ATE529918T1 - Rf-antennenelement und verfahren zu dessen herstellung - Google Patents
Rf-antennenelement und verfahren zu dessen herstellungInfo
- Publication number
- ATE529918T1 ATE529918T1 AT07762542T AT07762542T ATE529918T1 AT E529918 T1 ATE529918 T1 AT E529918T1 AT 07762542 T AT07762542 T AT 07762542T AT 07762542 T AT07762542 T AT 07762542T AT E529918 T1 ATE529918 T1 AT E529918T1
- Authority
- AT
- Austria
- Prior art keywords
- antenna
- metal foil
- layer
- antenna element
- producing same
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0522—Using an adhesive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1994—Means for delaminating from release surface
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Details Of Aerials (AREA)
- Laminated Bodies (AREA)
- Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/338,590 US8786510B2 (en) | 2006-01-24 | 2006-01-24 | Radio frequency (RF) antenna containing element and methods of making the same |
PCT/US2007/001048 WO2007087189A2 (en) | 2006-01-24 | 2007-01-16 | Radio frequency (rf) antenna containing element and methods of making the same |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE529918T1 true ATE529918T1 (de) | 2011-11-15 |
Family
ID=38285016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT07762542T ATE529918T1 (de) | 2006-01-24 | 2007-01-16 | Rf-antennenelement und verfahren zu dessen herstellung |
Country Status (6)
Country | Link |
---|---|
US (4) | US8786510B2 (de) |
EP (1) | EP1977478B1 (de) |
CN (1) | CN101375463A (de) |
AT (1) | ATE529918T1 (de) |
ES (1) | ES2375663T3 (de) |
WO (1) | WO2007087189A2 (de) |
Families Citing this family (91)
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---|---|---|---|---|
CA2173428A1 (en) | 1995-04-06 | 1996-10-07 | Donald W. Church | Electronic parking meter |
US7571862B2 (en) * | 2005-06-02 | 2009-08-11 | Avery Dennison Corporation | RFID tag that provides a flat print area and a pinch roller that enables the same |
US8786510B2 (en) * | 2006-01-24 | 2014-07-22 | Avery Dennison Corporation | Radio frequency (RF) antenna containing element and methods of making the same |
US20070256773A1 (en) * | 2006-05-03 | 2007-11-08 | Fu-Nan Huang | Cool transfer wireless RF identification label |
DE102007026720A1 (de) * | 2007-06-06 | 2008-12-11 | Bielomatik Leuze Gmbh + Co.Kg | Selbstklebende Antenne für ein RFID-System, insbesondere für ein RFID-Etikett, und Verfahren zu ihrer Herstellung |
US7651882B1 (en) * | 2007-08-09 | 2010-01-26 | Impinj, Inc. | RFID tag circuit die with shielding layer to control I/O bump flow |
DE102007041751B4 (de) * | 2007-09-04 | 2018-04-19 | Bielomatik Leuze Gmbh + Co. Kg | Verfahren und Vorrrichtung zur Herstellung eines RFID-Etiketts |
DE102007041752A1 (de) * | 2007-09-04 | 2009-03-05 | Bielomatik Leuze Gmbh + Co Kg | Chipmodul für ein RFID-System |
JP5428339B2 (ja) * | 2007-10-26 | 2014-02-26 | 東レ株式会社 | 平面アンテナおよびその製造方法 |
FI121592B (fi) | 2008-03-26 | 2011-01-31 | Tecnomar Oy | Piirilevylaminaatin, erityisesti rfid-antennilaminaatin valmistusmenetelmä ja piirilevylaminaatti |
CA2664291C (en) | 2008-04-25 | 2013-09-17 | J.J. Mackay Canada Limited | Improved data collection system for electronic parking meters |
US9991311B2 (en) | 2008-12-02 | 2018-06-05 | Arizona Board Of Regents On Behalf Of Arizona State University | Dual active layer semiconductor device and method of manufacturing the same |
US20140254113A1 (en) * | 2008-12-02 | 2014-09-11 | Arizona Board of Regents, a body corporate of the State of Arizona Acting for and on behalf of Arizo | Method of providing an electronic device structure and related electronic device structures |
US20110316716A1 (en) | 2008-12-23 | 2011-12-29 | George Allan Mackay | Low power wireless parking meter and parking meter network |
