ATE543374T1 - Schlämmenabgabeeinrichtung - Google Patents

Schlämmenabgabeeinrichtung

Info

Publication number
ATE543374T1
ATE543374T1 AT07830129T AT07830129T ATE543374T1 AT E543374 T1 ATE543374 T1 AT E543374T1 AT 07830129 T AT07830129 T AT 07830129T AT 07830129 T AT07830129 T AT 07830129T AT E543374 T1 ATE543374 T1 AT E543374T1
Authority
AT
Austria
Prior art keywords
tank
slurry
gas
discharging
dispensing device
Prior art date
Application number
AT07830129T
Other languages
English (en)
Inventor
Takashi Shoji
Takekazu Sakai
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Application granted granted Critical
Publication of ATE543374T1 publication Critical patent/ATE543374T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
AT07830129T 2006-10-17 2007-10-12 Schlämmenabgabeeinrichtung ATE543374T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006282328 2006-10-17
PCT/JP2007/070395 WO2008047888A1 (en) 2006-10-17 2007-10-12 Method for forming solder layer on printed-wiring board and slurry discharge device

Publications (1)

Publication Number Publication Date
ATE543374T1 true ATE543374T1 (de) 2012-02-15

Family

ID=39314101

Family Applications (2)

Application Number Title Priority Date Filing Date
AT10006438T ATE536735T1 (de) 2006-10-17 2007-10-12 Verfahren zur bildung einer lotschicht auf einer leiterplatte und schlammentladungsvorrichtung
AT07830129T ATE543374T1 (de) 2006-10-17 2007-10-12 Schlämmenabgabeeinrichtung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
AT10006438T ATE536735T1 (de) 2006-10-17 2007-10-12 Verfahren zur bildung einer lotschicht auf einer leiterplatte und schlammentladungsvorrichtung

Country Status (8)

Country Link
US (1) US20100009070A1 (de)
EP (2) EP2237651B1 (de)
JP (1) JP5001113B2 (de)
KR (1) KR101108960B1 (de)
CN (1) CN101536620B (de)
AT (2) ATE536735T1 (de)
TW (1) TWI411363B (de)
WO (1) WO2008047888A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4576270B2 (ja) * 2005-03-29 2010-11-04 昭和電工株式会社 ハンダ回路基板の製造方法
US20090041990A1 (en) * 2005-09-09 2009-02-12 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board
JP4920401B2 (ja) * 2006-12-27 2012-04-18 昭和電工株式会社 導電性回路基板の製造方法
US11071996B2 (en) 2013-03-14 2021-07-27 Musashi Engineering, Inc. Liquid material discharge device, coating device thereof, and coating method
CN106363267A (zh) * 2016-10-18 2017-02-01 成都言行果科技有限公司 电子设备熔接装置的过滤型焊料送料装置
CN106425004A (zh) * 2016-10-18 2017-02-22 成都言行果科技有限公司 电子设备熔接装置的多点位焊料送料装置
US11766729B2 (en) * 2017-09-28 2023-09-26 International Business Machines Corporation Molten solder injection head with vacuum filter and differential gauge system
CN110557897A (zh) * 2019-10-09 2019-12-10 新野县立新电子有限公司 一种环保印刷线路板生产工艺

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0187746A1 (de) * 1984-07-18 1986-07-23 AT&T Corp. Verfahren und apparat zum vielpunktverteilen von zähflüssigem material
US4572103A (en) * 1984-12-20 1986-02-25 Engel Harold J Solder paste dispenser for SMD circuit boards
JPS61155075U (de) * 1985-03-12 1986-09-26
JPH03152A (ja) * 1989-05-24 1991-01-07 Sanyo Electric Co Ltd 塗布装置
DE4092642C1 (de) * 1990-07-10 1995-11-23 Musashi Engineering Inc Flüssigkeitsausgabevorrichtung
JP3000152B2 (ja) * 1990-08-31 2000-01-17 名古屋工業大学長 高圧ガス噴射装置
US6476487B2 (en) * 1992-10-30 2002-11-05 Showa Denko K.K. Solder circuit
JP2592757B2 (ja) 1992-10-30 1997-03-19 昭和電工株式会社 はんだ回路基板及びその形成方法
US5346118A (en) * 1993-09-28 1994-09-13 At&T Bell Laboratories Surface mount solder assembly of leadless integrated circuit packages to substrates
JPH11163501A (ja) * 1997-12-02 1999-06-18 Rohm Co Ltd 電子部品の実装方法、およびその方法によって製造された電子回路装置
JP2000062138A (ja) 1998-08-19 2000-02-29 Matsushita Electric Ind Co Ltd 印刷装置
US6386433B1 (en) * 1999-08-24 2002-05-14 Kulicke & Soffa Investments, Inc. Solder ball delivery and reflow apparatus and method
US6694191B2 (en) * 2000-01-21 2004-02-17 Medtronic Minimed, Inc. Ambulatory medical apparatus and method having telemetry modifiable control software
SE518642C2 (sv) * 2000-07-11 2002-11-05 Mydata Automation Ab Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel
JP2003000152A (ja) * 2001-06-25 2003-01-07 Mitsubishi Heavy Ind Ltd ソフトクリームフリーザ
JP2004221378A (ja) * 2003-01-16 2004-08-05 Matsushita Electric Ind Co Ltd 電子部品の実装方法
US7838166B2 (en) * 2003-03-31 2010-11-23 Tokyo Gas Co., Ltd. Method for fabricating solid oxide fuel cell module
TWI259626B (en) * 2004-06-11 2006-08-01 Hon Hai Prec Ind Co Ltd Electrical card connector
US7381371B2 (en) * 2004-01-16 2008-06-03 Heathrow Scientific Llc Pipette device with pivotable nozzle assembly
JP2006064545A (ja) * 2004-08-27 2006-03-09 Mitsubishi Chemicals Corp 流体吐出機構及び流体吐出方法並びに流体分注装置
JP4688475B2 (ja) 2004-11-15 2011-05-25 株式会社タムラ製作所 はんだ材料供給装置及びこれを用いたはんだ材料供給方法
JP4576270B2 (ja) * 2005-03-29 2010-11-04 昭和電工株式会社 ハンダ回路基板の製造方法
JP4670436B2 (ja) 2005-03-31 2011-04-13 株式会社豊田自動織機 産業車両のヘッドガード
TWM275090U (en) * 2005-04-22 2005-09-11 Neng-Kuei Ye Low speed material supply device for mixing materials
US20090041990A1 (en) * 2005-09-09 2009-02-12 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board

Also Published As

Publication number Publication date
TW200838374A (en) 2008-09-16
EP2082630B1 (de) 2012-01-25
EP2237651A1 (de) 2010-10-06
EP2082630A4 (de) 2009-12-30
JP5001113B2 (ja) 2012-08-15
KR101108960B1 (ko) 2012-01-31
ATE536735T1 (de) 2011-12-15
CN101536620B (zh) 2011-04-06
CN101536620A (zh) 2009-09-16
TWI411363B (zh) 2013-10-01
JP2008124447A (ja) 2008-05-29
KR20090079902A (ko) 2009-07-22
EP2082630A1 (de) 2009-07-29
US20100009070A1 (en) 2010-01-14
WO2008047888A1 (en) 2008-04-24
EP2237651B1 (de) 2011-12-07

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