ATE487564T1 - Wafer poliermaschinentisch, wafer polierverfahren und halbleiterschleife herstellungsverfahren - Google Patents

Wafer poliermaschinentisch, wafer polierverfahren und halbleiterschleife herstellungsverfahren

Info

Publication number
ATE487564T1
ATE487564T1 AT00937244T AT00937244T ATE487564T1 AT E487564 T1 ATE487564 T1 AT E487564T1 AT 00937244 T AT00937244 T AT 00937244T AT 00937244 T AT00937244 T AT 00937244T AT E487564 T1 ATE487564 T1 AT E487564T1
Authority
AT
Austria
Prior art keywords
wafer polishing
machine table
wafer
production process
bases
Prior art date
Application number
AT00937244T
Other languages
English (en)
Inventor
Yuji Okuda
Naoyuki Jimbo
Kazutaka Majima
Masahiro Tsuji
Hideki Takagi
Shigeharu Ishikawa
Hiroyuki Yasuda
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP16852299A external-priority patent/JP2000354956A/ja
Priority claimed from JP16852399A external-priority patent/JP2000354957A/ja
Priority claimed from JP18533399A external-priority patent/JP4421015B2/ja
Priority claimed from JP23750799A external-priority patent/JP2001062708A/ja
Priority claimed from JP23750899A external-priority patent/JP4429420B2/ja
Priority claimed from JP23750999A external-priority patent/JP2001062710A/ja
Priority claimed from JP23990099A external-priority patent/JP2001062711A/ja
Priority claimed from JP27711899A external-priority patent/JP2001102336A/ja
Priority claimed from JP27711799A external-priority patent/JP2001096454A/ja
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Application granted granted Critical
Publication of ATE487564T1 publication Critical patent/ATE487564T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/14—Lapping plates for working plane surfaces characterised by the composition or properties of the plate materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AT00937244T 1999-06-15 2000-06-15 Wafer poliermaschinentisch, wafer polierverfahren und halbleiterschleife herstellungsverfahren ATE487564T1 (de)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP16852299A JP2000354956A (ja) 1999-06-15 1999-06-15 ウェハ研磨装置用テーブル、半導体ウェハの研磨方法、半導体ウェハの製造方法、積層セラミックス構造体
JP16852399A JP2000354957A (ja) 1999-06-15 1999-06-15 ウェハ研磨装置用テーブル、半導体ウェハの研磨方法、半導体ウェハの製造方法、積層セラミックス構造体
JP18533399A JP4421015B2 (ja) 1999-06-30 1999-06-30 ウェハ研磨装置用テーブル
JP23750799A JP2001062708A (ja) 1999-08-24 1999-08-24 ウェハ研磨装置用テーブル
JP23750899A JP4429420B2 (ja) 1999-08-24 1999-08-24 ウェハ研磨装置用テーブル
JP23750999A JP2001062710A (ja) 1999-08-24 1999-08-24 ウェハ研磨装置用テーブル
JP23990099A JP2001062711A (ja) 1999-08-26 1999-08-26 ウェハ研磨装置用テーブル及びその製造方法
JP27711899A JP2001102336A (ja) 1999-09-29 1999-09-29 ウェハ研磨装置用テーブル、セラミックス構造体
JP27711799A JP2001096454A (ja) 1999-09-29 1999-09-29 ウェハ研磨装置用テーブル、セラミックス構造体
PCT/JP2000/003899 WO2000076723A1 (en) 1999-06-15 2000-06-15 Table of wafer polisher, method of polishing wafer, and method of manufacturing semiconductor wafer

Publications (1)

Publication Number Publication Date
ATE487564T1 true ATE487564T1 (de) 2010-11-15

Family

ID=27577514

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00937244T ATE487564T1 (de) 1999-06-15 2000-06-15 Wafer poliermaschinentisch, wafer polierverfahren und halbleiterschleife herstellungsverfahren

Country Status (5)