US20100301006A1 (en) * | 2009-05-29 | 2010-12-02 | Nilsson Peter L J | Method of Manufacturing an Electrical Component on a Substrate |
US20100301005A1 (en) * | 2009-05-29 | 2010-12-02 | Nilsson Peter L J | Method of Manufacturing an Electrical Circuit on a Substrate |
US8128000B2 (en) | 2009-09-25 | 2012-03-06 | Avery Dennison Corporation | Method, system and apparatus for manufacturing a radio frequency identification device |
DE102009050386B4 (de) * | 2009-10-22 | 2013-10-31 | Mühlbauer Ag | Verfahren zum Herstellen von Durchkontaktierungen |
CN101714692B (zh) * | 2009-11-23 | 2013-05-22 | 北京澳普林特精密电子有限公司 | 一种铜箔天线的制备方法 |
ES2735236T3 (es) * | 2010-06-14 | 2019-12-17 | Avery Dennison Corp | Método y aparato de fabricar etiquetas y marbetes de identificación por radiofrecuencia en tiradas cortas |
US8991709B2 (en) | 2010-08-30 | 2015-03-31 | Tagstar Systems Gmbh | Tamper-proof RFID label |
CA3178279A1 (en) | 2011-03-03 | 2012-09-03 | J.J. Mackay Canada Limited | Parking meter with contactless payment |
WO2012139279A1 (zh) * | 2011-04-12 | 2012-10-18 | 深圳市厚泽真空技术有限公司 | 手机、真空镀膜天线及其制作方法 |
FI125720B (fi) | 2011-05-19 | 2016-01-29 | Tecnomar Oy | Rullalta rullalle -massavalmistukseen soveltuva sähköisten siltojen valmistusmenetelmä |
CN102407706A (zh) * | 2011-07-28 | 2012-04-11 | 深圳市通产丽星股份有限公司 | 一种烫印箔及烫印箔制作方法 |
CA145137S (en) | 2012-04-02 | 2013-07-22 | Jj Mackay Canada Ltd | Single space parking meter |
US9038918B2 (en) * | 2012-12-13 | 2015-05-26 | Avery Dennison Corporation | Antenna for RFID device and method for making the same |
US20140234577A1 (en) * | 2013-02-15 | 2014-08-21 | Identive Group, Inc. | Plastic Card Prelaminate and Plastic Card Including a Phone Sticker |
CN103367896B (zh) * | 2013-07-08 | 2016-05-04 | 温州格洛博电子有限公司 | 一种环保的射频天线模切加工工艺 |
WO2017034644A2 (en) | 2015-06-09 | 2017-03-02 | ARIZONA BOARD OF REGENTS a body corporate for THE STATE OF ARIZONA for and on behalf of ARIZONA STATE UNIVERSITY | Method of providing an electronic device and electronic device thereof |
US10381224B2 (en) | 2014-01-23 | 2019-08-13 | Arizona Board Of Regents On Behalf Of Arizona State University | Method of providing an electronic device and electronic device thereof |
CN106663640B (zh) | 2014-05-13 | 2020-01-07 | 代表亚利桑那大学的亚利桑那校董会 | 提供电子器件的方法及其电子器件 |
CN105338760A (zh) * | 2014-08-06 | 2016-02-17 | 上海信维蓝沛新材料科技有限公司 | Nfc天线线路板的制造方法 |
US10211443B2 (en) | 2014-09-10 | 2019-02-19 | Cellink Corporation | Battery interconnects |
US9741742B2 (en) | 2014-12-22 | 2017-08-22 | Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University | Deformable electronic device and methods of providing and using deformable electronic device |
US10446582B2 (en) | 2014-12-22 | 2019-10-15 | Arizona Board Of Regents On Behalf Of Arizona State University | Method of providing an imaging system and imaging system thereof |
US9773203B2 (en) | 2014-12-26 | 2017-09-26 | Avery Dennison Retail Information Services, Llc | Creating antennas connected to printed chips by post processing with a laser or other cutting device |
MX2017010502A (es) * | 2015-02-20 | 2018-03-14 | Nid Sa | Proceso de fabricacion de un dispositivo que incluye al menos un elemento electronico asociado a un substrato y a una antena. |
CA2894350C (en) | 2015-06-16 | 2023-03-28 | J.J. Mackay Canada Limited | Coin chute with anti-fishing assembly |
USRE48566E1 (en) | 2015-07-15 | 2021-05-25 | J.J. Mackay Canada Limited | Parking meter |
CA3176773A1 (en) | 2015-08-11 | 2017-02-11 | J.J. Mackay Canada Limited | Single space parking meter retrofit |
USD813059S1 (en) | 2016-02-24 | 2018-03-20 | J.J. Mackay Canada Limited | Parking meter |
CN105279549B (zh) * | 2015-11-19 | 2018-02-16 | 山东泰宝防伪技术产品有限公司 | 烫金rfid电子标签及其制备方法 |
US11138487B2 (en) * | 2016-03-18 | 2021-10-05 | Sato Holdings Kabushiki Kaisha | Method for manufacturing RFID inlet and antenna pattern |
US10977540B2 (en) | 2016-07-27 | 2021-04-13 | Composecure, Llc | RFID device |
CN109564634A (zh) | 2016-07-27 | 2019-04-02 | 安全创造有限责任公司 | 用于交易卡的经包覆模制的电子部件及其制造方法 |
US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
US11618191B2 (en) | 2016-07-27 | 2023-04-04 | Composecure, Llc | DI metal transaction devices and processes for the manufacture thereof |
US10885420B2 (en) | 2016-12-14 | 2021-01-05 | Ajay Khoche | Package sealing tape types with varied transducer sampling densities |
US10445634B2 (en) | 2016-12-14 | 2019-10-15 | Trackonomy Systems, Inc. | Fabricating multifunction adhesive product for ubiquitous realtime tracking |
US10902310B2 (en) | 2016-12-14 | 2021-01-26 | Trackonomy Systems, Inc. | Wireless communications and transducer based event detection platform |
US11138490B2 (en) | 2016-12-14 | 2021-10-05 | Ajay Khoche | Hierarchical combination of distributed statistics in a monitoring network |
WO2018125977A1 (en) | 2016-12-29 | 2018-07-05 | Avery Dennison Retail Information Services, Llc | Rfid tags with shielding structure for incorporation into microwavable food packaging |
WO2018176247A1 (zh) * | 2017-03-29 | 2018-10-04 | 上海英内物联网科技股份有限公司 | 一种环保涂层纸基射频识别天线及其制造方法 |
EP3653027A4 (de) | 2017-07-13 | 2021-04-28 | CelLink Corporation | Verbindungsschaltungsverfahren und -vorrichtungen |
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WO2019079007A1 (en) | 2017-10-18 | 2019-04-25 | Composecure, Llc | TRANSACTION CARD OF METAL, CERAMIC OR CERAMIC COATED HAVING WINDOW OR WINDOW PATTERN AND OPTIONAL BACKLIGHT |
US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
ES2943857T3 (es) | 2017-09-07 | 2023-06-16 | Composecure Llc | Tarjeta de transacción con componentes electrónicos integrados y procedimiento de fabricación |
CN107944535A (zh) * | 2017-11-24 | 2018-04-20 | 无锡科睿坦电子科技股份有限公司 | 一种无基材rfid标签天线及其制作工艺 |
CN107766913A (zh) * | 2017-12-07 | 2018-03-06 | 上海优比科物联网技术有限公司 | 一种rfid电子标签制造工艺及rfid电子标签 |
WO2019204694A1 (en) | 2018-04-20 | 2019-10-24 | Avery Dennison Retail Information Services, Llc | Method of using shielded rfid straps with rfid tag designs |
US11347992B2 (en) | 2018-04-20 | 2022-05-31 | Avery Dennison Retail Information Services Llc | RFID straps with a top and bottom conductor |
CN112334913B (zh) * | 2018-04-20 | 2024-05-17 | 艾利丹尼森零售信息服务公司 | 用于结合到可微波食品包装中的屏蔽rfid标签 |
CN108490298A (zh) * | 2018-05-25 | 2018-09-04 | 北京中电华大电子设计有限责任公司 | 一种采用金属箔贴片式天线触点设计的纸线圈装置 |
CN112639825B (zh) | 2018-06-27 | 2024-03-19 | 艾利丹尼森零售信息服务公司 | 耐受微波炉的操作于高频带中的rfid标签 |
EP3671564A1 (de) * | 2018-12-21 | 2020-06-24 | Thales Dis France SA | Herstellungsverfahren eines einsatzes einer funkfrequenz-chipkarte, der eine metallplatte umfasst |
CA3031936A1 (en) | 2019-01-30 | 2020-07-30 | J.J. Mackay Canada Limited | Spi keyboard module for a parking meter and a parking meter having an spi keyboard module |
US11922756B2 (en) | 2019-01-30 | 2024-03-05 | J.J. Mackay Canada Limited | Parking meter having touchscreen display |
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WO2007087189A2 (en) | 2007-08-02 |
US20110001670A1 (en) | 2011-01-06 |
US20070171129A1 (en) | 2007-07-26 |
ES2375663T3 (es) | 2012-03-05 |
EP1977478A2 (de) | 2008-10-08 |
EP1977478A4 (de) | 2010-03-10 |
US11069963B2 (en) | 2021-07-20 |
US8191230B2 (en) | 2012-06-05 |
US20090199966A1 (en) | 2009-08-13 |
EP1977478B1 (de) | 2011-10-19 |
US8786510B2 (en) | 2014-07-22 |
WO2007087189A3 (en) | 2008-01-17 |
US10186765B2 (en) | 2019-01-22 |
CN101375463A (zh) | 2009-02-25 |
US20110220276A1 (en) | 2011-09-15 |
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