ATE511240T1 - Akustische oberflächenwellenanordnung mit verbesserter leistung und herstellungsverfahren - Google Patents
Akustische oberflächenwellenanordnung mit verbesserter leistung und herstellungsverfahrenInfo
- Publication number
- ATE511240T1 ATE511240T1 AT03700034T AT03700034T ATE511240T1 AT E511240 T1 ATE511240 T1 AT E511240T1 AT 03700034 T AT03700034 T AT 03700034T AT 03700034 T AT03700034 T AT 03700034T AT E511240 T1 ATE511240 T1 AT E511240T1
- Authority
- AT
- Austria
- Prior art keywords
- acoustic wave
- surface acoustic
- sub
- wave device
- electrode
- Prior art date
Links
- 238000010897 surface acoustic wave method Methods 0.000 title abstract 5
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000002184 metal Substances 0.000 abstract 4
- 238000001465 metallisation Methods 0.000 abstract 2
- 230000000694 effects Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000002244 precipitate Substances 0.000 abstract 1
- 230000002787 reinforcement Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14538—Formation
- H03H9/14541—Multilayer finger or busbar electrode
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02897—Means for compensation or elimination of undesirable effects of strain or mechanical damage, e.g. strain due to bending influence
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/061,550 US7148610B2 (en) | 2002-02-01 | 2002-02-01 | Surface acoustic wave device having improved performance and method of making the device |
PCT/CH2003/000012 WO2003065577A1 (en) | 2002-02-01 | 2003-01-14 | Surface acoustic wave device having improved performance and method of making the device |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE511240T1 true ATE511240T1 (de) | 2011-06-15 |
Family
ID=27658441
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03700034T ATE511240T1 (de) | 2002-02-01 | 2003-01-14 | Akustische oberflächenwellenanordnung mit verbesserter leistung und herstellungsverfahren |
Country Status (9)
Country | Link |
---|---|
US (1) | US7148610B2 (de) |
EP (1) | EP1470639B1 (de) |
JP (1) | JP2005516517A (de) |
KR (1) | KR20040089131A (de) |
CN (1) | CN1625835B (de) |
AT (1) | ATE511240T1 (de) |
CA (1) | CA2468724A1 (de) |
TW (1) | TW200303625A (de) |
WO (1) | WO2003065577A1 (de) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10206369B4 (de) * | 2002-02-15 | 2012-12-27 | Epcos Ag | Elektrodenstruktur mit verbesserter Leistungsverträglichkeit und Verfahren zur Herstellung |
FR2842806B1 (fr) * | 2002-07-26 | 2005-07-29 | Mayoly Spindler Lab | Nouveau procede de preparation de derives styryle pyrazoles, isoxazoles et isothiazoles |
DE10316716A1 (de) * | 2003-04-11 | 2004-10-28 | Epcos Ag | Bauelement mit einer piezoelektrischen Funktionsschicht |
US7141909B2 (en) | 2003-06-17 | 2006-11-28 | Murata Manufacturing Co., Ltd. | Surface acoustic wave device |
DE102004032621B4 (de) * | 2004-07-05 | 2016-05-25 | Epcos Ag | SAW Bauelement mit verbesserter Leistungsverträglichkeit |
TW200626893A (en) * | 2005-01-28 | 2006-08-01 | yong-yu Chen | Surface acoustic wave thin-film measuring device and measuring method thereof |
US7737612B1 (en) | 2005-05-25 | 2010-06-15 | Maxim Integrated Products, Inc. | BAW resonator bi-layer top electrode with zero etch undercut |
US7893597B2 (en) * | 2005-09-20 | 2011-02-22 | Kyocera Corporation | Surface acoustic wave element and surface acoustic wave device |
US7600303B1 (en) | 2006-05-25 | 2009-10-13 | Maxim Integrated Products, Inc. | BAW resonator bi-layer top electrode with zero etch undercut |
US7612488B1 (en) * | 2007-01-16 | 2009-11-03 | Maxim Integrated Products, Inc. | Method to control BAW resonator top electrode edge during patterning |
JP4906536B2 (ja) * | 2007-02-27 | 2012-03-28 | 京セラ株式会社 | 弾性表面波素子及び弾性表面波装置 |
US7891252B2 (en) * | 2008-02-01 | 2011-02-22 | Honeywell International Inc. | Method for sensor fabrication and related sensor and system |
DE102008020783A1 (de) * | 2008-04-25 | 2009-10-29 | Epcos Ag | Filterchip mit unterschiedlichen Leitschichten und Verfahren zur Herstellung |
US8689426B2 (en) | 2008-12-17 | 2014-04-08 | Sand 9, Inc. | Method of manufacturing a resonating structure |
WO2011109382A1 (en) | 2010-03-01 | 2011-09-09 | Sand9, Inc. | Microelectromechanical gyroscopes and related apparatus and methods |
AT509633A1 (de) * | 2010-03-29 | 2011-10-15 | Ctr Carinthian Tech Res Ag | Hochtemperaturbeständige, elektrisch leitfähige dünnschichten |
DE102010014919B4 (de) | 2010-04-14 | 2015-07-02 | Epcos Ag | Verfahren zur Herstellung einer dielektrischen Schicht auf einem Bauelement |
US8833161B2 (en) | 2010-04-20 | 2014-09-16 | Sand 9, Inc. | Microelectromechanical gyroscopes and related apparatus and methods |
US9075077B2 (en) | 2010-09-20 | 2015-07-07 | Analog Devices, Inc. | Resonant sensing using extensional modes of a plate |
US20130335170A1 (en) * | 2011-01-27 | 2013-12-19 | Kyocera Corporation | Acoustic wave element and acoustic wave device using same |
JP2012160979A (ja) * | 2011-02-01 | 2012-08-23 | Taiyo Yuden Co Ltd | 弾性波デバイス及びその製造方法 |
US9383208B2 (en) | 2011-10-13 | 2016-07-05 | Analog Devices, Inc. | Electromechanical magnetometer and applications thereof |
CN107112968B (zh) * | 2015-01-22 | 2020-10-16 | 株式会社村田制作所 | 弹性波装置的制造方法以及弹性波装置 |
CN107615655B (zh) | 2015-07-17 | 2020-10-30 | 株式会社村田制作所 | 弹性波装置 |
US11689182B2 (en) | 2017-07-06 | 2023-06-27 | Kyocera Corporation | Acoustic wave element, filter element, and communication apparatus |
JP2019022093A (ja) * | 2017-07-18 | 2019-02-07 | 太陽誘電株式会社 | 弾性波デバイス |
US10770705B2 (en) * | 2017-08-17 | 2020-09-08 | Applied Materials, Inc. | Olefin separator free Li-ion battery |
JP6950654B2 (ja) * | 2017-11-24 | 2021-10-13 | 株式会社村田製作所 | 弾性波装置、高周波フロントエンド回路及び通信装置 |
DE102018130358A1 (de) * | 2018-11-29 | 2020-06-04 | RF360 Europe GmbH | Verfahren zum Herstellen und Trimmen eines akustischen Oberflächenresonators |
CN109802643B (zh) * | 2018-11-30 | 2020-09-08 | 无锡市好达电子股份有限公司 | 一种辅助显影版图制作方法 |
DE102018132695A1 (de) * | 2018-12-18 | 2020-06-18 | RF360 Europe GmbH | Elektronisches Bauelement |
JP7545404B2 (ja) * | 2019-10-30 | 2024-09-04 | 株式会社村田製作所 | 弾性波装置 |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
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GB1580600A (en) * | 1978-05-09 | 1980-12-03 | Philips Electronic Associated | Kpiezoelectric devices |
US4686111A (en) | 1982-05-27 | 1987-08-11 | Motorola, Inc. | Passivated and low scatter acoustic wave devices and method thereof |
GB2186456B (en) | 1986-01-13 | 1989-11-08 | Hitachi Ltd | Surface acoustic wave device |
JPS62272610A (ja) * | 1986-05-21 | 1987-11-26 | Hitachi Ltd | 弾性表面波素子 |
JPS6480113A (en) | 1987-09-22 | 1989-03-27 | Hitachi Ltd | Surface acoustic wave device |
JPH0314305A (ja) | 1989-06-13 | 1991-01-23 | Murata Mfg Co Ltd | 弾性表面波装置の製造方法 |
US5039957A (en) | 1990-05-07 | 1991-08-13 | Raytheon Company | High power surface acoustic wave devices having copper and titanium doped aluminum transducers and long-term frequency stability |
US5215546A (en) | 1990-09-04 | 1993-06-01 | Motorola, Inc. | Method and apparatus for SAW device passivation |
JP3252865B2 (ja) | 1992-09-11 | 2002-02-04 | 住友電気工業株式会社 | 表面弾性波素子および表面弾性波素子の製造方法 |
