ATE474249T1 - Deckschichtmaterialien für die immersion- lithographie - Google Patents
Deckschichtmaterialien für die immersion- lithographieInfo
- Publication number
- ATE474249T1 ATE474249T1 AT06735757T AT06735757T ATE474249T1 AT E474249 T1 ATE474249 T1 AT E474249T1 AT 06735757 T AT06735757 T AT 06735757T AT 06735757 T AT06735757 T AT 06735757T AT E474249 T1 ATE474249 T1 AT E474249T1
- Authority
- AT
- Austria
- Prior art keywords
- topcoat material
- immersion lithography
- cover layer
- layer materials
- water
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/108—Polyolefin or halogen containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/111—Polymer of unsaturated acid or ester
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Paints Or Removers (AREA)
- Bipolar Transistors (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/063,940 US7288362B2 (en) | 2005-02-23 | 2005-02-23 | Immersion topcoat materials with improved performance |
PCT/US2006/006225 WO2006091648A2 (en) | 2005-02-23 | 2006-02-22 | Immersion topcoat materials with improved performance |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE474249T1 true ATE474249T1 (de) | 2010-07-15 |
Family
ID=36913114
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT06735757T ATE474249T1 (de) | 2005-02-23 | 2006-02-22 | Deckschichtmaterialien für die immersion- lithographie |
Country Status (8)
Country | Link |
---|---|
US (2) | US7288362B2 (de) |
EP (1) | EP1851589B1 (de) |
JP (1) | JP5046236B2 (de) |
CN (1) | CN101164013B (de) |
AT (1) | ATE474249T1 (de) |
DE (1) | DE602006015428D1 (de) |
TW (1) | TWI397773B (de) |
WO (1) | WO2006091648A2 (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI297809B (de) * | 2001-10-24 | 2008-06-11 | Toyo Boseki | |
US7473512B2 (en) * | 2004-03-09 | 2009-01-06 | Az Electronic Materials Usa Corp. | Process of imaging a deep ultraviolet photoresist with a top coating and materials thereof |
JP4355944B2 (ja) * | 2004-04-16 | 2009-11-04 | 信越化学工業株式会社 | パターン形成方法及びこれに用いるレジスト上層膜材料 |
JP4697406B2 (ja) * | 2004-08-05 | 2011-06-08 | 信越化学工業株式会社 | 高分子化合物,レジスト保護膜材料及びパターン形成方法 |
JP4621451B2 (ja) * | 2004-08-11 | 2011-01-26 | 富士フイルム株式会社 | 液浸露光用保護膜形成組成物及びそれを用いたパターン形成方法 |
US7358035B2 (en) * | 2005-06-23 | 2008-04-15 | International Business Machines Corporation | Topcoat compositions and methods of use thereof |
JP5055743B2 (ja) * | 2005-11-04 | 2012-10-24 | セントラル硝子株式会社 | 含フッ素高分子コーティング用組成物、該コーティング用組成物を用いた含フッ素高分子膜の形成方法、ならびにフォトレジストまたはリソグラフィーパターンの形成方法。 |
US20070117040A1 (en) * | 2005-11-21 | 2007-05-24 | International Business Machines Corporation | Water castable-water strippable top coats for 193 nm immersion lithography |
JP5151038B2 (ja) * | 2006-02-16 | 2013-02-27 | 富士通株式会社 | レジストカバー膜形成材料、レジストパターンの形成方法、半導体装置及びその製造方法 |
US7521172B2 (en) * | 2006-04-28 | 2009-04-21 | International Business Machines Corporation | Topcoat material and use thereof in immersion lithography processes |
US8034532B2 (en) | 2006-04-28 | 2011-10-11 | International Business Machines Corporation | High contact angle topcoat material and use thereof in lithography process |
US8945808B2 (en) * | 2006-04-28 | 2015-02-03 | International Business Machines Corporation | Self-topcoating resist for photolithography |
US7951524B2 (en) * | 2006-04-28 | 2011-05-31 | International Business Machines Corporation | Self-topcoating photoresist for photolithography |
US20080311530A1 (en) * | 2007-06-15 | 2008-12-18 | Allen Robert D | Graded topcoat materials for immersion lithography |
JP5075516B2 (ja) * | 2007-07-25 | 2012-11-21 | 株式会社ダイセル | レジスト保護膜用重合体溶液の製造方法 |
US8003309B2 (en) * | 2008-01-16 | 2011-08-23 | International Business Machines Corporation | Photoresist compositions and methods of use in high index immersion lithography |
JP5010569B2 (ja) * | 2008-01-31 | 2012-08-29 | 信越化学工業株式会社 | レジスト保護膜材料及びパターン形成方法 |
US8084193B2 (en) * | 2008-07-12 | 2011-12-27 | International Business Machines Corporation | Self-segregating multilayer imaging stack with built-in antireflective properties |
US8541523B2 (en) * | 2010-04-05 | 2013-09-24 | Promerus, Llc | Norbornene-type polymers, compositions thereof and lithographic process using such compositions |
KR101099506B1 (ko) | 2010-11-17 | 2011-12-27 | 주식회사 동진쎄미켐 | 고분자 화합물 및 이를 포함하는 액침 노광 프로세스용 레지스트 보호막 조성물 |
US8476004B2 (en) | 2011-06-27 | 2013-07-02 | United Microelectronics Corp. | Method for forming photoresist patterns |
US8701052B1 (en) | 2013-01-23 | 2014-04-15 | United Microelectronics Corp. | Method of optical proximity correction in combination with double patterning technique |
US9746768B2 (en) * | 2013-01-24 | 2017-08-29 | Nissan Chemical Industries, Ltd. | Resist overlayer film forming composition for lithography and method for producing semiconductor device using the same |
US8627242B1 (en) | 2013-01-30 | 2014-01-07 | United Microelectronics Corp. | Method for making photomask layout |
US9230812B2 (en) | 2013-05-22 | 2016-01-05 | United Microelectronics Corp. | Method for forming semiconductor structure having opening |
JP6519753B2 (ja) | 2014-02-26 | 2019-05-29 | 日産化学株式会社 | レジスト上層膜形成組成物及びそれを用いた半導体装置の製造方法 |
WO2017062822A1 (en) * | 2015-10-09 | 2017-04-13 | Illinois Tool Works Inc. | Surface appearance simulation system and method |
US11993091B2 (en) * | 2021-03-12 | 2024-05-28 | Darin A. Grassman | Methods and apparatus for hand printing designs and patterns |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59211045A (ja) * | 1983-05-17 | 1984-11-29 | Toshiba Corp | ポジ型フォトレジストの露光方法 |
US5240812A (en) * | 1990-09-18 | 1993-08-31 | International Business Machines Corporation | Top coat for acid catalyzed resists |
EP0522990B1 (de) | 1991-06-28 | 1996-09-25 | International Business Machines Corporation | Reflexionsverminderde Überzüge |
US5330883A (en) | 1992-06-29 | 1994-07-19 | Lsi Logic Corporation | Techniques for uniformizing photoresist thickness and critical dimension of underlying features |
US5506090A (en) * | 1994-09-23 | 1996-04-09 | Minnesota Mining And Manufacturing Company | Process for making shoot and run printing plates |
JPH0936017A (ja) * | 1995-07-20 | 1997-02-07 | Hitachi Ltd | パタン形成方法及びそれを用いた半導体素子の製造方法 |
US5879853A (en) | 1996-01-18 | 1999-03-09 | Kabushiki Kaisha Toshiba | Top antireflective coating material and its process for DUV and VUV lithography systems |
JP3691897B2 (ja) * | 1996-03-07 | 2005-09-07 | 富士通株式会社 | レジスト材料及びレジストパターンの形成方法 |
US6274295B1 (en) * | 1997-03-06 | 2001-08-14 | Clariant Finance (Bvi) Limited | Light-absorbing antireflective layers with improved performance due to refractive index optimization |
JPH1115150A (ja) * | 1997-06-20 | 1999-01-22 | Toppan Printing Co Ltd | 多層構造を有するドライフィルムレジスト |
EP1476788A2 (de) * | 2002-02-21 | 2004-11-17 | Honeywell International Inc. | Fluorinierte moleküle und deren herstellungsmethoden und verwendungen |
JP2003345026A (ja) | 2002-05-24 | 2003-12-03 | Tokyo Ohka Kogyo Co Ltd | 反射防止膜形成用塗布液組成物およびこれを用いたホトレジスト積層体、並びにホトレジストパターンの形成方法 |
JP3851594B2 (ja) | 2002-07-04 | 2006-11-29 | Azエレクトロニックマテリアルズ株式会社 | 反射防止コーティング用組成物およびパターン形成方法 |
JP4410508B2 (ja) * | 2002-08-07 | 2010-02-03 | セントラル硝子株式会社 | 含フッ素化合物とその高分子化合物 |
US20040091813A1 (en) * | 2002-11-05 | 2004-05-13 | Honeywell International Inc. | Fluorinated polymers |
KR100620672B1 (ko) * | 2002-12-14 | 2006-09-13 | 주식회사 하이닉스반도체 | 포토레지스트 조성물 |
US7223518B2 (en) * | 2003-06-06 | 2007-05-29 | Georgia Tech Research Corporation | Compositions and methods of use thereof |
JP2005045083A (ja) * | 2003-07-24 | 2005-02-17 | Sony Corp | 露光方法 |
JP4376718B2 (ja) * | 2003-07-28 | 2009-12-02 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置、デバイス製造方法、及び基板 |
US8067147B2 (en) * | 2003-12-23 | 2011-11-29 | Koninklijke Philips Electronics N.V. | Removable pellicle for immersion lithography |
US20050202351A1 (en) * | 2004-03-09 | 2005-09-15 | Houlihan Francis M. | Process of imaging a deep ultraviolet photoresist with a top coating and materials thereof |
JP4484603B2 (ja) * | 2004-03-31 | 2010-06-16 | セントラル硝子株式会社 | トップコート組成物 |
JP4355944B2 (ja) * | 2004-04-16 | 2009-11-04 | 信越化学工業株式会社 | パターン形成方法及びこれに用いるレジスト上層膜材料 |
JP4697406B2 (ja) * | 2004-08-05 | 2011-06-08 | 信越化学工業株式会社 | 高分子化合物,レジスト保護膜材料及びパターン形成方法 |
-
2005
- 2005-02-23 US US11/063,940 patent/US7288362B2/en not_active Expired - Fee Related
-
2006
- 2006-02-17 TW TW095105386A patent/TWI397773B/zh not_active IP Right Cessation
- 2006-02-22 AT AT06735757T patent/ATE474249T1/de not_active IP Right Cessation
- 2006-02-22 DE DE602006015428T patent/DE602006015428D1/de active Active
- 2006-02-22 EP EP06735757A patent/EP1851589B1/de not_active Not-in-force
- 2006-02-22 JP JP2007556415A patent/JP5046236B2/ja not_active Expired - Fee Related
- 2006-02-22 WO PCT/US2006/006225 patent/WO2006091648A2/en active Application Filing
- 2006-02-22 CN CN2006800047266A patent/CN101164013B/zh not_active Expired - Fee Related
-
2007
- 2007-10-05 US US11/868,320 patent/US7855045B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7855045B2 (en) | 2010-12-21 |
DE602006015428D1 (en) | 2010-08-26 |
WO2006091648A3 (en) | 2007-11-22 |
US20060188804A1 (en) | 2006-08-24 |
JP2008532067A (ja) | 2008-08-14 |
TWI397773B (zh) | 2013-06-01 |
CN101164013A (zh) | 2008-04-16 |
EP1851589A4 (de) | 2009-08-19 |
EP1851589A2 (de) | 2007-11-07 |
US20080026330A1 (en) | 2008-01-31 |
JP5046236B2 (ja) | 2012-10-10 |
TW200643636A (en) | 2006-12-16 |
US7288362B2 (en) | 2007-10-30 |
WO2006091648A2 (en) | 2006-08-31 |
CN101164013B (zh) | 2010-11-03 |
EP1851589B1 (de) | 2010-07-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |