Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L24/93—Batch processes
  • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
  • H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07745—Mounting details of integrated circuit chips
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
  • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
  • G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
  • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
  • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
  • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
  • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
  • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
  • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
  • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
  • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
  • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
  • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
  • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/10—Bump connectors; Manufacturing methods related thereto
  • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
  • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/10—Bump connectors; Manufacturing methods related thereto
  • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
  • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
  • H01L2224/161—Disposition
  • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/10—Bump connectors; Manufacturing methods related thereto
  • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
  • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
  • H01L2224/161—Disposition
  • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
  • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
  • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
  • H01L2224/8119—Arrangement of the bump connectors prior to mounting
  • H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
  • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
  • H01L2224/8319—Arrangement of the layer connectors prior to mounting
  • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01005—Boron [B]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01006—Carbon [C]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01013—Aluminum [Al]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01015—Phosphorus [P]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01027—Cobalt [Co]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01033—Arsenic [As]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01047—Silver [Ag]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01057—Lanthanum [La]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01074—Tungsten [W]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01077—Iridium [Ir]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01079—Gold [Au]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01082—Lead [Pb]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
  • H01L2924/097—Glass-ceramics, e.g. devitrified glass
  • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/10—Details of semiconductor or other solid state devices to be connected
  • H01L2924/11—Device type
  • H01L2924/12—Passive devices, e.g. 2 terminal devices
  • H01L2924/1204—Optical Diode
  • H01L2924/12042—LASER
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/10—Details of semiconductor or other solid state devices to be connected
  • H01L2924/11—Device type
  • H01L2924/14—Integrated circuits
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
  • H01L2924/1901—Structure
  • H01L2924/1904—Component type
  • H01L2924/19041—Component type being a capacitor
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
  • H01L2924/1901—Structure
  • H01L2924/1904—Component type
  • H01L2924/19042—Component type being an inductor
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
  • H01L2924/1901—Structure
  • H01L2924/1904—Component type
  • H01L2924/19043—Component type being a resistor