Country Link
US (2) US7040963B1 (de)
EP (1) EP1238755B1 (de)
AT (1) ATE487564T1 (de)
DE (1) DE60045223D1 (de)
WO (1) WO2000076723A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050260930A1 (en) * 1999-06-15 2005-11-24 Yuji Okuda Table of wafer of polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer
US7935070B2 (en) * 2005-01-28 2011-05-03 Fresenius Medical Care North America Systems and methods for dextrose containing peritoneal dialysis (PD) solutions with neutral pH and reduced glucose degradation product
US9585810B2 (en) 2010-10-14 2017-03-07 Fresenius Medical Care Holdings, Inc. Systems and methods for delivery of peritoneal dialysis (PD) solutions with integrated inter-chamber diffuser
WO2013179936A1 (ja) * 2012-05-30 2013-12-05 京セラ株式会社 流路部材ならびにこれを用いた吸着装置および冷却装置
JP6434266B2 (ja) * 2013-12-17 2018-12-05 富士紡ホールディングス株式会社 ラッピング用樹脂定盤及びそれを用いたラッピング方法
JP6382979B2 (ja) 2014-07-22 2018-08-29 京セラ株式会社 載置用部材
CN105437052B (zh) * 2015-11-28 2019-02-05 郑臣钏 一种连续加工自修复式研抛装置
JP6736404B2 (ja) * 2016-07-26 2020-08-05 株式会社ディスコ 研削装置
US20190299360A1 (en) * 2018-04-02 2019-10-03 Ebara Corporation Polishing apparatus and substrate processing apparatus
US11305397B2 (en) * 2018-06-18 2022-04-19 Seagate Technology Llc Lapping system that includes a lapping plate temperature control system, and related methods
WO2020261990A1 (ja) * 2019-06-28 2020-12-30 日本碍子株式会社 ウエハ載置台及びその製法
DE102020125246A1 (de) * 2020-09-28 2022-03-31 Lapmaster Wolters Gmbh Doppel- oder Einseiten-Bearbeitungsmaschine
US12490416B2 (en) * 2022-12-08 2025-12-02 Bae Systems Information And Electronic Systems Integration Inc. Thermally dissipative electromagnetic interference shield or cover for an electronic device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3411120A1 (de) * 1983-03-26 1984-11-08 TOTO Ltd., Kitakyushyu, Fukuoka Laeppvorrichtung
US4552122A (en) 1983-12-16 1985-11-12 Kelly John M Portable apparatus for shaping glass by abrasion
DE69123749T2 (de) * 1990-10-09 1997-06-05 Minnesota Mining & Mfg Erodierbare agglomerate enthaltendes beschichtetes schleifmittel
US5256599A (en) 1992-06-01 1993-10-26 Motorola, Inc. Semiconductor wafer wax mounting and thinning process
US6099394A (en) * 1998-02-10 2000-08-08 Rodel Holdings, Inc. Polishing system having a multi-phase polishing substrate and methods relating thereto
JP3329644B2 (ja) * 1995-07-21 2002-09-30 株式会社東芝 研磨パッド、研磨装置及び研磨方法
JPH09150351A (ja) * 1995-11-28 1997-06-10 Tokyo Seimitsu Co Ltd 半導体ウェーハの研磨装置
JPH10235552A (ja) 1997-02-24 1998-09-08 Ebara Corp ポリッシング装置
US5888119A (en) * 1997-03-07 1999-03-30 Minnesota Mining And Manufacturing Company Method for providing a clear surface finish on glass
JPH1190814A (ja) 1997-09-12 1999-04-06 Fujikoshi Mach Corp ウェーハの研磨用定盤装置
JP3693483B2 (ja) * 1998-01-30 2005-09-07 株式会社荏原製作所 研磨装置
US6123612A (en) * 1998-04-15 2000-09-26 3M Innovative Properties Company Corrosion resistant abrasive article and method of making
DK1046462T3 (da) * 1999-03-26 2004-03-08 Ibiden Co Ltd Waferholdeplade til waferslibeapparat og fremgangsmåde til fremstilling af denne
US6220942B1 (en) * 1999-04-02 2001-04-24 Applied Materials, Inc. CMP platen with patterned surface

Also Published As

Publication number Publication date
DE60045223D1 (de) 2010-12-23
US7040963B1 (en) 2006-05-09
WO2000076723A1 (en) 2000-12-21
EP1238755A1 (de) 2002-09-11
US20050260938A1 (en) 2005-11-24
EP1238755A4 (de) 2007-02-07
EP1238755B1 (de) 2010-11-10

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