WO2017093516A1 - Biometric card - Google Patents

Biometric card Download PDF

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Publication number
WO2017093516A1
WO2017093516A1 PCT/EP2016/079642 EP2016079642W WO2017093516A1 WO 2017093516 A1 WO2017093516 A1 WO 2017093516A1 EP 2016079642 W EP2016079642 W EP 2016079642W WO 2017093516 A1 WO2017093516 A1 WO 2017093516A1
Authority
WO
WIPO (PCT)
Prior art keywords
biometric sensor
contacts
card
transition member
electronic card
Prior art date
Application number
PCT/EP2016/079642
Other languages
French (fr)
Inventor
Peter Robert LOWE
Jose Ignacio Wintergerst LAVIN
Original Assignee
Zwipe As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zwipe As filed Critical Zwipe As
Publication of WO2017093516A1 publication Critical patent/WO2017093516A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0716—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
    • G06K19/0718—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being of the biometric kind, e.g. fingerprint sensors
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/117—Identification of persons
    • A61B5/1171—Identification of persons based on the shapes or appearances of their bodies or parts thereof
    • A61B5/1172—Identification of persons based on the shapes or appearances of their bodies or parts thereof using fingerprinting
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
    • G06F21/31—User authentication
    • G06F21/32—User authentication using biometric data, e.g. fingerprints, iris scans or voiceprints
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/50—Maintenance of biometric data or enrolment thereof
    • G06V40/55—Performing matching on a personal external card, e.g. to avoid submitting reference information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device

Definitions

  • the present invention relates to an electronic card including a biometric sensor, particularly a fingerprint sensor, and to a method of manufacturing such an electronic card.
  • US 2015/049925 describes an example of a prior art technique for manufacturing an electronic "smart" card 2 including a fingerprint sensor 10.
  • the electronic card 2 is manufactured by first forming a card body 4 with an embedded circuit 6 that includes connection pads 8 for connection to a fingerprint sensor 10, and then removing material from the card body 4 to form a cavity that exposes the pads 8.
  • the walls of the cavity are coated with an adhesive epoxy, and contacts 12 on the underside of the fingerprint sensor 10 are connected to the connection pads 8 of the circuit 6 using a conductive epoxy.
  • An electronic card 2 manufactured in accordance with this technique is illustrated in Figures 1A and 1 B.
  • 0.08 mm which is the thickness defined by the ISO 7816 specification for a smart card.
  • manufacturing a smart card in accordance with the method described above often results in a total thickness that is greater than the upper limit of 0.84 mm.
  • an electronic card comprising: a card body having a cavity formed therein; a circuit substrate embedded within the card body, the circuit substrate having a circuit with one or more contacts that are exposed by the cavity; a biometric sensor module mounted within the cavity with its rear face orientated towards the circuit substrate, the biometric sensor module having one or more contacts formed on a front face or a side face thereof; and a transition member mounted within the cavity adjacent the biometric sensor module and electrically connecting the contacts of the biometric sensor module to the contacts of the circuit.
  • the contacts for connection of the sensor module to the circuit are formed on a transition member adjacent the sensor module, i.e. with the sensor module and transition member preferably side-by-side.
  • These contacts, and the material bonding them together have a significant thickness relative to the thickness of the overall card.
  • the contact pads are no longer between the sensor module and the substrate, allowing the rear of the sensor module to be positioned physically closer to the circuit substrate.
  • the thickness of the sensor module typically dictates the thickness of the card as a whole; thus this configuration allows the card to be made thinner.
  • front and rear refer to the orientation of components with respect to the card, when assembled.
  • the front face of the card refers to the face of the card into which the cavity is formed, and from which the biometric sensor module is exposed.
  • the cavity is formed in the front face of the card and does not extend fully through the card. That is to say, the cavity is preferably a blind hole. Preferably the cavity does not extend below the depth of the circuit substrate.
  • the circuit substrate extends behind at least part of the cavity, i.e. when viewed from the front of the electronic card.
  • the rear face of the biometric sensor preferably faces towards the front face of the circuit substrate.
  • the biometric sensor is preferably permanently secured into the cavity, for example by bonding one or more side faces of the biometric sensor to one or more side walls of the cavity.
  • the rear face of the biometric sensor module is in contact with or (directly) bonded/attached to the circuit substrate.
  • the electronic card may include a thin layer of adhesive (e.g. an epoxy or the like) bonding the biometric sensor to the substrate and/or to the cavity walls.
  • a configuration in which the rear face of the biometric sensor module is in contact with the circuit substrate achieves minimal thickness of the electronic card.
  • the rear face of the transition member preferably faces towards the front face of the circuit substrate.
  • the contacts of the transition member are formed on a rear face of the transition member. That is to say, towards the rear with respect to the orientation of the biometric sensor module.
  • the rear surface of the transition member is offset away from the circuit substrate with respect to the rear surface of the biometric sensor module. This arrangement allows space for the contacts to engage without causing unnecessary thickness at the sensor module.
  • One or more electronic components may also be embedded within the card body and connected to the circuit for processing biometric data received from the biometric sensor.
  • the card body may be formed integrally about the embedded components, for example by lamination.
  • the electronic components include a memory and processor connected to the circuit, the memory storing reference data and the processor being configured to compare biometric data received from the sensor with the stored reference data.
  • the circuit may include an antenna for wireless communication with a card reader, for example using RF communication.
  • the card may be an RFID card.
  • the card may or may not include a battery for powering the RF
  • the biometric sensor module is preferably a fingerprint sensor module.
  • the fingerprint sensor module may apply a voltage to the finger to detect a fingerprint; for example, it may include an active capacitance fingerprint sensor.
  • the electronic card preferably has a thickness less than 0.84 mm, and preferably of about 0.76 mm (e.g. ⁇ 0.08 mm), which are the thickness of a normal smart card. These thicknesses have been difficult to achieve using prior art techniques.
  • the electronic card preferably also has a width of between 85.47 mm and 85.72 mm, and a height of between 53.92 mm and 54.03 mm. More generally, the electronic card preferably complies with ISO 7816, which is the specification for a smart card.
  • the card body is formed from PVC.
  • the circuit substrate is preferably a flexible circuit substrate, and may be flexible printed circuit board, for example the circuit may be etched on the flexible substrate.
  • the term "flexible substrate” is intended to include any substrate that is at least sufficiently flexible such that the card can comply with the bending requirements of ISO 7816.
  • the flexible circuit substrate preferably has a thickness of less than 0.20mm, more preferably less than 0.15mm and preferably less than 0.10mm. That is to say, the flexible circuit preferably does not provide a significant degree of reinforcement against bending of the smartcard.
  • the contacts of the transition member are connected to the contacts of the circuit using an anisotropic conductive adhesive, which is preferably epoxy-based.
  • An anisotropic conductive adhesive conducts only in one direction, i.e. the thickness direction. This means that the anisotropic conductive adhesive does not conduct between adjacent contacts, even if connected by the adhesive. This is particularly important when using a transition member because the transition member desirably has a relatively narrow width, compared to the sensor module, and so may have a higher density of contacts than if the contacts were arranged across the underside of the sensor module.
  • the card may further comprise a reinforcement member configured to protect the biometric sensor module, preferably against bending moments.
  • the biometric sensor is relatively weak compared to the main body of the card, and bending in particular can damage a biometric sensor.
  • reinforcement member can reduce the risk of damage to the sensor when bending by increasing the stiffness of the card at the location of the sensor module, and hence reducing the bending forces applied to the module.
  • the reinforcement member preferably also reinforces the transition member, and particularly the electrical connection between the transition member and the biometric sensor module.
  • the connection means e.g. fine wires or the like
  • the reinforcement member reduces such forces, by stiffening the card at this location, reducing the bending effect that could pull the biometric sensor away from the transition member.
  • the reinforcement member is preferably made of metal, such as steel (e.g. stainless steel) or copper. Metal has much higher resistance to bending than typical materials used to make such cards, e.g. PVC or other plastics materials.
  • the reinforcement member may be configured to operate as an electrode of the sensor.
  • the reinforcement member may comprise a conductive surface on the front face of the card for contact with the finger.
  • the reinforcement member may be thicker in cross-section, or may surround a greater amount of the sensor in order to provide the reinforcement effect.
  • the reinforcement member completely surrounds the sensor module (and the transition member).
  • the reinforcement member comprises at least a continuous reinforcement element circumscribing a sensing area of the fingerprint sensor.
  • the planar portion preferably provides an electrode contact surface having a width of at least 1 mm, more preferably at least 1.5mm, on each side of the fingerprint sensor.
  • the electrode contact surfaces preferably extend along the full length of each side of the sensing area of the fingerprint sensor.
  • the reinforcement member may comprise a planar portion adjacent a front face of the biometric sensor module and surrounding adjacent a sensing area of the biometric sensor module.
  • the planar portion may form a rectangular plate, an in one configuration has a central hole for the sensing area to be exposed, for example a rectangular hole.
  • the thickness of the planar portion is preferably at least 0.05 mm, more preferably at least 0.10mm, more preferably at least 0.20mm and most preferably between 0.30mm and 0.50mm. In a preferred embodiment, the thickness of the planar portion may be between 0.375mm and 0.425mm.
  • the planar portion is preferably substantially flat, for example having a flatness of less than 50 ⁇ per mm, more preferably less than 25 ⁇ per mm, more preferably less than 10 ⁇ per mm and most preferably less than 5 ⁇ per mm.
  • the reinforced electrode may comprise only the planar portion. That is to say, the electrode may be a planar electrode.
  • the reinforcement member may comprise an edge portion adjacent the sides of the biometric sensor module and the transition member.
  • the edge portion may form a closed shape around all sides of the biometric sensor module and transition member. For example, a tubular, rectangular shape.
  • the reinforcement member comprises both the planar portion and the edge portion, with the edge portion extending away from the plane of the planar portion. These portions may be integrally connected such that the reinforcement member has an open, box-like structure.
  • the reinforcement member in one example takes the form of an open frame with one or more sides of the frame having an inverted, L-shape section (i.e. with the bottom of the L-shape at the front of the card), preferably with the planar portion forming a horizontal of the inverted L-shape and the edge portion forming a vertical of the inverted L-shape.
  • This shape has been found to be highly effective at protecting the biometric sensor and transition member against damage.
  • the thickness of the, or each, of the planar portion and/or the edge portion may be at least 0.05 mm.
  • the electronic card may be any one of: an access card; a payment card, such as a credit card, a debit card or a pre-pay card; a loyalty card; an identity card; and a cryptographic card.
  • the electronic card is preferably arranged to be inoperable if the biometric sensor does not provide an indication of an authorised user.
  • the present invention also provides, in a second aspect, a method of manufacturing an electronic card, the method comprising: providing a biometric sensor having one or more contacts formed on a front face or a side face thereof; providing a card body including an embedded circuit substrate, a cavity in the card body exposing contacts of a circuit on the substrate; and mounting the biometric sensor and a transition member adjacent one another in the cavity such that the transition member electrically connects the contacts of the biometric sensor module to the contacts of the circuit.
  • the card being manufactured is a card according to the first aspect.
  • the card being manufactured may optionally include any or all of the optional features above, and the method may include providing such features.
  • the transition member is preferably electrically connected to the contacts of the biometric sensor before installing the biometric sensor and the transition member into the cavity.
  • the transition member may be electrically connected to the contacts of the biometric sensor after installing the biometric sensor and the transition member into the cavity.
  • walls of the cavity are coated with an adhesive (such as an epoxy) prior to the biometric sensor and transition member being inserted.
  • the adhesive seals the sensor and transition member in place to prevent them becoming dislodged and being disconnected from the circuit.
  • the transition member may be bonded or otherwise joined to the biometric sensor before installation into the cavity. This provides a single unit to be installed into the card body. Furthermore, the transition member may provide some protection to the relatively-fragile sensor module against bending.
  • the transition member may be bonded to the biometric sensor at the same time as the biometric sensor is bonded to the card body, e.g. when curing an epoxy holding the sensor module within the cavity.
  • the transition member is connected to the contacts using a conductive adhesive (e.g. a conductive epoxy).
  • a conductive adhesive e.g. a conductive epoxy
  • the conductive adhesive should be selected so that its curing temperature is low enough not to damage the biometric sensor.
  • the conductive adhesive may have a curing temperature of less than 100°C, more preferably less than 60°C, this being a typical maximum designed operating temperature for many biometric sensors. An adhesive that cures at room temperature may be used.
  • the conductive adhesive may be an anisotropic conductive adhesive.
  • anisotropic conductive adhesive means that substantial conduction does not occur between the contacts, even if some of the adhesive spills over between the contacts. This allows more freedom in selecting the technique/apparatus that applies the conductive a, since less accuracy is required.
  • the method may comprise forming the cavity, preferably by removing material from a preformed card body to form the cavity.
  • the cavity may be milled using a precision end mill or, more preferably, a laser mill.
  • a laser milling machine is very precise and can be adjusted to remove just the plastic and not the contact material, which is more difficult with conventional mechanical milling.
  • the depth of the milling is preferably designed to end just at the level of the circuit within the card body such that the contacts are exposed.
  • the card body may be formed by a method comprising: providing a first plastic layer; providing the circuit substrate on the first plastic layer; providing a second plastic layer on the first plastic layer with the circuit substrate interposed between the first plastic layer and the second plastic layer; and laminating the first plastic layer and the second plastic layer to form the card.
  • the laminating may be performed at a temperature of at least 135°C and/or a pressure of at least 5 MPa, and is preferably performed at a temperature of at least 150°C and a pressure of at least 6.5 MPa.
  • additional layers may be provided above and/or below the first and second layers prior to lamination.
  • the present method is particularly advantageous when the above manufacturing method is used to produce the card body.
  • the lamination process above allows for materials such PVC to be used for the card body.
  • the method of the present aspect it is possible for such a lamination technique to be used to provide an electronic card including heat sensitive parts.
  • known card forming techniques may be used to manufacture the card body allowing the manufacturing method of the present aspect to be compatible with existing techniques.
  • the method of the above aspect may be used to manufacture electronic cards for a number of purposes where it is necessary for the identity of the bearer of the electronic card to be verified.
  • the electronic card manufactured in accordance with the above aspect may be any one of: an access card; a credit card; a debit card; a pre-pay card; a loyalty card; an identity card; and a
  • the electronic card is preferably arranged to be inoperable if the biometric sensor does not provide an indication of an authorised user.
  • the electronic card may provide its desired function only when the biometric information confirms that the user is authorised.
  • the access card may provide access only when the user is authorised.
  • the method of the above aspect may be used to manufacture electronic cards which use any one or more of: an RFID circuit and/or an electrical contact pad.
  • Figures 1A and 1 B illustrate a first electronic card manufactured in accordance with a prior art method
  • Figures 2A and 2B illustrate a second electronic card having reduced thickness compared to the cards shown in Figure 1 ;
  • Figures 3A and 3B shows a variation of the second electronic card including a reinforcement member
  • Figure 4 shows a detail view of a first reinforcement member
  • Figure 5 shows a detail view of a second reinforcement member
  • Figure 6 shows a detail view of a third reinforcement member
  • FIG 7 shows a smartcard incorporating the third reinforcement member.
  • the fingerprint sensor module 4 has rows of contacts 12 on the rear surface (the side opposite to the scanning side) designed to be connected to a circuit 6 embedded in the smartcard 2.
  • This configuration results in two sets of contacts 8, 12 (one set on the card circuit 6 and one set on the sensor module 10) being present between the circuit layer 6 of the card 2 and the sensor 10.
  • These contacts 8, 12 have a considerable thickness, relative to the thickness of the card body 4, and have been found to result in an undesirable thick card 2, as a whole.
  • Figures 2A and 2B illustrate an alternative configuration for a card 20 that reduces this problem.
  • the sensor module 22 has contacts formed on the front surface of the module 22, i.e. the side one on which the finger is to be placed to be scanned.
  • a transition member 30 is provided in order to connect the contacts of the sensor module 22 to contacts 24 of the circuit 26 embedded within the body 28 of the card 20.
  • the transition member 30 is fitted into the cavity, adjacent the module 22.
  • the transition member 30 connects to the contacts of the sensor module 22 by wire bonding, and provides contact pads 32 on its rear surface that correspond to contact pads 24 on the flex circuit 26.
  • the rear face of the transition member 30 is offset with respect to the rear face of the sensor module 22 such that the rear surface of the sensor module 22 just touches the circuit substrate 26 of the card 20 when the contact pads 32 of the transmission member 30 are in contact with the pads 24 of the circuit.
  • the bond pads 32 that connect to the circuit 26 are formed on the offset transition member 30, and therefore card thickness can be reduced compared to the configuration of Figures 1 A and 1 B.
  • the fingerprint sensor 22 applies a high frequency AC voltage signal to the skin when a measurement takes place.
  • the individual pixels of the sensor 22 are excited by this signal and have a voltage impressed upon them that is a function of the closeness of the finger to the sensor 22.
  • the variable profile of the fingerprint is impressed on the sensor 22 and can be read out to form an image of the fingerprint.
  • Such fingerprint sensors are known as active capacitance fingerprint sensors (sometimes also known as an AC or RF fingerprint sensors).
  • An example of such fingerprint sensors include the FPC1025 and FPC1055 sensors manufactured by Fingerprint Cards AB.
  • this type of fingerprint sensor 22 It is necessary, for the correct function of this type of fingerprint sensor 22, to provide an electrode 42 at the periphery of the sensor face that is in contact with the finger.
  • This electrode 42 carries the electrical signal which causes the voltage signal to be imparted to the finger.
  • this electrode 42 has been shaped to form an enclosure, whereby the whole sensor face is surrounded (see Figure 3B). More specifically, the electrode 42 is shaped like a box and provides strength to the otherwise very vulnerable sensor module 22. As illustrated in Figure 3A, the box of the electrode 42 also encloses the transition member 30.
  • a box-like shape is relatively hard to bend.
  • the box-shape of the electrode 42 has a cross sectional thickness sufficient to provide the desired reinforcement. This configuration provides structural integrity for the fingerprint sensor 22 and transition member 30, which may be relatively weak and could be damaged or pulled apart when the card is bend, as well as a useful electrode for active capacitance fingerprint detection.
  • FIGs 4 and 5 show details of two alternative, exemplary reinforcement members 42' 42".
  • Both exemplary reinforcement members 42' 42" are shaped for use with a swipe-type fingerprint sensor 22, such as illustrated in Figures 1 to 3, but it will be appreciated that the sensor opening 47 in the reinforcement members 42' 42" could be modified to accommodate an area-type fingerprint sensor 64.
  • the reinforcement members 42', 42" each comprise an edge portion 44 that fits adjacent the sides of the biometric sensor module 22 and the transition member 30.
  • the edge portion 44 has a tubular, rectangular shape, although it is envisaged that, in some embodiment, it may not form a complete tube.
  • the edge portion 44 could be present only around the corners of the reinforcement member, or could be only present along the sides and not at the corners.
  • the reinforcement members 42', 42" further comprise a planar portion 46 that is formed integrally with the side portion 44, and fits adjacent a front face of the biometric sensor module 22. Thus a rectangular hole 47 for exposing the sensing area is formed that is bounded on one side by the planar portion 46 and on the other three by the side portion 44.
  • the planar portion 46' is strip-shaped and serves as the electrode for the sensor module 22. As can be seen from Figure 3A, the planar portion 46' covers the transition member 30, protecting the delicate wire-bonding between the transition member 30 and the sensor module 22 from being damaged as the card 40 flexes.
  • the reinforcement member 42' is in the shape of a rectangular frame having a generally inverted L-shape cross-section along one side, and a generally planar cross-section along the other sides.
  • the planar portion 46" extends around the entire reinforcement member 42". Thus, it surrounds a scanning area of the biometric sensor module 22.
  • the planar portion 46" is thus shaped as a rectangular plate with a rectangular hole 47 exposing the sensing area.
  • the reinforcement member 42' is in the shape of a rectangular frame having a generally inverted L-shape cross-section along all of its sides. These shapes have been found to be highly effective at protecting the biometric sensor module 22, and also the electrical connections to the transition member 30, against damage.
  • FIG. 6 shows details of a further alternative, exemplary reinforcement member 48.
  • This third reinforcement member 48 is shaped for use with an area- type fingerprint sensor 64, but it will again be appreciated that the sensor opening 52 in the reinforcement member 48 could be modified to accommodate a swipe- type fingerprint sensor 22.
  • the third reinforcement member 48 does not comprise an edge portion to fit adjacent the sides of the biometric sensor module and the transition member.
  • the third reinforcement member 48 comprises only a planar portion 50 that fits adjacent a front face of the biometric sensor module.
  • the planar portion 50 extends around the entire reinforcement member 48. Thus, it surrounds a scanning area of the biometric sensor module.
  • the planar portion 50 is thus shaped as a rectangular plate with a square hole 52 exposing the sensing area.
  • the planar portion 50 has an outer length and width of 16.31 mm ⁇ 0.05mm and the rectangular hole 52 has a length and width of 12.64 mm ⁇ 0.05mm.
  • the corners of the rectangular hole 52 are curved at a radius of 0.25mm.
  • planar portion 46"' defines a conductive strip having a width of
  • the planar portion 50 has a thickness of 0.40mm ⁇ 0.025mm and has a flatness of less than 5 ⁇ per mm.
  • This shape has also been found to be highly effective at protecting the biometric sensor module against damage from bending.
  • An electronic payment card 60 having a card body 62 and an area-type fingerprint sensor 64 is illustrated in Figure 7.
  • the card 60 is shown incorporating the third reinforcement member 48 circumscribing a sensor area of the fingerprint sensor 64.
  • the smart card 20, 40, 60 comprise the card body 28, 62 and a circuit substrate 26 enclosed within the card body.
  • the circuit substrate 26 is in the form of a flexible printed circuit 26, which is preferably made from polyamide or FR-4 grade glass-reinforced epoxy laminate, with an etched, copper circuit formed on the surface.
  • the circuit substrate 26 is laminated between at least two layers of plastic.
  • the at least two layers of plastic include an first layer of plastic and a second layer of plastic with the circuit 26 sandwiched between the first and second layers.
  • the layers of plastic are made of PVC; however, other plastics may be used. Examples of other suitable plastics include polyester, acrylonitrile-butadiene-styrene (ABS), and any other suitable plastic. Additionally, plasticisers or dyes may be added to the plastic to achieve a desired look and feel.
  • An antenna 30 is connected to the circuit substrate 26 and is also embedded within the card body 28, 62.
  • the antenna 30 is used to communicate with a card reader, which is external to card 20, 40.
  • the antenna 30 may be formed by etching a suitable pattern onto a copper cladding of the printed circuit 26.
  • the memory is arranged to store biometric information relating to a bearer of the smart card 20, 40 and the processor is arranged to compare the biometric information stored on the memory to biometric information acquired by the biometric sensor module 22, 64 and communicated via the contacts 24 of the circuit substrate 26.
  • the processor is therefore arranged to determine if the user is an authorised user based on an indication provided by the biometric sensor.
  • the processor is arranged to communicate the data stored on the memory to a card reader, for example using the antenna 30.
  • the additional components 36 may, in some embodiments, also include a battery which is configured to power the memory and processor.
  • the card 20, 40 may be arranged to be powered via a contact pad (not shown) that couples to a power source, such as a contact card reader, or the card 20, 40 may be arranged to draw power from the antenna 34 when it is energised by a contactless card reader.
  • the cards 20, 40 shown in Figures 2 and 3 may be manufactured using a suitably modified version of the method described in US 2015/049925.
  • an exemplary method of manufacturing the cards 20, 40 includes: forming a card body 28, 62 including a circuit substrate 26 on which is formed a circuit having contacts 24 for connection to a biometric sensor 22, 64, the contacts 24 being embedded within the card body 28, 62;
  • the electrode 42 may be fitted to the biometric sensor 22, 64 and transition member 30 before installation into the cavity, or may be installed around the biometric sensor 22, 64 and transition member 30 after their installation into the cavity.
  • the card body 28, 62 may be produced by a hot lamination method, for example as described in US 6,586,078 B2.
  • a suitable hot lamination method could comprise the following steps:
  • forming a core by providing first and second layers of plastic and positioning the circuit substrate 26 between the first and second layers of plastic to thus form the core;
  • processing techniques may then be applied to the core to form the card body 28, 62.
  • processing techniques may include inking, the formation of an
  • the cavity is then milled into the surface of the card body 28, 62. This may be done using a precision end mill or, more preferably, a laser mill. The depth of the milling is set so that the base of the cavity is at the level of the circuit substrate 26 within the card body 28, 62, such that the contacts 24 are exposed.
  • a conductive epoxy is then applied to the surface of the contacts 24 of the circuit prior to the biometric sensor module 22, 64 and transition member 30 being inserted.
  • a suitable conductive epoxy is type SEC1222 epoxy, manufactured by Resinlab, LLC of Wisconsin USA, which cures at room temperatures (approx. 25°C).
  • a conductive epoxy having a strongly anisotropic characteristic may be used. This is beneficial when the contacts 24 on the transition member 30 are very close together because it provides the required conductivity between the respective contacts 24, 32, whilst ensuring that the epoxy does not form any appreciable conductive path between adjacent contacts, even if the conductive epoxy flows between them.
  • the biometric sensor 22, 64 and transition member 30 are then electrically connected and bonded to one another, aligned with the cavity and pushed into the cavity such that the contacts 32 on the transition member 30 and the contacts 24 in the circuit substrate 24 are brought into electrical contact through the conductive epoxy.
  • the rear surface of the sensor module 22, 64 is flush against the circuit substrate, thus minimising the projection of the module 22, 64 from the card body 28, 62.
  • the conductive epoxy and adhesive epoxy preferably cure without heating.
  • one or both of the conductive epoxy and adhesive epoxy may require heat curing where the curing temperature of the conductive epoxy and/or adhesive epoxy is below a safe temperature of the biometric sensor module 22, 64, for example below 60°C. Higher temperatures may be possible for short time periods and/or for different sensor types.

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Abstract

A low thickness biometric card 20 comprises a card body 28 having a circuit substrate 26 embedded therein and a cavity exposing one or more contacts 24 of a circuit on the circuit substrate 26. A biometric sensor 22 is mounted within the cavity with its rear face orientated towards the circuit substrate 26. A transition member 30 is also mounted within the cavity adjacent the biometric sensor 22. The biometric sensor 22 has one or more contacts formed on its front face or one of its side faces, and the transition member 30 connects the contacts of the biometric sensor 22 to the contacts 24 of the circuit.

Description

BIOMETRIC CARD
The present invention relates to an electronic card including a biometric sensor, particularly a fingerprint sensor, and to a method of manufacturing such an electronic card.
US 2015/049925 describes an example of a prior art technique for manufacturing an electronic "smart" card 2 including a fingerprint sensor 10. In that method, the electronic card 2 is manufactured by first forming a card body 4 with an embedded circuit 6 that includes connection pads 8 for connection to a fingerprint sensor 10, and then removing material from the card body 4 to form a cavity that exposes the pads 8. The walls of the cavity are coated with an adhesive epoxy, and contacts 12 on the underside of the fingerprint sensor 10 are connected to the connection pads 8 of the circuit 6 using a conductive epoxy. An electronic card 2 manufactured in accordance with this technique is illustrated in Figures 1A and 1 B.
It is desirable to manufacture smart cards having a thickness of 0.76 mm ±
0.08 mm, which is the thickness defined by the ISO 7816 specification for a smart card. However, it has been found that manufacturing a smart card in accordance with the method described above often results in a total thickness that is greater than the upper limit of 0.84 mm.
The present invention provides, in a first aspect, an electronic card comprising: a card body having a cavity formed therein; a circuit substrate embedded within the card body, the circuit substrate having a circuit with one or more contacts that are exposed by the cavity; a biometric sensor module mounted within the cavity with its rear face orientated towards the circuit substrate, the biometric sensor module having one or more contacts formed on a front face or a side face thereof; and a transition member mounted within the cavity adjacent the biometric sensor module and electrically connecting the contacts of the biometric sensor module to the contacts of the circuit.
In accordance with this configuration, the contacts for connection of the sensor module to the circuit are formed on a transition member adjacent the sensor module, i.e. with the sensor module and transition member preferably side-by-side. These contacts, and the material bonding them together (such as a conductive epoxy), have a significant thickness relative to the thickness of the overall card. In the proposed configuration, the contact pads are no longer between the sensor module and the substrate, allowing the rear of the sensor module to be positioned physically closer to the circuit substrate. The thickness of the sensor module typically dictates the thickness of the card as a whole; thus this configuration allows the card to be made thinner.
For the avoidance of doubt, the terms "front" and "rear", as used herein, refer to the orientation of components with respect to the card, when assembled. The front face of the card refers to the face of the card into which the cavity is formed, and from which the biometric sensor module is exposed.
Preferably, the cavity is formed in the front face of the card and does not extend fully through the card. That is to say, the cavity is preferably a blind hole. Preferably the cavity does not extend below the depth of the circuit substrate.
Preferably the circuit substrate extends behind at least part of the cavity, i.e. when viewed from the front of the electronic card. The rear face of the biometric sensor preferably faces towards the front face of the circuit substrate. The biometric sensor is preferably permanently secured into the cavity, for example by bonding one or more side faces of the biometric sensor to one or more side walls of the cavity. In one embodiment, the rear face of the biometric sensor module is in contact with or (directly) bonded/attached to the circuit substrate. For example, the electronic card may include a thin layer of adhesive (e.g. an epoxy or the like) bonding the biometric sensor to the substrate and/or to the cavity walls. A configuration in which the rear face of the biometric sensor module is in contact with the circuit substrate achieves minimal thickness of the electronic card.
The rear face of the transition member preferably faces towards the front face of the circuit substrate. Preferably, the contacts of the transition member are formed on a rear face of the transition member. That is to say, towards the rear with respect to the orientation of the biometric sensor module. Preferably, the rear surface of the transition member is offset away from the circuit substrate with respect to the rear surface of the biometric sensor module. This arrangement allows space for the contacts to engage without causing unnecessary thickness at the sensor module.
One or more electronic components may also be embedded within the card body and connected to the circuit for processing biometric data received from the biometric sensor. The card body may be formed integrally about the embedded components, for example by lamination.
In one embodiment, the electronic components include a memory and processor connected to the circuit, the memory storing reference data and the processor being configured to compare biometric data received from the sensor with the stored reference data.
The circuit may include an antenna for wireless communication with a card reader, for example using RF communication. Thus, the card may be an RFID card. The card may or may not include a battery for powering the RF
communication.
The biometric sensor module is preferably a fingerprint sensor module. In various embodiments, the fingerprint sensor module may apply a voltage to the finger to detect a fingerprint; for example, it may include an active capacitance fingerprint sensor.
The electronic card preferably has a thickness less than 0.84 mm, and preferably of about 0.76 mm (e.g. ± 0.08 mm), which are the thickness of a normal smart card. These thicknesses have been difficult to achieve using prior art techniques. The electronic card preferably also has a width of between 85.47 mm and 85.72 mm, and a height of between 53.92 mm and 54.03 mm. More generally, the electronic card preferably complies with ISO 7816, which is the specification for a smart card.
In various embodiments, the card body is formed from PVC. The circuit substrate is preferably a flexible circuit substrate, and may be flexible printed circuit board, for example the circuit may be etched on the flexible substrate. The term "flexible substrate" is intended to include any substrate that is at least sufficiently flexible such that the card can comply with the bending requirements of ISO 7816. The flexible circuit substrate preferably has a thickness of less than 0.20mm, more preferably less than 0.15mm and preferably less than 0.10mm. That is to say, the flexible circuit preferably does not provide a significant degree of reinforcement against bending of the smartcard.
In some embodiments, the contacts of the transition member are connected to the contacts of the circuit using an anisotropic conductive adhesive, which is preferably epoxy-based. An anisotropic conductive adhesive conducts only in one direction, i.e. the thickness direction. This means that the anisotropic conductive adhesive does not conduct between adjacent contacts, even if connected by the adhesive. This is particularly important when using a transition member because the transition member desirably has a relatively narrow width, compared to the sensor module, and so may have a higher density of contacts than if the contacts were arranged across the underside of the sensor module. The card may further comprise a reinforcement member configured to protect the biometric sensor module, preferably against bending moments. The biometric sensor is relatively weak compared to the main body of the card, and bending in particular can damage a biometric sensor. The addition of a
reinforcement member can reduce the risk of damage to the sensor when bending by increasing the stiffness of the card at the location of the sensor module, and hence reducing the bending forces applied to the module.
The reinforcement member preferably also reinforces the transition member, and particularly the electrical connection between the transition member and the biometric sensor module. The connection means (e.g. fine wires or the like) will typically extend length-ways along the card and between the biometric sensor module and the transition module, and may be close to the face of the card. Thus, length-ways bending of the card could put high strain on these connections. The reinforcement member reduces such forces, by stiffening the card at this location, reducing the bending effect that could pull the biometric sensor away from the transition member.
The reinforcement member is preferably made of metal, such as steel (e.g. stainless steel) or copper. Metal has much higher resistance to bending than typical materials used to make such cards, e.g. PVC or other plastics materials.
In one embodiment, where biometric sensor is an active capacitance fingerprint sensor, the reinforcement member may be configured to operate as an electrode of the sensor. For example, the reinforcement member may comprise a conductive surface on the front face of the card for contact with the finger.
Compared to normal electrodes, the reinforcement member may be thicker in cross-section, or may surround a greater amount of the sensor in order to provide the reinforcement effect.
In preferred embodiments, the reinforcement member completely surrounds the sensor module (and the transition member). Preferably the reinforcement member comprises at least a continuous reinforcement element circumscribing a sensing area of the fingerprint sensor. The planar portion preferably provides an electrode contact surface having a width of at least 1 mm, more preferably at least 1.5mm, on each side of the fingerprint sensor. The electrode contact surfaces preferably extend along the full length of each side of the sensing area of the fingerprint sensor The reinforcement member may comprise a planar portion adjacent a front face of the biometric sensor module and surrounding adjacent a sensing area of the biometric sensor module. The planar portion may form a rectangular plate, an in one configuration has a central hole for the sensing area to be exposed, for example a rectangular hole.
The thickness of the planar portion is preferably at least 0.05 mm, more preferably at least 0.10mm, more preferably at least 0.20mm and most preferably between 0.30mm and 0.50mm. In a preferred embodiment, the thickness of the planar portion may be between 0.375mm and 0.425mm.
The planar portion is preferably substantially flat, for example having a flatness of less than 50μηι per mm, more preferably less than 25μηι per mm, more preferably less than 10μηι per mm and most preferably less than 5μηι per mm.
In one embodiment, the reinforced electrode may comprise only the planar portion. That is to say, the electrode may be a planar electrode.
The reinforcement member may comprise an edge portion adjacent the sides of the biometric sensor module and the transition member. The edge portion may form a closed shape around all sides of the biometric sensor module and transition member. For example, a tubular, rectangular shape.
In one embodiment the reinforcement member comprises both the planar portion and the edge portion, with the edge portion extending away from the plane of the planar portion. These portions may be integrally connected such that the reinforcement member has an open, box-like structure.
The reinforcement member, in one example takes the form of an open frame with one or more sides of the frame having an inverted, L-shape section (i.e. with the bottom of the L-shape at the front of the card), preferably with the planar portion forming a horizontal of the inverted L-shape and the edge portion forming a vertical of the inverted L-shape. This shape has been found to be highly effective at protecting the biometric sensor and transition member against damage.
The thickness of the, or each, of the planar portion and/or the edge portion may be at least 0.05 mm.
The electronic card may be any one of: an access card; a payment card, such as a credit card, a debit card or a pre-pay card; a loyalty card; an identity card; and a cryptographic card. The electronic card is preferably arranged to be inoperable if the biometric sensor does not provide an indication of an authorised user. The present invention also provides, in a second aspect, a method of manufacturing an electronic card, the method comprising: providing a biometric sensor having one or more contacts formed on a front face or a side face thereof; providing a card body including an embedded circuit substrate, a cavity in the card body exposing contacts of a circuit on the substrate; and mounting the biometric sensor and a transition member adjacent one another in the cavity such that the transition member electrically connects the contacts of the biometric sensor module to the contacts of the circuit.
This method of manufacture results in a card having a reduced thickness compared to prior art techniques. In various embodiments, the card being manufactured is a card according to the first aspect. Thus, the card being manufactured may optionally include any or all of the optional features above, and the method may include providing such features.
In the method, the transition member is preferably electrically connected to the contacts of the biometric sensor before installing the biometric sensor and the transition member into the cavity. Alternatively, however, the transition member may be electrically connected to the contacts of the biometric sensor after installing the biometric sensor and the transition member into the cavity.
Preferably walls of the cavity are coated with an adhesive (such as an epoxy) prior to the biometric sensor and transition member being inserted. The adhesive seals the sensor and transition member in place to prevent them becoming dislodged and being disconnected from the circuit.
The transition member may be bonded or otherwise joined to the biometric sensor before installation into the cavity. This provides a single unit to be installed into the card body. Furthermore, the transition member may provide some protection to the relatively-fragile sensor module against bending.
In other embodiments, the transition member may be bonded to the biometric sensor at the same time as the biometric sensor is bonded to the card body, e.g. when curing an epoxy holding the sensor module within the cavity.
Preferably, the transition member is connected to the contacts using a conductive adhesive (e.g. a conductive epoxy). This ensures a good ohmic contact between the sensor and the contacts within the cavity. The conductive adhesive should be selected so that its curing temperature is low enough not to damage the biometric sensor. For example, the conductive adhesive may have a curing temperature of less than 100°C, more preferably less than 60°C, this being a typical maximum designed operating temperature for many biometric sensors. An adhesive that cures at room temperature may be used.
The conductive adhesive may be an anisotropic conductive adhesive. As above, the use of anisotropic conductive adhesive means that substantial conduction does not occur between the contacts, even if some of the adhesive spills over between the contacts. This allows more freedom in selecting the technique/apparatus that applies the conductive a, since less accuracy is required.
The method may comprise forming the cavity, preferably by removing material from a preformed card body to form the cavity. Particularly, the cavity may be milled using a precision end mill or, more preferably, a laser mill. A laser milling machine is very precise and can be adjusted to remove just the plastic and not the contact material, which is more difficult with conventional mechanical milling.
The depth of the milling is preferably designed to end just at the level of the circuit within the card body such that the contacts are exposed.
The card body may be formed by a method comprising: providing a first plastic layer; providing the circuit substrate on the first plastic layer; providing a second plastic layer on the first plastic layer with the circuit substrate interposed between the first plastic layer and the second plastic layer; and laminating the first plastic layer and the second plastic layer to form the card. The laminating may be performed at a temperature of at least 135°C and/or a pressure of at least 5 MPa, and is preferably performed at a temperature of at least 150°C and a pressure of at least 6.5 MPa. In some embodiments, additional layers may be provided above and/or below the first and second layers prior to lamination.
The present method is particularly advantageous when the above manufacturing method is used to produce the card body. Particularly, the lamination process above allows for materials such PVC to be used for the card body. With the method of the present aspect, it is possible for such a lamination technique to be used to provide an electronic card including heat sensitive parts. Additionally, by pre-forming the card body in this manner, known card forming techniques may be used to manufacture the card body allowing the manufacturing method of the present aspect to be compatible with existing techniques.
The method of the above aspect may be used to manufacture electronic cards for a number of purposes where it is necessary for the identity of the bearer of the electronic card to be verified. For example, the electronic card manufactured in accordance with the above aspect may be any one of: an access card; a credit card; a debit card; a pre-pay card; a loyalty card; an identity card; and a
cryptographic card. As discussed above, the electronic card is preferably arranged to be inoperable if the biometric sensor does not provide an indication of an authorised user. Thus, the electronic card may provide its desired function only when the biometric information confirms that the user is authorised. For example, where the electronic card is an access card, the access card may provide access only when the user is authorised. Further, the method of the above aspect may be used to manufacture electronic cards which use any one or more of: an RFID circuit and/or an electrical contact pad.
Certain preferred embodiments of the present invention will now be described in greater detail, by way of example only, with reference to the accompanying drawings, in which:
Figures 1A and 1 B illustrate a first electronic card manufactured in accordance with a prior art method;
Figures 2A and 2B illustrate a second electronic card having reduced thickness compared to the cards shown in Figure 1 ;
Figures 3A and 3B shows a variation of the second electronic card including a reinforcement member;
Figure 4 shows a detail view of a first reinforcement member;
Figure 5 shows a detail view of a second reinforcement member;
Figure 6 shows a detail view of a third reinforcement member; and
Figure 7 shows a smartcard incorporating the third reinforcement member. In the card 2 illustrated in Figures 1 A and 1 B, the fingerprint sensor module 4 has rows of contacts 12 on the rear surface (the side opposite to the scanning side) designed to be connected to a circuit 6 embedded in the smartcard 2. This configuration results in two sets of contacts 8, 12 (one set on the card circuit 6 and one set on the sensor module 10) being present between the circuit layer 6 of the card 2 and the sensor 10. These contacts 8, 12 have a considerable thickness, relative to the thickness of the card body 4, and have been found to result in an undesirable thick card 2, as a whole.
Figures 2A and 2B illustrate an alternative configuration for a card 20 that reduces this problem. In this configuration, the sensor module 22 has contacts formed on the front surface of the module 22, i.e. the side one on which the finger is to be placed to be scanned. In order to connect the contacts of the sensor module 22 to contacts 24 of the circuit 26 embedded within the body 28 of the card 20, a transition member 30 is provided. The transition member 30 is fitted into the cavity, adjacent the module 22. The transition member 30 connects to the contacts of the sensor module 22 by wire bonding, and provides contact pads 32 on its rear surface that correspond to contact pads 24 on the flex circuit 26.
The rear face of the transition member 30 is offset with respect to the rear face of the sensor module 22 such that the rear surface of the sensor module 22 just touches the circuit substrate 26 of the card 20 when the contact pads 32 of the transmission member 30 are in contact with the pads 24 of the circuit.
Thus, in Figures 2A and 2B, the bond pads 32 that connect to the circuit 26 are formed on the offset transition member 30, and therefore card thickness can be reduced compared to the configuration of Figures 1 A and 1 B.
In a preferred embodiment, the fingerprint sensor 22 applies a high frequency AC voltage signal to the skin when a measurement takes place. The individual pixels of the sensor 22 are excited by this signal and have a voltage impressed upon them that is a function of the closeness of the finger to the sensor 22. In other words the variable profile of the fingerprint is impressed on the sensor 22 and can be read out to form an image of the fingerprint. Such fingerprint sensors are known as active capacitance fingerprint sensors (sometimes also known as an AC or RF fingerprint sensors). An example of such fingerprint sensors include the FPC1025 and FPC1055 sensors manufactured by Fingerprint Cards AB.
It is necessary, for the correct function of this type of fingerprint sensor 22, to provide an electrode 42 at the periphery of the sensor face that is in contact with the finger. This electrode 42 carries the electrical signal which causes the voltage signal to be imparted to the finger.
In the card 40 shown in Figures 3A and 3B, this electrode 42 has been shaped to form an enclosure, whereby the whole sensor face is surrounded (see Figure 3B). More specifically, the electrode 42 is shaped like a box and provides strength to the otherwise very vulnerable sensor module 22. As illustrated in Figure 3A, the box of the electrode 42 also encloses the transition member 30.
A box-like shape is relatively hard to bend. The box-shape of the electrode 42 has a cross sectional thickness sufficient to provide the desired reinforcement. This configuration provides structural integrity for the fingerprint sensor 22 and transition member 30, which may be relatively weak and could be damaged or pulled apart when the card is bend, as well as a useful electrode for active capacitance fingerprint detection.
Figures 4 and 5 show details of two alternative, exemplary reinforcement members 42' 42". Both exemplary reinforcement members 42' 42" are shaped for use with a swipe-type fingerprint sensor 22, such as illustrated in Figures 1 to 3, but it will be appreciated that the sensor opening 47 in the reinforcement members 42' 42" could be modified to accommodate an area-type fingerprint sensor 64.
The reinforcement members 42', 42" each comprise an edge portion 44 that fits adjacent the sides of the biometric sensor module 22 and the transition member 30. The edge portion 44 has a tubular, rectangular shape, although it is envisaged that, in some embodiment, it may not form a complete tube. For example, the edge portion 44 could be present only around the corners of the reinforcement member, or could be only present along the sides and not at the corners.
The reinforcement members 42', 42" further comprise a planar portion 46 that is formed integrally with the side portion 44, and fits adjacent a front face of the biometric sensor module 22. Thus a rectangular hole 47 for exposing the sensing area is formed that is bounded on one side by the planar portion 46 and on the other three by the side portion 44.
In the first reinforcement member 42', the planar portion 46' is strip-shaped and serves as the electrode for the sensor module 22. As can be seen from Figure 3A, the planar portion 46' covers the transition member 30, protecting the delicate wire-bonding between the transition member 30 and the sensor module 22 from being damaged as the card 40 flexes.
In this example, the reinforcement member 42' is in the shape of a rectangular frame having a generally inverted L-shape cross-section along one side, and a generally planar cross-section along the other sides.
In the second reinforcement member 42", the planar portion 46" extends around the entire reinforcement member 42". Thus, it surrounds a scanning area of the biometric sensor module 22. The planar portion 46" is thus shaped as a rectangular plate with a rectangular hole 47 exposing the sensing area.
In this example, the reinforcement member 42' is in the shape of a rectangular frame having a generally inverted L-shape cross-section along all of its sides. These shapes have been found to be highly effective at protecting the biometric sensor module 22, and also the electrical connections to the transition member 30, against damage.
Figure 6 shows details of a further alternative, exemplary reinforcement member 48. This third reinforcement member 48 is shaped for use with an area- type fingerprint sensor 64, but it will again be appreciated that the sensor opening 52 in the reinforcement member 48 could be modified to accommodate a swipe- type fingerprint sensor 22.
The third reinforcement member 48 does not comprise an edge portion to fit adjacent the sides of the biometric sensor module and the transition member.
Instead, the third reinforcement member 48 comprises only a planar portion 50 that fits adjacent a front face of the biometric sensor module.
In the third reinforcement member 48, the planar portion 50 extends around the entire reinforcement member 48. Thus, it surrounds a scanning area of the biometric sensor module. The planar portion 50 is thus shaped as a rectangular plate with a square hole 52 exposing the sensing area.
The planar portion 50 has an outer length and width of 16.31 mm ± 0.05mm and the rectangular hole 52 has a length and width of 12.64 mm ± 0.05mm. The corners of the rectangular hole 52 are curved at a radius of 0.25mm.
Thus, the planar portion 46"' defines a conductive strip having a width of
1.82mm extending all the way around the rectangular hole 52, and hence around the sensing area. It will be appreciated that the width of the planar portion 50 could be enlarged on one side, similar to the first and second reinforcement members 42', 42", to also reinforce a transition member or the like.
The planar portion 50 has a thickness of 0.40mm ± 0.025mm and has a flatness of less than 5μηι per mm.
This shape has also been found to be highly effective at protecting the biometric sensor module against damage from bending.
An electronic payment card 60 having a card body 62 and an area-type fingerprint sensor 64 is illustrated in Figure 7. The card 60 is shown incorporating the third reinforcement member 48 circumscribing a sensor area of the fingerprint sensor 64.
Further features of the cards 20, 40, 60 are discussed below.
The smart card 20, 40, 60 comprise the card body 28, 62 and a circuit substrate 26 enclosed within the card body. The circuit substrate 26 is in the form of a flexible printed circuit 26, which is preferably made from polyamide or FR-4 grade glass-reinforced epoxy laminate, with an etched, copper circuit formed on the surface.
The circuit substrate 26 is laminated between at least two layers of plastic. The at least two layers of plastic include an first layer of plastic and a second layer of plastic with the circuit 26 sandwiched between the first and second layers. The layers of plastic are made of PVC; however, other plastics may be used. Examples of other suitable plastics include polyester, acrylonitrile-butadiene-styrene (ABS), and any other suitable plastic. Additionally, plasticisers or dyes may be added to the plastic to achieve a desired look and feel.
An antenna 30 is connected to the circuit substrate 26 and is also embedded within the card body 28, 62. The antenna 30 is used to communicate with a card reader, which is external to card 20, 40. The antenna 30 may be formed by etching a suitable pattern onto a copper cladding of the printed circuit 26.
A number of additional components are also mounted to the circuit substrate
26. These include a processor and a memory. The memory is arranged to store biometric information relating to a bearer of the smart card 20, 40 and the processor is arranged to compare the biometric information stored on the memory to biometric information acquired by the biometric sensor module 22, 64 and communicated via the contacts 24 of the circuit substrate 26. The processor is therefore arranged to determine if the user is an authorised user based on an indication provided by the biometric sensor.
Furthermore, subject to verification of the bearer of the smart card 20, 40, the processor is arranged to communicate the data stored on the memory to a card reader, for example using the antenna 30.
The additional components 36 may, in some embodiments, also include a battery which is configured to power the memory and processor. Alternatively, or in addition to the battery, the card 20, 40 may be arranged to be powered via a contact pad (not shown) that couples to a power source, such as a contact card reader, or the card 20, 40 may be arranged to draw power from the antenna 34 when it is energised by a contactless card reader.
The cards 20, 40 shown in Figures 2 and 3 may be manufactured using a suitably modified version of the method described in US 2015/049925.
For example, an exemplary method of manufacturing the cards 20, 40 includes: forming a card body 28, 62 including a circuit substrate 26 on which is formed a circuit having contacts 24 for connection to a biometric sensor 22, 64, the contacts 24 being embedded within the card body 28, 62;
forming a cavity in the card body 28, 62 to expose the contacts 24 and to receive the biometric sensor module 22, 64 and transition member 30;
connecting the contacts of the biometric sensor module 22, 64 to the transition member 30;
installing the biometric sensor module 22, 64 and the transition member 30 into the cavity; and
connecting the contacts 32 of the transition member 30 to the contacts 24 of the circuit 26 using a conductive epoxy.
The electrode 42, if desired, may be fitted to the biometric sensor 22, 64 and transition member 30 before installation into the cavity, or may be installed around the biometric sensor 22, 64 and transition member 30 after their installation into the cavity.
The card body 28, 62 may be produced by a hot lamination method, for example as described in US 6,586,078 B2. A suitable hot lamination method could comprise the following steps:
forming a core by providing first and second layers of plastic and positioning the circuit substrate 26 between the first and second layers of plastic to thus form the core;
placing the core in a laminator;
applying a heat cycle to the core in the laminator to liquefying or partially liquefying the layers of plastic, the heat cycle operating at a temperature of between 135°C and 250°C;
increasing a laminator ram pressure in combination with the heat to a pressure of approximately 6.5 MPa;
applying a cooling cycle to the core in the laminator with an associated increase in ram pressure of approximately 25% until the core has cooled to approximately 5°C to 20°C; and
removing the core from the laminator.
Conventional processing techniques, that would be well known to the person skilled in the art, may then be applied to the core to form the card body 28, 62. Such processing techniques may include inking, the formation of an
overlaminate film, or the like. The cavity is then milled into the surface of the card body 28, 62. This may be done using a precision end mill or, more preferably, a laser mill. The depth of the milling is set so that the base of the cavity is at the level of the circuit substrate 26 within the card body 28, 62, such that the contacts 24 are exposed.
A conductive epoxy is then applied to the surface of the contacts 24 of the circuit prior to the biometric sensor module 22, 64 and transition member 30 being inserted. A suitable conductive epoxy is type SEC1222 epoxy, manufactured by Resinlab, LLC of Wisconsin USA, which cures at room temperatures (approx. 25°C).
A conductive epoxy having a strongly anisotropic characteristic may be used. This is beneficial when the contacts 24 on the transition member 30 are very close together because it provides the required conductivity between the respective contacts 24, 32, whilst ensuring that the epoxy does not form any appreciable conductive path between adjacent contacts, even if the conductive epoxy flows between them.
Interior walls of the cavity are coated with an adhesive epoxy prior to the biometric sensor module 22, 64 and transition member 30 being inserted. The adhesive epoxy seals the biometric sensor module 22, 64 and transition member 30 in place to prevent them from becoming dislodged and becoming disconnected from the contacts 24 of the circuit substrate 26.
The biometric sensor 22, 64 and transition member 30 are then electrically connected and bonded to one another, aligned with the cavity and pushed into the cavity such that the contacts 32 on the transition member 30 and the contacts 24 in the circuit substrate 24 are brought into electrical contact through the conductive epoxy. Preferably, the rear surface of the sensor module 22, 64 is flush against the circuit substrate, thus minimising the projection of the module 22, 64 from the card body 28, 62.
The conductive epoxy and adhesive epoxy preferably cure without heating.
However, alternatively, one or both of the conductive epoxy and adhesive epoxy may require heat curing where the curing temperature of the conductive epoxy and/or adhesive epoxy is below a safe temperature of the biometric sensor module 22, 64, for example below 60°C. Higher temperatures may be possible for short time periods and/or for different sensor types.

Claims

CLAIMS:
1. An electronic card comprising:
a card body having a cavity formed therein;
a circuit substrate embedded within the card body, the circuit substrate having a circuit with one or more contacts that are exposed by the cavity;
a biometric sensor mounted within the cavity with its rear face orientated towards the circuit substrate, the biometric sensor having one or more contacts formed on a front face or a side face thereof; and
a transition member mounted within the cavity adjacent the biometric sensor module and electrically connecting the contacts of the biometric sensor to the contacts of the circuit.
2. An electronic card according to claim 1 , wherein the rear face of the biometric sensor is in contact with or bonded to the circuit substrate.
3. An electronic card according to claim 1 or 2, wherein the contacts of the transition member are formed on a rear face of the transition member.
4. An electronic card according to claim 1 , 2 or 3, wherein the rear surface of the transition member is offset away from the circuit substrate with respect to the rear surface of the biometric sensor.
5. An electronic card according to any preceding claim, wherein the one or more electronic components are connected to the circuit for processing biometric data received from the biometric sensor and are embedded within the card body.
6. An electronic card according to any preceding claim, wherein the biometric sensor module is a fingerprint sensor module.
7. An electronic card according to any preceding claim, wherein the electronic card has a thickness less than 0.84 mm, and preferably of about 0.76 mm.
8. An electronic card according to any preceding claim, wherein the electronic card is a laminated card.
9. An electronic card according to any preceding claim, wherein the contacts of the transition member are connected to the contacts of the circuit substrate using a anisotropic conductive adhesive.
10. An electronic card according to any preceding claim, further comprising a reinforcement member configured to protect the biometric sensor module and transition member against damage caused by bending.
1 1 . An electronic card according to claim 10, wherein the reinforcement member has an open frame shape and encloses the sensor module and the transition member.
12. An electronic card according to any preceding claim, wherein the electronic card is a payment card.
13. A method of manufacturing an electronic card, the method comprising: providing a biometric sensor having one or more contacts formed on a front face or a side face thereof;
providing a card body including an embedded circuit substrate, a cavity in the card body exposing contacts of a circuit on the substrate; and
mounting the biometric sensor and a transition member adjacent one another in the cavity such that the transition member electrically connects the contacts of the biometric sensor module to the contacts of the circuit.
14. A method according to claim 13, wherein the transition member is electrically connected to the contacts of the biometric sensor before mounting the biometric sensor and the transition member into the cavity.
15. A method according to claim 13 or 14, wherein the transition member is joined to the biometric sensor before mounting the biometric sensor and the transition member into the cavity.
PCT/EP2016/079642 2015-12-04 2016-12-02 Biometric card WO2017093516A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562262944P 2015-12-04 2015-12-04
US62/262,944 2015-12-04
GB1600892.2 2016-01-18
GB1600892.2A GB2545035A (en) 2015-12-04 2016-01-18 Low thickness biometric card

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GB201600892D0 (en) 2016-03-02

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