WO2009005058A1 - 吸着センサコントローラおよびそれを用いた吸着搬送装置 - Google Patents

吸着センサコントローラおよびそれを用いた吸着搬送装置 Download PDF

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Publication number
WO2009005058A1
WO2009005058A1 PCT/JP2008/061903 JP2008061903W WO2009005058A1 WO 2009005058 A1 WO2009005058 A1 WO 2009005058A1 JP 2008061903 W JP2008061903 W JP 2008061903W WO 2009005058 A1 WO2009005058 A1 WO 2009005058A1
Authority
WO
WIPO (PCT)
Prior art keywords
flow rate
suction
nozzle
conveyance device
electronic part
Prior art date
Application number
PCT/JP2008/061903
Other languages
English (en)
French (fr)
Inventor
Takehiro Omura
Yoshihiro Takahashi
Original Assignee
Koganei Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koganei Corporation filed Critical Koganei Corporation
Priority to JP2009521636A priority Critical patent/JPWO2009005058A1/ja
Publication of WO2009005058A1 publication Critical patent/WO2009005058A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays

Abstract

　吸着搬送装置は、電子部品を真空吸着するノズル１０とノズル１０に電子部品が吸着されたか否かを着脱流路１３の空気流量により検出する流量センサ２４とを有している。ノズル内流路の基準流量に対する目詰まり判定流量が吸着センサコントローラ２５の判定流量記憶部３１に格納され、ノズル１０に電子部品が接触していない状態のもとでノズル１０に負圧空気を供給して検出されるノズル内流路の空吸い流量と、目詰まり判定流量とを比較して空吸い流量が目詰まり判定流量よりも少ないときにはノズルは目詰まりであると判定される。
PCT/JP2008/061903 2007-07-04 2008-07-01 吸着センサコントローラおよびそれを用いた吸着搬送装置 WO2009005058A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009521636A JPWO2009005058A1 (ja) 2007-07-04 2008-07-01 吸着センサコントローラおよびそれを用いた吸着搬送装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-175760 2007-07-04
JP2007175760 2007-07-04

Publications (1)

Publication Number Publication Date
WO2009005058A1 true WO2009005058A1 (ja) 2009-01-08

Family

ID=40226103

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/061903 WO2009005058A1 (ja) 2007-07-04 2008-07-01 吸着センサコントローラおよびそれを用いた吸着搬送装置

Country Status (4)

Country Link
JP (1) JPWO2009005058A1 (ja)
KR (1) KR20100036219A (ja)
CN (1) CN101616777A (ja)
WO (1) WO2009005058A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013168278A1 (ja) * 2012-05-11 2013-11-14 富士機械製造株式会社 電子部品保持ヘッド、電子部品検出方法、および、ダイ供給機
EP2806718A4 (en) * 2012-01-19 2015-11-18 Fuji Machine Mfg SUCTION NOZZLE AND ANOMALY DETECTION DEVICE THEREFOR
WO2019193705A1 (ja) * 2018-04-05 2019-10-10 株式会社Ｆｕｊｉ 閾値の変更方法、及び検査装置
TWI737329B (zh) * 2020-05-29 2021-08-21 大陸商深超光電（深圳）有限公司 真空吸附裝置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011118173B4 (de) * 2011-11-10 2015-10-08 Festo Ag & Co. Kg Verfahren zum Betreiben einer Vakuumgreifeinrichtung, Vakuumsteuereinrichtung und Manipulator
CN103212895B (zh) * 2012-01-19 2016-03-02 昆山思拓机器有限公司 一种用于激光切割嘴的自动通孔系统
JP6161022B2 (ja) * 2012-05-08 2017-07-12 富士機械製造株式会社 吸着ノズル検査装置
JP5688609B2 (ja) * 2012-09-21 2015-03-25 Smc株式会社 位置検出装置
US10307915B2 (en) * 2014-07-15 2019-06-04 Fuji Corporation Inspection method
JP6558920B2 (ja) * 2015-01-26 2019-08-14 株式会社神戸製鋼所 溶接装置及び溶接方法
JP6580857B2 (ja) * 2015-04-10 2019-09-25 ハンファ精密機械株式会社 部品保持ヘッド
SG10201606197XA (en) 2015-08-18 2017-03-30 Ebara Corp Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
US9889995B1 (en) 2017-03-15 2018-02-13 Core Flow Ltd. Noncontact support platform with blockage detection
JP7193062B2 (ja) * 2018-08-01 2022-12-20 Thk株式会社 アクチュエータのセンシング装置及びアクチュエータの制御システム
CN117226462B (zh) * 2023-11-16 2024-02-02 深圳市恒锐创兴科技有限公司 一种射频功率放大器组装机械手

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133796A (ja) * 2001-10-29 2003-05-09 Matsushita Electric Ind Co Ltd 電子部品実装装置におけるノズル吸着高さの検出方法
JP2003204197A (ja) * 2002-01-08 2003-07-18 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法
JP2003224397A (ja) * 2002-01-30 2003-08-08 Fuji Mach Mfg Co Ltd 電気部品保持装置のフィルタの目詰まり状態検査，清掃方法および装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133796A (ja) * 2001-10-29 2003-05-09 Matsushita Electric Ind Co Ltd 電子部品実装装置におけるノズル吸着高さの検出方法
JP2003204197A (ja) * 2002-01-08 2003-07-18 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法
JP2003224397A (ja) * 2002-01-30 2003-08-08 Fuji Mach Mfg Co Ltd 電気部品保持装置のフィルタの目詰まり状態検査，清掃方法および装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2806718A4 (en) * 2012-01-19 2015-11-18 Fuji Machine Mfg SUCTION NOZZLE AND ANOMALY DETECTION DEVICE THEREFOR
WO2013168278A1 (ja) * 2012-05-11 2013-11-14 富士機械製造株式会社 電子部品保持ヘッド、電子部品検出方法、および、ダイ供給機
CN104271323A (zh) * 2012-05-11 2015-01-07 富士机械制造株式会社 电子元件保持头、电子元件检测方法及裸片供给机
JPWO2013168278A1 (ja) * 2012-05-11 2015-12-24 富士機械製造株式会社 電子部品保持ヘッド、電子部品検出方法、および、ダイ供給機
CN104271323B (zh) * 2012-05-11 2016-06-22 富士机械制造株式会社 电子元件保持头、电子元件检测方法及裸片供给机
WO2019193705A1 (ja) * 2018-04-05 2019-10-10 株式会社Ｆｕｊｉ 閾値の変更方法、及び検査装置
TWI737329B (zh) * 2020-05-29 2021-08-21 大陸商深超光電（深圳）有限公司 真空吸附裝置

Also Published As

Publication number Publication date
CN101616777A (zh) 2009-12-30
JPWO2009005058A1 (ja) 2010-08-26
KR20100036219A (ko) 2010-04-07

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