ATE502324T1 - System und verfahren zum positionieren eines produkts - Google Patents

System und verfahren zum positionieren eines produkts

Info

Publication number
ATE502324T1
ATE502324T1 AT05702775T AT05702775T ATE502324T1 AT E502324 T1 ATE502324 T1 AT E502324T1 AT 05702775 T AT05702775 T AT 05702775T AT 05702775 T AT05702775 T AT 05702775T AT E502324 T1 ATE502324 T1 AT E502324T1
Authority
AT
Austria
Prior art keywords
chuck
intermediate stage
product
stationary base
supporting
Prior art date
Application number
AT05702775T
Other languages
English (en)
Inventor
Arjan Bakker
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE502324T1 publication Critical patent/ATE502324T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B9/00—Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or -
    • G02B9/02—Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or - having one + component only
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Automatic Control Of Machine Tools (AREA)
AT05702775T 2004-02-11 2005-01-25 System und verfahren zum positionieren eines produkts ATE502324T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04100515 2004-02-11
PCT/IB2005/050288 WO2005078526A1 (en) 2004-02-11 2005-01-25 A system for positioning a product

Publications (1)

Publication Number Publication Date
ATE502324T1 true ATE502324T1 (de) 2011-04-15

Family

ID=34854679

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05702775T ATE502324T1 (de) 2004-02-11 2005-01-25 System und verfahren zum positionieren eines produkts

Country Status (9)

Country Link
US (1) US7903258B2 (de)
EP (1) EP1716456B1 (de)
JP (1) JP2007522668A (de)
KR (1) KR101166249B1 (de)
CN (1) CN100485529C (de)
AT (1) ATE502324T1 (de)
DE (1) DE602005026913D1 (de)
ES (1) ES2362611T3 (de)
WO (1) WO2005078526A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7405811B2 (en) 2005-04-20 2008-07-29 Asml Netherlands B.V. Lithographic apparatus and positioning apparatus
US7349069B2 (en) 2005-04-20 2008-03-25 Asml Netherlands B.V. Lithographic apparatus and positioning apparatus
ATE417699T1 (de) * 2006-04-27 2009-01-15 3R Syst Int Ab Spannvorrichtung mit einrichtung zur messung der distanz zwischen einem spannfutter und einem werkzeug- oder werkstückhalter
JP5613893B2 (ja) * 2006-05-22 2014-10-29 株式会社ブイ・テクノロジー 作業装置におけるテーブル位置決め装置および位置決め方法。
US7633070B2 (en) 2006-12-18 2009-12-15 Kla-Tencor Technologies Corporation Substrate processing apparatus and method
EP2097790A2 (de) * 2006-12-18 2009-09-09 KLA-Tencor Corporation Vorrichtung und verfahren zur substratverarbeitung
US8058628B2 (en) 2007-07-09 2011-11-15 Kla-Tencor Corporation Substrate processing apparatus and method
US7897942B1 (en) 2007-12-20 2011-03-01 Kla-Tencor Corporation Dynamic tracking of wafer motion and distortion during lithography
US8954287B2 (en) * 2007-12-27 2015-02-10 Lam Research Corporation Systems and methods for calibrating end effector alignment using at least a light source
CN102147505B (zh) 2010-02-08 2015-06-03 菲尼萨公司 增强型多体式光学设备
KR20140114500A (ko) 2013-03-14 2014-09-29 삼성전자주식회사 스테이지 장치 및 이의 구동 방법
US20150147839A1 (en) * 2013-11-26 2015-05-28 Infineon Technologies Dresden Gmbh Method for manufacturing a semiconductor device
US20200011652A1 (en) * 2018-07-03 2020-01-09 Applied Materials, Inc. Interferometry system and methods for substrate processing

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3434787A (en) * 1965-11-15 1969-03-25 Optomechanisms Inc Double axes interferometer
CH471368A (de) * 1968-01-25 1969-04-15 Bbc Brown Boveri & Cie Verfahren und Einrichtung zur interferometrischen Messung von mehreren Längen mit monochromatischen Lichtbündeln
JPS58218605A (ja) * 1982-06-14 1983-12-19 Toshiba Mach Co Ltd レ−ザ光による移動距離測定装置
JPH0674963B2 (ja) * 1988-02-08 1994-09-21 株式会社日立製作所 レーザ干渉測長器及びそれを用いた位置決め方法
JPH04351905A (ja) * 1991-05-30 1992-12-07 Fujitsu Ltd レーザ測長装置を備えたｘｙステージ
US5363196A (en) * 1992-01-10 1994-11-08 Ultratech Stepper, Inc. Apparatus for measuring a departure from flatness or straightness of a nominally-plane mirror for a precision X-Y movable-stage
JPH07190714A (ja) * 1993-12-24 1995-07-28 Olympus Optical Co Ltd 干渉計
JPH09171954A (ja) * 1995-12-20 1997-06-30 Nikon Corp 位置測定装置
US6317196B1 (en) * 1996-06-25 2001-11-13 Nikon Corporation Projection exposure apparatus
JP3669063B2 (ja) * 1996-07-05 2005-07-06 株式会社ニコン 投影露光装置
JPH1074692A (ja) * 1996-06-25 1998-03-17 Nikon Corp 露光装置
US5757160A (en) * 1996-12-23 1998-05-26 Svg Lithography Systems, Inc. Moving interferometer wafer stage
JP4211150B2 (ja) * 1998-08-20 2009-01-21 株式会社ニコン レーザ干渉計及び露光装置
US6486955B1 (en) * 1998-10-14 2002-11-26 Nikon Corporation Shape measuring method and shape measuring device, position control method, stage device, exposure apparatus and method for producing exposure apparatus, and device and method for manufacturing device
JP2001307983A (ja) * 2000-04-20 2001-11-02 Nikon Corp ステージ装置及び露光装置
EP1285222A4 (de) * 2000-05-17 2006-11-15 Zygo Corp Interferometrische vorrichtung und interferometrisches verfahren
WO2001088469A1 (en) * 2000-05-17 2001-11-22 Zygo Corporation Interferometric apparatus and method
DE60118726T2 (de) * 2000-05-19 2006-08-24 Zygo Corp., Middlefield In-situ spiegel-charakterisierung
US20020109823A1 (en) * 2001-02-09 2002-08-15 Nikon Corporation. Wafer stage assembly
JP2005518523A (ja) * 2001-08-20 2005-06-23 ザイゴ コーポレイション インサイチュでの鏡の特徴付け
EP1583934A1 (de) * 2002-12-12 2005-10-12 Zygo Corporation Korrektur von spiegel deformationen während einer photolithographischen belichtung
AU2003300806A1 (en) * 2003-07-29 2005-03-07 Zygo Corporation Compensation for errors in off-axis interferometric measurements

Also Published As

Publication number Publication date
KR20060111688A (ko) 2006-10-27
DE602005026913D1 (de) 2011-04-28
CN100485529C (zh) 2009-05-06
CN1969234A (zh) 2007-05-23
US7903258B2 (en) 2011-03-08
EP1716456A1 (de) 2006-11-02
KR101166249B1 (ko) 2012-07-18
ES2362611T3 (es) 2011-07-08
US20080144008A1 (en) 2008-06-19
EP1716456B1 (de) 2011-03-16
JP2007522668A (ja) 2007-08-09
WO2005078526A1 (en) 2005-08-25

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Legal Events

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