WO2013179936A1 - 流路部材ならびにこれを用いた吸着装置および冷却装置 - Google Patents
流路部材ならびにこれを用いた吸着装置および冷却装置 Download PDFInfo
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- WO2013179936A1 WO2013179936A1 PCT/JP2013/063997 JP2013063997W WO2013179936A1 WO 2013179936 A1 WO2013179936 A1 WO 2013179936A1 JP 2013063997 W JP2013063997 W JP 2013063997W WO 2013179936 A1 WO2013179936 A1 WO 2013179936A1
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- Prior art keywords
- flow path
- path member
- main body
- longitudinal direction
- flow
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/04—Constructions of heat-exchange apparatus characterised by the selection of particular materials of ceramic; of concrete; of natural stone
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
- F28F7/02—Blocks traversed by passages for heat-exchange media
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered
Definitions
- the present invention relates to a flow path member used in, for example, a semiconductor manufacturing apparatus or a flat panel display (FPD) manufacturing apparatus, and an adsorption apparatus and a cooling apparatus using the flow path member.
- a flow path member used in, for example, a semiconductor manufacturing apparatus or a flat panel display (FPD) manufacturing apparatus, and an adsorption apparatus and a cooling apparatus using the flow path member.
- FPD flat panel display
- semiconductor manufacturing apparatuses and FPD manufacturing apparatuses have been used to manufacture semiconductor devices and FPDs by processing objects to be processed such as semiconductor wafers and glass substrates.
- a flow path member having a flow path through which a fluid flows may be used.
- back grinding if heat is generated by processing the workpiece, the workpiece is thermally expanded, so that the processing accuracy of the workpiece is likely to decrease. When the processing accuracy of the workpiece is reduced, the workpiece may be damaged.
- the present invention provides a flow path member that increases the cooling efficiency of an object to be processed, and an adsorption device and a cooling device using the same.
- a flow path member includes a main body made of a ceramic sintered body in which a flow path through which a fluid flows is formed, and the main body is provided on the inner wall of the flow path with one of the ceramic sintered bodies. It has the convex part which consists of a part.
- the adsorption device includes the flow path member that adsorbs an object to be processed, and a fluid supply unit that supplies the fluid to the flow path of the flow path member.
- the cooling device includes the flow path member that cools an object, and fluid supply means that supplies the fluid to the flow path of the flow path member.
- the main body made of the ceramic sintered body has the convex portion made of a part of the ceramic sintered body on the inner wall of the flow path.
- the cooling efficiency of the object to be adsorbed can be increased.
- the cooling efficiency of the object to be processed can be increased.
- FIG.1 (a) is a perspective view of the flow-path member in one Embodiment of this invention
- FIG.1 (b) is a top view of Fig.1 (a).
- 2A is a cross-sectional view taken along the line AA in FIG. 1B
- FIG. 2B is an enlarged view of a portion R1 in FIG. 2A
- FIG. FIG. 3 is a partially enlarged view of the first flow path in FIG. 2A viewed from the lower surface side.
- FIGS. 3A to 3C are cross-sectional views along the thickness direction showing the manufacturing process of the flow path member described in FIG.
- FIG. 4A is a cross-sectional view along the thickness direction of the flow path member according to another embodiment of the present invention
- FIG. 4B is a cross-sectional view of the flow path member according to another embodiment of the present invention.
- FIG. 4C is an enlarged view of a portion corresponding to FIG. 2B, and
- FIG. 4C is an enlarged view of a portion corresponding to FIG. 2B of the flow path member in another embodiment of the present invention.
- the flow path member 1 of the present embodiment is used as a vacuum chuck (adsorption member) in a vacuum suction device that holds the workpiece 2 in a back grinding (back grinding) process or polishing process of the workpiece 2 that is a semiconductor wafer.
- the workpiece 2 placed on the upper surface which is the suction surface is sucked.
- the flow path member 1 is accommodated in a plate-like main body 4 in which a concave portion 3 having an opening on the upper surface is formed, and a concave portion 3 of the main body 4.
- the porous body 5 is formed.
- the main body 4 is made of a dense ceramic sintered body, supports the porous body 5 and sucks the workpiece 2 by exhausting air from the recess 3. Furthermore, the main body 4 of the present embodiment has a function of cooling the workpiece 2.
- the ceramic sintered body constituting the main body 4 for example, an alumina sintered body, a cordierite sintered body, or a silicon carbide sintered body can be used, and among these, an alumina sintered body can be used. desirable.
- the main body 4 has an elongated first flow path 6 along the plane direction (XY plane direction) and an elongated shape along the thickness direction (Z direction).
- the second flow path 7 is formed.
- the first flow path 6 is a flow path through which a cooling fluid such as pure water or a liquid or a gas flows, and functions as a cooling flow path for the workpiece 2.
- the first flow path 6 has an inflow port (not shown) opened on the side surface or the lower surface of the main body 4 and an outflow port (not shown) opened on the side surface or the lower surface of the main body 4. Then, the cooling fluid is supplied from the fluid supply means to the first flow path 6 through the inlet, and the cooling fluid is discharged from the first flow path 6 to the fluid supply means through the outlet, thereby A cooling fluid can flow through the flow path 6.
- the first flow path 6 is formed in an elongated shape along the plane direction of the main body 4 as described above, the cooling fluid flows along the plane direction of the main body 4. Therefore, the upper surface of the porous body 3 and the upper surface of the main body 4 constituting the adsorption surface of the flow path member 1 can be cooled uniformly, and consequently the workpiece 2 can be cooled uniformly.
- the planar shape of the 1st flow path 6 should just be elongate along the planar direction of the main body 4, for example, can be formed in a spiral shape or a meander shape.
- the thickness (Z direction) of the 1st flow path 6 is set to 2 mm or more and 8 mm or less, for example.
- vertical to the longitudinal direction of the 1st flow path 6 is set to 2 mm or more and 8 mm or less, for example.
- the second flow path 7 is a flow path for exhausting air from the recess 3 and functions as a flow path for adsorption of the workpiece 2.
- the second flow path 7 has an exhaust port 8 opened on the side surface or the lower surface of the main body 4 and a suction port 9 opened on the bottom surface of the recess 3. Then, air is exhausted from the second flow path 7 to the exhaust means (not shown) through the exhaust port 8, and air is sucked from the recess 3 into the second flow path 7 through the suction port 9. Air can be exhausted from the recess 3 to the outside via the two flow paths 7.
- a plurality of the second flow paths 7 are formed so as to penetrate the region forming the bottom of the recess 3 in the main body 4 in the thickness direction.
- the second flow path 7 is a flow path independent of the first flow path 6 and is not connected to the first flow path 6.
- the porous body 5 supports the workpiece 2 and adsorbs the workpiece 2 when the air in the recess 3 is exhausted to the outside by the second flow path 7.
- the porous body 5 is made of a porous ceramic having an open pore space.
- this porous ceramic for example, it is composed of a plurality of ceramic particles made of a ceramic that is the same material as the ceramic sintered body of the main body 4, and glass that bonds the ceramic particles, and open pores between the ceramic particles. The one in which the gap is formed can be used.
- the above-described flow path member 1 can adsorb the workpiece 2 as follows. First, the workpiece 2 is placed on the upper surface of the flow path member 1. At this time, as shown in FIG. 2 (a), the inner region of the object to be processed 2 is placed on the upper surface of the porous body 5 so as to cover the entire porous body 5, and the outer edge region of the object to be processed 2 is placed. Is placed on the upper surface of the main body 4. Next, air is exhausted from the recess 3 to the outside through the second flow path 7 of the main body 4. As a result, by reducing the atmospheric pressure in the recess 3, the workpiece 2 is sucked through the gap between the porous bodies 5, so that the workpiece 2 is adsorbed on the upper surface of the flow path member 1.
- the flow path member 1 can cool the adsorbed workpiece 2 by flowing a cooling fluid through the first flow path 6. As a result, when the workpiece 2 is processed, the temperature of the workpiece 2 can be kept uniform and the processing accuracy of the workpiece 2 can be increased.
- the main body 4 of the present embodiment has a convex portion 10 made of a part of a ceramic sintered body constituting the main body 4 on the inner wall of the first flow path 6 as shown in FIG. That is, the flow path member 1 of the present embodiment includes a main body 4 made of a ceramic sintered body, a first flow path 6 formed inside the main body 4 through which a cooling fluid flows, and an inner wall of the first flow path 6. And a convex portion 10 made of a part of a ceramic sintered body.
- the cooling fluid when the cooling fluid is caused to flow through the first flow path 6, the flow of the cooling fluid is disturbed by the convex portion 10, so that the turbulent flow is likely to occur in the cooling fluid.
- the flow rate of the cooling fluid is likely to decrease in the region where the convex portion 10 is formed, so that the heat exchange time between the cooling fluid and the main body 4 in the first flow path 6 is lengthened, and consequently the flow path.
- the cooling efficiency of the workpiece 2 by the member 1 can be increased. Further, since the cooling fluid is agitated by the convex portion 10, the cooling fluid can be efficiently used for heat exchange with the main body 4, so that the cooling efficiency can also be increased.
- the convex part 10 consists of a part of ceramic sintered compact which comprises the main body 4, the adhesive strength of the convex part 10 and the main body 4 is high. Therefore, it is possible to reduce the separation of the convex portion 10 from the inner wall of the first flow path 6 due to the pressure applied by the cooling fluid, and to maintain the cooling efficiency of the workpiece 2 due to the convex portion 10 well. Can do.
- the cross-sectional area along the longitudinal direction of the 1st flow path 6 will become small.
- the flow velocity of the cooling fluid flowing through the first flow path 6 tends to be high, but in the main body 4 of the present embodiment, as described above, the turbulent flow in the cooling fluid is easily generated by the convex portion 10. Even when the cross-sectional area along the longitudinal direction of the first flow path 6 is reduced as described above, the cooling efficiency of the workpiece 2 by the flow path member 1 can be increased.
- the length (projection amount) along the projecting direction of the convex portion 10 is, for example, 0.
- the length (width) perpendicular to the protruding direction of the convex portion 10 is set to 0.1 mm or more and 3 mm or less, for example.
- the convex portion 10 of the present embodiment has an elongated shape along the longitudinal direction of the first flow path 6.
- the bonding strength between the convex portion 10 and the main body 4 can be increased without increasing the pressure applied to the convex portion 10 by the cooling fluid, the convex portion 10 is peeled off from the inner wall of the first flow path 6. Can be reduced.
- a plurality of the convex portions 10 are formed so as to be separated from each other along the longitudinal direction of the first flow path 6. As a result, it is possible to easily generate turbulent flow by forming a plurality of convex portions 10.
- the first flow path 6 of the present embodiment has an elongated shape in a plan view and has a curved portion that is bent at least partially in the plan view.
- the main body 4 has a plurality of convex portions 10 separated from each other along the longitudinal direction of the first flow path 6 in the curved portion 11.
- turbulent flow can be easily generated by the plurality of convex portions 10 and the flow velocity can be further reduced. Therefore, the cooling efficiency of the workpiece 2 by the flow path member 1 is increased. be able to.
- the convex part 10 of this embodiment has the space
- the gap 12 has a circular shape in a cross section perpendicular to the longitudinal direction of the first flow path 6, and the width (diameter) of the gap 12 is, for example, not less than 0.1 mm and not more than 3 mm.
- one convex portion 10 has one gap 12 in a cross section perpendicular to the longitudinal direction of the first flow path 6.
- the main body 4 of the present embodiment has a pair of convex portions 10 facing each other on the inner wall of the first flow path 6 in a cross section perpendicular to the longitudinal direction of the first flow path 6.
- the cross section perpendicular to the longitudinal direction of the first flow path 6 it is possible to reduce the uneven position of a plurality of turbulent flows generated in the cooling fluid and make the heat exchange efficiency in the first flow path 6 more uniform. Can do.
- the surface of the convex portion 10 of the present embodiment has a convex curve shape in a cross section perpendicular to the longitudinal direction of the first flow path 6.
- the first flow path 6 of the present embodiment has a rectangular shape in a cross section perpendicular to the longitudinal direction.
- the main body 4 has the convex part 10 in the corner
- the convex portions 10 are arranged at the corners of the rectangular first flow path 6, thereby suppressing the retention of the cooling fluid. it can.
- the workpiece 2 can be efficiently cooled by the first flow path 6.
- an upper molded body 4a having a recess 3 formed on the upper surface and a lower molded body 4b having a recess 6a to be the first flow path 6 formed on the upper surface are produced. To do. Specifically, for example, the following is performed.
- a molded body for the upper molded body 4a and a molded body for the lower molded body 4b are produced so that the ceramic components have the same composition.
- the recesses 3 are formed on the upper surface and the lower surface is a flat surface, and the upper molded body 4a is formed.
- the recess 6a is formed on the upper surface and the lower surface is a flat surface. This is the lower molded body 4b.
- the main body 4 made of one ceramic sintered body is produced by co-firing 4b and the ceramic paste. Specifically, for example, the following is performed.
- a ceramic paste is applied to a region located between the depressions 6a on the upper surface of the lower molded body 4b.
- the lower surface of the upper molded body 4a and the upper surface of the lower molded body 4b are joined via the applied ceramic paste.
- the joined molded body is fired at, for example, 1400 ° C. or higher and 1800 ° C. or lower, whereby the upper molded body 4a, the lower molded body 4b, and the ceramic paste are simultaneously fired to produce one ceramic sintered body.
- the main body 4 made of a ceramic sintered body having a desired shape can be produced.
- the first flow path 6a was formed inside by baking after joining the lower surface, which is a flat surface of the upper molded body 4a, and the upper surface of the lower molded body 4b where the recess 6a was formed.
- the main body 4 made of a ceramic sintered body can be produced.
- the ceramic paste described above is a mixture of ceramic powder and pure water.
- the ceramic powder having the same composition as the ceramic powder used for the molded body of the main body 4 is used.
- the main body 4 made of one ceramic sintered body having the same composition as the entire ceramic component can be produced.
- the convex portion 10 is formed in the first flow path 6 of the main body 4.
- the convex portion 10 is formed as follows.
- a ceramic paste having a moisture content of the ceramic paste (ratio of pure water in the entire ceramic paste) of 40% by mass to 80% by mass is obtained.
- the viscosity of the ceramic paste may be adjusted by a thickener such as an organic substance.
- this ceramic paste is applied to the region between the depressions 6a on the upper surface of the lower molded body 4b so that the thickness after application is 0.1 mm or more and 2 mm or less.
- the ceramic paste is applied uniformly through the mesh, thereby uniformly applying the ceramic paste and adjusting the thickness of the ceramic paste.
- coating by making humidity into 50% RH or more, drying of a ceramic paste is suppressed and the moisture content of a ceramic paste is maintained.
- the lower surface of the upper molded body 4a is joined to the upper surface of the lower molded body 4b coated with the ceramic paste, and the upper molded body is pressed in the vertical direction at a pressure of 4.9 kPa to 98 kPa for 0.5 hours or longer.
- a part of the ceramic paste protrudes from the bonding interface between the body 4a and the lower molded body 4b toward the inside of the recess 6a to form a protrusion.
- the lower surface of the upper molded body 4a is bonded to the upper surface of the lower molded body 4b, thereby suppressing the drying of the ceramic paste before bonding and maintaining the moisture content of the ceramic paste.
- the ceramic paste is simultaneously fired together with the upper molded body 4 a and the lower molded body 4 b, whereby the protruding portion made of the ceramic paste is changed to the protruding portion 10 made of a part of the ceramic sintered body constituting the main body 4.
- the convex portion 10 can be formed.
- the protruding portion which is a part of the ceramic paste protruding from the bonding interface 13 is fired to form the protruding portion 10
- a pair of protruding portions 10 facing each other is formed on the inner wall of the first flow path 6.
- the convex portion 10 can be formed in an elongated shape along the longitudinal direction of the first flow path 6.
- the moisture content of the ceramic paste is adjusted.
- the surface of the protruding portion can be formed into a convex curve shape by surface tension, and as a result, the surface of the protruding portion 10 can be formed into a convex curve shape.
- the ceramic paste located at the center of the projecting portion is pulled outward because the projecting portion tends to be rounded by surface tension, so that the projecting portion has voids that are closed pores. 12 is formed. By firing this projecting portion, the void 12 that is a closed pore can be formed in the convex portion 10.
- the projecting portion contracts along the longitudinal direction and is divided into a plurality of locations, so that a plurality of convex portions 10 separated from each other along the longitudinal direction can be formed.
- the protruding portion is easily divided into a plurality of locations along the longitudinal direction, and thus the plurality of convex portions 10 can be formed in the curved portion 11.
- the porous body 5 is formed in the recess 3 by using a conventionally known method.
- the flow path member 1 can be manufactured.
- the configuration in which the flow path member 1 is used for the back grinding process or polishing process of the semiconductor wafer has been described as an example.
- the flow path member 1 may be an exposure process, an etching process, or a film formation process of the semiconductor wafer. You may use for other semiconductor manufacturing processes, such as a process, and you may use for a FPD manufacturing process.
- the flow path member 1 that is a vacuum chuck (adsorption member) having the porous body 5 as the adsorption portion has been described as an example. Good.
- the flow path member 1 has an annular seal portion 14 corresponding to the shape of the object 2, a bottom surface 15 located inside the seal portion 14, and a bottom surface 15 as an adsorption portion. You may have the some pin 16 which protruded from.
- a flow path member 1 may be a vacuum chuck or an electrostatic chuck or other attracting member.
- the flow path member 1 may not be an adsorption member, and may be a cooling member that cools an object such as a vacuum chuck or a plasma generating electrode. In this case, the flow path member 1 is used as a cooling member in the cooling device.
- the configuration using the cooling fluid as the fluid has been described as an example, but other fluids may be used.
- a plasma generating gas gas
- the main body 10 has the convex part 10 which consists of a part of ceramic sintered compact in the inner wall of the 1st flow path 6, a turbulent flow arises in the plasma generating gas, and the plasma generating gas becomes the convex part 10. Is stirred. By using this plasma generating gas, more uniform plasma can be generated.
- the configuration in which the cross-sectional shape perpendicular to the longitudinal direction of the first flow path 6 is rectangular has been described as an example.
- the cross-sectional shape perpendicular to the longitudinal direction of the first flow path 6 is rectangular.
- it may be circular.
- the main bodies 4 face each other with the inner wall of the first flow path 6 across the center of the first flow path 6 in a cross section perpendicular to the longitudinal direction of the first flow path 6. It has a pair of convex parts 10.
- a hollow portion having a semicircular cross section perpendicular to the longitudinal direction is provided at a position corresponding to each of the lower surface of the upper molded body 4 a and the upper surface of the lower molded body 4 b. It can be produced by forming 6a.
- the cross-sectional shape perpendicular to the longitudinal direction of the first flow path 6 is rectangular, and the main body 4 has a corner of the first flow path 6 in the cross-section perpendicular to the longitudinal direction of the first flow path 6.
- the convex portion 10 may not be arranged at the corner portion of the first flow path 6, for example, as shown in FIG. It may be arranged on the side surface of one flow path 6. In this case, in the cross section perpendicular to the longitudinal direction of the first flow path 6, it is possible to reduce the uneven position of the plurality of turbulent flows generated in the cooling fluid, and to make the heat exchange efficiency in the first flow path 6 more uniform. can do.
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Abstract
Description
2 被処理物
3 凹部
4 本体
5 多孔質体
6 第1流路
7 第2流路
8 排気口
9 吸引口
10 凸部
11 曲部
12 空隙
13 接合界面
Claims (10)
- 流体が流れる流路が内部に形成されたセラミック焼結体からなる本体を備え、
該本体は、前記流路の内壁に、前記セラミック焼結体の一部からなる凸部を有することを特徴とする流路部材。 - 請求項1に記載の流路部材において、
前記凸部は、前記流路の長手方向に沿った細長形状であることを特徴とする流路部材。 - 請求項2に記載の流路部材において、
前記流路は、平面視において細長形状であるとともに、少なくとも一部に曲がった曲部を有しており、
前記本体は、前記曲部において、前記流路の長手方向に沿って互いに離れた複数の前記凸部を有することを特徴とする流路部材。 - 請求項1に記載の流路部材において、
前記凸部は、内部に閉気孔である空隙を有することを特徴とする流路部材。 - 請求項1に記載の流路部材において、
前記本体は、前記流路の長手方向に垂直な断面において、前記流路の内壁に、互いに対向する一対の前記凸部を有することを特徴とする流路部材。 - 請求項1に記載の流路部材において、
前記流路は、長手方向に垂直な断面において、矩形状であり、
前記本体は、前記流路の長手方向に垂直な断面において、前記流路の角部に前記凸部を有することを特徴とする流路部材。 - 請求項6に記載の流路部材において、
前記凸部の表面は、前記流路の長手方向に垂直な断面において、凸曲線状であることを特徴とする流路部材。 - 請求項1に記載の流路部材において、
前記流路は、長手方向に垂直な断面において、円形状であり、
前記本体は、前記流路の長手方向に垂直な断面において、前記流路の内壁に、前記流路の中心を挟んで互いに対向する一対の前記凸部を有することを特徴とする流路部材。 - 被処理物を吸着する、請求項1ないし8のいずれかに記載の流路部材と、前記流路部材の流路に前記流体を供給する流体供給手段とを備えたことを特徴とする吸着装置。
- 対象物を冷却する、請求項1ないし8のいずれかに記載の流路部材と、該流路部材の流路に冷却用流体である前記流体を供給する流体供給手段とを備えたことを特徴とする冷却装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13798153.6A EP2858104B1 (en) | 2012-05-30 | 2013-05-21 | Flow path member, and adsorption device and refrigeration device employing same |
US14/403,848 US10480873B2 (en) | 2012-05-30 | 2013-05-21 | Flow path member, and adsorption device and cooling device using the same |
JP2014518391A JP6092857B2 (ja) | 2012-05-30 | 2013-05-21 | 流路部材ならびにこれを用いた吸着装置および冷却装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012123084 | 2012-05-30 | ||
JP2012-123084 | 2012-05-30 |
Publications (1)
Publication Number | Publication Date |
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WO2013179936A1 true WO2013179936A1 (ja) | 2013-12-05 |
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JP2016188663A (ja) * | 2015-03-30 | 2016-11-04 | 京セラ株式会社 | 管状体 |
JP2018518013A (ja) * | 2015-04-21 | 2018-07-05 | ヴァリアン セミコンダクター イクイップメント アソシエイツ インコーポレイテッド | 流体導管が埋め込まれた半導体製造装置 |
JP2020113588A (ja) * | 2019-01-09 | 2020-07-27 | 日本特殊陶業株式会社 | 静電チャック |
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TWI506680B (zh) * | 2013-02-22 | 2015-11-01 | Nissin Ion Equipment Co Ltd | Substrate cooling means and irradiating ion beam |
CN108369931B (zh) * | 2015-12-18 | 2021-06-18 | 京瓷株式会社 | 流路构件以及半导体模块 |
JP7143021B2 (ja) * | 2018-07-09 | 2022-09-28 | 株式会社ディスコ | ポーラスチャックテーブル、ポーラスチャックテーブルの製造方法、及び、加工装置 |
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EP2858104A1 (en) | 2015-04-08 |
US10480873B2 (en) | 2019-11-19 |
EP2858104B1 (en) | 2020-07-29 |
JP6092857B2 (ja) | 2017-03-08 |
JPWO2013179936A1 (ja) | 2016-01-18 |
EP2858104A4 (en) | 2016-01-13 |
US20150122464A1 (en) | 2015-05-07 |
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