ATE468608T1 - Verpackung von integrierten schaltungen - Google Patents

Verpackung von integrierten schaltungen

Info

Publication number
ATE468608T1
ATE468608T1 AT06787376T AT06787376T ATE468608T1 AT E468608 T1 ATE468608 T1 AT E468608T1 AT 06787376 T AT06787376 T AT 06787376T AT 06787376 T AT06787376 T AT 06787376T AT E468608 T1 ATE468608 T1 AT E468608T1
Authority
AT
Austria
Prior art keywords
pads
circuit
die
integrated circuit
ground
Prior art date
Application number
AT06787376T
Other languages
English (en)
Inventor
Laxminarayan Sharma
Mario Francisco Velez
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Application granted granted Critical
Publication of ATE468608T1 publication Critical patent/ATE468608T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49531—Additional leads the additional leads being a wiring board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
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    • H01L2224/05554—Shape in top view being square
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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    • H01L2924/30105—Capacitance
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    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Time-Division Multiplex Systems (AREA)
AT06787376T 2005-07-18 2006-07-14 Verpackung von integrierten schaltungen ATE468608T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US70014305P 2005-07-18 2005-07-18
US11/399,017 US7602050B2 (en) 2005-07-18 2006-04-05 Integrated circuit packaging
PCT/US2006/027462 WO2007011767A1 (en) 2005-07-18 2006-07-14 Integrated circuit packaging

Publications (1)

Publication Number Publication Date
ATE468608T1 true ATE468608T1 (de) 2010-06-15

Family

ID=37459525

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06787376T ATE468608T1 (de) 2005-07-18 2006-07-14 Verpackung von integrierten schaltungen

Country Status (9)

Country Link
US (1) US7602050B2 (de)
EP (1) EP1911092B1 (de)
JP (1) JP4847525B2 (de)
KR (1) KR100943604B1 (de)
CN (1) CN101263598B (de)
AT (1) ATE468608T1 (de)
DE (1) DE602006014412D1 (de)
TW (1) TWI315571B (de)
WO (1) WO2007011767A1 (de)

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US7825527B2 (en) * 2008-06-13 2010-11-02 Altera Corporation Return loss techniques in wirebond packages for high-speed data communications
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US8106502B2 (en) * 2008-11-17 2012-01-31 Stats Chippac Ltd. Integrated circuit packaging system with plated pad and method of manufacture thereof
US20100126764A1 (en) * 2008-11-24 2010-05-27 Seagate Technology, Llc die ground lead
KR101113518B1 (ko) * 2009-11-18 2012-02-29 삼성전기주식회사 리드 프레임
US20110115063A1 (en) * 2009-11-18 2011-05-19 Entropic Communications, Inc. Integrated Circuit Packaging with Split Paddle
TWI401776B (zh) * 2009-12-31 2013-07-11 Chipmos Technologies Inc 四邊扁平無接腳封裝（ｑｆｎ）結構
CN102201384A (zh) * 2010-03-22 2011-09-28 无锡华润安盛科技有限公司 一种led驱动电路的小外形封装引线框
CN101814480B (zh) * 2010-04-16 2011-08-31 杭州矽力杰半导体技术有限公司 一种芯片封装结构及其封装方法
TWI419290B (zh) * 2010-10-29 2013-12-11 Advanced Semiconductor Eng 四方扁平無引腳封裝及其製作方法
US9635794B2 (en) 2012-02-20 2017-04-25 Trw Automotive U.S. Llc Method and apparatus for attachment of integrated circuits
JP5894209B2 (ja) * 2014-04-03 2016-03-23 ルネサスエレクトロニクス株式会社 半導体装置
US10128170B2 (en) 2017-01-09 2018-11-13 Silanna Asia Pte Ltd Conductive clip connection arrangements for semiconductor packages
US11264309B2 (en) * 2019-06-24 2022-03-01 Mediatek Inc. Multi-row QFN semiconductor package
US11515240B2 (en) * 2019-08-01 2022-11-29 Stmicroelectronics S.R.L. Lead frame for a package for a semiconductor device, semiconductor device and process for manufacturing a semiconductor device
CN111900144B (zh) * 2020-08-12 2021-11-12 深圳安捷丽新技术有限公司 高速互连的接地参考形状
JP7097933B2 (ja) * 2020-10-08 2022-07-08 三菱電機株式会社 半導体装置の製造方法

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Also Published As

Publication number Publication date
TW200746377A (en) 2007-12-16
US20070096268A1 (en) 2007-05-03
KR100943604B1 (ko) 2010-02-24
CN101263598A (zh) 2008-09-10
WO2007011767A1 (en) 2007-01-25
TWI315571B (en) 2009-10-01
EP1911092B1 (de) 2010-05-19
JP4847525B2 (ja) 2011-12-28
DE602006014412D1 (de) 2010-07-01
KR20080026216A (ko) 2008-03-24
CN101263598B (zh) 2010-09-22
JP2009502045A (ja) 2009-01-22
US7602050B2 (en) 2009-10-13
EP1911092A1 (de) 2008-04-16

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