US5468595A (en) | 1993-01-29 | 1995-11-21 | Electron Vision Corporation | Method for three-dimensional control of solubility properties of resist layers |
JP3379049B2 (ja) | 1993-10-27 | 2003-02-17 | 富士通株式会社 | 表面弾性波素子とその製造方法 |
JP3208977B2 (ja) | 1993-12-02 | 2001-09-17 | 株式会社村田製作所 | 弾性表面波素子の電極形成方法 |
WO1996004713A1 (fr) | 1994-08-05 | 1996-02-15 | Japan Energy Corporation | Dispositif a ondes acoustiques de surface et procede de production |
US5815900A (en) * | 1995-03-06 | 1998-10-06 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing a surface acoustic wave module |
JPH0969748A (ja) * | 1995-09-01 | 1997-03-11 | Matsushita Electric Ind Co Ltd | Sawデバイスおよびその製造方法 |
US5929723A (en) | 1995-09-21 | 1999-07-27 | Tdk Corporation | Surface acoustic wave apparatus having an electrode that is a doped alloy film |
JPH09223944A (ja) | 1995-12-13 | 1997-08-26 | Fujitsu Ltd | 弾性表面波素子及びその製造方法 |
JP3275775B2 (ja) * | 1997-05-16 | 2002-04-22 | 株式会社村田製作所 | 弾性表面波装置 |
WO1999005788A1 (fr) * | 1997-07-28 | 1999-02-04 | Kabushiki Kaisha Toshiba | Dispositif de traitement d'ondes acoustiques de surface et son procede de fabrication |
JP3301399B2 (ja) | 1998-02-16 | 2002-07-15 | 株式会社村田製作所 | 弾性表面波装置 |
US6297580B1 (en) * | 1998-04-21 | 2001-10-02 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave device and production method thereof and mobile communication equipment using it |
US6259185B1 (en) * | 1998-12-02 | 2001-07-10 | Cts Corporation | Metallization for high power handling in a surface acoustic wave device and method for providing same |
JP3860364B2 (ja) * | 1999-08-11 | 2006-12-20 | 富士通メディアデバイス株式会社 | 弾性表面波装置 |
EP1089431A3 (de) | 1999-09-30 | 2003-12-10 | Matsushita Electric Industrial Co., Ltd. | Akustische Oberflächenwellenanordnung und Verfahren zur Herstellung derselben |
DE60035966T2 (de) * | 1999-11-30 | 2008-03-20 | Tdk Corp. | Herstellungsverfahren für eine akustische oberflächenwellenvorrichtung |
JP3405329B2 (ja) * | 2000-07-19 | 2003-05-12 | 株式会社村田製作所 | 表面波装置 |
JP3412611B2 (ja) * | 2000-09-25 | 2003-06-03 | 株式会社村田製作所 | 弾性表面波装置 |
US6909341B2 (en) * | 2000-10-23 | 2005-06-21 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave filter utilizing a layer for preventing grain boundary diffusion |
JP3521864B2 (ja) * | 2000-10-26 | 2004-04-26 | 株式会社村田製作所 | 弾性表面波素子 |
JP3445971B2 (ja) * | 2000-12-14 | 2003-09-16 | 富士通株式会社 | 弾性表面波素子 |
JP4060090B2 (ja) * | 2002-02-15 | 2008-03-12 | 沖電気工業株式会社 | 弾性表面波素子 |
-
2002
- 2002-02-01 US US10/061,550 patent/US7148610B2/en not_active Expired - Fee Related
-
2003
- 2003-01-14 EP EP03700034A patent/EP1470639B1/de not_active Expired - Lifetime
- 2003-01-14 WO PCT/CH2003/000012 patent/WO2003065577A1/en active Application Filing
- 2003-01-14 AT AT03700034T patent/ATE511240T1/de not_active IP Right Cessation
- 2003-01-14 CA CA002468724A patent/CA2468724A1/en not_active Abandoned
- 2003-01-14 JP JP2003565044A patent/JP2005516517A/ja not_active Withdrawn
- 2003-01-14 KR KR10-2004-7011831A patent/KR20040089131A/ko not_active Application Discontinuation
- 2003-01-14 CN CN038030802A patent/CN1625835B/zh not_active Expired - Fee Related
- 2003-01-30 TW TW092102114A patent/TW200303625A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN1625835A (zh) | 2005-06-08 |
CA2468724A1 (en) | 2003-08-07 |
WO2003065577A1 (en) | 2003-08-07 |
EP1470639A1 (de) | 2004-10-27 |
US20030146674A1 (en) | 2003-08-07 |
EP1470639B1 (de) | 2011-05-25 |
US7148610B2 (en) | 2006-12-12 |
CN1625835B (zh) | 2010-06-09 |
JP2005516517A (ja) | 2005-06-02 |
KR20040089131A (ko) | 2004-10-20 |
TW200303625A (en) | 2003-09-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |