film (204) is provided by an unwinding unit (144), is pulled off by a gripper (148) for joining the carrier film (204) and is positioned with respect to the card substrate (200).
14. The method according to claim 13, characterized in that the carrier film (204) is perforated before positioning, and in that it is threaded for positioning onto positioning pins of a suction gripper (140), on which the card substrate (200) with the window part (206) is also threaded.
15. The method according to any one of claims 12 to 14, characterized in that the carrier film (204) is part of a film web which is separated before or after joining.

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