Definitions

• the present invention relates generally to the assembly of electronic devices. More particularly, the present invention relates to the assembly of radio frequency identification (RFID) tags.
• RFID radio frequency identification
• Pick and place techniques are often used to assemble electronic devices. Such techniques involve a manipulator, such as a robot arm, to remove integrated circuit (IC) dies from a wafer and place them into a die carrier. The dies are subsequently mounted onto a substrate with other electronic components, such as antennas, capacitors, resistors, and inductors to form an electronic device.
• IC integrated circuit
• Pick and place techniques involve complex robotic components and control systems that handle only one die at a time. This has a drawback of limiting throughput volume. Furthermore, pick and place techniques have limited placement accuracy, and have a minimum die size requirement.
• One type of electronic device that may be assembled using pick and place techniques is an RFID "tag.”
• An RFID tag may be affixed to an item whose presence is to be detected and/or monitored. The presence of an RFID tag, and therefore the presence of the item to which the tag is affixed, may be checked and monitored by devices known as "readers.”
• readers devices known as "readers.”
• the present invention is directed to methods, systems, and apparatuses for producing one or more electronic devices, such as RFID tags, that each include a die having one or more electrically conductive contact pads that provide electrical connections to related electronics on a substrate.
• a plurality of RFID tags is assembled according to the present invention.
• a plurality of dies are separated from a scribed wafer and attached to a transfer or support surface (commonly referred to as a "green tape" in the industry).
• the dies are transferred from the support surface to corresponding tag substrates either directly or via one or more intermediate surfaces.
• dies are transferred between surfaces using an adhesive surface mechanism and process.
• dies are transferred between surfaces using a punching mechanism and process.
• dies are transferred between surfaces using a multi- barrel die collet mechanism and process.
• a die frame is formed. Furthermore, dies are transferred using the die frame.
• a wafer that comprises a plurality of dies is attached to a surface of a tape structure.
• a grid of grooves is formed in the wafer to separate the plurality of dies on the surface of the tape structure.
• a portion of the tape structure that is accessible through the grooves of the grid is caused to harden into a grid shaped structure.
• the grid shaped structure removably holds the plurality of dies.
• One or more dies of the plurality of dies can be moved from the grid shaped structure onto a target surface.
• a wafer that comprises a plurality of dies is attached to a surface of a tape structure.
• the tape structure comprises an encapsulated hardening material.
• a grid of grooves is formed in the wafer to separate the plurality of dies on the surface of the tape structure.
• the surface of the tape structure is breached in the grooves while forming the grooves to cause the encapsulated hardening material to harden in the grooves into a grid shaped hardened material in the grooves of the grid.
• dies may be transferred from a die frame made according to the present invention.
• a die frame is positioned closely adjacent to a surface of a substrate such that a die of a plurality of dies removably held in the die frame is closely adjacent to the substrate.
• the die is transferred onto the closely adjacent substrate from the die frame.
• Each die may be transferred from the die frame to the closely adjacent surface in this manner.
• Dies may be transferred from the die frame one by one, or multiple dies may be transferred at a time.
• dies may be transferred between surfaces in a "pads up” orientation.
• related electronics can be printed or otherwise formed to couple contact pads of the die to related electronics of the tag substrate.
• the dies may be transferred between surfaces in a "pads down” orientation.
• related electronics can be pre-printed or otherwise pre-deposited on the tag substrates.
• a system for forming a die frame applies a wafer to a surface of a tape structure.
• the wafer preparation module forms a grid of grooves in the wafer to separate the plurality of dies on the surface of the tape structure.
• a hardening agent source causes a portion of the tape structure that is accessible through the grooves of the grid to harden into a grid shaped structure.
• the grid shaped structure removably holds the plurality of dies.
• One or more dies of the plurality of dies can be moved from the grid shaped structure onto a target surface.
• another system for forming a die frame is described.
• a wafer preparation module applies a wafer to a surface of a tape structure.
• the wafer preparation module forms a grid of grooves in the wafer to separate the plurality of dies on the surface of the tape structure.
• the tape structure comprises an encapsulated hardening material.
• a wafer singulation module forms a grid of grooves in the wafer to separate the plurality of dies on the surface of the tape structure. The wafer singulation module breaches the surface of the tape structure in the grooves when forming the grooves to cause the encapsulated hardening material to harden in the grooves into a grid shaped hardened material
• a system and apparatus enables the assembly of RFID tags.
• a die transfer module is present to transfer a plurality of dies from the support surface to the tag substrates in either a pads up or down manner
• an alternative system and apparatus enables the assembly of RFID tags.
• a wafer preparation module is present to transfer the dies from the support surface to a transfer surface.
• a die transfer module transfers the dies from the transfer surface to the tag substrates in either a pads up or down manner.
• FIGS. 1A shows a block diagram of an exemplary RFID tag, according to an embodiment of the present invention.
• FIGS. IB and 1C show detailed views of exemplary RFID tags, according to embodiments of the present invention.
• FIGS. 2A and 2B show plan and side views of an exemplary die, respectively.
• FIGS. 2C and 2D show portions of a substrate with a die attached thereto, according to example embodiments of the present invention.
• FIG. 3 is a flowchart illustrating a continuous-roll tag assembly operation.
• FIGS. 4A and 4B are plan and side views of a wafer having multiple dies affixed to a support surface, respectively.
• FIG. 5 is a view of a wafer having separated dies affixed to a support surface.
• FIG. 6 shows a flowchart providing steps for transferring dies from a first surface to a second surface, according to embodiments of the present invention.
• FIG. 7 shows a flowchart providing steps for transferring a plurality of dies from a first surface to a second surface using an adhesive surface.
• FIGS. 8-10 show views of a plurality of dies being transferred from a first surface to a second surface using an adhesive according to the process of FIG. 7.
• FIG. 11 is a flowchart illustrating a "pads up" die transfer onto a tag substrate.
• FIGS. 12A and 12B are plan and side views, respectively, of a plurality of dies in contact with a support surface and a transfer surface.
• FIG. 13 is a view of a plurality of dies attached to a transfer surface.
• FIG. 14 is a view of a "pads up" oriented die in contact with a transfer surface and a tag substrate.
• FIG. 15 is a view of a "pads up" oriented die attached to a tag substrate.
• FIG. 16 is a flowchart illustrating a "pads down" die transfer onto a tag substrate.
• FIG. 17 is a view of a plurality of dies in contact with primary and secondary transfer surfaces.
• FIG. 18 is a view of a plurality of dies attached to a secondary transfer surface.
• FIG. 19 is a view of a "pads down” oriented die in contact with a transfer surface and a tag substrate.
• FIG. 20 is a view of a "pads down” oriented die attached to a tag substrate.
• FIG. 21 shows a flowchart providing steps for transferring a plurality of dies from a first surface to a second surface using a parallel punching process, according to embodiments of the present invention.
• FIGS. 22-29 show views of a plurality of dies being transferred from a first surface to a second surface using the punching process of FIG. 21.
• FIG. 30 shows a flowchart providing steps for assembling RFID tags, according to embodiments of the present invention.
• FIGS. 31-36 show views of a plurality of dies being transferred from a chip carrier to a substrate using the punching process of FIG. 30.
• FIGS. 37-39 show view of substrate structures that include a plurality of individual substrates.
• FIGS. 40-45 show views of a plurality of dies being transferred from a chip carrier to a substrate using the punching process of FIG. 30.
• FIGS. 46 and 47 show views of the formation of electrical conductors on a substrate.
• FIGS. 48 A and 48B show views of an example multi-barrel die transfer apparatus, according to an embodiment of the present invention.
• FIG. 49 shows a flowchart providing example sljeps for transferring dies using a multi-barrel die transfer apparatus, according to an embodiment of the present invention.
• FIG. 50 shows a cross-sectional view of a multi-barrel transfer apparatus being applied to first surface.
• FIGS. 51 and 52 show cross-sectional views of a multi-barrel transfer apparatus transferring dies to second surfaces.
• FIG. 53 shows a cross-sectional top view of an example barrel with die inside, according to an embodiment of the present invention.
• FIG. 54 is a flowchart illustrating a post processing operation.
• FIGS. 55 and 56 are block diagrams of tag assembly devices.
• FIGS. 57A and 57B show flowcharts providing steps for making a die frame, according to example embodiments of the present invention.
• FIG. 58-62 show example views of a wafer at different process steps while being formed into a die frame, according to embodiments of the present invention.
• FIG. 63 shows a cross-sectional view of an example die frame, according to an embodiment of the present invention.
• FIGS. 64A-64C show views of a scribed wafer attached to an adhesive surface, and held in a wafer frame.
• FIGS. 65A and 65B show the scribed wafer of FIGS. 64A-64C with a solidifiable material applied thereto, according to example embodiments of the present invention.
• FIG. 66 shows a flowchart providing example steps for transferring dies using a die frame, according to an embodiment of the present invention.
• FIG. 67 shows a block diagram of dies being transferred from a die frame to a substrate tape, according to an example embodiment of the present invention.
• FIGS. 68A and 68B show flowcharts providing example steps for transferring dies using a die frame, according to embodiments of the present invention.
• FIG. 69 shows a system for transferring dies from a stack of die frames to a substrate structure, according to an example embodiment of the present invention.
• FIG. 70 shows a block diagram of dies being transferred from a stack of die frames into a multi-barrel die transfer apparatus, according to an example embodiment of the present invention.
• FIG. 71 shows a flowchart providing steps for making a die frame, according to an example embodiment of the present invention.
• FIGS. 72, 73 A, and 73B show views of a wafer having separated dies attached to an adhesive surface of tape structures, according to example embodiments of the present invention.
• FIG. 74 shows a system for forming a hardened grid in the tape structure that supports the separated dies shown in FIGS. 71-73, according to an example embodiment of the present invention.
• FIG. 75 shows a die being moved from the hardened grid shown in FIG. 74, according to an example embodiment of the present invention.
• FIG. 76 shows a flowchart providing steps for making a die frame, according to an example embodiment of the present invention.
• FIG. 77 shows a wafer attached to an adhesive surface of a tape structure that includes an encapsulated hardening material, according to an example embodiment of the present invention.
• FIG. 78 shows a laser being used to separate dies of the wafer of FIG. 77 and to cause the encapsulated hardening material to harden, according to an example embodiment of the present invention.
• FIG. 79 shows a perspective view of a saw being used to separate dies of a portion of the wafer of FIG. 77 and to cause the encapsulated hardening material to harden into a die frame, according to an example embodiment of the present invention.
• FIG. 80 shows a perspective view of a portion of the wafer of FIG. 77 that has been separated on the tape structure, with a die frame formed by the encapsulated hardening material, according to an example embodiment of the present invention.
• FIG. 81 shows a die frame formed by an encapsulated hardening material that has been detached from a tape structure, according to an example embodiment of the present invention.
• the present invention provides improved processes and systems for assembling electronic devices, including RFID tags.
• the present invention provides improvements over current processes.
• Conventional techniques include vision-based systems that pick and place dies one at a time onto substrates.
• the present invention can transfer multiple dies simultaneously. Vision-based systems are limited as far as the size of dies that may be handled, such as being limited to dies larger than 600 microns square.
• the present invention is applicable to dies 100 microns square and even smaller.
• yield is poor in conventional systems, where two or more dies may be accidentally picked up at a time, causing losses of additional dies.
• the present invention provides an advantage of simplicity.
• Conventional die transfer tape mechanisms may be used by the present invention. Furthermore, much higher fabrication rates are possible. Current techniques process 5-8 thousand units per hour. The present invention can provide improvements in these rates by a factor of N. For example, embodiments of the present invention can process dies 5 times as fast as conventional techniques, at 100 times as fast as conventional techniques, and at even faster rates. Furthermore, because the present invention allows for flip-chip die attachment techniques, wire bonds are not necessary.
• Example RFID tags are described in the section below.
• the present invention is directed to techniques for producing electronic devices, such as RFLD tags.
• electronic devices such as RFLD tags.
• the description herein primarily relates to the production of RFID tags.
• the description is also adaptable to the production of further electronic device types, as would be understood by persons skilled in the relevant art(s) from the teachings herein.
• FIG. 1A shows a block diagram of an exemplary RFID tag 100, according to an embodiment of the present invention.
• RFID tag 100 includes a die 104 and related electronics 106 located on a tag substrate 116.
• Related electronics 106 includes an antenna 114 in the present example.
• FIGS. IB and 1C show detailed views of exemplary RFID tags 100, indicated as RFID tags 100a and 100b.
• die 104 can be mounted onto antenna 114 of related electronics 106.
• die 104 may be mounted in either a pads up or pads down orientation.
• RFID tag 100 may be located in an area having a large number or pool of RFID tags present.
• RFID tag 100 receives interrogation signals transmitted by one or more tag readers. According to interrogation protocols, RFID tag 100 responds to these signals. Each response includes information that identifies the corresponding RFID tag 100 of the potential pool of RFID tags present.
• the tag reader determines the identity of the responding tag, thereby ascertaining the existence of the tag within a coverage area defined by the tag reader.
• RFID tag 100 may be used in various applications, such as inventory control, airport baggage monitoring, as well as security and surveillance applications. Thus, RFID tag 100 can be affixed to items such as airline baggage, retail inventory, warehouse inventory, automobiles, compact discs (CDs), digital video disks (DVDs), video tapes, and other objects. RFID tag 100 enables location monitoring and real time tracking of such items.
• die 104 is an integrated circuit that performs RFID operations, such as communicating with one or more tag readers (not shown) according to various interrogation protocols. Exemplary interrogation protocols are described in U.S. Patent No. 6,002,344 issued December 14, 1999 to Bandy et al. entitled System and Method for Electronic Inventory, and U.S. Patent Application No. 10/072,885, filed on February 12, 2002. Die 104 includes a plurality of contact pads that each provide an electrical connection with related electronics 106.
• Related electronics 106 are connected to die 104 through a plurality of contact pads of IC die 104.
• related electronics 106 provide one or more capabilities, including RF reception and transmission capabilities, sensor functionality, power reception and storage functionality, as well as additional capabilities.
• the components of related electronics 106 can be printed onto a tag substrate 116 with materials, such as conductive inks.
• conductive inks include silver conductors 5000, 5021, and 5025, produced by DuPont Electronic Materials of Research Triangle Park, N.C.
• Other materials or means suitable for printing related electronics 106 onto tag substrate 116 include polymeric dielectric composition 5018 and carbon-based PTC resistor paste 7282, which are also produced by DuPont Electronic Materials of Research Triangle Park, N.C.
• Other materials or means that may be used to deposit the component material onto the substrate would be apparent to persons skilled in the relevant art(s) from the teachings herein.
• tag substrate 116 has a first surface that accommodates die 104, related electronics 106, as well as further components of tag 100.
• Tag substrate 116 also has a second surface that is opposite the first surface.
• An adhesive material or backing can be included on the second surface. When present, the adhesive backing enables tag 100 to be attached to objects, such as books and consumer products.
• Tag substrate 116 is made from a material, such as polyester, paper, plastic, fabrics such as cloth, and/or other materials such as commercially available Tyvec®.
• tag substrate 116 can include an indentation or "cell" (not shown in FIGS. 1A-1C) that accommodates die 104.
• An example of such an implementation is included in a "pads up" orientation of die 104, as is further described elsewhere herein.
• FIGS. 2A and 2B show plan and side views of an example die 104.
• Die 104 includes four contact pads 204a-d that provide electrical connections between related electronics 106 and internal circuitry of die 104. Note that although four contact pads 204a-d are shown, any number of contact pads may be used, depending on a particular application.
• Contact pads 204 are made of an electrically conductive material during fabrication of the die. Contact pads 204 can be further built up if required by the assembly process, by the depostion of additional and/or other materials, such as gold and solder flux.
• FIG. 2C shows a portion of a substrate 116 with die 104 attached thereto, according to an example embodiment of the present invention.
• contact pads 204a-d of die 104 are coupled to respective contact areas 210a-d of substrate 116.
• Contact areas 210a-d provide electrical connections to related electronics 106.
• the arrangement of contact pads 204a- d in a rectangular shape allows for flexibility in attachment of die 104 to substrate 116, and good mechanical adherement. This arrangement allows for a range of tolerance for imperfect placement of IC die 104 on substrate 116, while still achieving acceptable electrical coupling between contact pads 204a- d and contact areas 210a-d.
• FIG. 2D shows an imperfect placement of IC die 104 on substrate 116. However, even though IC die 104 has been improperly placed, acceptable electrical coupling is achieved between contact pads 204a-d and contact areas 210a-d.
• FIGS. 2A-2D show the layout of four contact pads 204a-d collectively forming a rectangular shape, greater or lesser numbers of contact pads 204 may be used. Furthermore, contact pads 204a-d may be laid out in other shapes in embodiments of the present invention.
• the present invention is directed to continuous-roll assembly techniques and other techniques for assembling tags, such as RFID tag 100.
• Such techniques involve a continuous web (or roll) of the material of the tag antenna substrate 116 that is capable of being separated into a plurality of tags.
• the manufactured one or more tags can then be post processed for individual use.
• the techniques described herein are made with reference to assembly of RFID tag 100. However, these techniques can be applied to other tag implementations and other suitable devices, as would be apparent to persons skilled in the relevant art(s) from the teachings herein.
• the present invention advantageously eliminates the restriction of assembling electronic devices, such as RFID tags, one at a time, allowing multiple electronic devices to be assembled in parallel.
• the present invention provides a continuous-roll technique that is scalable and provides much higher throughput assembly rates than conventional pick and place techniques.
• FIG. 3 shows a flowchart 300 with example steps relating to continuous-roll production of RFID tags 100, according to example embodiments of the present invention.
• FIG. 3 shows a flowchart illustrating a process 300 for assembling tags 100.
• Process 300 begins with a step 302.
• a wafer 400 having a plurality of dies 104 is produced.
• FIG. 4A illustrates a plan view of an exemplary wafer 400. As illustrated in FIG. 4A, a plurality of dies 104 are arranged in a plurality of rows 402a-n.
• wafer 400 is applied to a support surface 404.
• Support surface 404 includes an adhesive material to provide adhesiveness.
• support surface 404 may be an adhesive tape that holds wafer 400 in place for subsequent processing.
• FIG. 4B shows an example view of wafer 400 in contact with an example support surface 404.
• step 306 the plurality of dies 104 on wafer 400 are separated.
• step 306 may include scribing wafer 400 according to a process, such as laser etching.
• FIG. 5 shows a view of wafer 400 having example separated dies 104 that are in contact with support surface 404.
• FIG. 5 shows a plurality of scribe lines 502a-l that indicate locations where dies 104 are separated.
• step 308 the plurality of dies 104 are transferred from support surface 404 to tag substrate 116.
• step 308 may allow for
• step 308 may allow for "pads up” transfer.
• the terms “pads up” and “pads down” denote alternative implementations of tags 100. In particular, these terms designate the orientation of connection pads 204 in relation to tag substrate 116. In a “pads up” orientation for tag 100, die 104 is transferred to tag substrate 116 with pads 204a-204d facing away from tag substrate 116. In a “pads down” orientation for tag 100, die 104 is transferred to tag substrate 116 with pads 204a-204d facing towards, and in contact with tag substrate 116.
• An example of step 308 involving "pads up” transfer is described in greater detail herein with reference to FIG. 11. An example of step 308 involving "pads down” transfer is described in greater detail herein with reference to FIG. 16.
• step 310 post processing is performed. During step 310, assembly of RFID tag(s) 100 is completed. Step 310 is described in further detail below with reference to FIG. 54.
• Step 308 shown in FIG. 3, and discussed above relates to transferring separated dies from a support surface to a tag substrate.
• the separated dies that are attached to the support surface can be transferred to the tag substrate by a variety of techniques.
• the transfer is accomplished using a pick and place tool.
• the pick and place tool uses a vacuum die collet controlled by a robotic mechanism that picks up the die from the support structure by a suction action, and holds the die securely in the die collet.
• the pick and place tool deposits the die into a die carrier or transfer surface.
• a suitable transfer surface is a "punch tape" manufactured by Mulbauer, Germany.
• a disadvantage of the present pick and place approach is that only one die at a time may be transferred. Hence, the present pick and place approach does not scale well for very high throughput rates.
• the present invention allows for the transfer of more than one die at a time from a support surface to a transfer surface.
• the present invention allows for the transfer of more than one die between any two surfaces, including transferring dies from a support surface to an intermediate surface, transferring dies between multiple intermediate surfaces, transferring dies between an intermediate surface and the final substrate surface, and transferring dies directly from a support surface to the final substrate surface.
• FIG. 6 shows a flowchart 600 providing steps for transferring dies from a first surface to a second surface, according to embodiments of the present invention. Structural embodiments of the present invention will be apparent to persons skilled in the relevant art(s) based on the following discussion. These steps are described in detail below.
• Flowchart 600 begins with step 602.
• a plurality of dies attached to a support surface are received.
• the dies are dies 104, which are shown attached to a support surface 404 in FIG. 4A.
• the support surface can be a "green tape" as would be known to persons skilled in the relevant art(s).
• the plurality of dies are transferred to a subsequent surface.
• dies 104 may be transferred according to embodiments of the present invention.
• the dies may be fransferred by an adhesive tape, a punch tape, a multi-barrel transport mechanism and/or process, or a die frame, such as are further described below, and may be transferred by other mechanisms and processes, or by combinations of the mechanisms/processes described herein.
• the subsequent surface can be an intermediate surface or an actual final substrate.
• the intermediate surface can be a transfer surface, including a "blue tape" as would be known to persons skilled in the relevant art(s).
• the subsequent surface is a substrate
• the subsequent surface may be a substrate structure that includes a plurality of tag substrates, or may be another substrate type.
• step 606 it is determined whether the subsequent surface is a final surface. If the subsequent surface is a substrate to which the dies are going to be permanently attached, the process of flowchart 600 is complete. Thus, as shown in FIG. 6, the process proceeds to step 310 of flowchart 300, as shown in FIG. 3. If the subsequent surface is not a final surface, then the process proceeds to step 604, where the plurality of dies are then transferred to another subsequent surface. Steps 604 and 606 may be repeated as many times as is required by the particular application.
• any of the intermediate/transfer surfaces and final substrate surfaces may or may not have cells formed therein for dies to reside therein.
• Various processes described below may be used to transfer multiple dies simultaneously between first and second surfaces, according to embodiments of the present invention. In any of the processes described herein, dies may be transferred in either pads-up or pads-down orientations from one surface to another.
• the die transfer processes described herein include transfer using an adhesive surface, a parallel die punch process, a multi-barrel die collect process, a die frame, and a die support frame. Elements of the die transfer processes described herein may be combined in any way, as would be understood by persons skilled in the relevant art(s). These die fransfer processes, and related example structures for performing these processes, are further described in the following subsections.
• an adhesive substance coated onto a second surface may be pressed against separated die that reside on a first surface, causing the die to attach to the adhesively coated second surface.
• the second surface may be moved away from the first surface, to carry the attached die away from the first surface.
• the die can then be transferred to subsequent intermediate/transfer surfaces, or to a final surface, such as a substrate.
• FIG. 7 shows a flowchart 700 providing steps for transferring a plurality of dies from a first surface to a second surface using an adhesive surface.
• flowchart 700 will be described in reference to FIGS. 8-10, although the process of flowchart 700 is not limited to the structures shown in FIGS. 8-10. I
• Flowchart 700 begins with step 702.
• the second surface is positioned to be closely adjacent to the first surface that has a plurality of dies attached thereto.
• a plurality of dies 104 are attached to a first surface 802.
• a second surface 804 is positioned closely to first surface 802.
• surface 802 may be a scribed wafer or support surface, or may be an intermediate surface.
• second surface 804 may be an intermediate or transfer surface, or may be a substrate surface.
• An example support surface is shown in FIG. 4A, as support surface 404.
• Second surface 804 may be a green tape or a blue tape, as they are known in the industry, for example.
• step 704 a distance between the first surface and a second surface is reduced until the plurality of dies contact the second surface and attach to the second surface due to an adhesiveness of the second surface.
• An example of this is shown in FIG. 9.
• second surface 802 is in contact with plurality of dies 104. Either or both of first and second surfaces 802 and 804 may be moved to cause the contact.
• second surface 804 may have the adhesiveness because it is an adhesive tape, or may be a surface that has an adhesive material, such as an epoxy, glue, or wax applied thereto, to cause it to be adhesive.
• step 706 the first surface and second surface are moved apart, whereby the plurality of dies remain attached to the second surface.
• the plurality of dies remain attached to the second surface.
• FIG. 10 first surface 802 and second surface 804 have been moved apart, and the plurality of dies 104 remain attached to second surface 804.
• the plurality of dies 104 are detached from first surface 802.
• the plurality of dies 104 remain attached to second surface 804 due to a greater adhesiveness of second surface 804 relative to first surface 802.
• flowchart 700 may include the additional step where an adhesive material is applied to the second surface so that the adhesiveness of the second surface is greater than that of the first surface.
• overlapping (including identical) means may be used to perform steps 704 and 706 to reduce the distance between the first and second surfaces, and to move the first and second surfaces apart, or different means may be used.
• 706 may include the use of rollers, piston-type punching techniques, air jets, and or any other suitable mechanisms described elsewhere herein or otherwise known.
• flowchart 700 is applicable to dies being oriented in a pads- up or pads-down orientation on either of first and second surfaces 802 and
• flowchart 700 may include the further step where the plurality of dies attached to the first surface are oriented so that at least one contact pad of each die of the plurality of dies is facing away from the first surface. Hence, when the first surface and second surface are moved apart, the plurality of dies will remain attached to the second surface in a pads-down manner.
• flowchart 700 can include the step where the plurality of dies attached to the first surface are oriented so that at least one contact pad of each die of the plurality of dies is facing towards the first surface. Hence, when the first surface and second surface are moved apart, the plurality of dies remain attached to the second surface in a pads-up manner.
• the process of flowchart 700 may be implemented on any portion of, or all of the separated die on the first surface. For example, this process may be accomplished in one or more iterations, using one or more strips of an adhesive coated second surface 804 that each adhere to and carry away a single column of die 104 from first surface 802. Alternatively, a sheet sized adhesive coated second surface 804 may be used to adhere to and carry away multiple columns/any size array of die 104 from first surface 802.
• dies 104 can be fransferred from support surface 404 to tag substrate 116 in a "pads up" manner.
• a die 104 is transferred to tag substrate 116 in this manner, it is oriented so that connecting pads 204a-d face away from tag substrate 116.
• FIG. 11 is a flowchart illustrating performance of step 308 in greater detail for "pads up” transfer. This performance begins with a step 1102.
• step 1102 one or more dies 104 are oriented for "pads up” transfer from support surface 404 onto tag substrate 116.
• Step 1102 is described in greater detail with reference to FIGs. 12A, 12B, 13, 14, and 15, which provide exemplary views of dies 104, support surface 404, a transfer surface 1202, and tag substrate 116 during various stages of a "pads up” transfer operation.
• Step 1102 comprises transferring die(s) 104 onto a fransfer surface.
• step 1102 includes steps 1120 and 1122.
• step 1120 die(s) 104 are placed in contact with transfer surface 1202.
• FIGs. 12A and 12B which provide views of a die 104 in contact with support surface 404 and transfer surface 1202.
• Transfer surface 1202 is an adhesive material, such as tape.
• Placing die(s) 104 in contact with fransfer surface 1202 can include the step of reducing the physical separation between support surface 404 and transfer surface 1202 until die 104 contacts transfer surface 1202. This can be performed through the use of rollers, piston-type punching techniques, and/or air jets.
• Step 1120 further includes the step of aligning transfer surface 1202 with one or more rows 402.
• FIG. 12A shows fransfer surface 1202 aligned with row 402a.
• transfer surface 1202 has a width 1204 that is selected to contact a single row 402 of dies 104.
• other widths 1202 can be employed that enable contact with multiple rows 402.
• step 1122 die(s) 104 are removed from support surface 404, thereby resulting in the transfer of die(s) 104 from support surface 404 to transfer surface 1202.
• FIG. 13 is a view of a plurality of dies 104 transferred to fransfer surface 1202. Removal of die(s) 104 from support surface 404 can include the steps of providing a stronger adhesive on transfer surface 1202 than on support surface 404, and increasing the physical separation between support surface 404 and transfer surface 1202. Alternatively, removal of dies
• 104 from support surface 404 can include the steps of providing a release adhesive on support surface 404 that loses its adhesive properties upon a release action, such as exposure to thermal energy, radiation, or ultraviolet light, and creating a release action at a time when removal is desired.
• a step 1104 is performed.
• an adhesive is applied to tag substrate 116. This adhesive will provide a bond between die 104 and tag substrate 116.
• step 1106 follows step 1104.
• step 1106 die(s) 104 are fransferred onto tag subsfrate 116 in a "pads up" manner.
• Step 1106 includes the steps of placing die(s) 104 in contact with tag substrate 116 and removing die(s) 104 from fransfer surface 1202. Snapshots from a performance of step 1106 are illustrated in FIGs. 14 and 15.
• FIG. 14 shows a die 104n in contact with a transfer surface 1202 and tag substrate 116.
• Die 104n is in contact with a cell or indentation 1402 that is formed on tag substrate 116.
• Indentation 1402 enables connection pads 204 to be substantially even with surface(s) on tag substrate 116 that accommodate related electronics 106.
• Placing die(s) 104 in contact with tag subsfrate 116 includes the step of reducing the physical separation between transfer surface 1202 and tag substrate 116 until die 104 contacts tag substrate 116. This can be performed through the use of rollers, piston-type punching techniques, and or air jets.
• placing die(s) 104 in contact with tag subsfrate 116 in a "pads up" orientation includes the step of aligning die(s) 104 with corresponding indentations 1402.
• Removal of die(s) 104 from transfer surface 1202 can include the steps of providing a stronger adhesive on tag subsfrate 116 than on transfer surface 1202, and increasing the physical separation between transfer surface 1202 and tag substrate 104.
• removal of dies 104 from support surface 404 can include the steps of providing a release adhesive on transfer surface 1202 that loses it adhesive properties upon a release action, such as exposure to thermal energy, radiation, or ultraviolet light, and creating a release action at a time when removal is desired.
• FIG. 15 shows a die 104n released from transfer surface 1202 and transferred to tag subsfrate 116.
• pads 204 are substantially even with surfaces 1502 and 1504 of tag substrate 116, thereby enabling electrical connections to be easily fonned between pads 204 and related electronics 106 printed on these surfaces.
• step 1108 is performed.
• related electronics 106 are printed on tag subsfrate 116.
• Step 1106 can comprise the steps of printing related electronics 106 onto tag substrate 116 through a screen printing process, an ink jet process, and/or a thermal spray process.
• step 1106 can comprise the step of removing conductive material already disposed on tag substrate 116 through an oblation process.
• step 1110 is performed.
• an overcoating is applied on tag substrate 116. This overcoating protects elements of tag 100, such as die 104 and related electronics 106, from mechanical forces. In addition, this overcoating provides electrical insulation.
• this overcoating can provide a compression force on tag substrate 116 to further ensure proper connections between related electronics 106 and die 104.
• a compression force can be provided through the use of heat shrinkable materials.
• step 308 dies 104 can be transferred from support surface 404 to tag substrate 116 in a "pads down" manner.
• a die 104 is fransferred to tag subsfrate 116 in this manner, it is oriented so that connecting pads 204a-d face towards tag substrate 116.
• FIG. 16 is a flowchart illustrating a performance of step 308 in greater detail for "pads down" fransfer. This performance begins with a step 1602.
• step 1602 one or more dies 104 are oriented for pads down transfer from support surface 404 onto tag substrate 116.
• Step 1602 is described in greater detail with reference to FIGs. 12A, 12B, 13-15, and 17-20. These drawings provide exemplary views of dies 104, support surface 404, a transfer surface 1202, a secondary fransfer surface 1702, and tag substrate 116 during various stages of a "pads down" transfer operation.
• Step 1602 comprises a step 1620 of transferring die(s) 104 onto a primary transfer surface and a step 1622 of transferring die(s) 104 onto a secondary transfer surface.
• step 1620 die(s) 104 are placed in contact with transfer surface 1202 and removed from support surface 404, thereby resulting in the transfer of die(s) 104 from support surface 404 to transfer surface 1202.
• FIGs. 12A and 12B provide views of a die 104 in contact with support surface 404 and transfer surface 1202.
• Transfer surface 1202 is an adhesive material, such as tape.
• Placing die(s) 104 in contact with transfer surface 1202 can include the step of reducing the physical separation between support surface 404 and transfer surface 1202 until die 104 contacts fransfer surface 1202. This can be performed through the use of rollers, piston-type punching techniques, and/or air jets.
• FIG. 13 is a view of a plurality of dies 104 removed from support surface 404 and fransferred to fransfer surface 1202.
• Removal of die(s) 104 from support surface 404 can include the steps of providing a stronger adhesive on transfer surface 1202 than on support surface 404, and increasing the physical separation between support surface 404 and transfer surface 1202.
• removal of dies 104 from support surface 404 can include the steps of providing a release adhesive on support surface 404 that loses it adhesive properties upon a release action, such as exposure to thermal energy, radiation, or ulfraviolet light, and creating a release action at a time when removal is desired.
• step 1622 die(s) 104 are transferred from transfer surface 1202 onto secondary fransfer surface 1702.
• step 1622 die(s) 104 are placed in contact with secondary transfer surface 1702.
• FIG. 17 provides an exemplary view of such contact, where die(s) 104 are in contact with transfer surface 1202 and secondary transfer surface 1702.
• Placing die(s) 104 in contact with secondary transfer surface 1702 can include the step of reducing the physical separation between support surface 404 and transfer surface 1202 until die 104 contacts transfer surface 1202. This can be performed through the use of rollers, piston-type punching techniques, and/or airjets.
• FIG. 18 is a view of a die 104 that has been removed from fransfer surface 1202, and is therefore transferred to secondary fransfer surface 1702.
• both transfer surface 1202 and secondary transfer surface 1702 are adhesive surfaces.
• removal of die(s) 104 from fransfer surface 1202 can include the steps of providing a stronger adhesive on secondary transfer surface 1702 than on transfer surface 1202, and increasing the physical separation between transfer surface 1202 and secondary transfer surface 1702.
• removal of die(s) 104 from fransfer surface 1202 can include the steps of providing a release adhesive on transfer surface 1202 that loses it adhesive properties upon a release action, such as exposure to thermal energy, radiation, or ulfraviolet light, and creating a release action at a time when removal is desired.
• a release action such as exposure to thermal energy, radiation, or ulfraviolet light
• related electronics 106 are printed onto tag substrate 116.
• Step 1604 can comprise the steps of printing related electronics 106 onto tag substrate 116 through a screen printing process, an ink jet process, andor a thermal spray process. Alternatively, step 1604 can comprise the step of removing conductive material already disposed on tag substrate 116 through an oblation process. In step 1606, a layer of conductive adhesive is placed on tag substrate
• This step comprises applying an anisotropic adhesive that conducts electricity in a single dimension.
• an anisotropic adhesive that conducts electricity in a single dimension.
• One such adhesive is commercially available "z-axis" adhesive, which is well-known in the relevant arts.
• Anisotropic adhesives conduct electricity in a single direction. Therefore, they advantageously enable electrical connections to be established between connecting pads 204 and related electronics 106 without shorting connecting pads 204 together.
• step 1608 die(s) 104 are transferred onto tag subsfrate 116 in a "pads down" manner.
• the anisotropic adhesive layer placed on tag substrate 116 in step 1606 provides an electrical connection between each connecting pad 204 and corresponding elements of related electronics 106.
• Step 1608 comprises the steps of placing die(s) 104 in contact with tag substrate 116 and removing die(s) 104 from secondary transfer surface 1702.
• Placing die(s) 104 in contact with tag substrate 116 can include the step of reducing the physical separation between secondary transfer surface
• FIG. 19 is a view of a "pads down" oriented die 104 in contact with secondary fransfer surface 1702 and tag substrate 116. As shown in FIG. 19, a punching member 1902 can be used to punch secondary transfer surface
• Removal of die(s) 104 from secondary transfer surface 1702 can include the steps of providing a stronger adhesive on tag substrate 116 than on secondary transfer surface 1702, and increasing the physical separation between secondary fransfer surface 1702 and tag substrate 116.
• removal of dies 104 from secondary transfer surface 1702 can include the steps of providing a release adhesive on secondary transfer surface 1702 that loses its adhesive properties upon a release action, such as exposure to thermal energy, radiation, or ultraviolet light, and creating a release action at a time when removal is desired.
• FIG. 20 is a view of a "pads down" oriented die 104 attached to tag substrate 116.
• a second surface such as a punch tape
• the punch tape has multiple die receptor holes, "divots," or cells formed in a surface.
• Each receptor cell in the punch tape is aligned with a corresponding die of the first surface.
• Multiple mechanical punches are actuated to push the die from the first surface into the corresponding receptor cell of the punch tape. In this manner, any number of dies, including tens and hundreds of dies, can be transferred simultaneously into the punch tape, instead of merely transferring one die at a time.
• FIG. 21 shows a flowchart 2100 providing steps for transferring a plurality of dies from a first surface to a second surface using a parallel punching process, according to embodiments of the present invention. Note that steps of flowchart 800 that are optional are shown enclosed in dotted lines. Further structural embodiments will be apparent to persons skilled in the relevant art(s) based on the following discussion.
• FIG. 22 shows a perspective view of an example punch tape 2200.
• FIG. 23 shows a cross-sectional view of punch tape 2200.
• punch tape 2200 has a plurality of cells 2202 formed in a top surface.
• punch tape 2200 may further have a plurality of guide holes 2204 formed in the top surface.
• punch tape 2200 may be formed from a punch tape body 2302 and an adhesive tape 2304.
• Adhesive tape 2304 is attached to a bottom surface of punch tape body 2302.
• Punch tape body 2302 is typically flexible, and may have a variety of thicknesses, including thicknesses ranging from 5 mils to 11 mils, or other thicknesses. Punch tape body 2302 may be made from plastic or from other flexible or non-flexible material. Adhesive tape 2304 may be any type of adhesive tape or other adhesive material. Alternatively, punch tape 2200 may be a conventional chip carrier as are available in the industry, and/or may be a single piece punch tape.
• Cells 2202 are open on a top surface of punch tape 2200 and are not open on the bottom surface of punch tape 2200.
• Plurality of cells 2202 are formed from a plurality of openings through punch tape body 2302, having one end covered by adhesive tape 2304. The openings may be preformed, or may be formed in punch tape 2200 by laser etching, or by other process.
• guide holes 2204 may penetrate all the way through punch tape 2200 to be open at the bottom and top surfaces of punch tape 2200, or may be open at only one of the two surfaces. Guide holes 2204 may be used to align punch tape 2200 with a surface.
• punch tape 2200 is described as receiving dies from a support surface, and transferring dies to a substrate. However, in embodiments, for example, punch tape 2200 may receive dies from a surface that is a scribed wafer or support surface, or an intermediate surface. Furthermore, punch tape 220 may transfer dies to an intermediate or transfer surface, or to a substrate surface.
• Flowchart 2100 shown in FIG. 21 begins with step 2102. hi step 2102, a support surface is positioned closely adjacent to a surface of a punch tape, such that each die of a plurality of dies attached to a first surface of the support surface is closely adjacent to a corresponding empty cell of a plurality of empty cells in the surface of the punch tape.
• FIG. 24 illustrates step 2102.
• the support surface of step 2102 may be support surface 404, which is positioned closely adjacent to punch tape 2200.
• a plurality of dies 104a are attached to support surface 404, and another plurality of dies 104b are attached to the surface of support surface 404.
• Each die of plurality of dies 104a is positioned closely adjacent to an empty cell 2202 in punch tape 2200.
• FIG. 24 also shows a punching apparatus 2402 positioned adjacent to support surface 404, according to an example embodiment of the present invention.
• Punching apparatus 2402 includes a body 2404 and a plurality of punching members 2406.
• Punching members 2406 are attached to body 2404.
• punching body 2402 may be any type of applicable punching device, including a flat surface having punching members 2406 extending therefrom, or may be a rolling-pin type device with punching members 2406 extending outward radially therefrom.
• Punching apparatus 2402 may be configured in additional ways.
• step 2104 all dies of the plurality of dies are simultaneously transferred into closely adjacent, corresponding empty cells from the support surface. For example, as shown in FIG.
• punching mechanism 2402 has moved upward to push each of the plurality of dies 104A into their corresponding cells 2202 by pushing through substrate surface 404.
• substrate surface 404 substantially flexes to allow punching members 2406 to push plurality of dies 104a upwards without substantial damage to support surface 404.
• plurality of dies 104a become attached in cells 2202 due to the adhesiveness of adhesive tape 2304, and remain in cells 2202 after punching members 2406 are removed or retracted.
• the punch tape is incremented relative to the support surface to position each die of another plurality of dies attached to the first surface of the support surface closely adjacent to a corresponding empty cell of another plurality of empty cells in the surface of the punch tape.
• punch tape 2200 has been moved and positioned closely adjacent to plurality of dies 104b such that an empty cell 2202 of punch tape 2200 is closely adjacent to each die of plurality of dies 104b.
• the process of incrementing punch tape 2200 relative to support surface 404 means that any one or more of punch tape 2200, support surface 404, and/or punching mechanism 2402 may be moved in order to properly position these elements relative to dies 104 on support surface 404.
• step 2108 all dies of the another plurality of dies are simultaneously transferred from the support surface into closely adjacent corresponding empty cells.
• punching mechanism 2402 pushes each die of plurality of dies 104b into the adjacent cell 2202.
• Plurality of dies 104b become attached in cells 2202 due to an adhesiveness of adhesive tape 2304.
• steps 2106 and 2108 can be repeated until substantially all dies attached to the support surface have been transferred from the support surface to the punch tape. Note that optional steps 2106, 2108, and 2110 apply to embodiments where multiple iterations are required to punch plurality of dies from one surface to another so that all dies attached to the first surface are transferred to the second surface.
• the plurality of dies that are fransferred in a single step may be substantially equal to one out of every N dies of a total number of dies attached to the support surface.
• the support surface may be positioned closely adjacent to the surface of the punch tape, such that each die of the one out of every N dies attached to the first surface of the support surface is closely adjacent to a corresponding empty cell of the plurality of empty cells in the surface of the punch tape.
• the plurality of dies are transferred, but not all dies.
• the plurality of dies transferred may be all of the dies attached to the first surface, so that further iterations are not required.
• FIG. 27 shows a plurality of dies 104 attached to support surface 404, where each die is positioned closely adjacent to corresponding cell 2202 in punch tape 2200.
• punching mechanism 2402 has a plurality of punching members 2406 that correspond to plurality of dies 104. Hence, when punching members 2406 simultaneously punch upward into support surface 404, all dies of plurality of dies 104 are moved into corresponding cells 2202 of punch tape 2200, simultaneously.
• punch mechanism die transfer embodiments described herein are applicable to both pads-up and pads-down die orientations.
• plurality of dies 104 may be fransferred into corresponding cells 2202 with pads facing in or out of the corresponding cells 2202, as desired.
• punching mechanism embodiments may be alternated with adhesive tape transfer embodiments described above in order to flip the orientation of dies 104.
• an adhesive tape may be used to transfer dies one or more times followed by a final transfer of the plurality of dies 104 by the punching mechanism.
• the adhesive tape embodiments may be used to orient the dies with either pads up or pads down prior to being punched into cells 2202.
• support surface 404 may be incremented by one column of dies 104 relative to punch tape.
• Punch tape 2200 may be spooled on a roll. Punch tape 2200 is advanced so that empty die receptor cells 2202 are aligned over a column of dies 104 on support surface
• Dies 104 in the column of support surface 404 are punched into the empty die receptor cells 2202 in step 2108.
• Support surface 404 may then be again incremented by one column, and punch tape 2200 is again advanced, so that the next column of dies 104 of support surface 404 may be punched into further empty die receptor cells of punch tape 2200. This procedure may be repeated until support surface 404 is exhausted of dies 104.
• Example die transfer embodiments using a punching mechanism are described in detail in the following subsection. 2.1.2.1 Direct transfer from support surface to antenna substrate
• a punching mechanism may simultaneously transfer each die of a plurality of dies from a first surface directly onto a corresponding antenna subsfrate.
• the first surface is a support surface that attaches separated dies from a wafer, this process allows for exfremely rapid fabrication of a large number of electronic devices, such as RFID tags 100.
• Steps 2102 and 2104 of flowchart 2100 support the transfer for die from a support surface to a subsfrate, where instead of using a punch tape as a second surface, an subsfrate is used as the second surface.
• FIG. 28 illustrates an example using punching mechanism 2402 to transfer a plurality of dies 104 from a support surface 404 to a substrate structure 2802 that includes a plurality of tag substrate portions (i.e., tag substrates 116a-d).
• punching mechanism 2402 has a plurality of punching members 2406 that are positioned adjacent to dies 104 on an opposite surface of support surface 404.
• support surface 404 is positioned closely adjacent to a surface of substrate structure 2802, such that each die 104 of the plurality of dies is closely adjacent to a tag substrate 116.
• Each tag substrate 116 has contact areas 210a and 210b for coupling to contact pads 204a and 204b of each die 104.
• an underfill material layer 2804 can be optionally applied to the surface of substrate structure 2802. This allows for each die 104 to be underfilled when attached to subsfrate structure 2802.
• a modified step 2104 all dies 104 of the plurality of dies are simultaneously fransferred onto the closely adjacent, corresponding tag substrate 116 from support surface 404.
• punching members 2408 may be moved in the direction of arrow 2408 to transfer dies 104.
• FIG. 29 shows substrate structure 2802 with each of dies 104 attached to a corresponding one of tag substrates 116a-d.
• Underfill material layer 2804 provides for an underfill material to be located between each die 104 and tag subsfrate 116.
• Example underfill materials suitable for underfill material layer 2804 are further described in the following section.
• FIGS. 28 and 29 show the transfer of dies 104 directly to tag substrates 116 in a "pads down" orientation, it will be understood to persons skilled in the relevant art(s) from the teachings herein that this fransfer of dies 104 directly to tag substrates 116 may also be accomplished in a "pads up" orientation.
• a second surface such as punch tape 2200
• punch tape 2200 is aligned over separated dies 104 attached to a first surface.
• Each receptor cell 2202 in punch tape 2202 has a corresponding die 104 placed therein.
• Each cell 2202 is then filled with an underfill material.
• Punching mechanism 2402 is actuated to move the die 104 from punch tape 2202 onto corresponding tag subsfrates 116 of substrate structure 2802.
• any number of dies including tens and hundreds of dies, can be transferred simultaneously from punch tape 2200, instead of merely transferring one die at a time.
• each die can be easily underfilled on the respective tag substrate 116 during the transfer process, providing numerous advantages.
• FIG. 30 shows a flowchart 3000 providing steps for assembling RFID tags, according to embodiments of the present invention. Note that steps of flowchart 3000 that are optional are shown enclosed in dotted lines. Flowchart 3000 will be described in relation to FIGS. 31-47, for illustrative purposes. Further structural embodiments will be apparent to persons skilled in the relevant art(s) based on the following discussion.
• Flowchart 3000 begins with step 3002.
• step 3002 a plurality of dies are transferred from a support surface to a chip carrier that has a plurality of cells accessible on a first surface of the chip carrier so that each die of the plurality of dies resides in a corresponding cell of the plurality of cells and is recessed in the corresponding cell with respect to the first surface.
• the chip carrier is a punch tape, such as punch tape 2200 shown in FIG. 31.
• punch tape 2200 has example empty first and second cells 2202a and 2202b.
• FIGS. 32 and 33 show first and second dies 104a and 104b being transferred into first and second cells 2202a and 2202b.
• First and second dies 104a and 104b may be transferred into first and second cells 2202a and 2202b by any process described here or otherwise known, including by a pick and place process.
• First and second dies 104a and 104b may be transferred into first and second cells 2202a and 2202b one at a time, as shown in FIGS. 32 and 33, or simultaneously. Note that two dies are shown in the current example for illustrative purposes, and that the present invention is applicable to any number of dies.
• an underfill material is applied into each cell of the plurality of cells.
• an underfill material 3402 is applied into first and second cells 2202a and 2202b to substantially cover each of dies 104a and 104b, shown as first and second underfill material portions 3402a and 3402b.
• Underfill material 3004 is used to underfill dies 104 when attached to a substrate, such as a tag subsfrate 116, for purposes such as environmental and hermetic protection, among other reasons.
• underfill material 3402 may be any underfill material conventionally known to persons skilled in the relevant art(s).
• Underfill material 3402 may be electrically conductive, or electrically non-conductive.
• underfill material 3402 may be isotropically conductive, i.e., substantially uniformly conductive in all directions.
• underfill material 3402 may be anisotropically conductive, i.e., conductive in a desired direction.
• underfill material 3402 may be a Z-axis epoxy.
• the amount of underfill material 3402 applied in each cell 2202 can be controlled, so that an amount required by the particular application is present.
• FIG. 34 shows first and second underfill material 3402a and 3402b have been applied so that the underfill material extends out of first and second cells 2202a and 2202b.
• first and second underfill material 3402a and 3402b have been applied so that the underfill material extends out of first and second cells 2202a and 2202b.
• FIG. 35 shows first and second underfill material 3402a and 3402b have been applied so that the underfill material is flush or even with the top surface of punch tape 2200.
• a "squeegee" process may be used in order to cause underfill material 3402 to be flush or even with the top surface of punch tape 2200.
• FIG. 36 shows an example squeegee process being performed.
• a squeegee element 3602 is passed along the top surface of punch tape 2200, smoothing first underfill material 3402a in first cell 2202a, for example. An excess underfill material 3604 is shown being removed.
• underfill material 3402 was applied to cells 2202 before squeegee element 3602 was applied.
• underfill material 3402 may be applied by squeegee element 3602.
• a height of each die 104 is approximately equal to half of a height of the corresponding cell 2202.
• Underfill material 3604 fills a remaining half of the height of the cell 2202. With such an amount of underfill material 3604 in cell 2202 relative to the size of die 104, enough underfill material 3604 is present to underfill die 104 when attached to substrate 116, without having excess underfill material.
• the present invention is applicable to higher and lower proportions of underfill material 3604 in cells 2202.
• the first surface of the chip carrier is positioned closely adjacent to a surface of a substrate structure having a plurality of tag subsfrate portions.
• FIG. 37 shows an example substrate structure 2802.
• Substrate structure 2802 includes a plurality of tag substrate portions (i.e., tag substrates 116), also referred to as a web or array of tag substrates.
• Substrate structure 2802 includes any number of tag substrates 116, and may be shaped into any size column, row, or array of tag substrates 116.
• FIG. 38 shows subsfrate structure 2802 of FIG. 37 after having been separated into separate strip-shaped tag substrate structures 2802a, 2802b, 2802c, and 2802d.
• Subsfrate structure 2802 may be separated into strips by sawing, cutting, by laser, and by other processes.
• a strip for substrate structure 2802 can be conveniently used to transfer dies 104 from punch tape 2200, which typically is also formed in a strip.
• FIG. 39 shows a view of a portion of strip-shaped substrate structure 2802a.
• Substrate structure 2802 includes first and second tag substrates 116a and 116b.
• First tag substrate 116a includes an antenna 114a and a guide hole 3902a.
• Second tag substrate 116b includes an antenna 114b and a guide hole
• Guide holes 3902 may be used to align substrate structure 2802a with punch tape 2200.
• guide holes 3902 may be used with guide holes 2204 shown in FIG. 22 to provide alignment.
• Guide holes 3902 and guide holes 2204 may be used to mechanically or optically align substrate structure 2802a with punch tape 2202.
• mechanical alignment can include aligning punch tape 2202 using a first wheel having spaced pegs that interlock with guide holes 2204, and aligning substrate structure 2802a using a second wheel having spaced pegs that interlock with guide holes 3902. The first wheel and second wheel are synchronized.
• FIG. 40 shows the top surface of the punch tape 2200 being positioned closely adjacent to substrate structure 2802a, according to step 3006.
• Tag substrate 116a is positioned closely adjacent to cell 2202a.
• a second surface of the chip carrier is punched proximate to a location opposite of each cell of the plurality of cells to move each die out of the corresponding cell such that the underfill material covering each die contacts a corresponding tag subsfrate of the plurality of tag substrate portions.
• a punching member 4102 punches the bottom surface of punch tape 2200 opposite to first cell 2202a.
• First die 104 moves out of first cell 2202a towards tag subsfrate 116a.
• Underfill material 3402a contacts tag substrate 116a.
• punching member 4102 moves first die 104 until first die 104 comes into contact with tag subsfrate 116a.
• step 3010 the first surface of each die is attached to the corresponding tag subsfrate so that the at least one contact pad of each die is electrically coupled to at least one corresponding contact pad of the corresponding tag subsfrate.
• first die 104 is attached to tag substrate 116a such that contact pads 204a-d are electrically coupled to contact areas 210a-d of tag substrate 116a.
• First die 104a may be attached to tag substrate 116a in a variety of ways.
• step 3010 may include the step where underfill material 3402 is cured to attach each die 104 to the corresponding tag subsfrate 116.
• a curable underfill material 3402 may be flash curable, thermally curable, acoustically curable, electron beam curable, ultraviolet (UV) light curable, infrared (IR) light curable, pressure curable, and other type of curable material. Hence, heat, an acoustic source, an electron beam, UV light, IR light, and/or pressure may be applied as needed to cure underfill material 3402.
• a two-party epoxy may be used for a flash curable underfill material, for example.
• underfill material 3402 causes underfill material 3402 to contract or shrink.
• underfill material 3402 can cause a decrease in a distance between each die 104 and the corresponding tag substrate 116, leading to improved mechanical and/or electrical coupling of contact pads 204a-d of each die 104 to the corresponding contact areas 210a-d of the corresponding tag substrate 116.
• underfill material 3402 has a thermal coefficient of expansion/contraction that dictates the amount of contraction when cured. By selecting the material used for underfill material 3402, this coefficient can be tuned. Hence, the thermal coefficient of underfill material 3402 can by tuned to match that of tag substrate 116, or otherwise.
• underfill material 3402 can be tuned to contract by a particular amount, such as 2 times or 3 times its mass, for example. Underfill material 3402 can be alternatively be tuned to apply a particular force over an area, such as 50 kg/cm 2 , for example. For example, the contraction of underfill material 3402 can cause contact pads 204a-d to come into contact with the corresponding contact areas 210a-d, creating a sufficient electrical connection for operation of the resulting device. Contact pads 204a-d and/or contact areas 210a-d may be substantially uniform in their smoothness or flatness so that a large area may come into contact between them.
• contact pads 204a-d and/or contact areas 210a-d may be non-uniform in smoothness or flatness to enhance connectivity.
• contact pads 204a-d (and/or contact areas 210a-d) may have one or more bumps, spikes, peaks, etc.
• underfill material 3402 includes electrically conductive microspheres to provide electrical connectivity.
• the microspheres may be gold, silver, other metal, or combination/alloy of metals, for example.
• die 104b can be similarly attached to tag substrate 116b.
• dies 104a and 104b can be simultaneously attached to their respective tag substrates.
• dies 104 are oriented to be mounted on tag substrate 116 in a pads down fashion.
• FIG. 43-47 shows an example where dies 104 are oriented to be mounted on tag substrate 116 in a pads up fashion.
• first and second dies 104a and 104b have been inserted into cell 2202a and 2202b such that contact pads 204a-d face into the cells.
• FIG. 43 first and second dies 104a and 104b have been inserted into cell 2202a and 2202b such that contact pads 204a-d face into the cells.
• punch tape 2200 is positioned closely adjacent to tag substrate 116a of substrate structure 2802a. As shown in FIG. 45, punch tape 2200 is punched proximate to a location of cell 2202a to move die 104a out of cell 2202a into a corresponding cell or cavity 4402 in tag substrate 116a such that underfill material 3402a substantially fills a gap between an outer edge of die 104a and cavity 4402. As shown in FIG. 45, a surface of die 104a and a surface of underfill material 3402a is substantially flush or even with the surface of tag subsfrate 116a.
• FIG. 46 shows a single die 104 attached in a cavity of tag substrate 116. As shown in FIG. 46, in the current example, contact pads 204a and
• FIG. 47 shows contact pads 204a and 204b of die 104 having been electrically coupled to contact areas 210a and 210b of tag subsfrate 116 by first and second electrical conductors 4702a and 4702b.
• electrical conductors 4702 can be printed, applied by a vapor deposition process, soldered, and otherwise formed between contact pads 204 of each die 104 and contact areas 210 on the surface of the corresponding tag substrate 116.
• a plurality of dies 104 may be transferred from a first surface to a second surface using a multi-barrel die transfer apparatus.
• FIG. 48A shows an example multi-barrel die transfer apparatus 4802, according to an embodiment of the present invention.
• Multi-barrel die fransfer apparatus 4802 includes a body 4804, and a plurality of barrels 4806.
• Body 4804 couples barrels 4806 to a gas supply and vacuum source 4810.
• a gas such as air, nitrogen, or other gas may be supplied by vacuum source 4810.
• any number of one or more barrels 4806 may be present, but typically multiple barrels 4806 are present to increase the fransfer rate of dies 104 by a factor of the number of barrels 4806 present. For example, tens or hundreds of barrels may be present.
• multi-barrel fransfer apparatus 4802 having a plurality of barrels 4806 is positioned over separated dies 104 attached to a first surface. The first surface is shown as support surface 404 in the example of FIG. 48A.
• Each barrel 4806 is positioned so that a respective end 4808 of the barrel 4806 is over a respective die 104 on support surface 404.
• Multi- barrel transfer apparatus 4802 receives the dies 104, storing them in stacks of dies 104 in the plurality of barrels 4806. As shown in FIG. 48B, multi-barrel transfer apparatus 4802 is then positioned over a second surface. The second surface is shown as fransfer surface 1202 in the example of FIG. 48B. Multi- barrel transfer apparatus 4802 deposits the dies 104 stored in the barrels 4806 on the second surface.
• FIG. 49 shows a flowchart 4900 providing example steps for transferring dies, according to an embodiment of the present invention.
• steps of flowchart 4900 may be further described in regards to multi-barrel transfer apparatus 4802, as shown in FIGS. 49-52.
• step 4902 each hollow barrel of a plurality of hollow barrels is applied in parallel to a respective die residing on the first surface.
• FIG. 50 shows a cross-sectional view of multi-barrel fransfer apparatus 4802 being applied to first surface 802.
• the plurality of hollow barrels are barrels 4806.
• Barrels 4806 are hollow so that at least a single die 104 may pass into barrel 4806 at a time, and be stored therein.
• each barrel 4806 is applied in parallel with the other barrels 4806 to a respective die 104 on the first surface.
• step 4904 the respective die is caused to move into each hollow barrel in parallel.
• each hollow barrel 4806 has a respective die 104 that has moved into the respective hollow barrel 4806.
• steps 4902 and 4904 are repeated to create a stack of dies in each hollow barrel.
• multi-barrel fransfer apparatus 4802 may be moved as many times as needed to position barrels 4806 over respective dies so that barrels 4806 may collect the respective dies 104.
• enough dies 104 have moved into each barrel 4806 to create a stack 5002 of dies 104 in each barrel 4806.
• Stack 5002 as shown in FIG. 50 includes two dies 104, but in embodiments may include any number of dies 104, including tens, hundreds, thousands, and even more dies.
• step 4908 dies from each hollow barrel are deposited in parallel onto the second surface until the stack of dies in each hollow barrel is substantially depleted.
• FIGS. 51 and 52 show cross-sectional views of multi-barrel transfer apparatus 4802 being applied to various second surfaces 804.
• barrels 4806 of multi-barrel transfer apparatus 4802 are depositing dies 104 in parallel onto second surface 804.
• Barrels 4806 deposit dies 104 until they are substantially depleted of dies 104.
• barrels 4806 can deposit varying amounts of dies 104 onto second surface 804, depending on the number of dies required by second surface 804, and or until one or more barrels 4806 are near or completely depleted of dies 104.
• Second surface 804 may have an adhesiveness that allows for dies 104 to stick thereto.
• second surface 804 may be an adhesive tape, or may have an adhesive material, such as a wax substance applied thereto to provide the adhesiveness.
• second surface 804 has cells 5102 formed therein, in which dies 104 are deposited from barrels 4806.
• second surface 804 may have a substantially planar surface onto which dies 104 are deposited.
• dies may be deposited in a pads down or pads up orientation. Barrels 4806 may be reversed end for end after collecting dies 104 in order to change the orientation of dies 104 before being deposited on second surface 804.
• ends 4808 and 5004 shown in FIG. 50 may be reversed after collecting dies 104.
• barrels 4806 can be left un-reversed.
• a vacuum may be used in steps 4904 and 4908 to move dies in and out of barrels 4806.
• a vacuum source 4810 is shown attached to multi-barrel transfer apparatus 4804 in FIGS. 48 A, 48B, and 50-51.
• Vacuum source 4810 may be applied to multi-barrel fransfer apparatus 4804 to cause a vacuum or suction in one or more barrels 4806 to move respective dies 104 into the barrel(s) 4806.
• the vacuum or suction may be continuous or applied in controlled bursts.
• Vacuum source 4810 may also be applied or varied to move dies 104 out of barrels 4806 onto second surface 804.
• vacuum source 4810 may apply bursts of positive pressure to move individual dies 104 out of barrels 4806.
• FIG. 53 shows a cross-sectional top view of an example barrel 4806 with die 104 inside, according to an embodiment of the present invention.
• Barrel 4806 may be rectangular as shown in FIG. 53, or may be round, or other shapes.
• Barrel 4806 may have a smooth interior surface 5302 in an embodiment of the present invention.
• interior surface 5302 may have a channel 5304 formed in one or more corners to allow gas to pass around dies 104. Channels 5304 may be used to control the vacuum or pressure in barrels 4806.
• Barrels 4806 may be made from a metal, plastic, or other applicable material.
• barrels 4806 may be barrels, tubes, or needles similar to hypodermic needles. Barrels 4806 are configured to collectively hold any number of dies 104. In an embodiment, the number and length of each barrel 4806 will be configured to have a cumulative die 104 holding capacity of at least one wafer worth of dies 104. For example, the cumulative holding capacity may be on the order of 50,000 to 100,000 of dies 104.
• the filled multi-barrel die collet can be moved, robotically or otherwise, to a die dispensing station for tag assembly.
• An empty multi-barrel die collet can then be positioned adjacent to a new wafer of separated die on a support surface to repeat the process.
• other mechanisms and/or processes may alternatively be used in step 4904 to cause dies to move into each hollow barrel, and in step 4908 to deposit dies from each hollow barrel.
• mechanical structures and forces, chemical processes and forces, electrostatic forces, adhesive materials, a gas pressure system, and further mechanisms and processes may be used, as would be understood by persons skilled in the relevant art(s) from the teachings herein.
• a plurality of dies 104 may be transferred to a target surface using a "die frame" or "wafer tape.”
• the die frame or wafer tape is formed directly from a wafer to hold the dies of the wafer such that they may be easily transferred to the target surface.
• Dies may be transferred from the die frame/wafer tape to an intermediate surface, or directly to a final surface, such as a subsfrate.
• the die frame or wafer tape of the present invention allows for fewer required manufacturing steps when transferring dies to a substrate compared to conventional transfer processes. For example, in a typical conventional process, dies are individually fransferred from the wafer to an intermediate transfer surface by a pick-and-place machine.
• the dies are then transferred from the intermediate surface to the final destination surface.
• This two step process allows for the dies to be flipped.
• dies can be directly transferred from the die frame/wafer tape to a substrate, without transfer to an intermediate surface. Furthermore, the dies can be flipped or not flipped by the transfer, as needed.
• the die frame/wafer tape of the present invention is referred to below as a die frame, for ease of description.
• the die frame may be formed according to processes of the present invention, some examples of which are described below for purposes of illustration, and not limitation.
• FIGS. 57 A and 57B show flowcharts for making a die frame, according to example embodiments of the present invention.
• FIGS. 66 and 68A-B show example flowcharts for transferring dies using a die frame, according to example embodiments of the present invention. Further embodiments for transferring dies using the die frame of the present invention will be apparent to persons skilled in the relevant arts based on the discussion herein.
• FIG. 57A shows a flowchart 5700 providing example steps for making a die frame, according to an embodiment of the present invention.
• Flowchart 5700 will be described below in relation to FIGS. 58-63, for illustrative purposes.
• Flowchart 5700 begins with step 5702.
• step 5702 a ring shaped groove is formed in a first surface of a wafer around a plurality of dies formed in the first surface of the wafer.
• FIG. 58 shows an example wafer 5800.
• a ring shaped groove 5802 has been formed in a surface of wafer 5800 closely adjacent to an outer edge of wafer 5800.
• the depth of ring shaped groove 5802 may be approximately equal to the thickness of an integrated circuit die, such as die 104, that is fo ⁇ ned in the surface of wafer 5800 (not shown in FIG. 58).
• ring shaped groove 5802 is substantially round or elliptical, and is continuous.
• ring shaped groove 5802 may be formed in other shapes, including square or other polygon.
• ring shaped groove 5802 does not necessarily have to be continuous, as shown in the example of FIG. 58, but may be instead be non-continuous, and for example, may include two or more separate portions formed in the surface of wafer 5800.
• the first surface of the wafer is scribed to form a grid of grooves in the first surface of the wafer that separates the plurality of dies.
• FIG. 59 shows wafer 5800 after having been scribed.
• the scribing of wafer 5800 has created a grid 5902 in the surface of wafer 5800.
• Grid 5902 is formed from a plurality of horizontal and vertical grooves 5904 formed in the surface of wafer 5800.
• a first groove 5904A, a second groove 5904B, a third groove 5904C, and a fourth groove 5904D of grid 5902 are indicated in FIG. 59.
• FIG. 59 shows an area for a first die 104a and an area for a second die 104b that reside within grid 5902. Note that features of dies 104 are not shown in FIG. 58 and
• FIG. 59 is a diagrammatic representation of FIG. 59.
• FIG. 60 shows a cross sectional view of a portion of wafer 5800.
• ring shaped groove 5802 and grooves 5904a and 5904b have a thickness or depth of depth 6002.
• depth 6002 may be 100 micrometers, or other thickness.
• Depth 6002 is typically equal to or greater than a thickness of a die of wafer 5800.
• wafer 6004 has a thickness 6004.
• Thickness 6004 can be any thickness of a conventional or special purpose wafer, which may be 600 to 700 micrometers or other thickness, for example.
• a solidifiable material is applied to the first surface of the wafer to substantially fill the ring shaped groove and the grooves of the grid.
• 61 shows, for example, a solidifiable material 6102 that has been applied to the surface of wafer 5800 to substantially fill ring shaped groove 5802 and grooves 5904 of grid 5902.
• Solidifiable material 6102 substantially fills ring shaped groove 6102 and grooves 5904.
• solidifiable material 6102 substantially fills ring shaped groove 6102 and grooves 5904.
• Solidifiable material 6102 may be a polymer, epoxy, resin, urethane, glass, or other material, for example.
• a variety of processes may be used to cause solidifiable material 6102 to fill grooves 5802 and 5904 when applied to wafer 5800, without leaving a substantial excess amount of solidifiable material 6102 otherwise on the surface of wafer 5800.
• a vacuum source may be applied to the opposite surface of wafer 5800, or to a tape, such as a blue or green tape, to which wafer 5800 is attached, to cause solidifiable material 6102 to be pulled into grooves 5802 and 5904.
• a gas source may direct a gas towards the surface of wafer 5800 to which solidifiable material 6102 is being applied, to blow, force, or push solidifiable material 6102 into grooves 5802 and 5904.
• solidifiable material 6102 is applied to the surface of wafer 5800 in a spin-coating fashion, such that a spinning motion of wafer 5800 causes solidifiable material 6102 to move or "wick" into grooves 5802 and 5904.
• Solidifiable material 6102 may be applied in additional ways to fill grooves 5802 and 5904, including by "squeegee” application, spraying, vapor deposition, physical deposition, or chemical deposition.
• step 5708 the solidifiable material is caused to harden into a ring shaped hardened material in the ring shaped groove, and into a grid shaped hardened material in the grooves of the grid to form the die frame.
• solidifiable material 6102 is caused to hardened in ring shaped groove 5802, and in grooves 5904 of grid
• the hardened material is formed by causing solidifiable material 6102 to hardened by a curing process.
• solidifiable material 6102 may be any curable material, such as a curable polymer, epoxy, resin, urethane, glass, or other material, for example.
• Solidifiable material 6102 may be a material that is caused to harden in a variety of ways, including by heat, by allowing a sufficient amount of time for solidifiable material 6102 to hardened on its own, by applying light, or by other ways described elsewhere herein or otherwise known.
• step 5710 the wafer is thinned such that the grid shaped hardened material removably holds the plurality of dies. For example, FIG.
• Die frame 6300 includes a hardened material 6304 resulting from the hardening of solidifiable material 6102 in ring shaped groove 5802 and grooves 5904 of grid 5902, as described above. Die frame 6300 further results from the thinning of wafer 5800. As shown in FIG. 63, wafer 5800 has been thinned to form die frame
• die frame 6300 of a thickness of approximately depth 6002.
• die frame 6300 can be formed or thinned to have a thickness of approximately equal to depth 6002, or a lesser thickness.
• die frame 6300 removably holds dies 104 in corresponding openings 6302.
• dies 104 can be easily removed from openings 6302.
• die frame 6300 removably holds die 104A in opening 6302A, and removably holds die 104B in an opening 6302B.
• Die frame 6300 provides a support structure in the shape of ring shaped groove 5802 and grid 5904 that is capable of removably holding dies 104 in openings 6302. Dies 104 may be removed from die frame 6300 by pushing, poking, or otherwise forcing them out of openings 6302 from either surface of die frame 6300 onto another surface. Depending on which surface of die frame 6300 that dies 104 are forced from will determine whether dies 104 are fransfe ⁇ ed to a surface in either a pads up or a pads down orientation. Note that wafer 5800 may be thinned in step 5710 according to any conventional or otherwise known means.
• FIG. 57B shows a flowchart 5720 providing example steps for making a die frame, according to another embodiment of the present invention. Flowchart 5720 will be described below in relation to FIGS. 64A-64C, 65A, and 65B, for illustrative purposes.
• Flowchart 5720 begins with step 5722.
• step 5722 a wafer attached to an adhesive surface is scribed such that a resulting plurality of dies are separated by a grid of grooves that extend through the wafer to the adhesive surface. For example, FIG.
• Wafer frame 64A shows a scribed wafer 6402 attached to an adhesive surface 6404.
• Adhesive surface 6404 is held in a wafer frame 6406.
• Wafer frame 6406 may also be referred to as a wafer carrier or tape ring.
• adhesive surface 6404 may be a green tape, blue tape, or other adhesive surface type.
• Wafer frame 6406 holds and supports adhesive surface 6404 in a taut fashion so that scribed wafer 6402 may be accessed. Because wafer 6402 has been scribed, wafer 6402 has a grid 5902 of grooves 5904 (not shown in FIG. 64A) that separates the dies 104 of wafer 6402. Wafer 6402 is scribed so that grooves 5904 extend through wafer 6402 to adhesive surface 6404.
• FIG. 64B shows a cross- sectional view of an example scribed wafer 6402 having three dies 104 separated by grooves 5904. Note that wafer 6402 is shown with three dies 104 for purposes of illustration, and not of limitation.
• FIG. 64C shows a perspective view of a portion of an example scribed wafer 6402 attached to adhesive surface 6404, having a plurality of dies 104 separated by grooves
• a solidifiable material is applied to the scribed wafer to substantially fill the grooves of the grid.
• solidifiable material 6102 is applied to scribed wafer 6402 to partially or completely fill grooves 5904 between dies 104.
• solidifiable material 6102a fills grooves 5904 between dies 104.
• solidifiable material 6102 may be applied such that solidifiable material 6102b is present to fill a space 6500 on adhesive surface 6404 between an outer edge 6502 of wafer 6402 and an inner edge 6504 of wafer frame 6406.
• solidifiable material 6102 may even extend partially within wafer frame 6406, as shown in FIG. 65A, although this is not required. Solidifiable material 6102 may be applied in any manner described elsewhere herein, such as is described above in relation to FIGS. 61 and 62, or otherwise known.
• the solidifiable material is caused to harden into a grid shaped hardened material in the grooves of the grid.
• solidifiable material 6102a and 6102b shown in FIG. 65 A is caused to harden into a grid shaped hardened material, such as is described above for hardened material 6304 in relation to FIG. 63.
• step 5728 the adhesive surface is removed so that the grid shaped hardened material removably holds the plurality of dies.
• FIG. 65B shows a die frame 6300 that results from the removal of adhesive surface 6404.
• Hardened material 6304a is present between dies 104, and hardened material 6304b is present outside of dies 104.
• Hardened material 6304 removably holds dies 104 in the shape of a grid in die frame 6300, as described above.
• adhesive surface 6404 may be removed or detached by peeling, chemically dissolving, or otherwise removing it from die frame 6300.
• die frame 6300 may be formed in a pads up or pads down fashion.
• flowchart 5720 may include steps similar to steps 702, 704, and 706 shown in flowchart 700 of FIG. 7, for flipping the orientation of dies 104 prior to performance of step 5722.
• the pads of dies 104 may be facing toward or away from adhesive surface 6404, depending on which orientation is selected.
• the structure of die frame 6300 has numerous advantages.
• the portion of die frame 6300 formed in a ring shape in ring shaped groove 5802 allows for a holding mechanism, such as a clamp or jig, to reliably hold die frame 6300 when being used for transferring dies, for example.
• the portion of die frame 6300 formed in a grid shape in grid 5904 allows for the holding of dies 104, with relative ease in removal of dies 104, as described below.
• the structure of die frame 6300 has further benefits. Note that in some embodiments, the ring shaped portion of die frame 6300 may not be necessary, and is not present.
• flowchart 5700 may include an additional step that is performed prior to step 5704, where a layer of protective material is applied onto the surface of the wafer.
• the protective material for example, may be a photo-resist material, or other protective material, which may be spin coated or otherwise applied to the surface of the wafer.
• flowchart 5700 may also include the step where the protective material is removed from the surface of the wafer. For example, removing the protective material from the wafer can cause the removal of excess solidifiable material 6102 in its hardened state or in its unhardened state (i.e., prior to or after step 5708).
• wafer 5800 may be immersed in a solvent, or may have a solvent applied thereto to dissolve the protective material from the surface of wafer 5800.
• the protective material may be removed from 5800 by other ways that are known to persons skilled in the relevant arts.
• Die frame 6300 may be used to fransfer dies 104 to a subsequent destination or transfer surface.
• the subsequent surface can be an intermediate surface, such as a blue or green tape, or intermediate surfaces otherwise known or described elsewhere herein, or may be used to transfer dies 104 to a final destination surface, such as a substrate.
• die frame 6300 allows for precise transfer of dies. For example, because the location of dies removably held in die frame 6300 is accurately known, precise regisfration of dies is present. Thus, expensive optical and/or other type registration systems may not be required to locate and accurately place dies.
• FIG. 66 shows a flowchart 6600 providing steps for transferring a plurality of dies to a surface using a die frame, according to embodiments of the present invention.
• Flowchart 6600 begins with step 6602.
• a die frame is positioned closely to a surface of a substrate tape that includes a plurality of substrates such that a die of a plurality of dies removably held in the die frame is closely adjacent to a corresponding substrate of the plurality of subsfrates of the substrate tape.
• FIG. 67 shows a system 6700 for transferring dies to a surface using die frame 6300.
• System 6700 includes die frame 6300, punching member 2406, a die frame jig 6702, a first reel 6706, a second reel 6708, and a subsfrate tape 6710. As shown in FIG.
• substrate tape 6710 includes a plurality of substrates 6712a-c.
• Substrate tape 6710 may include any number of substrates 6712.
• die frame 6300 is positioned closely adjacent to a surface of substrate tape 6710.
• Die frame 6300 is positioned closely adjacent to substrate tape 6710 such that a die 104 may be punched from die frame 6300 to a substrate 6712 of subsfrate tape 6710, as is described below.
• the die is transferred onto the closely adjacent corresponding substrate from the die frame.
• die 104 has been fransferred from die frame 6300 to a surface of substrate 6712b of substrate tape 6710.
• die 104 may be punched from die frame 6300, which removably holds die 104, onto substrate 6712a.
• a punching mechanism 2406 may be used to punch die
• substrate tape 6710 may include a plurality of substrates 6712 that are serially arranged.
• Substrate tape 6710 may be incremented according to a reel-to-reel system, such as shown in FIG. 67. i FIG. 67, a first reel 6706 may supply substrate tape 6710 to a second reel 6708, which receives substrate tape 6710.
• subsfrate tape 6710 may be incremented to move a next substrate 6712 into position to receive a die 104 from die frame 6300.
• Other mechanisms may be used to increment subsfrate tape 6710.
• subsfrate tape may include an N x M array of substrates 6712, where N > 1 and M > 1, instead of having substrates 6712 serially aligned.
• the die frame is positioned closely adjacent to the surface of the substrate tape such that another die of a plurality of dies removably held in the die frame is closely adjacent to a next corresponding substrate of the plurality of substrates of the substrate tape.
• die frame 6300 is held in a die frame jig 6702.
• Die frame jig 6702 may be moved laterally relative to substrate tape 6710 to position the next die 104 over the next substrate 6712, such as substrate 6712a or 6712b.
• the die frame jig 6702 may be repositioned by the width or length of a die 104, instead being repositioned by an optical and or other registration system type which has to determine the location of a die. For example, in an embodiment, for a 500 x 500 micron sized die, die frame jig 6702 may be moved by 500 microns (possibly plus the width of a groove 5904) to place the next die 104 into position for transfer. Note that the present invention is applicable to any size die. In step 6610, another die is transferred onto the closely adjacent next corresponding substrate from the die frame.
• a plurality of dies 104 may be transferred from die frame 6300 on to corresponding substrates 6712 of subsfrate tape 6710.
• a large number of tag substrate/die combinations may be created in a relatively rapid fashion, in fewer steps than with conventional processes.
• FIG. 68A shows a flowchart 6800 providing steps for transferring a plurality of dies to a surface using a stack of die frames, according to another embodiment of the present invention. Note that steps of flowchart 6800 that are optional are shown enclosed in dotted lines. Further structural embodiments will be apparent to persons skilled in the relevant arts based on the following discussion.
• Flowchart 6800 will be described in relation to FIG. 69, for illustrative purposes.
• Flowchart 6800 begins with step 6802.
• step 6802 a stack of die frames is formed, each die frame including a grid having a plurality of rectangular openings, wherein each opening of the plurality of rectangular openings removably holds a die, wherein co ⁇ esponding rectangular openings of the die frames in the stack are aligned in a column to form a plurality of columns of openings.
• FIG. 69 shows a stack of die frames 6902.
• Stack 6902 includes a plurality of die frames 6300.
• stack 6902 is shown including six die frames 6300a-£ but may include any number of two or more die frames 6300.
• each die frame is shown including six die frames 6300a-£ but may include any number of two or more die frames 6300.
• step 6804 a die removably held in an opening is fransferred from at least one column of the plurality of columns to the destination surface.
• one or more dies 104 are fransferred from stack 6902 from one or more columns to the destination surface. Dies 104 may be transfe ⁇ ed in numerous ways from stack 6902. For example, as shown in FIG.
• one or more punching members 2406 may be applied to corresponding columns of openings 6302 in stack 6902.
• a punching member 2406 pushes through stack 6902 to move dies 104 from the respective column of openings 6302 in stack 6902 to the destination surface.
• a punching member 2406 may be stepped to push out a single die 104 at a time. Any number of punching members 2406 may operate in parallel, such as punching members 2406a-c as shown in the example of FIG. 69, to increase the rate of die transfer.
• the destination surface may be a subsfrate tape or structure, as shown in FIG. 69.
• the destination surface may be a punch tape or chip carrier, such as shown in FIG. 22, any intermediate surface, such as a green tape or blue tape, or any other surface.
• dies 104 may be fransferred to the destination surface in a pads up or down configuration, depending on the orientation of stack 6902.
• Stack 6902 may be inserted into a die deposition apparatus that holds and aligns the respective die frames 6300 in a stack, and allows dies to be transferred therefrom.
• FIG. 70 shows a system 7000 for transferring dies from a die frame 6300 using a multi-barrel die fransfer apparatus 4802, according to an embodiment of the present invention.
• multi-barrel die transfer apparatus 4802 includes a plurality of barrels 4806a-c.
• system 7000 includes a stack 6902 of die frames 6300 which includes first, second, third, and fourth die frames 6300a-d.
• Stack 6902 may include any number of die frames 6300.
• a stack of die frames is formed, each die frame including a grid having a plurality of rectangular openings, wherein each opening of the plurality of rectangular openings removably holds a die, wherein corresponding openings of the die frames in the stack are aligned in a column.
• the die frames 6300a-d of die frame stack 6902 are aligned such that a plurality of columns 7002 are formed.
• Each column 7002 includes a die removably held in an opening in each of die frames 6300a-d.
• each hollow barrel of a plurality of hollow barrels is applied to a respective column of openings of the stack of die frames.
• a first column 7002a has first barrel 4806a applied thereto
• a second column 7002b has second barrel 4806b applied thereto
• a third column 7002c has a third barrel 4806c applied thereto.
• step 6814 dies removably held in the openings of the respective column of openings are caused to move into each hollow barrel in parallel. As shown in FIG. 70, dies 104 that were removably held in die frames 6300a- 6300d are caused to move into barrels 4806. Dies 104 may be caused to move into the hollow barrels 4806 by vacuum, by gas pressure, by mechanical means, or other means described elsewhere herein or otherwise known.
• steps 6812 and 6814 are repeated until each hollow barrel contains a stack of dies of a predetermined number. For example, steps 6812 and 6814 may be repeated until one or more of barrels 4806a-c become full, until stack 6902 is depleted of dies, or when an arbitrary number of dies 104 have been moved from stack 6902.
• a die from each hollow barrel is deposited onto the surface until the stack of dies contained by each hollow barrel is substantially depleted.
• dies 104 from hollow barrels 4806 may be deposited onto the destination or target surface, until the dies 104 in hollow barrels 4806 are depleted, or until the surface is full of dies 104, or until an arbitrary number of dies 104 have been transferred.
• dies 104 may be deposited from hollow barrels 4806 by mechanical means, by vacuum, by gas pressure or by other means described elsewhere herein or otherwise known.
• die frame 6300 may be used in a variety of ways to transfer dies to a target surface. Furthermore, die frame 6300 may be combined with any of the other die transfer mechanisms and processes described elsewhere herein to provide for enhanced die transfer mechanisms and processes. Further example die frame embodiments are described in the following subsections, for illustrative purposes.
• a die frame may be formed in a flexible, planar tape structure, similar to a "blue tape” or “green tape” used to attach wafers/dies.
• the tape structure is fabricated to include a hardenable material or substance.
• a wafer is attached to the tape structure, and is separated into a plurality of dies.
• the tape structure is processed to cause a hardened grid structure to form in the tape structure, which removably holds the plurality of dies.
• 71 shows a flowchart 7100 providing steps for making such a die frame or die support frame, according to an example embodiment of the present invention.
• Flowchart 7100 is described below in relation to FIGS. 72, 73 A, 73B, and 74 for illustrative purposes.
• Flowchart 7100 begins with step 7102.
• a wafer that comprises a plurality of dies is attached to a surface of a tape structure.
• FIG. 4B shows a wafer 400 attached to an example support surface 404.
• wafer 400 includes a plurality of dies 104.
• wafer 400 is attached in a similar fashion to a tape structure.
• the surface of the tape structure and/or wafer 400 may have an adhesive material applied thereon to adhere wafer 400 to the tape structure.
• the tape structure is described in further detail below.
• a grid of grooves is formed in the wafer to separate the plurality of dies on the surface of the tape structure.
• FIG. 72 shows wafer 400 attached to a surface 7202 of a tape structure 7200, according to an example embodiment of the present invention.
• Wafer 400 is separated into a plurality of dies 104 on surface 7202.
• Wafer 400 may be separated into a plurality of dies 104 on tape structure 7200 according to any conventional wafer separation technique, including scribing or separating wafer 400 by sawing, laser, mechanical or chemical etching, and other techniques.
• the separation of wafer 400 creates grid 5902 of grooves 5904 in wafer 400.
• Tape structure 7200 is a flexible structure that comprises a hardening or solidifiable material that can be caused to harden by various techniques.
• tape structure 7200 may include a material that can be caused to harden by the application of light, including by application of ultraviolet (UV) or other frequency bands of light.
• tape structure 7200 may include a material that may be caused to harden by the application of a solid, liquid, or gas, that reacts with the material of tape structure 7200 to cause portions of tape structure 7200 to harden or solidify.
• tape structure 7200 may comprise the material that can be caused to harden.
• FIG. 73 A shows a cross-sectional view of tape structure 7200 as a single layer structure having the solidifiable or hardenable material throughout.
• FIG. 73B shows tape structure 7200 as a multi-layer structure that includes a solidifiable or hardenable material layer 7302.
• Layer 7302 can be fabricated into tape structure 7200, or can be spread, applied, or sprayed onto tape structure 7200.
• the solidifiable or hardenable material may be a photoresist material or an epoxy applied to tape structure 7200.
• Tape structure 7200 may further include a paper, tape, polymer, or other material layer to provide structural support.
• steps 7102 and 7104 may be performed by structure(s) described herein or otherwise known, and may be performed by the same structure, or different structures.
• a wafer preparation module may perform steps 7102 and 7104.
• An example such wafer preparation module is further described in sections 3.0-3.2 below.
• the wafer preparation module may include a wafer application apparatus, for applying a wafer to tape structure 7200, and/or may include a wafer singulation apparatus for separating/singulating the wafer on surface 7202.
• a portion of the tape structure that is accessible through the grooves of the grid is caused to harden into a grid shaped structure.
• FIG. 74 shows an example system 7400 for causing the portion of tape structure 7200 that is accessible through grooves 5904 of grid 5902 to harden into a grid shaped structure.
• a hardening agent source 7402 transmits a hardening agent 7404 towards separated wafer 400 and tape structure 7200. Due to the location of dies 104, hardening agent 7404 reaches tape structure 7200 through grooves 5904 and at peripheral areas.
• portions of tape structure 7200 that are accessible through grooves 5904 and in peripheral areas are caused to harden, shown as hardened groove portions 7410 and hardened peripheral areas 7420, respectively.
• portions of tape structure 7200 that are not accessible to hardening agent 7404 do not harden.
• FIG. 74 shows an example portion 7430 of tape structure 7200 that is not hardened.
• Hardening agent source 7402 can include various sources for hardening agents, depending on the type of hardening or solidifiable material in tape structure 7200.
• hardening agent source 7402 can include a light source and respective optics, including a UV light source or infrared (IR) light source, for a material that hardens with exposure to light.
• the hardening material may be a photoresist material.
• hardening agent 7404 may be light, such as UV, IR, or other frequency band of light.
• hardening agent source 7402 can include a gas or liquid supply for applying or spraying a gas or liquid towards separated wafer 400 and tape structure 7200.
• hardening agent 7404 may be an epoxy of a two-party epoxy, to react with a corresponding epoxy incorporated in tape structure 7200.
• Other hardening agent sources and hardening agents are applicable to the present invention, including a heat source.
• a die frame 7460 is thereby formed.
• the die frame 7460 formed according to flowchart 7100 removably holds the plurality of dies 104.
• one or more dies 104 of the plurality of dies 104 can be moved from the grid shaped structure of die frame 7460 onto a target surface.
• FIG. 75 shows a die frame 7460 that includes an example grid shaped structure 7500. Die frame
• die 7460 is held by a die frame jig 6702. As shown in FIG. 75, a die 104 is being moved from die frame 7460 to a substrate 6712. In the example of FIG. 75, die 104 is being moved by a punching member 2406. Die 104 may be moved from die frame 7460 in a variety of ways, including by punching, by action of a gas, and by other ways otherwise known or described elsewhere herein.
• each non-hardened area 7430 may or may not tear from die frame 7460 when the respective die 104 is moved from die frame 7460.
• Die frame 7460 may be used in a variety of ways to transfer dies 104 to a target surface, including any of the ways for transferring dies described elsewhere herein. Furthermore, die frame 7460 may be combined with any of the other die fransfer mechanisms and processes described elsewhere herein to provide for enhanced die transfer mechanisms and processes. 2.1.4.2 Die Frame Formed by Releasing Encapsulated
• a die frame may be formed on a planar tape structure, similar to a "blue tape” or “green tape” used to attach wafers/dies.
• the tape structure is fabricated to include an encapsulated, releasable material or substance that hardens.
• a wafer is attached to the tape structure, and is separated into a plurality of dies. The process of separating the wafer into dies breaches the tape structure, which releases the encapsulated material. The released material hardens to create a hardened grid structure on the tape structure, which removably holds the plurality of dies. The remainder of the tape structure may then be optionally removed.
• FIG. 76 shows a flowchart 7600 providing steps for making such a die frame or die support frame, according to an another example embodiment of the present invention.
• Flowchart 7600 will be described below in relation to FIGS. 77-82, for illustrative purposes.
• Flowchart 7600 begins with step 7602.
• step 7602 a wafer that comprises a plurality of dies is attached to a surface of a tape structure, wherein the tape structure comprises an encapsulated releasable hardening or hardenable material.
• FIG. 4B shows wafer 400 attached to an example support surface 404.
• wafer 400 is attached to an example support surface 404.
• FIG. 4A wafer
• FIG. 77 shows wafer 400 attached to a surface 7706 of a tape structure 7702.
• Surface 7706 and/or wafer 400 may have an adhesive material applied thereto to adhere wafer 400 to surface 7706.
• Tape structure 7702 may be a single or multi-layer structure.
• An example multi-layer structure for tape structure 7702 is shown in FIG. 77.
• tape structure 7702 includes a layer 7704.
• Layer 7704 comprises an encapsulated hardening material that can be released and hardened.
• layer 7704 may include a gas, liquid, or solid that is released from layer 7704, and hardens, when a proper agent is applied to layer 7704. The operation and structure of layer 7704 is further described below.
• Tape structure 7702 is typically flexible, but may also be rigid. As shown in the example embodiment of FIG. 77, tape structure 7702 can include a tape layer 7708 for added structural support, although tape layer 7708 is not required. Tape layer 7708 may be made from a variety of materials. For example, tape layer 7708 may be a paper, a polymer, a subsfrate material, a glass, a metal or combination of metals/alloy, a plastic, or other suitable substance, or combination thereof.
• a grid of grooves in the wafer is formed to separate the plurality of dies on the surface of the tape structure, including the step of breaching the surface of the tape structure in the grooves to cause the encapsulated hardening material to harden in the grooves into a grid shaped hardened material in the grooves of the grid.
• FIG. 78 shows a cross-sectional view of wafer 400 being separated into separate dies 104 on surface 7706 of tape structure 7702, according to an example embodiment of the present invention. The separation of wafer 400 creates grid 5902 of grooves 5904 (similarly to as shown in FIG. 59).
• Wafer 400 may be separated into a plurality of dies 104 on tape structure 7702 according to any conventional wafer separation technique, including scribing or separating wafer 400 by sawing, laser, mechanical or chemical etching, and other techniques.
• FIG. 78 shows a cross- sectional view of wafer 400 being separated into a plurality of dies 104 using a laser 7810, according to an embodiment of the present invention.
• FIG. 79 shows a perspective view of a portion of wafer 400 being separated into a plurality of dies 104 using a saw 7910, according to another embodiment of the present invention.
• step 7604 forming the grid of grooves breaches the surface of the tape structure in the grooves to cause the encapsulated hardening material to harden in the grooves into a grid shaped hardened material.
• surface 7706 of tape structure 7702 is breached.
• An example breach in surface 7706 is indicated as a breach 7820.
• a sufficient breach 7820 occurs in surface 7706 along the length of each of grooves 5904 so that the encapsulated hardening material substantially fills each groove 5904.
• Breach 7820 may have any width and depth necessary to release a sufficient amount of encapsulated hardening material.
• FIGS. 78 and 79 each show a released hardening material 7802 that partially or completely fills a respective groove 5904.
• Breach 7820 releases hardening material 7802 from layer 7704 of tape structure 7702.
• Hardening material 7802 can be a gas, liquid, solid, or combination thereof.
• the material encapsulated in layer 7704 may be released as a foam, gel, epoxy, or other liquid.
• Hardening material 7802 may be caused to harden in a variety of ways.
• hardening material 7802 hardens when it meets the ambient air, or when it meets a selected gas or combination of gases
• hardening material 7802 hardens when it is heated by the particular wafer separation technique, such as the heat generated by contact with the beam of laser 7810 or by the action of saw 7910.
• hardening material 7802 hardens when it contacts or mixes with an epoxy or other material.
• layer 7704 may include micro-encapsulated spheres or beads that contain the hardening material. The spheres or beads are ruptured when the particular wafer separation technique breaches layer 7704.
• the hardening material is released from the spheres or beads and, and hardens when heated, when contacting air or other gas, or otherwise.
• FIG. 80 shows a perspective view of a portion of a separated wafer 400 on tape structure 7702, with hardening material 7802 forming a grid shaped hardened material 8000 around a plurality of dies 104, according to an example embodiment of the present invention.
• steps 7602 and 7604 may be performed by structure(s) described herein or otherwise known, and may be performed by the same structure, or different structures.
• a wafer preparation module may perform steps 7602 and 7604.
• An example such wafer preparation module is further described in section 3.0-3.2 below.
• the wafer preparation module may include a wafer application apparatus, for applying a wafer to tape structure 7702, and/or may include a wafer singulation apparatus for separating/singulating the wafer on surface 7706, and for breaching surface 7706.
• the wafer singulation apparatus may include laser 7810 and/or saw 7910, for example.
• step 7606 the tape structure is removed so that the grid shaped hardened material removably holds the plurality of dies.
• FIG. 81 shows a die frame 8100 that has been detached from tape structure 7702, according to an example embodiment of the present invention. Tape structure 7702 may be peeled, dissolved, etched, or otherwise removed.
• Die frame 8100 is thus formed according to flowchart 7600.
• Die frame 8100 may be used in a variety of ways to transfer dies to a target surface, including any of the ways for transferring dies described elsewhere herein.
• die frame 8100 may be combined with any of the other die transfer mechanisms and processes described elsewhere herein to provide for enhanced die fransfer mechanisms and processes.
• step 310 post processing is performed to complete assembly of RFID tag(s) 100.
• FIG. 54 is a flowchart illustrating a performance of step 310 in greater detail. This operation begins with a step 5402, where perforations are made on tag subsfrate 116 between tags 100. These perforations enable users to separate tags 100 for individual placement on various objects.
• step, 5404 each tag 100 is inspected to ensure proper assembly. This step comprises ensuring proper placement of related elecfronics 106 and die 104.
• step 5406 continuous roll(s) of tags 100 are cut and arranged into sheets.
• step 5408 an adhesive backing is applied to tag subsfrate 116.
• This adhesive backing is enables tags 100 to be attached to objects, such as books and consumer products.
• the present invention is also directed to a tag assembly apparatus.
• FIGs. 55 and 56 are block diagrams of two tag assembly apparatuses that employ the techniques described herein.
• FIG. 55 illustrates a "pads up” assembly apparatus 5500.
• Assembly apparatus 5500 assembles tags in a “pads up” manner, as described herein.
• assembly apparatus 5500 performs the steps as described herein with reference to FIGs. 3 and 11.
• Assembly apparatus 5500 includes a support surface supplier 5502, a support surface collector 5504, a wafer preparation module 5506, a first die transfer module 5508, a transfer surface supplier 5510, a fransfer surface collector 5512, a second die transfer module 5514, a tag substrate supplier 5516, a post processing module 5518, an adhesive application module 5520, and a printing module 5522.
• Support surface supplier 5502 and support surface collector 5504 convey support surface 404 in a direction, as indicated by the arrows in FIG.
• Wafer preparation module 5506 performs steps 304 and 306. Thus, wafer preparation module 5506 applies wafer 400 to support surface 404. In addition, wafer preparation module 5506 separates the plurality of dies 104 on wafer 400. Wafer preparation module 5506 is implemented with suitable mechanisms and scribing implements, such as laser(s).
• First die transfer module 5508 transfers die(s) 104 from support surface 404 to transfer surface 1202. That is, first die transfer module 5508 performs step 1102. Accordingly, first die transfer module 5508 includes piston(s), roller(s), air jet(s), and/or punching devices. First die fransfer module 5508 may include an adhesive tape, a punch tape, a multi-barrel transport mechanism, and/or a die frame, and other components associated with these components, such as are further described above for die transfer.
• First die transfer module 5508 also includes element(s) for releasing die(s) 104 from support surface 404, such as heating components and/or radiation devices.
• Transfer surface supplier 5510 and transfer surface collector 5512 convey transfer surface 1202 in a direction, as indicated by the arrows in FIG.
• Second die transfer module 5514 transfers die(s) 104 from transfer surface 1202 to tag substrate 116.
• second die transfer module 5514 performs step 1106.
• second die transfer module 5514 includes piston(s), roller(s), air jet(s), and/or punching devices.
• Second die transfer module 5514 may include an adhesive tape, a punch tape, a multi-barrel transport mechanism, and/or a die frame, and other components associated with these components, such as are further described above for die transfer.
• Second die transfer module 5514 also includes element(s) for releasing die(s)
• support surface 404 such as heating components and/or radiation devices.
• Tag subsfrate supplier 5516 conveys tag subsfrate 116 towards post processing module 5518, as indicated by the arrows in FIG. 55.
• Tag substrate supplier 5516 includes roller(s). However, other suitable means of conveyance can be used.
• Post processing module 5518 performs the post processing operations described herein with reference to step 310.
• Adhesive application module 5520 applies adhesive to tag subsfrate 116, pursuant to step 1104. To perform this step, adhesive application module 5520 includes a sprayer. However, adhesive application module 5520 can employ other suitable devices to perform this step.
• Printing and overcoating module 5522 prints related electronics 106 and applies an overcoating onto tag subsfrate 116, pursuant to steps 1108 and 1110.
• printing and overcoating module 5522 includes screen printing component(s) and sprayer(s).
• 5522 can employ other suitable devices, such as an ink jets, thermal spray equipment, and/or oblation devices.
• FIG. 56 illustrates a "pads down” assembly apparatus 5600.
• Assembly apparatus 5600 assembles tags in a “pads down” manner, as described herein.
• assembly apparatus performs the steps as described herein with reference to FIGs. 3 and 16.
• Assembly apparatus 5600 includes a support surface supplier 5502, a support surface collector 5504, a wafer preparation module 5506, a first die transfer module 5508, a first transfer surface supplier 5510, a first fransfer surface collector 5512, a second die transfer module 5602, a second transfer surface supplier 5604, a second fransfer surface collector 5606, a tag substrate supplier 5608, a third die fransfer module 5610, a post processing module
• Support surface supplier 5502 and support surface collector 5504 convey support surface 404 in a direction, as indicated by the arrows in FIG.
• These elements are spools. However, other suitable means of conveyance can be used.
• Wafer preparation module 5506 performs steps 304 and 306. Thus, wafer preparation module 5506 applies wafer 400 to support surface 404. In addition, wafer preparation module 5506 separates the plurality of dies 104 on wafer 400. Wafer preparation module 5506 is implemented with suitable mechanisms and scribing implements, such as laser(s).
• First die transfer module 5508 transfers die(s) 104 from support surface 404 to transfer surface 1202. That is, first die transfer module 5508 performs step 1620. Accordingly, first die transfer module 5508 includes piston(s), roller(s), air jet(s), and/or punching devices. First die transfer module 5508 may include an adhesive tape, a punch tape, a multi-barrel transport mechanism and/or process, and/or a die frame, and other components associated with these components, such as are further described above for die transfer. First die transfer module 5508 also includes element(s) for releasing die(s) 104 from support surface 404, such as heating components and/or radiation devices.
• First transfer surface supplier 5510 and first transfer surface collector 5512 convey transfer surface 1202 in a direction, as indicated by the a ⁇ ows in
• FIG. 56 These elements are spools. However, other suitable means of conveyance can be used.
• Second die transfer module 5602 transfers die(s) 104 from transfer surface 1202 to secondary transfer surface 1202. Thus, second die transfer module 5602 performs step 1622. Accordingly, second die transfer module
• Second die transfer module 5602 includes piston(s), roller(s), air jet(s), and/or punching devices.
• Second die transfer module 5602 may include an adhesive tape, a punch tape, a multi- barrel transport mechanism and/or process, and/or a die frame, and other components associated with these components, such as are further described above for die transfer.
• Second die transfer module 5602 also includes element(s) for releasing die(s) 104 from transfer surface 1202, such as heating components and/or radiation devices.
• Second fransfer surface supplier 5510 and second transfer surface collector 5512 convey secondary transfer surface 1202 in a direction, as indicated by the arrows in FIG. 56. These elements are spools. However, other suitable means of conveyance can be used.
• Tag substrate supplier 5608 conveys tag substrate 116 towards post processing module 5556, as indicated by the arrows in FIG. 56.
• Tag substrate supplier 5608 includes roller(s). However, other suitable means of conveyance can be used.
• Third die transfer module 5610 transfers die(s) 104 from secondary transfer surface 1202 to tag substrate 116. Thus, third die transfer module 5610 performs step 1608. Accordingly, third die transfer module 5610 includes piston(s), roller(s), air jet(s), and/or punching devices.
• Third die fransfer module 5610 may include an adhesive tape, a punch tape, a multi- barrel transport mechanism and/or process, and/or a die frame, and other components associated with these components, such as are further described above for die transfer. Third die transfer module 5610 also includes element(s) for releasing die(s) 104 from secondary transfer surface 1202, such as heating components and/or radiation devices. Adhesive application module 5628 applies adhesive to tag substrate
• adhesive application module 5628 includes a sprayer. However, adhesive application module 5628 can employ other suitable devices to perform this step.
• Printing module 5626 prints related electronics 106, pursuant to step 1606.
• printing module 5626 includes screen printing component(s) and sprayer(s).
• printing and overcoating module 5626 can employ other suitable devices, such as an ink jets, thermal spray equipment, and/or oblation devices.
• Post processing module 5556 performs the post processing operations described herein with reference to step 310.
• pads down assembly apparatus 5600 may also be adapted to fransfer dies directly from a support surface to a substrate, as would be understood by persons skilled in the relevant art(s) from the teachings herein.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Computer Hardware Design (AREA)
• General Physics & Mathematics (AREA)
• Physics & Mathematics (AREA)
• Theoretical Computer Science (AREA)
• Power Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
• Credit Cards Or The Like (AREA)
• Wire Bonding (AREA)

Applications Claiming Priority (13)

Publications (2)

Family

ID=31499693

Family Applications (1)

Country Status (6)

Families Citing this family (18)

Citations (3)

Family Cites Families (3)

• 2003
  • 2003-07-30 JP JP2005506084A patent/JP2005535149A/ja active Pending
  • 2003-07-30 AU AU2003257016A patent/AU2003257016B2/en not_active Ceased
  • 2003-07-30 EP EP03766981A patent/EP1545828A4/de not_active Withdrawn
  • 2003-07-30 WO PCT/US2003/023792 patent/WO2004012896A1/en active Application Filing
  • 2003-07-30 CA CA002494487A patent/CA2494487A1/en not_active Abandoned
  • 2003-08-01 TW TW092121188A patent/TWI226813B/zh not_active IP Right Cessation

Patent Citations (3)

Non-Patent Citations (1)

Also Published As

Similar Documents

Legal Events