ATE477126T1 - Strahlauftragung eines organischen dampfes mit abfuhr - Google Patents
Strahlauftragung eines organischen dampfes mit abfuhrInfo
- Publication number
- ATE477126T1 ATE477126T1 AT07862016T AT07862016T ATE477126T1 AT E477126 T1 ATE477126 T1 AT E477126T1 AT 07862016 T AT07862016 T AT 07862016T AT 07862016 T AT07862016 T AT 07862016T AT E477126 T1 ATE477126 T1 AT E477126T1
- Authority
- AT
- Austria
- Prior art keywords
- exhaust
- discharge
- nozzles
- jet application
- organic steam
- Prior art date
Links
- 238000004326 stimulated echo acquisition mode for imaging Methods 0.000 title 1
- 238000000151 deposition Methods 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
- 238000001912 gas jet deposition Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45502—Flow conditions in reaction chamber
- C23C16/4551—Jet streams
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45561—Gas plumbing upstream of the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45574—Nozzles for more than one gas
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
- Agricultural Chemicals And Associated Chemicals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/643,795 US7879401B2 (en) | 2006-12-22 | 2006-12-22 | Organic vapor jet deposition using an exhaust |
| PCT/US2007/023910 WO2008088446A2 (en) | 2006-12-22 | 2007-11-13 | Organic vapor jet deposition using an exhaust |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE477126T1 true ATE477126T1 (de) | 2010-08-15 |
Family
ID=39495094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT07862016T ATE477126T1 (de) | 2006-12-22 | 2007-11-13 | Strahlauftragung eines organischen dampfes mit abfuhr |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US7879401B2 (de) |
| EP (1) | EP2094495B1 (de) |
| JP (1) | JP5379019B2 (de) |
| KR (1) | KR101514090B1 (de) |
| CN (1) | CN101795869B (de) |
| AT (1) | ATE477126T1 (de) |
| DE (1) | DE602007008460D1 (de) |
| WO (1) | WO2008088446A2 (de) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7879401B2 (en) * | 2006-12-22 | 2011-02-01 | The Regents Of The University Of Michigan | Organic vapor jet deposition using an exhaust |
| KR101055606B1 (ko) * | 2008-10-22 | 2011-08-10 | 한국과학기술원 | 유기 드라이 젯 프린팅 헤드 및 이를 이용한 프린팅 장치 및 방법 |
| US8931431B2 (en) * | 2009-03-25 | 2015-01-13 | The Regents Of The University Of Michigan | Nozzle geometry for organic vapor jet printing |
| EP2425470A2 (de) * | 2009-05-01 | 2012-03-07 | Kateeva, Inc. | Verfahren und vorrichtung für organischen dampfstrahldruck |
| WO2010136082A1 (en) * | 2009-05-26 | 2010-12-02 | Imec | Method for forming an organic material layer on a substrate |
| US20110097495A1 (en) | 2009-09-03 | 2011-04-28 | Universal Display Corporation | Organic vapor jet printing with chiller plate |
| US8801856B2 (en) * | 2009-09-08 | 2014-08-12 | Universal Display Corporation | Method and system for high-throughput deposition of patterned organic thin films |
| JP4983890B2 (ja) | 2009-10-28 | 2012-07-25 | 住友化学株式会社 | 有機el素子の製造方法 |
| US9449862B2 (en) | 2011-06-03 | 2016-09-20 | Tel Nexx, Inc. | Parallel single substrate processing system |
| US8728858B2 (en) * | 2012-08-27 | 2014-05-20 | Universal Display Corporation | Multi-nozzle organic vapor jet printing |
| US9653709B2 (en) * | 2012-11-20 | 2017-05-16 | The Regents Of The University Of Michigan | Optoelectronic device formed with controlled vapor flow |
| US9178184B2 (en) | 2013-02-21 | 2015-11-03 | Universal Display Corporation | Deposition of patterned organic thin films |
| CN103343332A (zh) * | 2013-07-22 | 2013-10-09 | 湖南顶立科技有限公司 | 一种化学气相沉积方法 |
| US11220737B2 (en) | 2014-06-25 | 2022-01-11 | Universal Display Corporation | Systems and methods of modulating flow during vapor jet deposition of organic materials |
| EP2960059B1 (de) | 2014-06-25 | 2018-10-24 | Universal Display Corporation | Systeme und verfahren zur modulation des durchflusses während der dampfstrahlabscheidung von organischen materialien |
| US11267012B2 (en) * | 2014-06-25 | 2022-03-08 | Universal Display Corporation | Spatial control of vapor condensation using convection |
| US10566534B2 (en) | 2015-10-12 | 2020-02-18 | Universal Display Corporation | Apparatus and method to deliver organic material via organic vapor-jet printing (OVJP) |
| US10704144B2 (en) | 2015-10-12 | 2020-07-07 | Universal Display Corporation | Apparatus and method for printing multilayer organic thin films from vapor phase in an ultra-pure gas ambient |
| US11168391B2 (en) * | 2016-04-11 | 2021-11-09 | Universal Display Corporation | Nozzle exit contours for pattern composition |
| CN112941465A (zh) * | 2016-07-29 | 2021-06-11 | 环球展览公司 | 沉积喷嘴 |
| CN109906119B (zh) * | 2016-10-18 | 2021-12-21 | 环球展览公司 | 有机蒸气喷射沉积装置配置 |
| JP6640781B2 (ja) * | 2017-03-23 | 2020-02-05 | キオクシア株式会社 | 半導体製造装置 |
| KR102369676B1 (ko) | 2017-04-10 | 2022-03-04 | 삼성디스플레이 주식회사 | 표시 장치의 제조장치 및 표시 장치의 제조방법 |
| US10818840B2 (en) * | 2017-05-05 | 2020-10-27 | Universal Display Corporation | Segmented print bar for large-area OVJP deposition |
| US10998531B2 (en) | 2017-12-12 | 2021-05-04 | Universal Display Corporation | Segmented OVJP print bar |
| US11588140B2 (en) * | 2018-01-12 | 2023-02-21 | Universal Display Corporation | Organic vapor jet print head for depositing thin film features with high thickness uniformity |
| US11033924B2 (en) * | 2018-01-31 | 2021-06-15 | Universal Display Corporation | Organic vapor jet print head with orthogonal delivery and exhaust channels |
| US20190386256A1 (en) | 2018-06-18 | 2019-12-19 | Universal Display Corporation | Sequential material sources for thermally challenged OLED materials |
| JP6875336B2 (ja) * | 2018-08-27 | 2021-05-26 | 信越化学工業株式会社 | 成膜方法 |
| CN112695302B (zh) * | 2019-10-22 | 2023-05-30 | 中微半导体设备(上海)股份有限公司 | 一种mocvd反应器 |
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| JP4344949B2 (ja) * | 2005-12-27 | 2009-10-14 | セイコーエプソン株式会社 | シャワーヘッド、シャワーヘッドを含む成膜装置、ならびに強誘電体膜の製造方法 |
| CN101589171A (zh) * | 2006-03-03 | 2009-11-25 | 普拉萨德·盖德吉尔 | 用于大面积多层原子层化学气相处理薄膜的装置和方法 |
| US20080050521A1 (en) * | 2006-08-24 | 2008-02-28 | Seagate Technology Llc | Apparatus & method for vapor phase lubrication of recording media with reduced lubricant consumption |
| US7674352B2 (en) * | 2006-11-28 | 2010-03-09 | Applied Materials, Inc. | System and method for depositing a gaseous mixture onto a substrate surface using a showerhead apparatus |
| US7879401B2 (en) * | 2006-12-22 | 2011-02-01 | The Regents Of The University Of Michigan | Organic vapor jet deposition using an exhaust |
| US7976631B2 (en) * | 2007-10-16 | 2011-07-12 | Applied Materials, Inc. | Multi-gas straight channel showerhead |
| US9114413B1 (en) * | 2009-06-17 | 2015-08-25 | Alessandro Gomez | Multiplexed electrospray cooling |
| US8659896B2 (en) * | 2010-09-13 | 2014-02-25 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling apparatuses and power electronics modules |
| CN103388132B (zh) * | 2012-05-11 | 2015-11-25 | 中微半导体设备(上海)有限公司 | 气体喷淋头、其制造方法及薄膜生长反应器 |
| US11201288B2 (en) * | 2017-05-26 | 2021-12-14 | Universal Display Corporation | Generalized organic vapor jet depositor capable of high resolution printing and method for OVJP printing |
-
2006
- 2006-12-22 US US11/643,795 patent/US7879401B2/en active Active
-
2007
- 2007-11-13 WO PCT/US2007/023910 patent/WO2008088446A2/en not_active Ceased
- 2007-11-13 KR KR1020097015279A patent/KR101514090B1/ko active Active
- 2007-11-13 DE DE602007008460T patent/DE602007008460D1/de active Active
- 2007-11-13 EP EP07862016A patent/EP2094495B1/de active Active
- 2007-11-13 AT AT07862016T patent/ATE477126T1/de not_active IP Right Cessation
- 2007-11-13 CN CN2007800516916A patent/CN101795869B/zh active Active
- 2007-11-13 JP JP2009542771A patent/JP5379019B2/ja active Active
-
2010
- 2010-12-21 US US12/974,070 patent/US11374172B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US7879401B2 (en) | 2011-02-01 |
| KR20090109091A (ko) | 2009-10-19 |
| CN101795869A (zh) | 2010-08-04 |
| WO2008088446A3 (en) | 2008-09-12 |
| JP2010513719A (ja) | 2010-04-30 |
| WO2008088446A2 (en) | 2008-07-24 |
| KR101514090B1 (ko) | 2015-04-21 |
| US11374172B2 (en) | 2022-06-28 |
| JP5379019B2 (ja) | 2013-12-25 |
| DE602007008460D1 (de) | 2010-09-23 |
| US20110088621A1 (en) | 2011-04-21 |
| EP2094495B1 (de) | 2010-08-11 |
| EP2094495A2 (de) | 2009-09-02 |
| CN101795869B (zh) | 2012-08-15 |
| US20080152806A1 (en) | 2008-06-26 |
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