ATE487564T1 - Wafer poliermaschinentisch, wafer polierverfahren und halbleiterschleife herstellungsverfahren - Google Patents

Wafer poliermaschinentisch, wafer polierverfahren und halbleiterschleife herstellungsverfahren

Info

Publication number
ATE487564T1
ATE487564T1 AT00937244T AT00937244T ATE487564T1 AT E487564 T1 ATE487564 T1 AT E487564T1 AT 00937244 T AT00937244 T AT 00937244T AT 00937244 T AT00937244 T AT 00937244T AT E487564 T1 ATE487564 T1 AT E487564T1
Authority
AT
Austria
Prior art keywords
wafer polishing
machine table
wafer
production process
bases
Prior art date
Application number
AT00937244T
Other languages
English (en)
Inventor
Yuji Okuda
Naoyuki Jimbo
Kazutaka Majima
Masahiro Tsuji
Hideki Takagi
Shigeharu Ishikawa
Hiroyuki Yasuda
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP16852299A external-priority patent/JP2000354956A/ja
Priority claimed from JP16852399A external-priority patent/JP2000354957A/ja
Priority claimed from JP18533399A external-priority patent/JP4421015B2/ja
Priority claimed from JP23750999A external-priority patent/JP2001062710A/ja
Priority claimed from JP23750799A external-priority patent/JP2001062708A/ja
Priority claimed from JP23750899A external-priority patent/JP4429420B2/ja
Priority claimed from JP23990099A external-priority patent/JP2001062711A/ja
Priority claimed from JP27711899A external-priority patent/JP2001102336A/ja
Priority claimed from JP27711799A external-priority patent/JP2001096454A/ja
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Application granted granted Critical
Publication of ATE487564T1 publication Critical patent/ATE487564T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/14—Lapping plates for working plane surfaces characterised by the composition or properties of the plate materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AT00937244T 1999-06-15 2000-06-15 Wafer poliermaschinentisch, wafer polierverfahren und halbleiterschleife herstellungsverfahren ATE487564T1 (de)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP16852299A JP2000354956A (ja) 1999-06-15 1999-06-15 ウェハ研磨装置用テーブル、半導体ウェハの研磨方法、半導体ウェハの製造方法、積層セラミックス構造体
JP16852399A JP2000354957A (ja) 1999-06-15 1999-06-15 ウェハ研磨装置用テーブル、半導体ウェハの研磨方法、半導体ウェハの製造方法、積層セラミックス構造体
JP18533399A JP4421015B2 (ja) 1999-06-30 1999-06-30 ウェハ研磨装置用テーブル
JP23750999A JP2001062710A (ja) 1999-08-24 1999-08-24 ウェハ研磨装置用テーブル
JP23750799A JP2001062708A (ja) 1999-08-24 1999-08-24 ウェハ研磨装置用テーブル
JP23750899A JP4429420B2 (ja) 1999-08-24 1999-08-24 ウェハ研磨装置用テーブル
JP23990099A JP2001062711A (ja) 1999-08-26 1999-08-26 ウェハ研磨装置用テーブル及びその製造方法
JP27711899A JP2001102336A (ja) 1999-09-29 1999-09-29 ウェハ研磨装置用テーブル、セラミックス構造体
JP27711799A JP2001096454A (ja) 1999-09-29 1999-09-29 ウェハ研磨装置用テーブル、セラミックス構造体
PCT/JP2000/003899 WO2000076723A1 (fr) 1999-06-15 2000-06-15 Table de dispositif de polissage de tranche, procede de polissage de tranche et procede de fabrication de tranche de semi-conducteur

Publications (1)

Publication Number Publication Date
ATE487564T1 true ATE487564T1 (de) 2010-11-15

Family

ID=27577514

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00937244T ATE487564T1 (de) 1999-06-15 2000-06-15 Wafer poliermaschinentisch, wafer polierverfahren und halbleiterschleife herstellungsverfahren

Country Status (5)

Country Link
US (2) US7040963B1 (de)
EP (1) EP1238755B1 (de)
AT (1) ATE487564T1 (de)
DE (1) DE60045223D1 (de)
WO (1) WO2000076723A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050260930A1 (en) * 1999-06-15 2005-11-24 Yuji Okuda Table of wafer of polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer
US7935070B2 (en) * 2005-01-28 2011-05-03 Fresenius Medical Care North America Systems and methods for dextrose containing peritoneal dialysis (PD) solutions with neutral pH and reduced glucose degradation product
US9585810B2 (en) 2010-10-14 2017-03-07 Fresenius Medical Care Holdings, Inc. Systems and methods for delivery of peritoneal dialysis (PD) solutions with integrated inter-chamber diffuser
JP6092857B2 (ja) * 2012-05-30 2017-03-08 京セラ株式会社 流路部材ならびにこれを用いた吸着装置および冷却装置
JP6434266B2 (ja) * 2013-12-17 2018-12-05 富士紡ホールディングス株式会社 ラッピング用樹脂定盤及びそれを用いたラッピング方法
WO2016013589A1 (ja) 2014-07-22 2016-01-28 京セラ株式会社 載置用部材
CN105437052B (zh) * 2015-11-28 2019-02-05 郑臣钏 一种连续加工自修复式研抛装置
JP6736404B2 (ja) * 2016-07-26 2020-08-05 株式会社ディスコ 研削装置
US20190299360A1 (en) * 2018-04-02 2019-10-03 Ebara Corporation Polishing apparatus and substrate processing apparatus
US11305397B2 (en) * 2018-06-18 2022-04-19 Seagate Technology Llc Lapping system that includes a lapping plate temperature control system, and related methods
WO2020261990A1 (ja) * 2019-06-28 2020-12-30 日本碍子株式会社 ウエハ載置台及びその製法
DE102020125246A1 (de) * 2020-09-28 2022-03-31 Lapmaster Wolters Gmbh Doppel- oder Einseiten-Bearbeitungsmaschine

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3411120A1 (de) * 1983-03-26 1984-11-08 TOTO Ltd., Kitakyushyu, Fukuoka Laeppvorrichtung
US4552122A (en) 1983-12-16 1985-11-12 Kelly John M Portable apparatus for shaping glass by abrasion
EP0552190B1 (de) * 1990-10-09 1996-12-18 Minnesota Mining And Manufacturing Company Erodierbare agglomerate enthaltendes beschichtetes schleifmittel
US5256599A (en) 1992-06-01 1993-10-26 Motorola, Inc. Semiconductor wafer wax mounting and thinning process
US6099394A (en) * 1998-02-10 2000-08-08 Rodel Holdings, Inc. Polishing system having a multi-phase polishing substrate and methods relating thereto
JP3329644B2 (ja) * 1995-07-21 2002-09-30 株式会社東芝 研磨パッド、研磨装置及び研磨方法
JPH09150351A (ja) * 1995-11-28 1997-06-10 Tokyo Seimitsu Co Ltd 半導体ウェーハの研磨装置
JPH10235552A (ja) * 1997-02-24 1998-09-08 Ebara Corp ポリッシング装置
US5888119A (en) * 1997-03-07 1999-03-30 Minnesota Mining And Manufacturing Company Method for providing a clear surface finish on glass
JPH1190814A (ja) 1997-09-12 1999-04-06 Fujikoshi Mach Corp ウェーハの研磨用定盤装置
JP3693483B2 (ja) * 1998-01-30 2005-09-07 株式会社荏原製作所 研磨装置
US6123612A (en) * 1998-04-15 2000-09-26 3M Innovative Properties Company Corrosion resistant abrasive article and method of making
DE60006179T2 (de) * 1999-03-26 2004-07-15 Ibiden Co. Ltd., Ogaki Halteplatte für Scheiben bei Schleifmaschinen und Verfahren zur Herstellung dieser Platte
US6220942B1 (en) * 1999-04-02 2001-04-24 Applied Materials, Inc. CMP platen with patterned surface

Also Published As

Publication number Publication date
DE60045223D1 (de) 2010-12-23
WO2000076723A1 (fr) 2000-12-21
EP1238755A1 (de) 2002-09-11
EP1238755B1 (de) 2010-11-10
US20050260938A1 (en) 2005-11-24
US7040963B1 (en) 2006-05-09
EP1238755A4 (de) 2007-02-07

Similar Documents

Publication Publication Date Title
ATE487564T1 (de) Wafer poliermaschinentisch, wafer polierverfahren und halbleiterschleife herstellungsverfahren
TWI223318B (en) A workpiece carrier with adjustable pressure zones and barriers
EP0926706A3 (de) Substratverarbeitungsvorrichtung, Substratträgervorrichtung, Substratverarbeitungsverfahren und Substratherstellungsverfahren
WO2003044851A3 (en) Method and apparatus for utilizing integrated metrology data as feed-forward data
TWI286965B (en) Polishing head and polishing apparatus
JPH078472B2 (ja) 工作物表面に研摩を施す方法及び装置
EP1244332A3 (de) Silikon-kapazitives Mikrofon
DE60045345D1 (de) Reaktor für die bearbeitung von halbleiterscheiben
WO2002062527A8 (en) Abrasive article suitable for modifying a semiconductor wafer
WO2002093624A3 (en) Apparatus for regulating temperature of a process kit in a semiconductor wafer-processing chamber
DE602006016850D1 (de) Verfahren zur herstellung von ein gettermaterial enthaltenden mikromechanischen vorrichtungen und so hergestellte vorrichtungen
GB9822473D0 (en) Chemical compounds
NL1025056A1 (nl) Vervaardigingswerkwijze voor een fotomasker voor een geïntegreerde schakeling en overeenkomstig fotomasker.
ATE522925T1 (de) Chiptransferverfahren und vorrichtung
CA2231852A1 (en) Substrate processing apparatus and method
DE602004008037D1 (de) Elektrostatische bond-einspannvorrichtung mit integrierter hochfrequenzelektrode und thermostatischen mitteln
WO2002017354A3 (en) Ring chuck to hold 200 and 300 mm wafer
JP2001353656A (ja) 積重ね研磨パッド
EP1308544A4 (de) Silizium-einkristall-wafer mit hohlraumfreier zone auf der oberfläche, durchmesser von ungefähr 300mm und dessen herstellung
JP2007142220A (ja) ワーク用チャック装置
JPH01227441A (ja) 半導体基板
JP3357311B2 (ja) 半導体製造装置におけるウェハ支持装置
DE60220583D1 (de) Polierverfahren
EP1147855A3 (de) Polierträgervorrichtung
KR20030028985A (ko) 반도체 소자 제조용 장비에서의 웨이퍼 척

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties